Light source structure of photoetching machine

Abstract

The utility model relates to a light source structure of a photoetching machine, and relates to the technical field of photoetching. The light source structure of the photoetching machine comprises a supporting structure, a lamp body, a shielding structure, a temperature detection device and a cooling device, the supporting structure is provided with a first opening, laser generated by the lamp body can penetrate through the first opening so as to carry out an exposure process, and the shielding structure can control opening and closing of the first opening. In order to guarantee that the shielding structure is not damaged while the lamp body is turned on all the time, the temperature of the shielding structure is detected through the temperature detection device, then the temperature of the shielding structure is fed back to the cooling device, the cooling device conducts precise cooling according to the temperature of the shielding structure, and therefore the situation that the shielding structure is damaged due to too high heat is avoided; and the shutdown of the photoetching machine table is further avoided.

Description

Technical Field

[0001] The present application relates to the field of photolithography technology, and in particular to a light source structure of a photolithography machine. Background Art

[0002] In order to meet the requirements of the exposure process, existing photolithography machines usually keep the light source on all the time, that is, when not exposing, the light source is always maintained at high power.

[0003] However, when the light source is always at high power, it will generate high energy and high heat. In addition, the gravity factor will cause the shielding structure that blocks the light source when exposure is not required to be deformed and damaged, causing the lithography machine to alarm and shut down.

[0004] Based on this, how to cool down the shielding structure that blocks the light source is a technical problem that those skilled in the art urgently need to solve. Utility Model Content

[0005] Based on this, it is necessary to provide a light source structure of a photolithography machine in order to reduce the temperature of the shielding structure.

[0006] In order to achieve the above-mentioned object, on the one hand, the present invention provides a light source structure of a lithography machine, the light source structure of the lithography machine comprising:

[0007] Support structure, lamp body, shielding structure, temperature detection device and cooling device;

[0008] The support structure has a first opening, and the first opening is used for light transmission;

[0009] The lamp body is located on one side of the supporting structure and is used to emit laser;

[0010] The shielding structure is located on a side of the supporting structure away from the lamp body, and is used to open or close the first opening;

[0011] The temperature detection device is used to detect the temperature of the shielding structure and feed back the temperature to the cooling device;

[0012] The temperature-reducing device is located on a side of the shielding structure away from the supporting structure, and is used to reduce the temperature of the shielding structure according to feedback from the temperature detection device.

[0013] In one embodiment, the temperature detection device includes:

[0014] a temperature detection unit, configured to detect the temperature of the shielding structure;

[0015] The first control unit is electrically connected to the temperature detection unit and the cooling device respectively, and is used to feed back a comparison result between the temperature of the shielding structure and a preset temperature to the cooling device.

[0016] In one embodiment, the temperature detection unit is a thermistor.

[0017] In one embodiment, the light source structure of the lithography machine further includes:

[0018] A sensor is located on a side of the support structure where the shielding structure is provided, is electrically connected to the cooling device, and is used to detect the opening and closing of the shielding structure and feed back the detection result to the cooling device.

[0019] In one embodiment, the cooling device comprises:

[0020] A temperature control plate is located on an upper surface of the shielding structure away from the supporting structure;

[0021] A temperature control unit is electrically connected to the temperature control board and is used to adjust the temperature of the temperature control board according to feedback from the temperature detection device.

[0022] In one embodiment, the temperature control plate includes a semiconductor refrigeration plate.

[0023] In one embodiment, the temperature control plate includes a plurality of annular structures, which are concentric rings and are arranged in a sparse outer and dense inner manner.

[0024] In one embodiment, an orthographic projection of the temperature control plate in the first direction at least partially overlaps with an orthographic projection of the first opening in the first direction.

[0025] In one embodiment, the light source structure of the lithography machine further includes:

[0026] A switch shaft connects the supporting structure and the shielding structure, and is used to rotate the shielding structure to open or close the first opening.

[0027] In one embodiment, the temperature detection device is adjacent to the switch shaft.

[0028] Compared with the existing technology, the above technical solution has the following advantages:

[0029] The light source structure of the lithography machine includes a support structure, a lamp body, a shielding structure, a temperature detection device, and a cooling device. The support structure has a first opening, through which the laser light generated by the lamp body can pass to perform the exposure process. The shielding structure can control the opening and closing of the first opening. To ensure that the lamp body is always on without damaging the shielding structure, the temperature of the shielding structure is detected by the temperature detection device, and the temperature of the shielding structure is then fed back to the cooling device. The cooling device accurately cools the shielding structure based on the temperature of the shielding structure, thereby preventing the shielding structure from being damaged due to excessive heat and further preventing the lithography machine from shutting down. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic structural diagram of a light source structure of a photolithography machine is provided for an embodiment of the present application;

[0032] Figure 2 A schematic top view of a light source structure of a photolithography machine is provided for an embodiment of the present application;

[0033] Figure 3 A schematic structural diagram of a light source structure of another lithography machine is provided for an embodiment of the present application;

[0034] Figure 4 A structural schematic diagram of a light source structure of another lithography machine is provided for an embodiment of the present application;

[0035] Figure 5 A schematic top view of a light source structure of another lithography machine is provided for an embodiment of the present application;

[0036] Figure 6 A schematic diagram of a semiconductor refrigeration plate refrigeration principle is provided for an embodiment of the present application;

[0037] Figure 7 A schematic diagram of a top view of a temperature control plate is provided for an embodiment of the present application.

[0038] Explanation of the accompanying drawings: 01-support structure; 02-lamp body; 03-shielding structure; 04-temperature detection device; 05-cooling device; 06-first opening; 07-elliptical mirror; 08-sensor; 09-switch shaft; 051-temperature control panel. DETAILED DESCRIPTION

[0039] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0041] It will be understood that when a layer is referred to as being "on," "adjacent," or "connected to" another layer, it can be directly on, adjacent, or connected to the other layer, or intervening layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent," or "directly connected to" another layer, there are no intervening layers present.

[0042] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0044] refer to Figure 1 , Figure 1 A schematic diagram of a light source structure of a lithography machine is provided for reference in the embodiment of the present application; Figure 2 , Figure 2 A schematic top view of a light source structure of a lithography machine is provided for an embodiment of the present application; the light source structure of the lithography machine includes:

[0045] Support structure 01, lamp body 02, shielding structure 03, temperature detection device 04 and cooling device 05.

[0046] The support structure 01 has a first opening 06 , and the first opening 06 is used for light transmission.

[0047] The lamp body 02 is located on one side of the supporting structure 01 and is used to emit laser.

[0048] The shielding structure 03 is located on a side of the supporting structure 01 facing away from the lamp body 02 and is used to open or close the first opening 06 .

[0049] The temperature detection device 04 is used to detect the temperature of the shielding structure 03 and feed back the temperature to the cooling device 05 .

[0050] The cooling device 05 is located on a side of the shielding structure 03 away from the supporting structure 01 , and is used to cool the shielding structure 03 according to feedback from the temperature detection device 04 .

[0051] Specifically, in this embodiment, the lamp body 02 used in the lithography machine may be a mercury lamp, and the support structure 01 is only a partial structural representation. Figure 1 The support structure 01 shown is only used to support the shielding structure 03, temperature detection device 04, and cooling device 05. In the light source structure of the lithography machine, the support structure 01 is only a part of the support frame and is not described in detail here. The support structure 01 has a first opening 06. When the lithography machine performs the exposure process, the first opening 06 is opened, and the laser emitted by the lamp body 02 is transmitted through the first opening 06, thereby performing the exposure. The shielding structure 03 can be moved to open and close the first opening 06 to ensure that the lithography machine emits laser light from the first opening 06 when exposure is required and blocks the laser light when exposure is not required.

[0052] refer to Figure 3 , Figure 3 The present invention provides a schematic diagram of another light source structure for a photolithography machine. To ensure sufficient laser energy for exposure, an elliptical mirror 07 is provided on the periphery of the lamp body 02, focusing the majority of the laser light emitted by the mercury lamp at the first opening 06. Because the mercury lamp is constantly on, it generates high energy and heat. In the existing structure, when the photolithography machine is not exposing, the shielding structure 03 bends and deforms due to the increased heat, causing the photolithography machine to shut down and generate an alarm.

[0053] However, this application installs a cooling device 05 and a temperature detection device 04 on the side of the shielding structure 03 facing away from the support structure 01. The temperature detection device 04 can detect the temperature of the shielding structure 03 in real time and then feed the detected temperature of the shielding structure 03 back to the cooling device 05. The cooling device 05 accurately cools the shielding structure 03 based on the temperature feedback from the temperature detection device 04, thus achieving a closed-loop temperature control. When the temperature is lowered, the shielding structure 03 will not deform due to high temperature and gravity.

[0054] In the light source structure of the lithography machine, in order to ensure that the lamp body 02 is always on without damaging the shielding structure 03, the temperature of the shielding structure 03 is detected by the temperature detection device 04, and then the temperature of the shielding structure 03 is fed back to the cooling device 05. The cooling device 05 accurately cools the shielding structure 03 according to the temperature of the shielding structure 03, thereby avoiding damage to the shielding structure 03 due to excessive heat, and further avoiding shutdown of the lithography machine.

[0055] Optionally, in another embodiment of the present application, refer to Figure 4 , Figure 4 A schematic diagram of a light source structure of another lithography machine is provided for the embodiment of the present application; Figure 5 , Figure 5 A schematic top view of a light source structure of another lithography machine is provided for an embodiment of the present application; the light source structure of the lithography machine further includes:

[0056] The sensor 08 is located on the side of the support structure 01 where the shielding structure 03 is provided, and is electrically connected to the cooling device 05 . The sensor 08 is used to detect the opening and closing of the shielding structure 03 and feed back the detection result to the cooling device 05 .

[0057] Specifically, in this embodiment, the sensor 08 may be a VSO sensor, for example Figure 4 and Figure 5 The sensor 08 is arranged on the upper surface of the support structure 01. The VSO sensor can detect whether the shielding structure 03 is opened or closed. When it detects that it is opened, the VSO sensor outputs "1", and when it detects that it is closed, the VSO sensor outputs "0". When the sensor 08 detects that the shielding structure 03 opens the first opening 06, it will feed back the opening signal "1" to the cooling device 05. Because the shielding structure 03 does not block the first opening 06 at this time, there is no high temperature accumulation. The cooling device 05 can turn off the power supply to reduce the energy waste of the light source structure of the lithography machine. When the sensor 08 detects that the shielding structure 03 closes the first opening 06, it will feed back the closing signal "0" to the cooling device 05. Because the shielding structure 03 blocks the first opening 06 at this time, the cooling device 05 turns on the power supply and is in a working state to reduce the temperature of the shielding structure 03, thereby preventing the shielding structure 03 from being damaged due to excessive heat, and further avoiding the shutdown of the lithography machine.

[0058] In addition, the machine safety interlock device can also trigger the shielding structure 03 to close, blocking the laser from entering the optical path to ensure personnel safety.

[0059] Optionally, in another embodiment of the present application, refer to Figure 3 and Figure 4 , the light source structure of the lithography machine also includes:

[0060] The switch shaft 09 connects the supporting structure 01 and the shielding structure 03 and is used to rotate the shielding structure 03 to open or close the first opening 06 .

[0061] Specifically, the switch shaft 09 connects the support structure 01 to the shielding structure 03. When the lithography machine is about to perform exposure, the shielding structure 03 rotates via the switch shaft 09 to open the first opening 06. At this time, the shielding structure 03 can contact the sensor 08, so that the sensor 08 detects the opening signal. When the lithography machine does not need to perform exposure, the shielding structure 03 rotates via the switch shaft 09 to close the first opening 06, that is, to shield the first opening 06. At this time, the shielding structure 03 loses contact with the sensor 08, and the sensor 08 detects the closing signal.

[0062] Optionally, in another embodiment of the present application, the temperature detection device 04 is adjacent to the switch shaft 09 .

[0063] Specifically, in this embodiment, the temperature detection device 04 may be adjacent to the switch shaft 09. It should be noted that the position of the temperature detection device 04 is not limited, but when it is made on the shielding structure 03 or the switch shaft 09, the temperature measurement is more accurate.

[0064] Optionally, in another embodiment of the present application, the temperature detection device 04 includes:

[0065] The temperature detection unit is used to detect the temperature of the shielding structure.

[0066] The first control unit is electrically connected to the temperature detection unit and the cooling device 05 respectively, and is used to feed back the comparison result between the temperature of the shielding structure 03 and the preset temperature to the cooling device 05 .

[0067] Specifically, in this embodiment, a preset temperature is defined in the first control unit, and the preset temperature can be 50°C. There is no specific limitation on this, and it is set according to actual needs. After the temperature detection unit detects the temperature of the shielding structure 03, the first control unit reads the temperature of the shielding structure 03 and compares it with the preset temperature. When the temperature is higher than the preset temperature, the cooling device 05 increases the power to cool down; when the temperature is equal to the preset temperature, the cooling device 05 maintains the power to cool down, forming a closed loop of temperature control, which can form variable frequency temperature control to achieve the purpose of rapid cooling and precise temperature control. The temperature detection device 04 converts the temperature comparison result into an electrical signal in real time and feeds it back to the cooling device 05. The cooling device 05 controls the cooling power according to the electrical signal to achieve rapid cooling and stable temperature control.

[0068] Optionally, in another embodiment of the present application, the temperature detection unit is a thermistor.

[0069] Specifically, a thermistor is an electronic component that is sensitive to temperature, and its resistance value changes with temperature. The temperature change can be mapped by the change in resistance value, and then the temperature can be compared in the first control unit.

[0070] Optionally, in another embodiment of the present application, the cooling device 05 includes:

[0071] The temperature control plate is located on the upper surface of the shielding structure 03 away from the supporting structure 01 .

[0072] The temperature control unit is electrically connected to the temperature control board and is used to adjust the temperature of the temperature control board according to the feedback from the temperature detection device 04.

[0073] Specifically, in this embodiment, the cooling device 05 includes a temperature control plate and a temperature control unit. When the lithography machine does not need exposure, the power supply of the cooling device 05 is in working state, and the temperature control unit receives the comparison result of the temperature of the shielding structure 03 from the temperature detection device 04, and controls the temperature of the temperature control plate according to the comparison result, thereby reducing the temperature of the shielding structure 03.

[0074] Optionally, in another embodiment of the present application, refer to Figure 6 , Figure 6 A refrigeration principle diagram of a semiconductor refrigeration plate is provided for an embodiment of the present application; the temperature control plate includes a semiconductor refrigeration plate.

[0075] Specifically, semiconductor cooling panels utilize the Peltier effect of semiconductors. This effect occurs when current passes through a junction composed of two dissimilar semiconductor materials, generating heat absorption and release at the junction. Free electrons in the N-type semiconductor and "holes" in the P-type semiconductor migrate in a directional manner under the influence of an applied electric field, forming a current known as "carriers." This movement of carriers transfers heat, causing one end to absorb heat and cool down, while the other end releases heat and warms up. By controlling the direction and magnitude of the current, the temperature difference between the hot and cold ends of the semiconductor cooling panel can be adjusted. It should be noted that using semiconductor cooling panels is more convenient for cooling.

[0076] Optionally, in another embodiment of the present application, refer to Figure 7 , Figure 7 A schematic diagram of a top view of the structure of a temperature control plate is provided for an embodiment of the present application; the temperature control plate 051 includes a plurality of annular structures, which are concentric rings and are arranged in a sparse outer and dense inner manner.

[0077] Specifically, such as Figure 5 As shown, the shape of the temperature control plate can be a circular ring structure, such as Figure 7The temperature control plate 051 may also be in the shape of a regular hexagonal ring structure, without specific limitation. For example, it may be in the shape of a square ring structure or another regular polygonal ring structure. Because the light generated by the mercury lamp is focused at the first opening 06, the temperature at the focus is higher than in other areas. Therefore, the ring structure can be configured as concentric rings, arranged in a sparse outer and dense inner pattern, with the center temperature being the highest and the high density resulting in a better cooling effect.

[0078] Optionally, in another embodiment of the present application, the orthographic projection of the temperature control plate 051 in the first direction at least partially overlaps with the orthographic projection of the first opening 06 in the first direction.

[0079] Specifically, the first direction is perpendicular to the support structure 01, and the orthographic projection of the temperature control plate 051 in the first direction at least partially overlaps with the orthographic projection of the first opening 06 in the first direction. In other words, the temperature control plate 051 is positioned near the first opening 06 to achieve a better cooling effect.

[0080] In one embodiment, since the temperature control plate 051 also has weight, the geometric center of the temperature control plate 051 is located on the same straight line as the center of the first opening 06. This can prevent the shielding structure 03 from being bent due to the excessive weight of the temperature control plate 051.

[0081] In this specification, reference to terms such as "some embodiments," "one embodiment," or "another embodiment" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0082] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A light source structure of a photolithography machine, characterized in that: The light source structure of the lithography machine includes: Support structure, lamp body, shielding structure, temperature detection device and cooling device; The support structure has a first opening, and the first opening is used for light transmission; The lamp body is located on one side of the supporting structure and is used to emit laser; The shielding structure is located on a side of the supporting structure away from the lamp body, and is used to open or close the first opening; The temperature detection device is used to detect the temperature of the shielding structure and feed back the temperature to the cooling device; The temperature-reducing device is located on a side of the shielding structure away from the supporting structure, and is used to reduce the temperature of the shielding structure according to feedback from the temperature detection device.

2. The light source structure of the lithography machine according to claim 1, characterized in that: The temperature detection device comprises: a temperature detection unit, configured to detect the temperature of the shielding structure; The first control unit is electrically connected to the temperature detection unit and the cooling device respectively, and is used to feed back a comparison result between the temperature of the shielding structure and a preset temperature to the cooling device.

3. The light source structure of the lithography machine according to claim 2, characterized in that: The temperature detection unit is a thermistor.

4. The light source structure of the lithography machine according to claim 1, characterized in that: The light source structure of the lithography machine further includes: A sensor is located on a side of the support structure where the shielding structure is provided, is electrically connected to the cooling device, and is used to detect the opening and closing of the shielding structure and feed back the detection result to the cooling device.

5. The light source structure of the photolithography machine according to claim 1, characterized in that: The cooling device comprises: A temperature control plate is located on an upper surface of the shielding structure away from the supporting structure; A temperature control unit is electrically connected to the temperature control board and is used to adjust the temperature of the temperature control board according to feedback from the temperature detection device.

6. The light source structure of the photolithography machine according to claim 5, characterized in that: The temperature control plate includes a semiconductor refrigeration plate.

7. The light source structure of the photolithography machine according to claim 5, characterized in that: The temperature control plate includes a plurality of annular structures, which are concentric rings and are arranged in a sparse outer and dense inner manner.

8. The light source structure of the photolithography machine according to claim 5, characterized in that: An orthographic projection of the temperature control plate in the first direction at least partially overlaps with an orthographic projection of the first opening in the first direction.

9. The light source structure of the photolithography machine according to claim 1, characterized in that: The light source structure of the lithography machine further includes: A switch shaft connects the supporting structure and the shielding structure, and is used to rotate the shielding structure to open or close the first opening.

10. The light source structure of the photolithography machine according to claim 9, characterized in that: The temperature detection device is adjacent to the switch shaft.

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