Automatic grinding and polishing equipment capable of adapting to semiconductor products of various sizes

Abstract

The utility model discloses automatic grinding and polishing equipment capable of adapting to semiconductor products with various sizes, which comprises an equipment shell, a grinding device, a polishing device and a grinding device, the grinding disc is rotationally arranged at the bottom of the machining station through a rotary driving device; the positioning disc is placed on the polishing disc, and a semiconductor product is bonded to the end face, facing the polishing disc, of the positioning disc through a bonding agent; the pressing discs are arranged at the tops of the machining stations in a lifting mode through first lifting driving devices, and positioning grooves connected with the positioning discs in a sleeving mode are formed in the bottoms of the pressing discs; the transparent observation window is arranged on the outer side of the machining station in a lifting mode. According to the utility model, the problems of low product positioning efficiency, long processing time and poor positioning processing quality during production of the existing grinding and polishing equipment can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding and polishing equipment, in particular to an automatic grinding and polishing equipment which can adapt to semiconductor products of various sizes. Background Art

[0002] When grinding and polishing semiconductor products, the positioning and removal of products of different sizes and quantities are generally performed through adjustable mechanisms on the equipment or through manual operations, resulting in low product positioning efficiency, long processing time and poor positioning processing quality. Utility Model Content

[0003] The purpose of the utility model is to provide an automatic grinding and polishing device that can adapt to semiconductor products of various sizes in order to solve the problems of low product positioning efficiency, long processing time and poor positioning processing quality during production of existing grinding and polishing equipment.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: an automatic grinding and polishing device that can adapt to semiconductor products of various sizes, comprising:

[0005] The equipment housing has a processing station provided on its upper side;

[0006] A grinding disc, which is rotatably arranged at the bottom of the processing station via a rotary drive device;

[0007] a positioning disc, which is placed on the grinding disc and has a semiconductor product bonded to its end surface facing the grinding disc via an adhesive;

[0008] A plurality of pressure plates, each of which is lifted and lowered on the top of the processing station by a first lifting drive device, and a positioning groove is provided at the bottom thereof to be sleeved with the positioning plate;

[0009] A transparent observation window is arranged on the outside of the processing station in a lifting manner.

[0010] As a further description of the above technical solution:

[0011] A fence is provided at the bottom of the processing station on the outside of the grinding disc, and the top of the fence extends to above the top surface of the grinding disc.

[0012] As a further description of the above technical solution:

[0013] The grinding disc is located directly below the plurality of pressure plates, and the overall size of the plurality of pressure plates is smaller than that of the grinding disc.

[0014] As a further description of the above technical solution:

[0015] The adhesive is a high temperature debonding adhesive.

[0016] As a further description of the above technical solution:

[0017] The output shaft of the first lifting drive device is connected to the top surface of the pressure plate. A folding sleeve is sleeved on the outer side of the output shaft. The ends of the folding sleeve are respectively positioned on the processing station and the top surface of the pressure plate.

[0018] As a further description of the above technical solution:

[0019] The top of the transparent observation window is lifted and arranged in the receiving groove of the equipment shell, and a connecting piece is provided on the output shaft of the second lifting drive device on the side of the receiving groove, and the connecting piece is positioned at the top of the transparent observation window.

[0020] As a further description of the above technical solution:

[0021] A sealing slot is provided at the bottom of the processing station and is plugged into the bottom edge of the transparent observation window.

[0022] In summary, due to the adoption of the above technical solution, the present invention has the following advantages compared with the prior art:

[0023] Beneficial effects:

[0024] When the utility model is used, the semiconductor product to be processed is first bonded to the positioning disk by high-temperature debonding. After that, the transparent observation window is driven to move upward and open, and the positioning disk is placed downward on the designated position of the grinding disk. The pressure plate is driven to move downward so that the positioning groove is sleeved and presses the positioning disk, so that the semiconductor product on the grinding disk is pressed and positioned laterally. After that, the transparent observation window is closed and the grinding disk is driven to rotate, and the grinding and polishing of the product can be achieved. Based on the high-temperature resistant nature of semiconductor products, the adhesive adopts high-temperature debonding, so that after the product positioned on the positioning disk is processed, it can be placed in a high-temperature environment to reduce the viscosity of the adhesive, debond, and the product can be detached and removed. Each pressure plate is driven independently, thereby realizing the rapid positioning, grinding, polishing, and removal of products of different quantities and sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A cross-sectional view of an automatic grinding and polishing device that can adapt to semiconductor products of various sizes.

[0027] Figure 2This is a diagram showing the usage of a positioning plate in an automatic grinding and polishing device that can adapt to semiconductor products of various sizes.

[0028] Legend:

[0029] 1. Equipment housing; 11. Enclosure; 12. Storage slot; 13. Sealing slot; 2. Processing station; 3. Grinding disc; 31. Rotation drive device; 4. Positioning disc; 5. Pressure plate; 51. First lifting drive device; 52. Positioning slot; 53. Folding sleeve; 6. Transparent observation window; 7. Second lifting drive device; 71. Connector; 10. Semiconductor product. DETAILED DESCRIPTION

[0030] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0032] See also Figure 1-2 The utility model provides a technical solution: an automatic grinding and polishing device that can adapt to semiconductor products of various sizes, including:

[0033] The equipment housing 1 has a processing station 2 extending through it.

[0034] A grinding disc 3, which is rotatably arranged at the bottom of the processing station 2 via a rotary drive device 31;

[0035] A positioning plate 4 is placed on the grinding plate 3, and a semiconductor product 10 is bonded to the end surface of the positioning plate 4 facing the grinding plate 3 by an adhesive;

[0036] A plurality of pressure plates 5, each of which is lifted and lowered on the top of the processing station 2 by a first lifting drive device 51, and a positioning groove 52 is provided at the bottom thereof to be sleeved with the positioning plate 4;

[0037] A transparent observation window 6 is arranged on the outside of the processing station 2 in a lifting manner.

[0038] A fence 11 is provided at the bottom of the processing station 2 outside the grinding disc 3, and the top of the fence 11 extends above the top surface of the grinding disc 3. The fence 11 is mainly used to block the waste residue produced by grinding to prevent it from splashing to various parts of the processing station 2 for subsequent collection.

[0039] The grinding disc 3 is located directly below the plurality of pressure plates 5 , and the overall size of the plurality of pressure plates 5 is smaller than that of the grinding disc 3 , so as to fully grind and polish products of different quantities and sizes.

[0040] The adhesive is a high temperature debonding adhesive. In addition, the positioning plate 4 adopts a high temperature resistant material plate.

[0041] The output shaft of the first lifting drive device 51 is connected to the top surface of the pressure plate 5. A folding sleeve 53 is sleeved on the outside of the output shaft. The ends of the folding sleeve 53 are respectively positioned on the processing station 2 and the top surface of the pressure plate 5. This design is mainly used to prevent waste residue formed by grinding and polishing from entering the equipment with the air flow and affecting its operation.

[0042] The top of the transparent observation window 6 is lifted and disposed within a receiving slot 12 of the device housing 1. A connecting member 71 is provided on the output shaft of the second lifting drive device 7 on the side of the receiving slot 12. The connecting member 71 is positioned at the top of the transparent observation window 6. This ensures visualization of device operation and product processing while preventing waste residue from splashing out of the device, facilitating centralized waste collection.

[0043] The driving device mentioned above adopts one or more of a motor, a cylinder or a hydraulic cylinder.

[0044] A sealing slot 13 is provided at the bottom of the processing station 2 and is plugged into the bottom edge of the transparent observation window 6 to ensure the sealing of the transparent observation window 6 when it is closed.

[0045] The working principle of the automatic grinding and polishing equipment of this embodiment, which can adapt to semiconductor products of various sizes, includes the following: when in use, the semiconductor product 10 to be processed is first bonded to the positioning plate 4 by high-temperature debonding. Then, the transparent observation window 6 is driven upward and opened, and the positioning plate 4 is placed downward on the designated position of the grinding plate 3. The pressure plate 5 is driven downward so that the positioning groove 52 is sleeved and pressed against the positioning plate 4, so that the semiconductor product 10 on the grinding plate 3 is pressed and laterally positioned. Then, the transparent observation window 6 is closed and the grinding plate 3 is driven to rotate, thereby completing the grinding and polishing of the product. Based on the high-temperature resistance of the semiconductor product 10, the adhesive is made of high-temperature debonding adhesive. After the product is processed and placed in a high-temperature environment, the adhesive viscosity is reduced, the adhesive is debonded, and the product is detached and removed. This high-temperature removal process can be placed in the drying process after the product is ground, polished, and cleaned, thereby improving production efficiency. Each pressure plate 5 is driven independently, thereby achieving rapid positioning, grinding, polishing, and removal of products of different quantities and sizes.

[0046] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automatic grinding and polishing device that can adapt to semiconductor products of various sizes, characterized in that: include: The equipment housing has a processing station provided on its upper side; A grinding disc, which is rotatably arranged at the bottom of the processing station via a rotary drive device; a positioning disc, which is placed on the grinding disc and has a semiconductor product bonded to its end surface facing the grinding disc via an adhesive; A plurality of pressure plates, each of which is lifted and lowered on the top of the processing station by a first lifting drive device, and a positioning groove is provided at the bottom thereof to be sleeved with the positioning plate; A transparent observation window is arranged on the outside of the processing station in a lifting manner.

2. The automatic grinding and polishing equipment according to claim 1, which is adaptable to semiconductor products of various sizes, is characterized in that: A fence is provided at the bottom of the processing station on the outside of the grinding disc, and the top of the fence extends to above the top surface of the grinding disc.

3. The automatic grinding and polishing equipment according to claim 1, which is adaptable to semiconductor products of various sizes, is characterized in that: The grinding disc is located directly below the plurality of pressure plates, and the overall size of the plurality of pressure plates is smaller than that of the grinding disc.

4. The automatic grinding and polishing equipment according to claim 1, which is adaptable to semiconductor products of various sizes, is characterized in that: The adhesive is a high temperature debonding adhesive.

5. The automatic grinding and polishing equipment that can adapt to semiconductor products of various sizes according to claim 1 is characterized in that: The output shaft of the first lifting drive device is connected to the top surface of the pressure plate. A folding sleeve is sleeved on the outer side of the output shaft. The ends of the folding sleeve are respectively positioned on the processing station and the top surface of the pressure plate.

6. The automatic grinding and polishing equipment that can adapt to semiconductor products of various sizes according to claim 1 is characterized in that: The top of the transparent observation window is lifted and arranged in the receiving groove of the equipment shell, and a connecting piece is provided on the output shaft of the second lifting drive device on the side of the receiving groove, and the connecting piece is positioned at the top of the transparent observation window.

7. The automatic grinding and polishing equipment that can adapt to semiconductor products of various sizes according to claim 1 is characterized in that: A sealing slot is provided at the bottom of the processing station and is plugged into the bottom edge of the transparent observation window.

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