Drying device for chip packaging
By designing the drying device for chip packaging, using a conveyor belt and clamping mechanism combined with an electric heater and a hot air fan, the continuous conveying and heating and drying of the chip are achieved, solving the complicated conveying problems after drying in existing equipment, improving efficiency and avoiding expansion problems caused by natural drying.
Patent Information
- Application Number
- CN202422537006.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-10-21
AI Technical Summary
The existing drying equipment requires the chips to be placed in a closed environment for drying. After drying, complicated conveying procedures are required, and the efficiency needs to be improved.
A drying device for chip packaging is designed, using a conveyor belt and clamping mechanism to combine with an electric heater and a hot air fan to realize the continuous conveying and heating drying of the chip. The contact heat transfer between the clamping mechanism and the electric heating plate and the hot air blowing of the hot air fan are used to quickly dry the glue on the surface of the chip.
The continuous conveying and heating drying of the chip is realized, which shortens the drying time, avoids the expansion problems caused by changes in humidity and temperature during natural drying, and improves efficiency.
Smart Images

Figure CN223216632U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip packaging, in particular to a drying device for chip packaging. Background Art
[0002] The housing used to house semiconductor integrated circuit chips houses, secures, seals, and protects the chips, enhancing their electrical and thermal performance. It also serves as a bridge between the chip's internal world and external circuits. Wires connect the chip's contacts to the package's pins, which in turn connect to other components via wires on the printed circuit board. During the chip packaging process, glue is dispensed, and after this, the glue needs to be dried.
[0003] Existing drying equipment requires placing chips in batches in a closed environment for drying. After drying, the batches of dried chips need to be transported. The procedure is relatively complicated and the efficiency needs to be improved.
[0004] Therefore, it is necessary to propose a new drying device for chip packaging to solve the above problems. Utility Model Content
[0005] The purpose of the utility model is to provide a drying device for chip packaging to solve the problem that the existing drying equipment needs to place the chips in batches in a closed environment for drying. After the drying is completed, the batches of dried chips need to be transported, the procedure is relatively complicated, and the efficiency needs to be improved.
[0006] To achieve the above object, the present invention provides the following technical solution: a drying device for chip packaging, comprising a conveyor frame, wherein the conveyor frame is internally connected to a conveyor belt, wherein the outer surface of the conveyor belt is provided with openings, wherein the openings are distributed along the width direction of the conveyor belt, wherein the openings are provided in plurality, and a clamping mechanism is inserted into the openings;
[0007] An electric heater is fixed on one side of the conveyor frame, and an electric heating plate is connected to one side of the electric heater. The electric heating plate extends into the interior of the conveyor belt, and the bottom end of the clamping mechanism contacts the top end of the electric heating plate;
[0008] The clamping mechanism includes a base plate, the bottom end of the base plate is fixedly connected with an insert block, the insert block is inserted into the corresponding through opening, and the top end of the base plate is slidably matched with two support seats.
[0009] Preferably, a sliding groove is provided at the top of the bottom plate along the length direction, the two support seats are slidably fitted in the sliding groove, and a card slot for placing the chip is provided at the top of the two support seats.
[0010] Preferably, a top plate is fixed in the middle of the top of the conveying frame, and the top plate is distributed along the width direction of the conveyor belt. A cavity is opened inside the top plate, and an air trough is opened at the bottom end of the top plate. A plurality of hot air blowers are fixed at the top of the top plate, and the plurality of hot air blowers, the cavity and the air trough are connected in sequence.
[0011] Preferably, both ends of the conveyor frame are rotatably connected to conveyor rollers, the transmission belt is connected between the two conveyor rollers, and a motor is fixed on one side of the conveyor frame, and one of the conveyor rollers is connected to the drive shaft of the motor.
[0012] Preferably, the electric heating plates are distributed along the width direction of the conveyor belt, and the positions of the top plate and the electric heating plates correspond to each other.
[0013] Preferably, the bottom end of the through opening also passes through the inner surface of the conveyor belt.
[0014] The beneficial technical effects of the present utility model are:
[0015] In actual operation, after the motor is started, it can drive the conveyor belt to rotate, so that the clamping mechanism drives the clamped chip to move and complete the conveying task. During the conveying process, the clamped chip can also be heated and dried to speed up the solidification of the glue.
[0016] When the conveyor belt drives the clamping mechanism and the chip to move to the bottom of the top plate, the electric heating plate and the hot air blower start, and the bottom end of the plug will contact the top end of the electric heating plate. The heat will be transferred to the support seat through the plug, speeding up the heat transmission speed and heating the clamped chip. At the same time, the heat generated will also be transported to the lower surface of the chip through the conveyor belt to dry the glue.
[0017] Furthermore, the hot air generated by the hot air blower will be blown to the upper surface of the chip through the wind slot, thereby completing the drying of the entire chip. The hot air can also blow away the dust adhering to the chip during the movement, playing a cleaning role. Drying the glue in advance can speed up the solidification of the glue compared to the natural drying of the glue, and avoid the glue from drying in the natural environment and expanding due to the influence of humidity and temperature. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic structural diagram of a drying device for chip packaging according to the present invention.
[0019] Figure 2 This is a schematic diagram of the clamping mechanism of the utility model.
[0020] Figure 3 This is a structural diagram of the electric heating plate of the utility model.
[0021] In the figure: 1. Conveyor rack; 2. Electric heater; 3. Conveyor belt; 4. Through port; 5. Top plate; 6. Hot air blower; 7. Clamping mechanism; 8. Bottom plate; 9. Insert block; 10. Sliding groove; 11. Support seat; 12. Card slot; 13. Electric heating plate. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] like Figure 1 - Figure 3 As shown, the utility model provides a drying device for chip packaging, including a conveyor frame 1, the internal transmission of the conveyor frame 1 is connected to a conveyor belt 3, the outer surface of the conveyor belt 3 is provided with a through opening 4, the through opening 4 is distributed along the width direction of the conveyor belt 3, and a plurality of through openings 4 are provided. A clamping mechanism 7 is inserted into the through opening 4, and the clamping mechanism 7 is used to clamp and fix the chip that needs to be heated.
[0024] Specifically, both ends of the conveyor frame 1 are rotatably connected to conveyor rollers, the transmission belt 3 is transmission-connected between the two conveyor rollers, and a motor is fixed on one side of the conveyor frame 1, and one of the conveyor rollers is connected to the drive shaft of the motor.
[0025] In the actual operation of the present invention, after the motor is started, it can drive the conveyor belt 3 to rotate, so that the clamping mechanism 7 drives the clamped chip to move and complete the conveying task. During the conveying process, the clamped chip can also be heated and dried to accelerate the solidification speed of the glue.
[0026] The clamping mechanism 7 includes a base plate 8, the bottom end of the base plate 8 is fixedly connected to an insert block 9, the insert block 9 is inserted into the corresponding through opening 4, and the top of the base plate 8 is slidably fitted with two support seats 11, and a sliding groove 10 is provided at the top of the base plate 8 along the length direction. The two support seats 11 are both slidably fitted in the sliding groove 10, and the top of the two support seats 11 are both provided with a card slot 12 for placing the chip.
[0027] In the actual operation of the present invention, the clamping mechanism 7 can be inserted into the opening 4 on the conveyor belt 3 through the plug block 9, which is convenient for installation and disassembly. When the clamping mechanism 7 is disassembled, the conveyor belt 3 can also be used to transport other materials. The chip can be placed in the card slot 12 of the two support seats 11, and the chip is supported by the two support seats 11 and transported and moved.
[0028] An electric heater 2 is fixed to one side of the conveyor frame 1, and an electric heating plate 13 is connected to one side of the electric heater 2. The electric heating plate 13 extends into the interior of the conveyor belt 3, and the bottom end of the clamping mechanism 7 contacts the top end of the electric heating plate 13;
[0029] It should be noted that the clamping mechanism 7 is made of heat-conducting material.
[0030] A top plate 5 is fixed in the middle of the top of the conveying frame 1, and the top plate 5 is distributed along the width direction of the conveyor belt 3. A cavity is opened inside the top plate 5, and an air trough is opened at the bottom end of the top plate 5. A plurality of hot air blowers 6 are fixed to the top of the top plate 5. The plurality of hot air blowers 6, the cavity and the air trough are connected in sequence. The electric heating plate 13 is distributed along the width direction of the conveyor belt 3, and the positions of the top plate 5 and the electric heating plate 13 correspond to each other.
[0031] In the actual operation of the present invention, when the conveyor belt 3 drives the clamping mechanism 7 and the chip to move to the bottom of the top plate 5, the electric heating plate 13 and the hot air blower 6 are started, and the bottom end of the plug 9 will contact the top end of the electric heating plate 13. The heat will be transferred to the support seat 11 through the plug 9, thereby accelerating the heat transmission speed and heating the clamped chip. At the same time, the heat generated will also be transported to the lower surface of the chip through the conveyor belt 3 to dry the glue.
[0032] Furthermore, the hot air generated by the hot air blower 6 will be blown to the upper surface of the chip through the wind slot, thereby completing the drying of the entire chip. The hot air can also blow away the dust adhering to the chip during the movement process, playing a cleaning role.
[0033] Drying the glue in advance can speed up the solidification of the glue compared to letting it dry naturally, and prevent the glue from drying in the natural environment and expanding due to humidity and temperature.
[0034] The bottom end of the through opening 4 also passes through the inner surface of the conveyor belt 3 .
Claims
1. A drying device for chip packaging, comprising a conveyor frame (1), characterized in that: The conveyor frame (1) is internally connected to a conveyor belt (3), and an outer surface of the conveyor belt (3) is provided with a through opening (4), and the through opening (4) is distributed along the width direction of the conveyor belt (3). There are multiple through openings (4), and a clamping mechanism (7) is inserted into the through opening (4); An electric heater (2) is fixed on one side of the conveying frame (1), and an electric heating plate (13) is connected to one side of the electric heater (2). The electric heating plate (13) extends into the interior of the conveyor belt (3), and the bottom end of the clamping mechanism (7) contacts the top end of the electric heating plate (13); The clamping mechanism (7) comprises a base plate (8), the bottom end of which is fixedly connected to an insert block (9), the insert block (9) being inserted into the corresponding through opening (4), and the top end of the base plate (8) being slidably fitted with two support seats (11).
2. The drying device for chip packaging according to claim 1, characterized in that: The top of the base plate (8) is provided with a sliding groove (10) along the length direction, and the two support seats (11) are both slidably fitted in the sliding groove (10), and the tops of the two support seats (11) are both provided with a card slot (12) for placing a chip.
3. The drying device for chip packaging according to claim 1, wherein: A top plate (5) is fixed at the middle of the top of the conveying frame (1), and the top plate (5) is distributed along the width direction of the conveyor belt (3). A cavity is provided inside the top plate (5), and an air trough is provided at the bottom end of the top plate (5). A plurality of hot air blowers (6) are fixed at the top of the top plate (5), and the plurality of hot air blowers (6), the cavity and the air trough are connected in sequence.
4. The drying device for chip packaging according to claim 1, wherein: Both ends of the conveying frame (1) are rotatably connected to conveying rollers, the transmission belt (3) is transmission-connected between the two conveying rollers, and a motor is fixed on one side of the conveying frame (1), wherein one of the conveying rollers is connected to the drive shaft of the motor.
5. The drying device for chip packaging according to claim 1, wherein: The electric heating plates (13) are distributed along the width direction of the conveyor belt (3), and the positions of the top plate (5) and the electric heating plates (13) correspond to each other.
6. The drying device for chip packaging according to claim 1, wherein: The bottom end of the through opening (4) simultaneously passes through the inner surface of the conveyor belt (3).