Protective cover for circuit board element in vacuum coating process
By designing the protective cover, the insulation failure problem caused by parylene deposition in the vacuum coating process of circuit board components is solved, and the normal conduction of the components and the reliable use of the protective cover is achieved.
Patent Information
- Application Number
- CN202422447837.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In the vacuum coating process, parylene penetrates into the gap and cools and precipitates, resulting in the insulation failure of the connecting sockets such as gold fingers and cannot be conducted with the connecting wire.
A protective cover is designed, including a hard bottom layer and a flexible cover, with grooves matching the protected element, bonded to the circuit board through a glue layer, hiding the element to prevent parylene deposition.
It effectively avoids the deposition of parylene in the vacuum coating equipment, keeps the electrical characteristics of the components working normally, and is convenient and reliable in use.
Smart Images
Figure CN223214163U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum coating, in particular to a protective cover used for circuit board components during the vacuum coating process. Background Art
[0002] During the vacuum coating process for printed circuit boards, vaporized parylene (P-xylene) penetrates the gaps between components and cools down to form a surface, achieving overall waterproofing and insulation. However, during this coating process, the parylene can also coat the surfaces of the gold fingers that connect the circuit board's sockets. This insulation prevents electrical conduction between the connecting wires, resulting in functional loss. Summary of the Invention
[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a protective cover for circuit board components used in a vacuum coating process.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A protective cover for circuit board components used in a vacuum coating process comprises a hard base layer with a flexible covering fixed to the end face of the hard base layer. The covering has a groove with an open bottom, the shape of the groove being adapted to the shape of the protected component, and an adhesive layer on the bottom face of the covering. The cover is bonded to the circuit board via the adhesive layer, and the groove conceals the protected component within.
[0006] Furthermore, the hard bottom layer is formed of PVC material.
[0007] Furthermore, the adhesive surface of the adhesive layer is connected with release paper.
[0008] Furthermore, the covering body is a foam with a U-shaped cross section.
[0009] The present invention utilizes the above technical solution. By snapping the protective cover onto the protected component and pressing it firmly before performing the vacuum coating process, it effectively prevents the protected component on the circuit board from being deposited with parylene within the vacuum coating equipment. Furthermore, the protective cover of the present invention has a simple structure and is easy and reliable to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:
[0011] Figure 1 It is a structural diagram of the utility model;
[0012] Figure 2 This is a schematic diagram of the specific use of the utility model. DETAILED DESCRIPTION
[0013] like Figure 1-2 As shown, the present invention provides a protective cover for circuit board components during a vacuum coating process, comprising a hard base layer 1, a flexible covering body 2 fixed to the end face of the hard base layer 1, and a recess 21 with an open bottom on the covering body 2. The shape of the recess 21 matches the shape of the component to be protected, and the length, width, and depth of the recess 21 correspond to the length, width, and height of the component. The recess 21 is approximately 10% of the length, width, and height for easy attachment. At the same time, the outer dimensions of the protective cover and foam should be kept within a certain distance from other components on the circuit board to avoid covering other surrounding components. The bottom surface of the covering body 2 has an adhesive layer 3; the cover is bonded to the circuit board via the adhesive layer 3, and the recess 21 conceals the protected component.
[0014] The hard bottom layer 1 is made of PVC. The adhesive surface of the adhesive layer 3 is connected to a release paper. When using, the release paper is removed before being attached to the circuit board. The covering body 2 is a foam with a U-shaped cross section.
[0015] Before placing the circuit board into the vacuum coating machine, use anti-static tweezers to remove the protective cover from the release paper. Then, apply the cover to the component being protected (such as a gold finger or other socket component) and press firmly. This prevents parylene from adhering to the component, preserving its electrical properties. After vacuum coating, use anti-static tweezers to directly remove the protective cover from the circuit board. If the vacuum coating is too thick, use an anti-static ceramic blade to gently scratch along the foam of the protective cover to break the coating in that area before removing it with tweezers. After use, reattach the protective cover to the release paper, mark the number of uses, and store it for future use.
[0016] The above describes the specific implementation of the present invention, but those skilled in the art should understand that this is only an example. Those skilled in the art can make various changes or modifications to this implementation without departing from the principle and essence of the present invention, but these changes and modifications will fall within the scope of protection of the present invention.
Claims
1. A protective cover for circuit board components used in a vacuum coating process, characterized by: It includes a hard bottom layer, on the end surface of which a flexible covering body is fixed. The covering body has a groove with an open bottom, and the shape of the groove is adapted to the shape of the protected component. The bottom surface of the covering body has an adhesive layer; the covering body is bonded to the circuit board through the adhesive layer, and the groove hides the protected component inside.
2. The protective cover for circuit board components used in a vacuum coating process according to claim 1, characterized in that: The hard bottom layer is formed of PVC material.
3. The protective cover for circuit board components used in a vacuum coating process according to claim 1, characterized in that: The adhesive surface of the adhesive layer is connected with release paper.
4. The protective cover for circuit board components used in a vacuum coating process according to claim 1, characterized in that: The covering body is a foam with a U-shaped cross section.