Sensor structure and detection equipment

Abstract

The utility model relates to a sensor structure and detection equipment. The sensor structure comprises a metal bottom plate, a low thermal expansion coefficient plate, a laser light source, a lens, a color sensor, a first heat conduction piece and a second heat conduction piece, the low thermal expansion coefficient plate is adhered to one surface of the bottom plate through glue; the laser light source, the lens and the color sensor are respectively connected to the low thermal expansion coefficient plate; the two ends of the first heat conduction piece are respectively bonded with the laser light source and the bottom plate through glue; the two ends of the second heat conduction piece are bonded with the color sensor and the bottom plate through glue respectively. According to the structure, the low-thermal-expansion-coefficient plates bonded through glue are additionally arranged among the bottom plate, the laser light source, the lens and the color sensor, deformation, caused by environment temperature changes, of the bottom plate is buffered through the low-thermal-expansion-coefficient plates and the glue, the relative position relation of all components is kept stable, and therefore the measurement precision and stability are improved; and the defect that a low-thermal-expansion-coefficient plate is poor in heat conduction performance is overcome by arranging the heat conduction piece, and the heat dissipation performance of the structure is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a sensor structure and detection equipment. Background Art

[0002] The line laser 3D profile sensor is a high-precision, high-efficiency measurement tool. It utilizes the principle of laser triangulation to project a laser line onto the surface of an object and collect the reflected light, thereby acquiring three-dimensional surface profile data. This non-contact measurement method not only improves measurement accuracy and efficiency, but also simplifies the measurement process, reducing the errors and inconveniences associated with traditional measurement methods.

[0003] Existing line laser 3D profile sensors mainly consist of a line laser light source, a lens, and a color sensor. These three components are fixed on a metal plate in a certain relative position relationship. However, during the operation of the sensor, the temperature of the machine casing changes due to changes in the external ambient temperature and the heat generated by each component. The metal plate expands and contracts due to heat and deforms, causing relative displacement of the line laser light source, lens, and color sensor. As a result, the relative position relationship between the three cannot be ensured, which in turn affects the stability and accuracy of the entire sensor measurement process. Utility Model Content

[0004] To this end, the technical problem to be solved by the present invention is to overcome the problem that the line laser 3D profile sensor in the prior art mainly includes a line laser light source, a lens and a color sensor, and these three parts are fixed on a metal plate with a certain relative position relationship; however, during the operation of the sensor, due to changes in the external environmental temperature and the heat generated by each component, the temperature of the machine casing will change, and the metal plate will expand and contract due to deformation, which will cause the line laser light source, lens and color sensor to undergo relative displacement, thereby making it impossible to ensure the relative position relationship between the three, which will in turn affect the stability and accuracy of the entire sensor measurement process.

[0005] In order to solve the above technical problems, the utility model provides a sensor structure, including:

[0006] A bottom plate, wherein the bottom plate is a metal plate;

[0007] A low thermal expansion coefficient plate, wherein the low thermal expansion coefficient plate is horizontally bonded to one surface of the base plate by glue;

[0008] A laser light source connected to the low thermal expansion coefficient plate;

[0009] A lens, wherein the lens is mounted on the low thermal expansion coefficient board;

[0010] a color sensor, the color sensor being disposed on the low thermal expansion coefficient board;

[0011] a first heat-conducting member, wherein two ends of the first heat-conducting member are respectively bonded to the laser light source and the bottom plate by glue;

[0012] The second heat conducting member has two ends bonded to the color sensor and the bottom plate respectively by glue.

[0013] In one embodiment of the present invention, thermal grease is provided between the first heat conducting member, the laser light source, and the bottom plate, and thermal grease is also provided between the second heat conducting member, the color sensor, and the bottom plate.

[0014] In one embodiment of the present invention, the laser light source, the lens and the color sensor are pre-connected to the low thermal expansion coefficient plate through fasteners, and are all bonded to the low thermal expansion coefficient plate through glue.

[0015] In one embodiment of the present invention, a through groove and a notch are respectively formed on the low thermal expansion coefficient plate, and the through groove and the notch are respectively close to the laser light source and the color sensor.

[0016] In one embodiment of the present invention, a groove is milled on the base plate and an extension portion extending into the groove is formed by milling, the shape of the extension portion matches the shape of the notch, the low thermal expansion coefficient plate is arranged in the groove, and the notch and the extension portion are interlocked with each other.

[0017] In one embodiment of the present invention, a first heat dissipation area and a second heat dissipation area are respectively provided on the base plate, the position of the first heat dissipation area corresponds to the position of the through slot, the second heat dissipation area is located on the extension portion, one end of the first heat conductor passes through the through slot and is bonded to the base plate at the position of the first heat dissipation area, and one end of the second heat conductor is bonded to the base plate at the position of the second heat dissipation area.

[0018] In one embodiment of the present invention, the first heat conducting member and the second heat conducting member are both L-shaped metal members, and are made of copper or aluminum.

[0019] In one embodiment of the present invention, the low thermal expansion coefficient plate is made of Invar plate, aluminum nitride plate, aluminum oxide plate or silicon carbide plate.

[0020] In one embodiment of the present invention, the color sensor is connected to a bracket, and the bracket is connected to the low thermal expansion coefficient board.

[0021] A detection device comprises the sensor structure as described in any one of the above.

[0022] The above technical solution of the utility model has the following advantages compared with the prior art:

[0023] The sensor structure and detection device described in the present invention include a metal base plate, a low thermal expansion coefficient plate, a laser light source, a lens, a color sensor, a first heat conductor, and a second heat conductor. The low thermal expansion coefficient plate is horizontally bonded to one surface of the base plate by glue. The laser light source, the lens, and the color sensor are respectively connected to the low thermal expansion coefficient plate. The two ends of the first heat conductor are respectively bonded to the laser light source and the base plate by glue. The two ends of the second heat conductor are respectively bonded to the color sensor and the base plate by glue. By adding the low thermal expansion coefficient plate bonded by glue between the base plate and the laser light source, the lens, and the color sensor, the sensor structure buffers deformation of the base plate caused by changes in ambient temperature by the low thermal expansion coefficient plate and the glue, thereby maintaining a stable relative positional relationship between the laser light source, the lens, and the color sensor, thereby improving the measurement accuracy and measurement stability of the sensor structure. The heat conductor is also provided to overcome the disadvantage of the low thermal expansion coefficient plate's poor thermal conductivity, thereby ensuring the heat dissipation performance of the entire structure. The entire sensor structure is simple in structure, easy to install and maintain, and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to make the content of the utility model easier to understand, the utility model is further described in detail below based on the specific embodiments of the utility model and in conjunction with the accompanying drawings, wherein

[0025] Figure 1 It is a perspective view of the sensor structure of the preferred embodiment of the present invention from a first perspective;

[0026] Figure 2 is a perspective view of the sensor structure of the preferred embodiment of the present invention from a second viewing angle;

[0027] Figure 3 Schematic diagram of the first heat dissipation area and the second heat dissipation area of the sensor structure of the preferred embodiment of the present utility model;

[0028] Figure 4 This is a schematic structural diagram of a sensor structure in a preferred embodiment of the present invention in which a base plate and a low thermal expansion coefficient plate are connected together;

[0029] Figure 5 It is a structural schematic diagram of a low thermal expansion coefficient plate of a sensor structure in a preferred embodiment of the present utility model.

[0030] Explanation of the reference numerals in the accompanying drawings in the specification: 1. Base plate; 11. Extension portion; 12. First heat dissipation area; 13. Second heat dissipation area; 2. Low thermal expansion coefficient plate; 21. Through groove; 22. Notch; 3. Laser light source; 4. Lens; 5. Color sensor; 6. First heat-conducting member; 7. Second heat-conducting member. DETAILED DESCRIPTION

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention. Example 1

[0032] Reference Figure 1-Figure 5 As shown, a sensor structure of the utility model includes:

[0033] Bottom plate 1, bottom plate 1 is a metal plate;

[0034] The low thermal expansion coefficient plate 2 is horizontally bonded to one surface of the bottom plate 1 by glue;

[0035] A laser light source 3 is connected to the low thermal expansion coefficient plate 2;

[0036] Lens 4, lens 4 is mounted on the low thermal expansion coefficient board 2;

[0037] Color sensor 5, color sensor 5 is provided on the low thermal expansion coefficient board 2;

[0038] A first heat conducting member 6, both ends of which are bonded to the laser light source 3 and the bottom plate 1 respectively by glue;

[0039] The second heat conducting member 7 has two ends bonded to the color sensor 5 and the bottom plate 1 respectively by glue.

[0040] Specifically, the low thermal expansion coefficient plate 2 is made of a material with a low thermal expansion coefficient. When the base plate 1 deforms (expands and contracts) due to changes in ambient temperature, the deformation is minimized due to the characteristics of the low thermal expansion coefficient plate 2. This significantly reduces the relative displacement of the laser light source 3, lens 4, and color sensor 5 mounted on the low thermal expansion coefficient plate 2, effectively improving the sensor structure's measurement stability and accuracy during temperature fluctuations. Furthermore, the low thermal expansion coefficient plate 2 and base plate 1 are bonded together using glue, which acts as a buffer against deformation of the base plate 1 and prevents deformation or breakage of the low thermal expansion coefficient plate 2 caused by a hard connection. Furthermore, thermally conductive elements (first thermal conductive element 6 and second thermal conductive element 7) are bonded between the heat-prone components (specifically, the laser light source 3 and color sensor 5) and the base plate 1. This allows the heat generated during operation of the laser light source 3 and color sensor 5 to be quickly transferred to the heat dissipation area on the base plate 1, achieving rapid heat dissipation and ensuring stable sensor operation. Specifically, this structure is suitable for products where the light source and sensor have a strict positional relationship. It can be used in both all-in-one and split-mount models, such as line laser 3D profilers, structured light 3D sensors, and binocular 3D sensors.

[0041] Specifically, the sensor structure of the present invention incorporates a low thermal expansion coefficient plate 2 bonded with glue between a base plate 1 and the laser light source 3, lens 4, and color sensor 5. This plate and the glue buffer deformation of the base plate 1 caused by ambient temperature fluctuations, thereby maintaining a stable relative position between the laser light source 3, lens 4, and color sensor 5, thereby improving the sensor's measurement accuracy and stability. Furthermore, the provision of a thermally conductive element overcomes the poor thermal conductivity of the low thermal expansion coefficient plate 2, ensuring excellent heat dissipation throughout the structure. The sensor structure is simple, easy to install and maintain, and highly practical.

[0042] Furthermore, thermal grease is provided between the first heat conductor 6 and the laser light source 3 and the base plate 1, and thermal grease is also provided between the second heat conductor 7 and the color sensor 5 and the base plate 1. The heat generated by the laser light source 3 and the color sensor 5 can be quickly transferred to the base plate 1 through the thermal grease for heat dissipation, thereby ensuring the heat dissipation performance of the entire sensor structure.

[0043] Reference Figure 1 、 Figure 2 and Figure 3 As shown, further, the laser light source 3, the lens 4 and the color sensor 5 are pre-connected to the low thermal expansion coefficient plate 2 through fasteners, and are all bonded to the low thermal expansion coefficient plate 2 through glue.

[0044] Reference Figure 4 and Figure 5As shown, further, a through groove 21 and a notch 22 are respectively opened on the low thermal expansion coefficient plate 2, and the through groove 21 and the notch 22 are respectively close to the laser light source 3 and the color sensor 5.

[0045] Furthermore, a groove is milled into the base plate 1, and an extension 11 is formed by milling to extend into the groove. The shape of the extension 11 matches the shape of the notch 22. The low thermal expansion coefficient plate 2 is disposed in the groove, and the notch 22 and the extension 11 engage with each other. It is conceivable that the cooperation between the notch 22 and the extension 11 facilitates the positioning and installation of the low thermal expansion coefficient plate 2 by the operator, and also facilitates the connection of the second heat conductor 7 to the base plate 1.

[0046] Reference Figure 3 As shown, further, a first heat dissipation area 12 and a second heat dissipation area 13 are respectively provided on the base plate 1. The position of the first heat dissipation area 12 corresponds to the position of the through slot 21, and the second heat dissipation area 13 is located on the extension portion 11. One end of the first heat conductor 6 passes through the through slot 21 and is bonded to the base plate 1 at the position of the first heat dissipation area 12, and one end of the second heat conductor 7 is bonded to the base plate 1 at the position of the second heat dissipation area 13. Specifically, since most low thermal expansion materials generally have poor thermal conductivity, some low thermal expansion materials have good thermal conductivity but are costly and difficult to process. Therefore, providing a heat dissipation area on the base plate 1 and cooperating with the heat conductor to conduct heat generated by the heat-sensitive components to the heat dissipation area for dissipation can greatly reduce costs.

[0047] Furthermore, the first heat conducting member 6 and the second heat conducting member 7 are both L-shaped metal members, and are made of copper or aluminum. Specifically, the first heat conducting member 6 and the second heat conducting member 7 are both made of materials with good thermal conductivity, such as copper or aluminum, but not limited to the above materials.

[0048] Furthermore, the low thermal expansion coefficient plate 2 can be a metal plate with a low thermal expansion coefficient such as an Invar plate or a ceramic plate with a low thermal expansion coefficient such as an aluminum nitride plate, an aluminum oxide plate, or a silicon carbide plate. The selection can be made based on the different thermal conductivity, processability, and cost of the material.

[0049] Furthermore, the color sensor 5 is connected to a bracket, which is connected to the low thermal expansion coefficient board 2. The bracket is an L-shaped block structure, connected to the low thermal expansion coefficient board 2 by fasteners, and a mounting position for mounting the color sensor 5 is provided on the bracket. Example 2

[0050] The utility model also discloses a detection device, which includes the sensor structure as in the first embodiment.

[0051] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A sensor structure, characterized in that: include: A bottom plate, wherein the bottom plate is a metal plate; A low thermal expansion coefficient plate, wherein the low thermal expansion coefficient plate is horizontally bonded to one surface of the base plate by glue; A laser light source connected to the low thermal expansion coefficient plate; A lens, wherein the lens is mounted on the low thermal expansion coefficient board; a color sensor, the color sensor being disposed on the low thermal expansion coefficient board; a first heat-conducting member, wherein two ends of the first heat-conducting member are respectively bonded to the laser light source and the bottom plate by glue; The second heat conducting member has two ends bonded to the color sensor and the bottom plate respectively by glue.

2. The sensor structure according to claim 1, wherein: Thermal conductive silicone grease is provided between the first heat conducting member, the laser light source and the bottom plate, and thermal conductive silicone grease is also provided between the second heat conducting member, the color sensor and the bottom plate.

3. The sensor structure according to claim 1, wherein: The laser light source, the lens and the color sensor are pre-connected to the low thermal expansion coefficient plate through fasteners, and are all bonded to the low thermal expansion coefficient plate through glue.

4. The sensor structure according to claim 1, wherein: A through groove and a notch are respectively formed on the low thermal expansion coefficient plate, and the through groove and the notch are respectively close to the laser light source and the color sensor.

5. The sensor structure according to claim 4, characterized in that: A groove is milled on the bottom plate and an extension portion extending into the groove is formed by milling. The shape of the extension portion matches the shape of the notch. The low thermal expansion coefficient plate is arranged in the groove, and the notch and the extension portion are embedded in each other.

6. The sensor structure according to claim 5, characterized in that: A first heat dissipation area and a second heat dissipation area are respectively provided on the base plate. The position of the first heat dissipation area corresponds to the position of the through slot. The second heat dissipation area is located on the extension portion. One end of the first heat conductor passes through the through slot and is bonded to the base plate at the position of the first heat dissipation area. One end of the second heat conductor is bonded to the base plate at the position of the second heat dissipation area.

7. The sensor structure according to claim 1, characterized in that: The first heat conducting member and the second heat conducting member are both L-shaped metal members, and are made of copper or aluminum.

8. The sensor structure according to claim 1, wherein: The low thermal expansion coefficient plate is made of Invar plate, aluminum nitride plate, aluminum oxide plate or silicon carbide plate.

9. The sensor structure according to claim 1, characterized in that: The color sensor is connected to a bracket, and the bracket is connected to the low thermal expansion coefficient board.

10. A detection device, characterized in that: The sensor structure comprises the sensor structure according to any one of claims 1 to 9.

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