Grinding pad quick release structure and wafer thinning machine

Abstract

The utility model belongs to the technical field of wafer processing equipment, and discloses a quick release structure of a grinding pad and a wafer thinning machine. The quick release structure of the grinding pad comprises a fixed seat, a quick release seat and the grinding pad. The quick-release seat is arranged on the side, away from the driving mechanism, of the fixing seat, a quick-release groove is formed in the quick-release seat, a hanging pin is arranged on the fixing seat, the quick-release groove is provided with an unlocking section and a locking section which are communicated with each other, and the hanging pin can stretch into the unlocking section and slide to the locking section. The fixed seat is matched with the quick release seat to drive the grinding pad to rotate relative to the wafer, and when the grinding pad is locked, the hanging pin can be inserted into the unlocking section of the quick release groove, and then the quick release seat is rotated, so that the hanging pin slides to the locking section; when the grinding pad is replaced, the quick release seat can be reversely rotated, so that the hanging pin slides from the locking section to the unlocking section, and then the quick release seat is separated from the fixed seat, so that the grinding pad can be directly disassembled and replaced on the quick release seat, one worker can finish the operation by hand without cooperation of multiple persons, the operation is simple and convenient, the structure is firm and durable, and the production cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a grinding pad quick-disassembly structure and a wafer thinning machine. Background Art

[0002] During the wafer thinning process, in order to improve the flatness of the back of the wafer, CMP chemical mechanical polishing is required. During the polishing process, the pad (polishing pad) will be continuously consumed, so the polishing pad needs to be replaced every once in a while.

[0003] In the prior art wafer thinning machine, the grinding pad is fixed by multiple bolts, which need to be loosened or tightened with a wrench, resulting in low operating efficiency. In addition, when replacing a large-sized grinding pad, two workers are required to work together, resulting in a high error rate and wasting time and effort. Utility Model Content

[0004] The purpose of the utility model is to provide a grinding pad quick-disassembly structure and a wafer thinning machine, which has high grinding pad replacement efficiency and saves time and labor.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] Grinding pad quick-release structure, including:

[0007] A fixed seat, the drive mechanism of the wafer thinning machine can drive the fixed seat to rotate;

[0008] a quick-release seat, disposed on a side of the fixed seat away from the drive mechanism, the quick-release seat being provided with a quick-release slot, the fixed seat being provided with a hook pin, the quick-release slot being provided with an unlocking section and a locking section being interconnected, the hook pin being capable of extending into the unlocking section and sliding to the locking section, the quick-release seat being capable of being separated from the fixed seat when the hook pin is located in the unlocking section, and the quick-release seat being locked to the fixed seat when the hook pin is located in the locking section;

[0009] The grinding pad is detachably connected to a side of the quick-release seat away from the fixed seat.

[0010] Preferably, the opening width of the unlocking section is greater than the opening width of the locking section, the inner wall of the locking section is provided with a limiting step, and the hanging pin is provided with a locking block, and the locking block can abut against the limiting step.

[0011] Preferably, the hanging pin includes a pin shaft, the pin shaft is detachably arranged on the fixing seat, the locking block is sleeved on the pin shaft, and the position of the locking block is adjustable along the length direction of the pin shaft.

[0012] Preferably, the quick-release slot is arc-shaped.

[0013] Preferably, the quick-release seat is circular, a plurality of quick-release slots are provided, and are symmetrically arranged about the center of the circle of the quick-release seat, and the hanging pins correspond one to one with the quick-release slots.

[0014] Preferably, a positioning shaft is provided on the quick-release seat, and a positioning hole is provided on the fixed seat. The positioning shaft can extend into the positioning hole and rotate in the positioning hole.

[0015] Preferably, the quick-release seat comprises:

[0016] The base plate is provided with a first fixing groove;

[0017] A positioning plate, the positioning shaft is fixedly connected to the positioning plate, and the positioning plate is detachably arranged in the first fixing groove.

[0018] Preferably, the quick-release seat further includes a quick-release plate, the quick-release slot is provided on the quick-release plate, a second fixing slot is provided on the base plate, and the quick-release plate is detachably disposed in the second fixing slot.

[0019] Preferably, a positioning pin is provided on the fixing seat, and the positioning pin is fixedly connected to the driving mechanism of the wafer thinning machine.

[0020] The wafer thinning machine comprises a driving mechanism and the above-mentioned grinding pad quick-release structure, wherein the fixing seat is fixedly connected to the output end of the driving mechanism.

[0021] Beneficial effects of the utility model:

[0022] The fixed seat and the quick-release seat cooperate to drive the grinding pad to rotate relative to the wafer. When the grinding pad needs to be locked, the hanging pin can be inserted into the unlocking section of the quick-release slot, and then the quick-release seat is rotated to make the hanging pin slide to the locking section. When the grinding pad needs to be replaced, the quick-release seat can be rotated in the opposite direction to make the hanging pin slide from the locking section to the unlocking section, and then the quick-release seat is separated from the fixed seat. The grinding pad can be directly removed and replaced on the quick-release seat. One worker can complete the operation by hand without the cooperation of multiple people. The operation is simple and convenient, the structure is strong and durable, and the production cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an exploded view of the quick-release structure of the polishing pad of the present invention;

[0024] Figure 2 It is a side sectional view of the wafer thinning machine described in the present invention.

[0025] In the picture:

[0026] 100. Driving mechanism; 101. Liquid injection channel;

[0027] 200, injection mechanism;

[0028] 1. Fixed seat; 11. Hanging pin; 12. Positioning hole;

[0029] 2. Quick-release seat; 21. Quick-release slot; 22. Positioning shaft; 23. Base plate; 231. First fixing slot; 232. Second fixing slot; 24. Positioning plate; 25. Quick-release plate;

[0030] 3. Abrasive pad. DETAILED DESCRIPTION

[0031] The following describes in detail embodiments of the present invention. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed or detachable connections, mechanical or electrical connections, direct or indirect connections through an intermediate medium, and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0033] In the description of the present utility model, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0035] like Figure 1-Figure 2As shown, the utility model provides a grinding pad quick-release structure for fixing and replacing the grinding pad for a wafer thinning machine. The grinding pad quick-release structure includes a fixed seat 1, a quick-release seat 2 and a grinding pad 3. The driving mechanism 100 of the wafer thinning machine can drive the fixed seat 1 to rotate; the quick-release seat 2 is arranged on the side of the fixed seat 1 away from the driving mechanism 100, and a quick-release slot 21 is provided on the quick-release seat 2, and a hanging pin 11 is provided on the fixed seat 1. The quick-release slot 21 is provided with an unlocking section and a locking section that are interconnected, and the hanging pin 11 can extend into the unlocking section and slide to the locking section. When the hanging pin 11 is in the unlocking section, the quick-release seat 2 can be separated from the fixed seat 1, and when the hanging pin 11 is in the locking section, the quick-release seat 2 is locked to the fixed seat 1; the grinding pad 3 is detachably connected to the side of the quick-release seat 2 away from the fixed seat 1.

[0036] It is understandable that the driving mechanism 100 can only rotate in one direction from the unlocking section to the locking section and cannot be reversed, so as to prevent the quick-release seat 2 from separating from the fixing seat 1 under the action of centrifugation.

[0037] The fixed seat 1 and the quick-release seat 2 cooperate to drive the grinding pad 3 to rotate relative to the wafer. When the grinding pad 3 needs to be locked, the hanging pin 11 can be inserted into the unlocking section of the quick-release slot 21, and then the quick-release seat 2 is rotated to make the hanging pin 11 slide to the locking section. When the grinding pad 3 needs to be replaced, the quick-release seat 2 can be rotated in the opposite direction to make the hanging pin 11 slide from the locking section to the unlocking section, and then the quick-release seat 2 is separated from the fixed seat 1. The grinding pad 3 can be directly removed and replaced on the quick-release seat 2. One worker can complete the operation by hand without the cooperation of multiple people. The operation is simple and convenient, the structure is strong and durable, and the production cost is low.

[0038] Preferably, in this embodiment, the polishing pad 3 is bonded to the quick-release seat 2, which is firm and reliable while being easy to disassemble.

[0039] Specifically, the opening width of the unlocking section is larger than the opening width of the locking section. A limiting step is provided on the inner wall of the locking section. The hook pin 11 is provided with a locking block that can abut against the limiting step. With the above arrangement, the opening width of the locking section is smaller than the opening width of the unlocking section. When the locking block abuts against the limiting step, the hook pin 11 cannot escape from the quick-release slot 21, thereby locking the quick-release seat 2 to the fixed seat 1.

[0040] More specifically, the hook pin 11 comprises a pin shaft that is detachably mounted on the fixing base 1. A locking block is sleeved onto the pin shaft, and the locking block is adjustable along the length of the pin shaft. This arrangement allows the contact pressure and friction between the locking block and the stop step to be adjusted by adjusting the position of the locking block, thereby adjusting the locking force of the quick-release base 2.

[0041] Preferably, in this embodiment, the locking block is screwed to the pin shaft, and the locking block can be moved along the pin shaft by rotating it.

[0042] More specifically, the quick release slot 21 is arc-shaped. The above arrangement makes the process of rotating the locking block smoother and prevents the locking block from getting stuck in the quick release slot 21.

[0043] More specifically, the quick release seat 2 is circular, and a plurality of quick release slots 21 are provided, and are symmetrically arranged about the center of the circle of the quick release seat 2, and the hanging pins 11 correspond one to one with the quick release slots 21. The above arrangement makes the force on the quick release seat 2 more balanced.

[0044] Preferably, in this embodiment, there are four quick-release slots 21. In other embodiments, the number of quick-release slots 21 can be adjusted according to actual needs, and is not specifically limited here.

[0045] Specifically, the quick-release base 2 is provided with a positioning shaft 22, and the fixed base 1 is provided with a positioning hole 12. The positioning shaft 22 can be inserted into the positioning hole 12 and rotate in the positioning hole 12. With the above arrangement, inserting the positioning shaft 22 into the positioning hole 12 can align the quick-release base 2 with the fixed base 1, preventing the quick-release base 2 from being eccentric or skewed during rotation.

[0046] Specifically, the quick-release mount 2 includes a base plate 23 and a positioning plate 24. The base plate 23 defines a first fixing slot 231. The positioning shaft 22 is fixedly connected to the positioning plate 24, which is detachably disposed within the first fixing slot 231. This arrangement facilitates separation of the base plate 23 from the positioning shaft 22.

[0047] Preferably, in this embodiment, the positioning plate 24 is installed in the first fixing groove 231 by bolts.

[0048] More specifically, the substrate 23 can be provided with multiple types according to the type, shape and size of the polishing pad 3. Different types of substrates 23 are provided with first fixing grooves 231 of the same size, so that the same positioning plate 24 can be adapted to multiple substrates 23, making it easy to replace different polishing pads 3.

[0049] Specifically, the quick-release mount 2 further includes a quick-release plate 25, the quick-release slot 21 being defined on the quick-release plate 25, and a second fixing slot 232 being defined on the base plate 23. The quick-release plate 25 is detachably disposed in the second fixing slot 232. The configuration of the quick-release plate 25 allows the same quick-release plate 25 to be adapted to base plates 23 of various sizes.

[0050] Preferably, in this embodiment, the quick release plate 25 is installed in the second fixing groove 232 by bolts.

[0051] Specifically, a positioning pin is provided on the fixing base 1, and the positioning pin is fixedly connected to the driving mechanism 100 of the wafer thinning machine. The provision of the positioning pin makes the connection between the fixing base 1 and the output end of the driving mechanism 100 more secure.

[0052] The present invention also provides a wafer thinning machine for thinning wafers. The wafer thinning machine has all the beneficial effects of the above-mentioned grinding pad quick-release structure, which will not be repeated here. The wafer thinning machine includes a drive mechanism 100 and the above-mentioned grinding pad quick-release structure, and a fixing base 1 is fixedly connected to the output end of the drive mechanism 100.

[0053] Preferably, in this embodiment, the driving mechanism 100 is a DD motor commonly used in the art.

[0054] Specifically, the output shaft of the driving mechanism 100 is provided with a liquid injection channel 101 for circulating coolant to dissipate heat of the driving mechanism 100 .

[0055] More specifically, the fixing base 1, the quick-release base 2, and the polishing pad 3 are all provided with interconnected cooling ports, which are connected to the drive mechanism 100. With the above arrangement, the cooling ports can continuously spray coolant during the thinning operation of the polishing pad 3 to control the temperature of the wafer surface.

[0056] Specifically, the wafer thinning machine also includes a liquid injection mechanism 200, the output end of which is connected to the end of the liquid injection channel 101 away from the polishing pad quick-release structure. The configuration of the liquid injection mechanism 200 can continuously provide coolant during the wafer thinning operation to prevent the equipment from overheating.

[0057] More specifically, the output end of the liquid injection mechanism 200 is rotatably connected to the output end of the driving mechanism 100 , so that the connection between the liquid injection mechanism 200 and the driving mechanism 100 is more secure.

[0058] Preferably, in this embodiment, a liquid receiving tray is further provided between the driving mechanism 100 and the liquid injection mechanism 200 to prevent damage to the driving mechanism 100 .

[0059] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. The quick-release structure of the polishing pad is characterized by: include: A fixed seat (1), wherein a driving mechanism (100) of the wafer thinning machine is capable of driving the fixed seat (1) to rotate; A quick-release seat (2) is arranged on a side (100) of the fixed seat (1) away from the driving mechanism, the quick-release seat (2) is provided with a quick-release slot (21), the fixed seat (1) is provided with a hanging pin (11), the quick-release slot (21) is provided with an unlocking section and a locking section that are interconnected, the hanging pin (11) can extend into the unlocking section and slide to the locking section, the quick-release seat (2) can be separated from the fixed seat (1) when the hanging pin (11) is located in the unlocking section, and the quick-release seat (2) is locked to the fixed seat (1) when the hanging pin (11) is located in the locking section; The grinding pad (3) is detachably connected to a side of the quick-release seat (2) away from the fixed seat (1).

2. The polishing pad quick-release structure according to claim 1, characterized in that: The opening width of the unlocking section is greater than the opening width of the locking section, the inner wall of the locking section is provided with a limiting step, and the hanging pin (11) is provided with a locking block, and the locking block can abut against the limiting step.

3. The polishing pad quick-release structure according to claim 2, characterized in that: The hanging pin (11) comprises a pin shaft, the pin shaft is detachably arranged on the fixing seat (1), the locking block is sleeved on the pin shaft, and the position of the locking block is adjustable along the length direction of the pin shaft.

4. The polishing pad quick-release structure according to claim 1, wherein: The quick-release slot (21) is arc-shaped.

5. The polishing pad quick-release structure according to claim 1, wherein: The quick-release seat (2) is circular, a plurality of quick-release slots (21) are provided, and are symmetrically arranged about the center of the circle of the quick-release seat (2), and the hanging pins (11) correspond one to one with the quick-release slots (21).

6. The polishing pad quick-release structure according to claim 1, characterized in that: The quick-release seat (2) is provided with a positioning shaft (22), and the fixed seat (1) is provided with a positioning hole (12). The positioning shaft (22) can extend into the positioning hole (12) and rotate in the positioning hole (12).

7. The polishing pad quick-release structure according to claim 6, characterized in that: The quick-release seat (2) comprises: The base plate (23) is provided with a first fixing groove (231); A positioning plate (24), the positioning shaft (22) is fixedly connected to the positioning plate (24), and the positioning plate (24) is detachably disposed in the first fixing groove (231).

8. The polishing pad quick-release structure according to claim 7, characterized in that: The quick-release seat (2) further comprises a quick-release plate (25), the quick-release slot (21) being provided on the quick-release plate (25), a second fixing slot (232) being provided on the base plate (23), and the quick-release plate (25) being detachably disposed in the second fixing slot (232).

9. The polishing pad quick-release structure according to claim 1, wherein: A positioning pin is provided on the fixing seat (1), and the positioning pin is fixedly connected to the driving mechanism (100) of the wafer thinning machine.

10. Wafer thinning machine, characterized in that, It comprises a driving mechanism (100) and a polishing pad quick-release structure according to any one of claims 1 to 8, wherein the fixing seat (1) is fixedly connected to the output end of the driving mechanism (100).

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