Flip chip adsorption device

Abstract

The flip chip adsorption device comprises a module which is suspended at the top of an annular cooling fin and matched with the annular cooling fin, and the interior of the module is hollow to form an air path; the bottom surface of the module is provided with first air holes of a plurality of ventilation paths and suction nozzles used for adsorbing the annular cooling fins; a second air hole of the ventilation path is formed in the side face or the top face of the module and used for being connected with an air pipe providing negative pressure. By arranging a plurality of rubber suction nozzles capable of adsorbing the annular cooling fins, the positions of the suction nozzles for adsorbing single FBGA products with the annular cooling fins are changed, the suction nozzles are prevented from directly acting on chips and not making contact with the surfaces of the chips, and the damage risk of the surfaces of the chips is reduced; the rubber suction nozzles with better sealing performance are combined with multiple rows of suction nozzles to suck a heavy single flip chip ball grid array packaging belt annular cooling fin product, the product suction stability is improved, the risk of material falling in the operation process is reduced, the machine efficiency is improved, the product quality is improved, and high practicability and wide applicability are achieved.

Description

Technical Field

[0001] The present invention relates to an adsorption device, in particular to a flip chip adsorption device, and belongs to the technical field of semiconductor packaging. Background Art

[0002] With the continuous development of the semiconductor packaging industry, product packaging forms are becoming more and more diversified. For single flip chip ball grid array (FCBGA / Flip Chip Ball Grid Array) products with ring heat sinks, the industry uses sponge nozzles to directly suck the chip surface to pick up the product.

[0003] The sponge material can solve the problem of nozzle marks, but its sealing is worse than that of the rubber nozzle, and there is a problem of unstable suction. At the same time, its direct action on the chip surface also has the risk of causing stress damage to the chip.

[0004] Therefore, it is necessary to provide a flip chip nozzle. Summary of the Invention

[0005] In order to solve the deficiencies of the prior art, the present invention aims to provide a flip chip adsorption device.

[0006] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0007] A flip chip adsorption device includes a module suspended on top of and matched with an annular heat sink, wherein the interior of the module is hollow to form an air path;

[0008] The bottom surface of the module is provided with a plurality of first air holes for ventilation, and the first air holes are connected to a suction nozzle for adsorbing the annular heat sink;

[0009] The side surface or top surface of the module is provided with a first air hole for an air vent, and the second air hole is used for connecting to an air pipe for providing negative pressure.

[0010] There are at least two second air holes.

[0011] There are at least four first air holes.

[0012] The plurality of first air holes are arranged in a row.

[0013] Furthermore, the first air holes are symmetrically arranged on the bottom surface of the module.

[0014] The above-mentioned suction nozzle is a rubber suction nozzle.

[0015] The top surface of the module is provided with a suspension component for suspension.

[0016] The present invention is beneficial in that:

[0017] The flip chip adsorption device of the present invention is provided with multiple rubber suction nozzles that can adsorb annular heat sinks, thereby changing the position of the suction nozzle in sucking a single FBGA product with an annular heat sink, avoiding the suction nozzle from directly acting on the chip and not contacting the chip surface, thereby reducing the risk of damage to the chip surface; the rubber suction nozzle with better sealing performance is used in combination with a multi-row arrangement to suck heavier single flip chip ball grid array package products with annular heat sinks, thereby improving product suction stability, reducing the risk of material falling during operation, improving machine efficiency, and improving product quality.

[0018] The flip chip adsorption device of the present invention optimizes the suction method of products with annular heat sinks, effectively solves the risk of material dropping and chip damage when the suction nozzle sucks a single flip chip ball grid array packaged product with annular heat sinks, and has strong practicality and wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view of the structural schematic diagram of the flip chip adsorption device.

[0020] Figure 2 It is a top view of the structural schematic diagram of the flip chip adsorption device.

[0021] Figure 3 A side view of the structural schematic diagram of the flip chip adsorption device.

[0022] The meanings of the marks in the accompanying drawings are as follows: 1. first air hole, 2. suction nozzle, 3. second air hole, 4. annular heat sink, 5. chip surface, 6. air path. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1-3 As shown, the annular heat sink surrounds the chip surface.

[0025] A flip chip adsorption device consists of a module and a rubber suction nozzle.

[0026] The size of the module, especially its bottom area, matches the annular heat sink. The module is hollow inside, forming an air path 6. The bottom surface of the module is provided with a plurality of first air holes. Preferably, the first air holes 1 are arranged in two rows, respectively placed on both sides of the bottom surface of the module and corresponding to the two sides of the annular heat sink. The rubber suction nozzles are respectively provided on the bottom surface of the module through the first air holes and connected to the air path. Preferably, there are two first air holes in each row, that is, there are two rubber suction nozzles in each row, for a total of four.

[0027] The air path is connected to the air pipe through the second air hole. Preferably, the second air hole is set on the side or top surface of the module, and the air pipe is connected to the negative pressure air source. There are preferably two second air holes.

[0028] The top surface of the module is provided with a hanging component, which can be a hook, a hook ring, etc. according to the use requirements. Through the hanging component, the module is suspended on the top of the annular heat sink, and the rubber nozzle is facing the two sides of the annular heat sink.

[0029] According to usage requirements, the first air hole can also be set in a ring-shaped (rectangular) shape, that is, the ring-shaped rubber suction nozzle is facing the four sides of the ring-shaped heat sink.

[0030] The module can be made of aluminum alloy to reduce the weight of the fixture.

[0031] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation fall within the scope of protection of the present invention.

Claims

1. A flip chip adsorption device, characterized in that: It includes a module suspended on the top of the annular heat sink and matched with the annular heat sink, wherein the internal hollow of the module forms an air path; The bottom surface of the module is provided with a plurality of first air holes for ventilation, the first air holes are connected to a suction nozzle for adsorbing the annular heat sink, and the suction nozzle is a rubber suction nozzle; The side surface or top surface of the module is provided with a second air hole for the ventilation path, and the second air hole is used for connecting to an air pipe providing negative pressure.

2. The adsorption device according to claim 1, characterized in that There are at least two second air holes.

3. The adsorption device according to claim 1, characterized in that The number of the first air holes is at least 4.

4. The adsorption device according to claim 3, characterized in that The plurality of first air holes are arranged in a row.

5. The adsorption device according to claim 3, characterized in that: The first air holes are symmetrically arranged on the bottom surface of the module.

6. The adsorption device according to claim 1, characterized in that The top surface of the module is provided with a suspension component for suspension.

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