Semiconductor intelligent goods shelf and semiconductor intelligent logistics system

Abstract

The utility model provides an intelligent semiconductor goods shelf and an intelligent semiconductor logistics system. The intelligent semiconductor goods shelf comprises a storage rack, a positioning device, a grabbing mechanism and a loading table. The storage rack comprises a plurality of storage positions used for bearing carriers, and the multiple storage positions are arranged along the X-Z plane. The storage rack and the positioning device are arranged in parallel in the Y direction; the positioning device comprises a base and a mechanical arm arranged on the base, and the base can move in the X-Z plane direction; the grabbing mechanism is connected with the mechanical arm, and the grabbing mechanism is driven by the mechanical arm to move at least in the Y direction so as to grab and carry the carrier in the Y direction; the loading table is arranged on one side of the positioning device in the Y direction and used for bearing a carrier which is carried in or carried out. The grabbing mechanism is configured to be driven by the positioning device to carry a carrier between the multiple storage positions or between the storage positions and the loading table.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, and in particular to a semiconductor intelligent shelf and a semiconductor intelligent logistics system. Background Art

[0002] As we all know, semiconductor manufacturing plants have extremely high operating costs. Even standing idle after process equipment is started up incurs high costs. This idle time, which does not generate production capacity, directly leads to significant cost losses. Therefore, semiconductor manufacturing plants are places where every second counts, and process times must be shortened as much as possible, eliminating unnecessary waiting time to avoid costly waste.

[0003] Process times can include vapor deposition, photolithography, etching, electroplating, ion implantation, annealing, cleaning, and drying. These times are strictly adhered to according to the semiconductor product's process flow (or process recipe). Compressing process time is extremely challenging, as it depends on numerous factors, including product performance requirements, material properties, and process equipment capabilities. Adjusting a single process time often requires adjustments to numerous process parameters, making it extremely difficult and with limited margin for adjustment. Even with significant effort, time savings can only reach a few minutes or even seconds at best.

[0004] By comparison, wafer handling time within a semiconductor manufacturing plant is more easily controlled. As mentioned above, semiconductor manufacturing involves a complex production process. For example, chip manufacturing requires repeated handling between various process equipment, between various stockers, between process equipment and stockers, and even within stockers. Therefore, handling efficiency is a key factor in the large-scale production of semiconductor products.

[0005] To address the production and handling issues of semiconductor products, the current solution is to use expensive overhead crane systems (AMHS, OHT). These systems are installed on the roof of the semiconductor fabrication plant, hence the name "overhead crane." However, while these systems address the handling of semiconductor products, they can only transport them to the designated storage space (stocker). They cannot address the handling of semiconductor products within the stocker, nor can they transport them to locations close to the next process equipment. They still require manual transport using carts, which consumes additional manpower and time. Furthermore, the installation of these overhead crane systems requires the cleanroom height to be increased by approximately 4 meters. For example, for a 100m*100m cleanroom, the cleanroom volume would increase by 40,000 cubic meters, significantly increasing energy consumption and construction costs.

[0006] Furthermore, the existing equipment cannot be expanded in height due to the limited access to materials. Due to capacity constraints, the current storage space has low storage levels, which is ergonomically unsuitable for personnel access. Furthermore, the lower storage levels are small (e.g., less than 750mm), which cannot meet PARTICLE requirements. Utility Model Content

[0007] The purpose of the present utility model is to provide a semiconductor intelligent shelf and a semiconductor intelligent logistics system to solve the problems of inconvenience in the transportation of existing semiconductor products within the storage space and the inconvenience in the input, output and loading of the storage space.

[0008] In order to solve the above technical problems, the present invention provides a semiconductor intelligent shelf, which includes: a storage rack, a positioning device, a gripping mechanism and a loading platform; the storage rack includes a plurality of storage locations for carrying carriers, and the plurality of storage locations are arranged along the XZ plane; the storage rack and the positioning device are arranged side by side along the Y direction; the positioning device includes a base and a robotic arm arranged on the base, and the base is movable along the XZ plane direction; the gripping mechanism is connected to the robotic arm, and the gripping mechanism is movable at least along the Y direction under the drive of the robotic arm to grip and transport the carrier along the Y direction; the loading platform is arranged on one side of the positioning device along the Y direction, for carrying carriers moved in or out; the gripping mechanism is configured to transport carriers between the plurality of storage locations or between the storage locations and the loading platform under the drive of the positioning device.

[0009] Optionally, the loading platform and the storage rack are on the same XZ plane; or, the loading platform and the storage rack are on opposite sides of the positioning device along the Y direction.

[0010] Optionally, the semiconductor smart shelf also includes a transfer platform; the transfer platform and the loading platform are arranged adjacent to each other along the X direction or the Y direction; there is an entry and exit handling device between the transfer platform and the loading platform, and the entry and exit handling device is movable along the X direction or the Y direction to transport the carrier back and forth between the transfer platform and the loading platform.

[0011] Optionally, the semiconductor smart shelf also includes a rail loading position; the rail loading position is arranged on one side of the positioning device along the Y direction, and the rail loading position is flush with the rail pulley along the Z direction; the rail loading position is used to connect to the rail pulley or to carry a carrier that is connected to the rail pulley.

[0012] Optionally, the positioning device includes a transverse slide rail extending along the X direction and a longitudinal slide rail extending along the Z direction;

[0013] The transverse slide rail is movably provided on the longitudinal slide rail along the Z direction, and the base is movably provided on the transverse slide rail along the X direction; or

[0014] The longitudinal slide rail is movably arranged on the transverse slide rail along the X direction, and the base is movably arranged on the longitudinal slide rail along the Z direction.

[0015] Optionally, the positioning device includes a horizontal slide, which is movably arranged along the X direction; the base is movably arranged on the horizontal slide along the Z direction.

[0016] Optionally, the robotic arm includes a first arm, a second arm, a first rotational joint, a second rotational joint, and a third rotational joint; the rotation axes of the first rotational joint, the second rotational joint, and the third rotational joint all extend along the Z direction;

[0017] The first arm is rotatably provided on the base via the first rotation joint, the second arm is rotatably provided on the first arm via the second rotation joint, and the grasping mechanism is rotatably provided on the second arm via the third rotation joint;

[0018] The gripping mechanism is configured to achieve movement at least along the Y direction based on rotation of the first rotational joint, the second rotational joint, and the third rotational joint.

[0019] Optionally, the robotic arm includes a first arm, a second arm, a third arm, a first rotational joint, a second rotational joint, a third rotational joint, and a fourth rotational joint; the rotation axis of the first rotational joint extends along the Z direction, the rotation axis of the second rotational joint is perpendicular to the rotation axis of the first rotational joint, the rotation axis of the third rotational joint is parallel to the rotation axis of the second rotational joint, and the rotation axis of the fourth rotational joint is perpendicular to the rotation axis of the third rotational joint;

[0020] The first arm is rotatably provided on the base via the first rotation joint, the second arm is rotatably provided on the first arm via the second rotation joint, the third arm is rotatably provided on the second arm via the third rotation joint, and the grasping mechanism is rotatably provided on the third arm via the fourth rotation joint;

[0021] The gripping mechanism is configured to achieve movement at least along the Y direction based on rotation of the first rotational joint, the second rotational joint, the third rotational joint, and the fourth rotational joint.

[0022] Optionally, the storage location has a radio frequency identification module for identifying the loading ID information of the vehicle carried by the storage location.

[0023] In order to solve the above technical problems, the present invention also provides a semiconductor intelligent logistics system, which includes at least two semiconductor intelligent shelves as described above, and also includes a track and a track pulley; at least two of the semiconductor intelligent shelves are connected by the track, and the track pulley is movably arranged on the track along the track; a carrier is transported between at least two of the semiconductor intelligent shelves via the track pulley;

[0024] or

[0025] The semiconductor intelligent logistics system includes process equipment and the semiconductor intelligent shelves as described above, and also includes rails and rail pulleys; the process equipment and the semiconductor intelligent shelves are connected through the rails, and the rail pulleys are movably arranged on the rails along the rails; the carriers are transported between the process equipment and the semiconductor intelligent shelves via the rail pulleys.

[0026] In summary, in the semiconductor smart shelf and semiconductor smart logistics system provided by the present invention, the semiconductor smart shelf includes: a storage rack, a positioning device, a gripping mechanism and a loading platform; the storage rack includes a plurality of storage locations for carrying carriers, and the plurality of storage locations are arranged along the XZ plane; the storage rack and the positioning device are arranged side by side along the Y direction; the positioning device includes a base and a robotic arm arranged on the base, and the base is movable along the XZ plane direction; the gripping mechanism is connected to the robotic arm, and the gripping mechanism is movable at least along the Y direction under the drive of the robotic arm to grip and transport the carrier along the Y direction; the loading platform is arranged on one side of the positioning device along the Y direction, for carrying carriers moved in or out; the gripping mechanism is configured to transport carriers between the plurality of storage locations or between the storage locations and the loading platform under the drive of the positioning device.

[0027] With this configuration, the positioning device and the storage rack are arranged side by side, so that the grasping mechanism can move freely to the position corresponding to each storage location in the space without affecting the storage rack, and grasp and move the carrier, thereby realizing the transportation of the carriers in each storage location inside the semiconductor smart shelf. Furthermore, based on the parallel arrangement of the loading platform and the positioning device, the grasping mechanism can move the carrier into or out of the loading platform without affecting the loading platform, facilitating the input or output of the carrier. Furthermore, based on the setting of the positioning device and the grasping mechanism, the limitations of manual material collection are overcome, and the storage racks and storage locations can make full use of the height, preferably extending to the ceiling, to make full use of the space in the clean room. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Those skilled in the art will appreciate that the accompanying drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0029] Figure 1 Schematic diagram of a semiconductor smart shelf according to an embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of the semiconductor smart shelf in another direction of an embodiment of the present invention, in which the robotic arm includes 3 degrees of freedom.

[0031] Figure 3 This is a schematic diagram of the semiconductor smart shelf in another direction of an embodiment of the present invention, in which the robotic arm includes 4 degrees of freedom.

[0032] Figure 4 This is a top view of the semiconductor smart shelf according to an embodiment of the present invention.

[0033] Figure 5 It is a side view of the semiconductor smart shelf according to an embodiment of the present utility model.

[0034] Figure 6 It is a schematic diagram of the storage location and the carrier according to an embodiment of the present utility model.

[0035] Figure 7 It is a schematic diagram of a transfer platform, a loading platform and an in-and-out handling device according to an embodiment of the present utility model.

[0036] Figure 8 This is a schematic diagram of the layout of semiconductor smart shelves and tracks in an embodiment of the present utility model.

[0037] Figure 9 Schematic diagram of a semiconductor intelligent logistics system according to an embodiment of the present invention.

[0038] In the attached figure:

[0039] 10-storage rack; 11-storage location; 111-RFID module; 20-positioning device; 21-base; 22-robotic arm; 221-first arm; 222-second arm; 223-third arm; 224-first rotation joint; 225-second rotation joint; 226-third rotation joint; 227-fourth rotation joint; 23-horizontal slide; 24-longitudinal slide; 30-grasping mechanism; 40-loading platform; 50-carrier; 60-rail loading position; 70-rail; 71-rail pulley; 80-handover platform; 81-entry and exit handling device. DETAILED DESCRIPTION

[0040] To further clarify the objectives, advantages, and features of the present invention, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are highly simplified and not drawn to scale, and are intended solely to facilitate and clearly illustrate the objectives of the embodiments of the present invention. Furthermore, the structures shown in the drawings are often portions of the actual structures. In particular, different drawings may require different emphases and may use different scales.

[0041] As used in the present invention, the singular forms "a", "an", "one" and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the term "at least two" is generally used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" as well as "proximal end" and "distal end" generally refer to two corresponding parts, which include not only endpoints. In addition, as used in the present invention, "installed", "connected", "connected", and one element is "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0042] The present invention aims to provide a semiconductor intelligent shelf and semiconductor intelligent logistics system to solve the existing problem of inconvenience in transporting semiconductor products within storage spaces and in loading, unloading and importing the storage space.

[0043] Please refer to Figures 1 to 7, an embodiment of the present invention provides a semiconductor smart shelf, which includes: a storage rack 10, a positioning device 20, a gripping mechanism 30 and a loading platform 40; the storage rack 10 includes a plurality of storage locations 11 for carrying carriers 50, and the plurality of storage locations 11 are arranged along the XZ plane; the storage rack 10 and the positioning device 20 are arranged in parallel along the Y direction; the positioning device 20 includes a base 21 and a robotic arm 22 provided on the base 21, and the base 21 is movable along the XZ plane direction; the gripping mechanism 30 is connected to the robotic arm 22, and the gripping mechanism 30 is movable at least along the Y direction under the drive of the robotic arm 22 to grip and transport the carrier 50 along the Y direction; the loading platform 40 is provided on one side of the positioning device 20 along the Y direction, for carrying the carrier 50 to be moved in or out; the gripping mechanism 30 is configured to transport the carrier 50 between the plurality of storage locations 11 or between the storage location 11 and the loading platform 40 under the drive of the positioning device 20.

[0044] It should be noted that in this embodiment, the X and Y directions extend substantially horizontally, and the Z direction extends substantially vertically. Preferably, each of the X, Y, and Z directions is perpendicular to each other. It should be understood that the term "perpendicular" here should be broadly understood to include a certain degree of deviation. For example, an angle between the two directions within the range of 85° to 95° should be considered substantially perpendicular.

[0045] Semiconductor manufacturing facilities typically feature multiple process equipment, each used to process semiconductor products (including but not limited to wafers or chips) according to a specific process flow. After completing one process, the semiconductor product must be transferred to the next process equipment. Semiconductor products are often placed in a carrier 50 (including but not limited to a FOUP, FOSB, SMIF POD, open cassette, or reticle POD) and transported via the carrier 50. The carrier 50 is used to hold semiconductor products. Of course, it is understood that the carrier 50 can also be left empty and transported.

[0046] Optionally, the storage rack 10 can be constructed based on profiles, and has multiple layers, pallets or brackets to form storage locations 11. The size, arrangement spacing and number of the layers, pallets or brackets can be set according to the number and specifications of the carriers 50 to be stored. Figure 1In the illustrated example, the storage rack 10 forms storage locations 11 using shelves. Specifically, the storage rack 10 includes multiple shelves 12 extending along the XY plane, with the shelves 12 spaced apart along the Z direction. Each shelf 12 is provided with two to four storage locations 11 arranged along the X direction, and the carrier 50 can be placed on a storage location 11. As can be understood, all storage locations 11 are on the same XZ plane (which can be understood as a vertical plane). This arrangement facilitates the positioning device 20 and the gripping mechanism 30 to grasp and transport the carrier 50.

[0047] The storage rack 10 and the positioning device 20 are arranged side by side along the Y direction, meaning that they are arranged side by side on different XZ planes along the Y direction. This allows the moving components of the positioning device 20 (including but not limited to the base 21 and the robotic arm 22) to move freely along the XZ plane parallel to the storage rack 10 without being obstructed by the storage rack 10. The gripping mechanism 30 is preferably located at the distal end of the robotic arm 22, that is, the end of the robotic arm 22 distal from the connection with the base 21. Therefore, the gripping mechanism 30 can move with the movement of the base 21 and the robotic arm 22. To grasp or place a carrier 50 on a specific storage location 11 or loading platform 40, the base 21 and the robotic arm 22 can move along the XZ plane parallel to the storage rack 10, aligning the gripping mechanism 30 with the desired carrier 50 in the XZ direction. Then, driven by the robotic arm 22, the gripping mechanism 30 extends into the storage rack 10 along the Y direction to grasp or place the carrier 50. After completing the steps of grabbing or placing the carrier 50 , the grabbing mechanism 30 is driven by the robot arm 22 to move out of the storage rack 10 along the Y direction, and the moving component of the positioning device 20 can move to the position of the next carrier 50 to be operated.

[0048] In an alternative exemplary embodiment, the gripping mechanism 30 includes, for example, a fork-shaped claw, and the carrier 50 has a matching slot. The fork-shaped claw is inserted into the slot along the Y direction to grasp the carrier 50. Preferably, after the fork-shaped claw is inserted into the slot of the carrier 50, the base 21 or the robotic arm 22 can be slightly raised in the Z direction, thereby allowing the carrier 50 to leave the storage position 11. Then, when the gripping mechanism 30 moves out of the storage rack 10, it carries the carrier 50 with it. In the step of placing the carrier 50, the base 21 and the robotic arm 22 drive the gripping mechanism 30 to align with the target empty storage position 11 in the XZ direction, and then the robotic arm 22 drives the gripping mechanism 30 carrying the carrier 50 into the storage rack 10. After the carrier 50 is aligned with the storage position 11, the base 21 or the robotic arm 22 can be slightly lowered in the Z direction, thereby placing the carrier 50 on the storage position 11. The gripping mechanism 30 is then removed from the storage rack 10, completing the placement step of the carrier 50. It should be noted that the gripping mechanism 30 is not limited to comprising forked claws, and the carrier 50 is not limited to having a slot. In another embodiment, the gripping mechanism 30 may also comprise a clamp that can grip and place the carrier 50 by clamping and releasing it. Those skilled in the art will understand and configure this based on existing technology.

[0049] Optionally, the loading platform 40 and the storage rack 10 are located in the same XZ plane; alternatively, the loading platform 40 and the storage rack 10 are located on opposite sides of the positioning device 20 along the Y direction. The loading platform 40 is used to carry carriers 50 in and out. "Carrying in" or "carrying out" here refers to the transport of carriers 50 into or out of the semiconductor smart rack. In some embodiments, carriers 50 can be transported in or out of the loading platform 40 by a transport vehicle (including an AMR or manual transport vehicle, not shown; reference should be made to the prior art for understanding). In a preferred embodiment, the semiconductor smart rack is arranged in a long, rectangular shape extending along the X direction. In this case, the loading platform 40 must be offset from the positioning device 20 in the Y direction to avoid conflict with the positioning device 20's movement space. Therefore, there are two possible layouts for the loading platform 40: one is to place it on the same side of the positioning device 20 as the storage rack 10 (i.e., the loading platform 40 and the storage rack 10 are in the same XZ plane); the other is to place it on the opposite side of the storage rack 10. Figure 1 The example shown shows the loading platform 40 and storage rack 10 being arranged on the same side of the positioning device 20. This arrangement can relatively save space, but it will affect and occupy some of the storage rack 10's space, reducing the number of storage locations 11. In other embodiments, the loading platform 40 and storage rack 10 are arranged on opposite sides of the positioning device 20. This does not affect the storage rack 10's space or reduce the number of storage locations 11, but the loading platform 40 requires additional space. In practice, the selected configuration can be determined based on objective conditions and needs.

[0050] Optional, please refer to Figure 7The semiconductor smart shelf also includes a transfer platform 80; the transfer platform 90 is arranged adjacent to the loading platform 40 along the X direction or the Y direction, and there is an entry and exit handling device 81 between the transfer platform 80 and the loading platform 40. The entry and exit handling device 81 can move along the X direction or the Y direction to transport the carrier 50 back and forth between the transfer platform 80 and the loading platform 40.

[0051] In some embodiments, the semiconductor smart shelf may further be provided with a transfer platform 80 to transfer the carriers 50 that are moved in and out. The transfer platform 80 may be arranged in parallel with the loading platform 40 along the Y direction, and the entry and exit handling device 81 may, for example, move on a Y-direction slide rail and have a Z-direction micro-lifting mechanism. In the process of moving a carrier 50 in, the carrier 50 is first placed on the transfer platform 80 by a transport cart, and then the entry and exit handling device 81 uses the Z-direction micro-lifting mechanism to rise slightly in the Z direction to lift the carrier 50 so that the carrier 50 is separated from the transfer platform. The entry and exit handling device 81 then moves along the Y-direction slide rail toward the loading platform 40, and after it is aligned with the loading platform 40, the Z-direction micro-lifting mechanism descends slightly in the Z direction to place the carrier 50 on the loading platform 40. The process of moving out the carrier 50 can be understood with reference to the moving-in process, and will not be described in detail here. In another embodiment, the transfer platform 80 is not limited to being arranged adjacent to the loading platform 40 along the Y direction. The transfer platform 80 can also be arranged along the X direction at one end of the loading platform 40. In this case, the in-and-out handling device 81 can move on, for example, X-direction slide rails. Those skilled in the art can arrange the positions of the loading platform 40 and the transfer platform 80, as well as the handling direction of the in-and-out handling device 81, by comprehensively considering factors such as the actual space, the location of process equipment, and handling flow lines.

[0052] Of course, in some embodiments, the transfer station 80 and the loading and unloading device 81 may not be provided, and the loading station 40 may be directly used as a transfer station for the carriers 50 to be loaded and unloaded. This helps to simplify the structure and floor space of the semiconductor smart shelf. However, such a configuration may reduce the efficiency of loading and unloading in some cases. Those skilled in the art can configure whether to provide the transfer station 80 and the loading and unloading device 81 based on objective conditions and actual needs.

[0053] Optional, please refer to Figure 2 and Figure 3In some embodiments, the positioning device 20 includes a transverse slide 23 extending along the X-direction and a longitudinal slide 24 extending along the Z-direction; the transverse slide 23 is movably provided on the longitudinal slide 24 along the Z-direction, and the base 21 is movably provided on the transverse slide 23 along the X-direction, thereby forming a double-rod moving mechanism in the XZ plane. In this case, the base 21 can move freely in the XZ plane. Then, by driving the grasping mechanism 30 through the robotic arm 22, the grasping or placing operation of the carrier 50 at any position can be achieved. It is understandable that in other embodiments, the double-rod moving mechanism is not limited to the transverse slide 23 being provided on the longitudinal slide 24. It can also be that the longitudinal slide 24 is movably provided on the transverse slide 23 along the X-direction, and the base 21 is movably provided on the longitudinal slide 24 along the Z-direction, which has the same effect.

[0054] In other embodiments, the positioning device 20 is not limited to being a double-rod moving mechanism, and can also be configured as an elevator-type lifting mechanism (not shown). In one exemplary embodiment, the positioning device 20 includes a horizontal slide, which is movably arranged along the X direction; the base is movably arranged on the horizontal slide along the Z direction. The horizontal slide is movably arranged, for example, by a ground rail arranged in the X direction. The horizontal slide has a higher height in the Z direction and has a longitudinal lifting mechanism extending in the Z direction, and the base 21 is fixed to the longitudinal lifting mechanism. With this configuration, the base 21 can also move freely in the XZ plane.

[0055] The robot arm 22 is used to drive the grasping mechanism 30 to move in the Y direction. In the simplest embodiment, the robot arm 22 may only include one Y-direction telescopic joint, which can drive the robot arm 22 to move in the Y direction by telescoping. Such an embodiment can be applied to the solution in which the loading platform 40 and the storage rack 10 are arranged on the same side of the positioning device 20, but when responding to the solution in which the loading platform 40 and the storage rack 10 are arranged on opposite sides of the positioning device 20, the grasping mechanism 30 needs to span the entire positioning device 20. In this case, the robot arm 22 needs to have more degrees of freedom to have better adaptability. Taking into account the phased increase in production capacity demand of semiconductor smart shelves, the subsequent development of new products and the replacement of equipment selection leading to process upgrades, there may be a need for re-layout, and its shape, specifications and layout methods may all change. The robot arm 22 preferably includes multiple degrees of freedom. The following is an exemplary description of a multi-degree-of-freedom robot arm 22.

[0056] Please refer to Figure 2 and Figure 4In an alternative exemplary embodiment, the robotic arm 22 includes a first arm 221, a second arm 222, a first rotational joint 224, a second rotational joint 225 and a third rotational joint 226; the rotation axes of the first rotational joint 224, the second rotational joint 225 and the third rotational joint 226 all extend along the Z direction; the first arm 221 is rotatably arranged on the base 21 through the first rotational joint 224, the second arm 222 is rotatably arranged on the first arm 221 through the second rotational joint 225, and the grasping mechanism 30 is rotatably arranged on the second arm 222 through the third rotational joint 226; the grasping mechanism 30 is configured to achieve movement at least along the Y direction based on the rotation of the first rotational joint 224, the second rotational joint 225 and the third rotational joint 226. Based on the above configuration, it can be understood that based on the robot kinematic equation, under the joint action of the first rotational joint 224, the second rotational joint 225 and the third rotational joint 226, various complex operations can be achieved, such as driving the grasping mechanism 30 to extend into or exit the storage rack 10 along the Y direction, the grasping mechanism 30 to rotate 180° around the Z direction, and the grasping mechanism 30 to extend into or exit the loading platform 40 along the Y direction.

[0057] Please refer to Figure 3 and Figure 5 In another alternative exemplary embodiment, the robotic arm 22 includes a first arm 221, a second arm 222, a third arm 223, a first rotational joint 224, a second rotational joint 225, a third rotational joint 226 and a fourth rotational joint 227; the rotation axis of the first rotational joint 224 extends along the Z direction, the rotation axis of the second rotational joint 225 is perpendicular to the rotation axis of the first rotational joint 224, the rotation axis of the third rotational joint 226 is parallel to the rotation axis of the second rotational joint 225, and the rotation axis of the fourth rotational joint 227 is perpendicular to the rotation axis of the third rotational joint 226; the first The arm 221 is rotatably arranged on the base 21 through the first rotating joint 224, the second arm 222 is rotatably arranged on the first arm 221 through the second rotating joint 225, the third arm 223 is rotatably arranged on the second arm 222 through the third rotating joint 226, and the grasping mechanism 30 is rotatably arranged on the third arm 223 through the fourth rotating joint 227; the grasping mechanism 30 is configured to achieve movement at least along the Y direction based on the rotation of the first rotating joint 224, the second rotating joint 225, the third rotating joint 226 and the fourth rotating joint 227.

[0058] Based on the above configuration, it can be understood that Figure 3 and Figure 5The robotic arm 22 shown has at least four degrees of freedom. In addition to meeting the requirements for operations such as movement of the grasping mechanism 30 in the Y direction and rotation around the Z direction, it can also realize special requirements such as driving the grasping mechanism 30 to tilt. On the one hand, it has wider adaptability and better universality in some special scenarios. On the other hand, due to the redundant degrees of freedom, it is helpful to avoid the generation of singular points. On the other hand, when calculating the drive of the robotic arm 22, it is possible to choose to reduce the movement of the base 21, which is beneficial to reducing the movement range of the positioning device 20 and improving the rigidity and stability of the positioning device 20.

[0059] It should be noted that the two types of robotic arms 22 shown above are merely examples of the robotic arms 22 and are not limitations on the structure of the robotic arms 22. In other embodiments, the robotic arms 22 may include more degrees of freedom, or telescopic degrees of freedom, etc. This embodiment is not limited to this.

[0060] Optional, please refer to Figure 8 and Figure 9 The semiconductor smart shelf further includes a rail loading position 60; the rail loading position 60 is provided on one side of the positioning device 20 along the Y direction, and the rail loading position 60 is flush with the rail pulley 71 along the Z direction; the rail loading position 60 is used to access the rail pulley 71 or to carry the carrier 50 that is transferred to the rail pulley 71. In some embodiments, multiple semiconductor smart shelves, or semiconductor smart shelves and process equipment can be connected by rails 70, and the rail pulley 71 running on the rails 70 can be used to transport the carrier 50 between different semiconductor smart shelves or between the semiconductor smart shelves and process equipment. The method of transporting the carrier 50 by rails 70 can replace the overhead crane transportation system used in the prior art, which can reduce the height of the clean room, energy consumption and construction costs.

[0061] exist Figure 8 and Figure 9In the illustrated example, the rail loading station 60 is a physical structure with a loading platform, which is used to carry the carrier 50 to be transferred to the rail trolley 71. Its configuration principle and structure are generally similar to those of the loading station 40. The corresponding rail 70 can be arranged adjacent to the rail loading station 60, so that when the rail trolley 71 moves along the rail 70 to a position adjacent to the rail loading station 60, the rail loading station 60 can very conveniently transfer the carrier 50 to the rail trolley 71. The transfer here includes the transfer of the carrier 50 from the rail loading station 60 to the rail trolley 71 or the transfer of the carrier 50 from the rail loading station 60 to the rail trolley 71. In one embodiment, an entry and exit handling device (such as an OHCV, not shown, can be understood with reference to the prior art) can be provided between the rail loading station 60 and the rail trolley 71 to facilitate the transfer of the carrier 50 between the rail loading station 60 and the rail trolley 71. Furthermore, the positioning device 20 and the gripping mechanism 30 can be used to transport the carrier 50 between the rail loading position 60 and the storage position 11 .

[0062] The rail loading position 60 is arranged on one side of the positioning device 20 along the Y direction, and also does not affect the activity space of the positioning device 20. Figure 7 and Figure 8 In the illustrated example, the rail loading station 60 and the storage rack 10 are arranged on the same side of the positioning device 20. This arrangement can relatively save space, but it will affect and occupy some of the space of the storage rack 10, reducing the number of storage stations 11. In other embodiments, the rail loading station 60 and the storage rack 10 can also be arranged on the opposite side of the positioning device 20. In practice, the selected configuration can be selected based on objective conditions and needs.

[0063] In other embodiments, the rail loading station 60 is used to receive a rail trolley 71. In these embodiments, the rail loading station 60 no longer has a physical structure, but can be configured as a space for the rail trolley 71 to enter. In one example, the rail 70 can extend into the rail loading station 60 along the X-direction (or Y-direction), allowing the rail trolley 71 to move directly into the rail loading station 60. In this case, the positioning device 20 and the gripping mechanism 30 can be used to directly transfer the carrier 50 to the rail trolley 71, or to remove the carrier 50 from the rail trolley 71.

[0064] Optionally, the storage location 11 has a radio frequency identification module 111 for identifying the loading ID information of the carrier 50 carried by the storage location 11. In some application scenarios, the carrier 50 may carry loading ID information, which includes but is not limited to information storage forms such as RFID and Reader. The loading ID information may include, for example, the ID information of the semiconductor products loaded inside the carrier 50, or parameter information of the carrier 50 itself. This loading ID information can be read by the radio frequency identification module 111, so that the control unit of the semiconductor smart shelf can identify the loading ID information of each carrier 50. Combined with the location information of the storage location 11 where the carrier 50 is located, the placement and transportation of the carrier 50 can be efficiently managed.

[0065] Please refer to Figure 8 and Figure 9 An embodiment of the present invention also provides a semiconductor intelligent logistics system, which includes at least two semiconductor intelligent shelves, and also includes a rail 70 and a rail pulley 71; at least two of the semiconductor intelligent shelves are connected by the rail 70, and the rail pulley 71 is movably arranged on the rail 70 along the rail 70; the carrier 50 is transported between at least two of the semiconductor intelligent shelves via the rail pulley 71.

[0066] Optionally, track 70 can be mounted on the floor, columns, or semiconductor smart shelves in a semiconductor manufacturing facility's clean room. It can be configured as a removable modular structure. Track 70 can be removably reconfigured based on work performance and / or process flow, adapting to phased increases in production capacity, subsequent process upgrades due to equipment selection changes during new product development, and other scenarios.

[0067] In another embodiment, the semiconductor intelligent logistics system includes process equipment and semiconductor intelligent shelves, and further includes a track 70 and a track trolley 71; the process equipment and the semiconductor intelligent shelves are connected via the track 70, and the track trolley 71 is movably disposed on the track 70 along the track 70; and the carrier 50 is transported between the process equipment and the semiconductor intelligent shelves via the track trolley 71. It will be understood that the track 70 is not limited to being configured to connect different semiconductor intelligent shelves. In some embodiments, the track 70 can also be configured to connect semiconductor intelligent shelves and process equipment to further improve the transportation efficiency of the carrier 50.

[0068] In summary, in the semiconductor smart shelf and semiconductor smart logistics system provided by the present invention, the semiconductor smart shelf includes: a storage rack, a positioning device, a gripping mechanism and a loading platform; the storage rack includes a plurality of storage locations for carrying carriers, and the plurality of storage locations are arranged along the XZ plane; the storage rack and the positioning device are arranged side by side along the Y direction; the positioning device includes a base and a robotic arm arranged on the base, and the base is movable along the XZ plane direction; the gripping mechanism is connected to the robotic arm, and the gripping mechanism is movable at least along the Y direction under the drive of the robotic arm to grip and transport the carrier along the Y direction; the loading platform is arranged on one side of the positioning device along the Y direction, for carrying carriers moved in or out; the gripping mechanism is configured to transport carriers between the plurality of storage locations or between the storage locations and the loading platform under the drive of the positioning device. With this configuration, the positioning device is arranged side by side with the storage rack, allowing the gripping mechanism to move freely to the corresponding position of each storage location without affecting the storage rack space, and to grab and move the carrier, thereby realizing the transportation of carriers in each storage location within the semiconductor intelligent rack. Furthermore, with the loading platform and the positioning device arranged side by side, the gripping mechanism can move the carrier into or out of the loading platform without affecting the loading platform, facilitating the input and output of the carrier.

[0069] It should be noted that the above embodiments can be combined with each other. The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes or modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the present invention.

Claims

1. A semiconductor smart shelf, characterized in that: include: A storage rack, a positioning device, a gripping mechanism and a loading platform; the storage rack includes a plurality of storage locations for carrying carriers, and the plurality of storage locations are arranged along the XZ plane; the storage rack and the positioning device are arranged side by side along the Y direction; the positioning device includes a base and a robotic arm provided on the base, and the base is movable along the XZ plane direction; the gripping mechanism is connected to the robotic arm, and the gripping mechanism is movable at least along the Y direction under the drive of the robotic arm to grip and transport the carrier along the Y direction; the loading platform is provided on one side of the positioning device along the Y direction, for carrying carriers moved in or out; the gripping mechanism is configured to transport carriers between the plurality of storage locations or between the storage locations and the loading platform under the drive of the positioning device.

2. The semiconductor smart shelf according to claim 1, characterized in that: The loading platform and the storage rack are on the same XZ plane; or, the loading platform and the storage rack are on opposite sides of the positioning device along the Y direction.

3. The semiconductor smart shelf according to claim 2, characterized in that: The semiconductor smart shelf also includes a transfer platform; the transfer platform and the loading platform are arranged adjacent to each other along the X direction or the Y direction; there is an entry and exit handling device between the transfer platform and the loading platform, and the entry and exit handling device can move along the X direction or the Y direction to transport the carrier back and forth between the transfer platform and the loading platform.

4. The semiconductor smart shelf according to claim 1, characterized in that: The semiconductor smart shelf also includes a rail loading position; the rail loading position is arranged on one side of the positioning device along the Y direction, and the rail loading position is flush with the rail pulley along the Z direction; the rail loading position is used to connect to the rail pulley or to carry a carrier that is connected to the rail pulley.

5. The semiconductor smart shelf according to claim 1, characterized in that: The positioning device includes a transverse slide rail extending along the X direction and a longitudinal slide rail extending along the Z direction; The transverse slide rail is movably provided on the longitudinal slide rail along the Z direction, and the base is movably provided on the transverse slide rail along the X direction; or The longitudinal slide rail is movably arranged on the transverse slide rail along the X direction, and the base is movably arranged on the longitudinal slide rail along the Z direction.

6. The semiconductor smart shelf according to claim 1, characterized in that: The positioning device includes a horizontal slide, which is movably arranged along the X direction; the base is movably arranged on the horizontal slide along the Z direction.

7. The semiconductor smart shelf according to claim 1, characterized in that: The robotic arm includes a first arm, a second arm, a first rotational joint, a second rotational joint, and a third rotational joint; the rotation axes of the first rotational joint, the second rotational joint, and the third rotational joint all extend along the Z direction; The first arm is rotatably provided on the base via the first rotation joint, the second arm is rotatably provided on the first arm via the second rotation joint, and the grasping mechanism is rotatably provided on the second arm via the third rotation joint; The gripping mechanism is configured to achieve movement at least along the Y direction based on rotation of the first rotational joint, the second rotational joint, and the third rotational joint.

8. The semiconductor smart shelf according to claim 1, characterized in that: The robotic arm includes a first arm, a second arm, a third arm, a first rotational joint, a second rotational joint, a third rotational joint and a fourth rotational joint; the rotation axis of the first rotational joint extends along the Z direction, the rotation axis of the second rotational joint is perpendicular to the rotation axis of the first rotational joint, the rotation axis of the third rotational joint is parallel to the rotation axis of the second rotational joint, and the rotation axis of the fourth rotational joint is perpendicular to the rotation axis of the third rotational joint; The first arm is rotatably provided on the base via the first rotation joint, the second arm is rotatably provided on the first arm via the second rotation joint, the third arm is rotatably provided on the second arm via the third rotation joint, and the grasping mechanism is rotatably provided on the third arm via the fourth rotation joint; The gripping mechanism is configured to achieve movement at least along the Y direction based on rotation of the first rotational joint, the second rotational joint, the third rotational joint, and the fourth rotational joint.

9. The semiconductor smart shelf according to claim 1, characterized in that: The storage location has a radio frequency identification module for identifying the loading ID information of the carrier carried by the storage location.

10. A semiconductor intelligent logistics system, characterized in that: The semiconductor intelligent logistics system comprises at least two semiconductor intelligent shelves according to any one of claims 1 to 9, and further comprises a track and a track pulley; at least two of the semiconductor intelligent shelves are connected by the track, and the track pulley is movably arranged on the track along the track; a carrier is transported between at least two of the semiconductor intelligent shelves via the track pulley; or The semiconductor intelligent logistics system includes process equipment and semiconductor intelligent shelves according to any one of claims 1 to 9, and also includes rails and rail pulleys; the process equipment and the semiconductor intelligent shelves are connected through the rails, and the rail pulleys are movably arranged on the rails along the rails; the carriers are transported between the process equipment and the semiconductor intelligent shelves via the rail pulleys.

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