High-efficiency heat dissipation audio power amplifier equipment

Abstract

The utility model discloses audio power amplifier equipment with efficient heat dissipation, and relates to the technical field of audio power amplifier equipment. The device comprises a device body, an air exhaust assembly and an air inlet assembly. A top cover is installed on the top of the equipment body, and the air exhaust assembly and the air inlet assembly are both arranged outside the equipment body. The air exhaust assembly comprises two connecting covers, the two connecting covers are fixedly connected to the back of the equipment body, the ends, located outside the connecting covers, of the two connecting covers are fixedly connected with air suction fans, the bottom of the top cover is fixedly connected with two air suction pipes, and the air suction pipes communicate with the connecting covers. The air inlet assembly comprises a mounting frame, the mounting frame is fixedly connected to the exterior of the equipment body, a heat exchanger and a semiconductor chilling plate are fixedly connected to the interior of the mounting frame, and dust blocking nets are mounted on the two sides of the mounting frame. According to the utility model, the heat exchanger is cooled through the semiconductor chilling plate, so that air entering the equipment main body can be cooled, and efficient heat dissipation can be realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of audio power amplifier equipment, and in particular relates to an audio power amplifier equipment with high-efficiency heat dissipation. Background Art

[0002] Audio power amplifiers have the ability to boost the power of audio signals, driving speakers or other audio output devices to produce louder sounds. At the same time, they can also improve sound quality and clarity. Furthermore, audio power amplifiers are equipped with multiple safety features, such as overload protection and short-circuit protection, to protect audio equipment from damage and make audio system operation more convenient.

[0003] During operation, the internal electronic components of audio amplifiers generate a large amount of heat. Existing heat dissipation mechanisms for audio amplifiers typically use a cooling fan to expel the hot air and then draw in outside air. However, when the ambient temperature is high, the temperature of the inhaled air is also high, resulting in low heat dissipation efficiency.

[0004] To this end, we provide an audio power amplifier device with efficient heat dissipation to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an audio power amplifier device with efficient heat dissipation, which cools the heat exchanger through a semiconductor refrigeration plate, thereby cooling the air entering the device body, thereby solving the problem of low heat dissipation efficiency of existing audio power amplifier devices.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The utility model is an audio power amplifier device with high efficiency in heat dissipation, comprising a device body, an air extraction component and an air intake component; a top cover is installed on the top of the device body, and the air extraction component and the air intake component are both arranged outside the device body;

[0008] The exhaust assembly includes two connecting covers, both of which are fixedly connected to the back of the device body. One end of the two connecting covers located outside the connecting covers is fixedly connected to an air suction fan, and the bottom of the top cover is fixedly connected to two air suction pipes, and the air suction pipes are connected to the connecting covers;

[0009] The air intake assembly includes a mounting frame, which is fixedly connected to the outside of the equipment body. The inside of the mounting frame is fixedly connected to a heat exchanger and a semiconductor refrigeration plate, and dust screens are installed on both sides of the mounting frame.

[0010] The utility model is further configured such that the air intake pipe comprises a main pipe, a plurality of branch pipes are fixedly connected to the outside of the main pipe, and the branch pipes are communicated with the main pipe, and air intake ports are provided at the bottoms of the plurality of branch pipes.

[0011] The utility model is further configured such that the multiple branches of the two suction pipes are interlaced with each other, the bottom of the main pipe is fixedly connected with a mounting sleeve, and the connecting cover is movably sleeved inside the mounting sleeve.

[0012] The utility model is further configured such that the heat exchanger includes a heat conducting plate, which is fixedly connected to the inner side of the mounting frame, and the cooling surface of the semiconductor refrigeration plate is in contact with the heat conducting plate, and a plurality of cooling fins are fixedly connected to a side of the heat conducting plate facing away from the semiconductor refrigeration plate.

[0013] The utility model is further configured such that the cooling fins are in an inverted V-shape, and a plurality of guide bars are fixedly connected to the tops of the cooling fins.

[0014] The utility model is further configured such that both sides of the installation frame are fixedly connected with installation grooves, and the dust shield is movably inserted into the interior of the installation grooves.

[0015] The utility model is further configured such that both sides of the installation frame are fixedly connected with slide plates, the interiors of the two slide plates are slidably connected with a placement box, and the placement box is located at the bottom of the installation frame, and absorbent cotton is placed inside the placement box.

[0016] The utility model is further configured such that a guide plate is fixedly connected to the interior of the installation frame, and the guide plate is located between the plurality of cooling fins and the placement box, and the length of the cooling fins is shorter than the length of the guide plate.

[0017] The utility model has the following beneficial effects:

[0018] 1. The utility model can draw out the hot air in the device body along the connecting cover and the suction pipe through the suction fan, so that the interior of the device body is in a low-pressure state. Then the outside air enters the installation frame through the dust screen, and then cools the heat exchanger through the semiconductor refrigeration plate. After that, the heat is absorbed when the air passes through the gaps between the multiple cooling fins of the heat exchanger, so that low-temperature air can be formed to enter the interior of the device body, which can efficiently cool the interior of the device body.

[0019] 2. The utility model uses inverted V-shaped cooling fins to allow condensation to gather on the cooling fins and flow along the cooling fins into the guide plate. The water droplets then flow into the placement box and are finally absorbed by the absorbent cotton, thereby preventing water from entering the main body of the equipment and causing erosion of its internal parts.

[0020] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a front structural schematic diagram of the present utility model.

[0023] Figure 2 It is a schematic diagram of the back structure of the utility model.

[0024] Figure 3 Schematic diagram of the structure of the exhaust component.

[0025] Figure 4 It is a schematic diagram of the structure of the intake pipe when viewed from above.

[0026] Figure 5 Schematic diagram of the exploded structure of the air intake component.

[0027] Figure 6 Schematic diagram of the structure of the cooling fins.

[0028] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0029] 100-equipment body, 200-top cover, 300-exhaust assembly, 301-connecting cover, 302-intake fan, 303-intake pipe, 303a-main pipe, 303b-branch pipe, 303c-intake port, 304-installation sleeve, 400-air inlet assembly, 401-installation frame, 402-heat exchanger, 402a-heat conducting plate, 402b-cooling fins, 402c-guide strip, 403-semiconductor refrigeration plate, 404-installation slot, 405-dust screen, 406-placement box, 407-absorbent cotton, 408-slide plate, 409-guide plate. DETAILED DESCRIPTION

[0030] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Example 1

[0032] See also Figure 1-5The present invention is an audio power amplifier device with high efficiency in heat dissipation, comprising a device body 100, an exhaust assembly 300 and an air intake assembly 400; a top cover 200 is installed on the top of the device body 100, and the exhaust assembly 300 and the air intake assembly 400 are both arranged outside the device body 100;

[0033] The exhaust assembly 300 includes two connecting covers 301, both of which are fixedly connected to the back of the device body 100. One end of the two connecting covers 301 located outside the connecting covers 301 is fixedly connected to an air suction fan 302. Two air suction pipes 303 are fixedly connected to the bottom of the top cover 200, and the air suction pipes 303 are connected to the connecting covers 301. The hot air in the device body 100 can be sucked out more evenly through the air suction pipes 303, reducing the temperature difference between different positions in the device body 100.

[0034] The air intake assembly 400 includes a mounting frame 401, which is fixedly connected to the outside of the device body 100. The inside of the mounting frame 401 is fixedly connected with a heat exchanger 402 and a semiconductor refrigeration plate 403. Dust screens 405 are installed on both sides of the mounting frame 401. The heat exchanger 402 and the semiconductor refrigeration plate 403 can be used to cool down the temperature of the air entering the device body 100, thereby improving the cooling effect.

[0035] Specifically, the air intake pipe 303 includes a main pipe 303a, a plurality of branch pipes 303b are fixedly connected to the outside of the main pipe 303a, and the branch pipes 303b are connected to the main pipe 303a. The bottoms of the plurality of branch pipes 303b are each provided with an air intake port 303c. The plurality of branch pipes 303b can evenly suck out the hot air in the device body 100.

[0036] The heat exchanger 402 includes a heat conducting sheet 402a, which is fixedly connected to the inner side of the mounting frame 401. The cooling surface of the semiconductor cooling sheet 403 is in contact with the heat conducting sheet 402a. A plurality of cooling fins 402b are fixedly connected to the side of the heat conducting sheet 402a facing away from the semiconductor cooling sheet 403. The plurality of cooling fins 402b can increase the heat exchange area, thereby improving the cooling efficiency of the air.

[0037] Both sides of the mounting frame 401 are fixedly connected with mounting grooves 404, and the dust screen 405 is movably inserted into the interior of the mounting groove 404. The dust screen 405 can be easily replaced by pulling the dust screen 405, thereby improving ventilation efficiency and avoiding blockage.

[0038] Furthermore, the multiple branch pipes 303 b of the two air intake pipes 303 are intertwined with each other, the bottom of the main pipe 303 a is fixedly connected to the installation sleeve 304 , and the connection cover 301 is movably sleeved inside the installation sleeve 304 .

[0039] The operating process of this embodiment is: when it is necessary to cool down the device main body 100, the hot air in the device main body 100 can be drawn out through the connecting cover 301 and the intake pipe 303 by starting the intake fan 302, and then the interior of the device main body 100 is made into a low-pressure state. Then the outside air enters the interior of the installation frame 401 through the dust screen 405, and then the heat exchanger 402 is cooled by the semiconductor refrigeration plate 403. After that, the heat is absorbed when the air passes through the gaps between the multiple cooling fins 402b of the heat exchanger 402, so that low-temperature air can be formed to enter the interior of the device main body 100, which can effectively cool the interior of the device main body 100.

[0040] Example 2

[0041] See also Figure 5-6 Based on the specific embodiment 1, the cooling fins 402b are in an inverted V shape, and a plurality of guide bars 402c are fixedly connected to the top of the cooling fins 402b.

[0042] Specifically, both sides of the installation frame 401 are fixedly connected with a slide plate 408, and the interior of the two slide plates 408 is slidably connected with a placement box 406, and the placement box 406 is located at the bottom of the installation frame 401. Water-absorbing cotton 407 is placed inside the placement box 406. The water-absorbing cotton 407 can absorb water droplets flowing down from the cooling fins 402b, thereby preventing water from entering the interior of the equipment body 100 and causing erosion of its internal parts.

[0043] Furthermore, a guide plate 409 is fixedly connected to the interior of the installation frame 401 , and the guide plate 409 is located between the plurality of cooling fins 402 b and the placement box 406 . The length of the cooling fins 402 b is shorter than that of the guide plate 409 .

[0044] The operating process of this embodiment is: when water droplets condense on the surface of the cooling fins 402b, the inverted V-shaped cooling fins 402b can make the condensation on the cooling fins 402b gather and flow along the cooling fins 402b onto the guide plate 409, and then the water droplets flow into the placement box 406 and are finally absorbed by the absorbent cotton 407.

[0045] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0046] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An audio power amplifier device with high heat dissipation efficiency, comprising a device body (100), an exhaust assembly (300) and an air intake assembly (400); characterized in that: A top cover (200) is installed on the top of the device body (100), and the air extraction component (300) and the air intake component (400) are both arranged outside the device body (100); The air extraction assembly (300) comprises two connecting covers (301), both of the connecting covers (301) are fixedly connected to the back of the device body (100), one end of the two connecting covers (301) located outside the connecting covers (301) is fixedly connected to an air suction fan (302), and the bottom of the top cover (200) is fixedly connected to two air suction pipes (303), and the air suction pipes (303) are communicated with the connecting covers (301); The air intake assembly (400) includes a mounting frame (401), the mounting frame (401) is fixedly connected to the outside of the device body (100), a heat exchanger (402) and a semiconductor cooling plate (403) are fixedly connected inside the mounting frame (401), and dust screens (405) are installed on both sides of the mounting frame (401).

2. The audio power amplifier device with high heat dissipation efficiency according to claim 1, characterized in that: The air intake pipe (303) comprises a main pipe (303a), the exterior of the main pipe (303a) is fixedly connected to a plurality of branch pipes (303b), and the branch pipes (303b) are in communication with the main pipe (303a), and the bottoms of the plurality of branch pipes (303b) are each provided with an air intake port (303c).

3. The audio power amplifier device with high heat dissipation efficiency according to claim 2, characterized in that: The multiple branch pipes (303b) of the two suction pipes (303) are interlaced with each other, the bottom of the main pipe (303a) is fixedly connected to a mounting sleeve (304), and the connecting cover (301) is movably sleeved inside the mounting sleeve (304).

4. The audio power amplifier device with high heat dissipation efficiency according to claim 1, characterized in that: The heat exchanger (402) comprises a heat conducting plate (402a), the heat conducting plate (402a) being fixedly connected to the inner side of the mounting frame (401), and the cooling surface of the semiconductor cooling plate (403) being in contact with the heat conducting plate (402a), and a plurality of cooling fins (402b) being fixedly connected to a side of the heat conducting plate (402a) facing away from the semiconductor cooling plate (403).

5. The audio power amplifier device with high heat dissipation efficiency according to claim 4, characterized in that: The cooling fins (402b) are in an inverted V-shape, and a plurality of guide bars (402c) are fixedly connected to the top of the cooling fins (402b).

6. The audio power amplifier device with high heat dissipation efficiency according to claim 1, characterized in that: Both sides of the installation frame (401) are fixedly connected with installation grooves (404), and the dust shield (405) is movably inserted into the interior of the installation grooves (404).

7. The audio power amplifier device with high heat dissipation efficiency according to claim 1, characterized in that: Both sides of the installation frame (401) are fixedly connected with a slide plate (408), and the interiors of the two slide plates (408) are slidably connected with a placement box (406), and the placement box (406) is located at the bottom of the installation frame (401), and absorbent cotton (407) is placed inside the placement box (406).

8. The audio power amplifier device with high heat dissipation efficiency according to claim 1, characterized in that: A guide plate (409) is fixedly connected to the interior of the installation frame (401), and the guide plate (409) is located between the plurality of cooling fins (402b) and the placement box (406), and the length of the cooling fins (402b) is shorter than the length of the guide plate (409).

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