Ceramic carrier plate copper filling device

Abstract

The utility model relates to a ceramic carrier plate copper filling device, and relates to the technical field of ceramic carrier plate production. A plurality of stand columns are arranged on the surface of the base, a supporting plate is arranged at the top ends of the stand columns, a lifting piece is arranged on the bottom wall of the supporting plate, a piston rod of the lifting piece is connected with a pressing plate, the pressing plate is connected to the stand columns in a sliding mode, and a plurality of installation pieces are arranged on the bottom wall of the pressing plate corresponding to through holes of the ceramic carrier plate. A through hole is formed in the ceramic carrier plate, a tamping pestle is arranged on the bottom wall of the mounting piece, the tamping pestle and the through hole of the ceramic carrier plate are coaxially arranged, a fixing cylinder is further arranged on the bottom wall of the mounting piece, a limiting cylinder is slidably connected in the fixing cylinder, an elastic piece is arranged in the fixing cylinder, and the elastic piece drives the limiting cylinder to keep the trend of moving towards the direction away from the fixing cylinder. The problem that pits are likely to appear on the two sides of the through hole when the ceramic carrier plate is filled with copper is solved, and the performance of the ceramic carrier plate is improved.

Description

Technical Field

[0001] The present application relates to the technical field of ceramic carrier production, and in particular to a ceramic carrier copper filling device. Background Art

[0002] A ceramic carrier is a basic material used to support and fix electronic components. It is usually made of high-temperature ceramic materials such as alumina, aluminum nitride, and zirconium oxide, and has important applications in the electrical field. During production, ceramic carriers usually require through holes to be opened on their surfaces to enhance the mechanical strength and thermal conductivity of the ceramic carriers. After the through holes are opened, the through holes need to be filled with copper to achieve conductive connections of the ceramic carriers. However, in the prior art, the copper filling process of ceramic carrier through holes is usually performed manually, but the manual copper filling method will cause pits on both sides of the through holes, affecting the performance of the ceramic carriers, so it needs to be improved. Utility Model Content

[0003] In order to improve the problem that pits are easily formed on both sides of the through-holes when the ceramic carrier is filled with copper, which affects the performance of the ceramic carrier, the present application provides a ceramic carrier copper filling device.

[0004] The present application provides a ceramic carrier copper filling device that adopts the following technical solution:

[0005] A device for filling copper with a ceramic carrier plate comprises a base for placing the ceramic carrier plate, a plurality of columns are provided on the surface of the base, a support plate is provided on the top of the columns, a lifting member is provided on the bottom wall of the support plate, the piston rod of the lifting member is connected to a pressure plate, the pressure plate is slidably connected to the column, a plurality of mounting plates are provided on the bottom wall of the pressure plate corresponding to the through holes of the ceramic carrier plate, a filling and pressing pestle is provided on the bottom wall of the mounting plate, the filling and pressing pestle is coaxially arranged with the through hole of the ceramic carrier plate, a fixed cylinder is further provided on the bottom wall of the mounting plate, a limiting cylinder is slidably connected to the fixed cylinder, an elastic member is provided in the fixed cylinder, and the elastic member drives the limiting cylinder to maintain a movement trend in a direction away from the fixed cylinder.

[0006] By adopting the above technical solution, the ceramic carrier is placed on the base, copper material is added to the through hole of the ceramic carrier, the filling and pressing pestle is aligned with the through hole of the ceramic carrier, the lifting member drives the pressure plate to move toward the base, and the limiting cylinder first contacts the ceramic carrier. During the continued movement of the lifting member, the elastic member is compressed, and the limiting cylinder slides relative to the fixed cylinder. The existence of the limiting cylinder prevents the copper material from being exposed during the copper filling process, and the filling and pressing pestle continues to move and gradually contacts the copper material exposed outside the through hole, and the copper material is stably pressed into the through hole, thereby achieving copper filling of the through hole. Since the bottom wall of the filling and pressing pestle is flat, the phenomenon of pits appearing on both sides of the through hole during the copper filling process can be effectively eliminated, thereby improving the copper filling quality.

[0007] Optionally, a buffer ring is provided on the peripheral wall of one end of the limiting cylinder away from the fixing cylinder.

[0008] By adopting the above technical solution, providing the buffer ring can increase the contact area between the limiting cylinder and the ceramic carrier, thereby allocating the force generated by the contact with the ceramic carrier and protecting the structural safety of the ceramic carrier.

[0009] Optionally, a buffer groove is provided on the bottom wall of the buffer ring along the circumferential direction, and a buffer ring is provided in the buffer groove.

[0010] By adopting the above technical solution, the buffer ring in the buffer groove can provide buffering when the buffer ring abuts against the surface of the ceramic carrier, thereby protecting the surface structure safety of the ceramic carrier and ensuring the quality and performance of the ceramic carrier.

[0011] Optionally, the mounting piece is detachably connected to the pressing plate.

[0012] By adopting the above technical solution, the mounting plate and the pressing plate are set to a detachable connection form, which makes it easy to replace the filling and pressing pestle of appropriate size according to the specific size of the through holes of different ceramic carriers, so as to ensure the quality of copper filling of the ceramic carrier and reduce the probability of pits.

[0013] Optionally, a plurality of positioning holes are opened on the surface of the base corresponding to the through holes of the ceramic carrier plate, and a telescopic block is slidably connected in each of the positioning holes. A reset member is provided between the telescopic block and the bottom wall of the positioning hole, and the reset member drives the telescopic block to maintain the tendency to extend out of the positioning hole, and a positioning block is provided on the surface of the telescopic block.

[0014] By adopting the above technical solution, under the action of the reset member, the positioning block will extend out of the positioning hole, and the ceramic carrier can be fitted by aligning the through hole of the ceramic carrier with the positioning block. Under the restriction of multiple positioning blocks, the ceramic carrier will not slide during the copper filling process, thereby maintaining the stability of the ceramic carrier during the copper filling process. When the filling and pressing pestle presses the copper material in the through hole, the positioning block will gradually separate from the through hole under the extrusion of the copper material. At this time, the reset member contracts and accumulates elastic potential energy to reset the telescopic block and the positioning block.

[0015] Optionally, the thickness of the positioning block is consistent with the sliding stroke of the telescopic block.

[0016] By adopting the above technical solution, the thickness of the positioning block is set to be consistent with the stroke of the telescopic block, so that after the filling and pressing pestle completes the copper filling of the through hole of the ceramic carrier, the positioning block will just be separated from the through hole, thereby ensuring the adequacy of the copper filling and facilitating the removal of the ceramic carrier, which is highly convenient and practical.

[0017] Optionally, the positioning block is detachably connected to the telescopic block.

[0018] By adopting the above technical solution, the positioning block and the telescopic block are set to be detachably connected, which makes it easy to replace the positioning block according to the diameter of the through hole of the ceramic carrier, so that the positioning block can stably enter the through hole of the ceramic carrier.

[0019] Optionally, a limiting plate is provided on the peripheral wall of the column.

[0020] By adopting the above technical solution, the limiting plate can limit the movement stroke of the pressure plate to prevent the pressure plate from moving excessively, causing the limiting cylinder to excessively squeeze the surface of the ceramic carrier plate, resulting in damage to the ceramic carrier plate.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. This application uses a lifting member and a filling and pressing pestle to fill copper on the ceramic carrier. The presence of the limiting cylinder prevents the copper material from being exposed during the copper filling process. Since the bottom wall of the filling and pressing pestle is flat, it can effectively eliminate the pitting phenomenon on both sides of the through-hole during the copper filling process, thereby improving the copper filling quality.

[0023] 2. Under the restriction of multiple positioning blocks, the ceramic carrier will not slide during the copper filling process, thereby maintaining the stability of the ceramic carrier during the copper filling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of a ceramic carrier copper filling device in an embodiment of the present application.

[0025] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle.

[0026] Explanation of the accompanying reference numerals: 1. Base; 11. Post; 12. Support plate; 13. Lifting member; 14. Limiting plate; 15. Positioning hole; 2. Pressing plate; 3. Mounting plate; 4. Filling and pressing pestle; 5. Fixing cylinder; 51. Limiting cylinder; 511. Buffer ring; 512. Buffer groove; 513. Buffer ring; 52. Elastic member; 6. Telescopic block; 61. Resetting member; 62. Positioning block. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1-2 This application is described in further detail.

[0028] The embodiment of the present application discloses a copper filling device for a ceramic carrier. Figure 1 and Figure 2, including a base 1 for placing a ceramic carrier, a plurality of positioning holes 15 are opened on the surface of the base 1, and a telescopic block 6 is slidably connected in each positioning hole 15, and a reset member 61 is provided between the telescopic block 6 and the bottom wall of the positioning hole 15. In this embodiment, the reset member 61 adopts a guide rod and a spring. The guide rod is vertically connected to the bottom wall of the telescopic block 6, and the other end of the guide rod passes through the bottom wall of the positioning block 62 and forms a sliding connection with the bottom wall of the positioning block 62. The spring is sleeved on the peripheral wall of the guide rod, and the spring abuts between the bottom wall of the telescopic block 6 and the bottom wall of the positioning hole 15. Under the action of the reset member 61, the telescopic block 6 always maintains a movement trend away from the bottom wall of the positioning hole 15. When the reset member 61 is not compressed, the surface of the telescopic block 6 is flush with the surface of the base 1, so that the ceramic carrier can be placed stably.

[0029] Reference Figure 1 and Figure 2 A positioning block 62 is provided on the surface of each telescopic block 6. In this embodiment, a stud is provided on the bottom wall of the positioning block 62, and a threaded hole is provided on the surface of the telescopic block 6. The stud and the threaded hole realize the detachable connection between the positioning block 62 and the telescopic block 6, so that positioning blocks 62 of different diameters can be replaced according to the size of the through-holes of different ceramic carriers. After the positioning block 62 is pressed into the through-hole, the ceramic carrier can be stabilized, so as to improve the stability of the ceramic carrier when copper is subsequently filled.

[0030] Reference Figure 1 and Figure 2 A plurality of columns 11 are vertically arranged on the surface of the base 1, a support plate 12 is provided on the top wall of the column 11, and a lifting member 13 is provided on the bottom wall of the support plate 12. In this embodiment, the lifting member 13 adopts an oil cylinder, and the piston rod of the lifting member 13 is arranged in the vertical direction. The end of the piston rod of the lifting member 13 is connected to the pressure plate 2, which is nested on the column 11 and can slide along the length direction of the column 11.

[0031] Reference Figure 1 and Figure 2 , a plurality of mounting plates 3 are provided on the bottom wall of the pressing plate 2. In this embodiment, studs are provided on the surface of the mounting plates 3, and threaded holes are provided on the bottom wall of the pressing plate 2 to form a detachable connection between the mounting plates 3 and the pressing plate 2, so that the staff can replace different types of mounting plates 3 according to different types of ceramic carriers.

[0032] Reference Figure 1 and Figure 2A filling pestle 4 is vertically provided on the bottom wall of the mounting piece 3. The filling pestle 4 is coaxially arranged with the through hole of the ceramic carrier plate. The diameter of the filling pestle 4 is consistent with the inner diameter of the through hole. A fixed cylinder 5 is provided on the bottom wall of the mounting piece 3. The fixed cylinder 5 is arranged around the filling pestle 4. A limiting cylinder 51 is slidably connected inside the fixed cylinder 5. The limiting cylinder 51 is sleeved on the peripheral wall of the filling pestle 4. An elastic member 52 is provided in the fixed cylinder 5. In this embodiment, the elastic member 52 is an elastic ring, which abuts against the top of the limiting cylinder 51. Under the action of the elastic member 52, the limiting cylinder 51 always maintains a sliding trend toward the direction of extending out of the fixed cylinder 5. The end of the limiting cylinder 51 away from the fixed cylinder 5 exceeds the length of the filling pestle 4. The limiting cylinder 51 can first abut against the ceramic carrier plate, thereby limiting the copper material.

[0033] Reference Figure 1 and Figure 2 A buffer ring 511 is integrally formed on the peripheral wall of the end of the limiting cylinder 51 away from the fixed cylinder 5 to increase the contact area with the ceramic carrier and distribute the force. A buffer groove 512 is opened on the bottom wall of the buffer ring 511 along the circumferential direction, and a buffer ring 513 is arranged in the buffer groove 512. In this embodiment, the buffer ring 513 is made of rubber material to protect the surface of the ceramic carrier; a limiting plate 14 is provided on the column 11 to prevent the limiting cylinder 51 from excessive movement and causing damage to the ceramic carrier.

[0034] The implementation principle of a ceramic carrier copper filling device according to an embodiment of the present application is as follows: according to the size of the through-hole of the ceramic carrier, a positioning block 62 and a filling and pressing pestle 4 of appropriate size are selected, and the ceramic carrier is nested on the positioning block 62 to complete the positioning. The staff adds copper material into the through-hole of the ceramic carrier and starts the lifting member 13. The lifting member 13 drives the pressure plate 2 to move toward the base 1. The limiting cylinder 51 first contacts the ceramic carrier, thereby limiting the copper material in the limiting cylinder 51. As the lifting member 13 continues to operate, the filling and pressing pestle 4 will be pressed into the through-hole of the ceramic carrier, thereby compacting the copper material in the through-hole and squeezing the positioning block 62 out of the through-hole, thereby completing the copper filling process of the ceramic carrier. Since the bottom wall of the filling and pressing pestle 4 is flat, the probability of pits on both sides of the through-hole can be reduced, thereby improving the quality of the copper filling of the ceramic carrier.

[0035] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A copper filling device for a ceramic carrier, characterized in that: The invention comprises a base (1) for placing a ceramic carrier plate, wherein the surface of the base (1) is provided with a plurality of columns (11), the top of the column (11) is provided with a support plate (12), the bottom wall of the support plate (12) is provided with a lifting member (13), the piston rod of the lifting member (13) is connected with a pressure plate (2), the pressure plate (2) is slidably connected to the column (11), the bottom wall of the pressure plate (2) is provided with a plurality of mounting plates (3) corresponding to the through holes of the ceramic carrier plate, the bottom wall of the mounting plate (3) is provided with a filling and pressing pestle (4), the filling and pressing pestle (4) is coaxially arranged with the through hole of the ceramic carrier plate, the bottom wall of the mounting plate (3) is further provided with a fixing cylinder (5), the fixing cylinder (5) is slidably connected with a limiting cylinder (51), the fixing cylinder (5) is provided with an elastic member (52), and the elastic member (52) drives the limiting cylinder (51) to maintain a movement tendency in a direction away from the fixing cylinder (5).

2. A copper filling device for a ceramic carrier according to claim 1, characterized in that: A buffer ring (511) is provided on the peripheral wall of one end of the limiting cylinder (51) away from the fixing cylinder (5).

3. The copper filling device for a ceramic carrier according to claim 2, characterized in that: A buffer groove (512) is provided on the bottom wall of the buffer ring (511) along the circumferential direction, and a buffer ring (513) is provided in the buffer groove (512).

4. The copper filling device for a ceramic carrier according to claim 1, characterized in that: The mounting piece (3) is detachably connected to the pressing plate (2).

5. The copper filling device for a ceramic carrier according to claim 1, characterized in that: The surface of the base (1) is provided with a plurality of positioning holes (15) corresponding to the through holes of the ceramic carrier plate. A telescopic block (6) is slidably connected in each of the positioning holes (15). A reset member (61) is provided between the telescopic block (6) and the bottom wall of the positioning hole (15). The reset member (61) drives the telescopic block (6) to maintain a tendency to extend out of the positioning hole (15). A positioning block (62) is provided on the surface of the telescopic block (6).

6. The copper filling device for a ceramic carrier according to claim 5, characterized in that: The thickness of the positioning block (62) is consistent with the sliding stroke of the telescopic block (6).

7. The copper filling device for a ceramic carrier according to claim 5, characterized in that: The positioning block (62) is detachably connected to the telescopic block (6).

8. The copper filling device for a ceramic carrier according to claim 1, characterized in that: A limiting piece (14) is provided on the peripheral wall of the column (11).

Images