Tooth type radiator
By setting oblique heat dissipation teeth and deflectors on both sides of the chip connection base to optimize the airflow, the problem of limited radiator size and obstruction of the windward surface is solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422363795.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The dense layout of electronic devices on existing PCB boards leads to limited radiator size, and the windward surface is blocked by other electronic devices, resulting in difficulty in dissipating heat from the chip and increasing temperature exceeding the limit.
A toothed radiator is designed, including a chip connection base, with vertical heat dissipation teeth in the middle and oblique heat dissipation teeth on both sides. The oblique heat dissipation teeth are located between the gaps of the electronic device, increasing the heat dissipation area and windward area, and optimizing airflow through the oblique heat dissipation flap and deflector.
Effectively increase the heat dissipation area and windward area, reduce the chip temperature, improve the heat dissipation efficiency, and ensure that the temperature is within a safe range.
Smart Images
Figure CN223219367U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of radiators, and particularly relates to a tooth-type radiator. Background Art
[0002] To save PCB board material, the layout of electronic components on existing PCB boards is becoming increasingly dense. This situation limits the size of the heat sink on the heat-generating chip. At the same time, it is easy for other electronic components on the PCB to block the airflow, making it difficult for the chip to dissipate heat, causing the temperature to rise, and even exceeding the temperature limit of the chip.
[0003] like Figure 1 and Figure 2 The figure shows a conventional radiator. Because there are other electronic devices around the radiator, such as the horizontal electronic device 2 and the vertical electronic device 3, the size of the radiator cannot be increased. At the same time, the air outlet of the radiator is blocked by other electronic devices. Figure 3 As shown in FIG. 1 , simulation verifies that the chip temperature has far exceeded 125°C under this conventional heat sink solution, which cannot meet the temperature specification of the chip. Utility Model Content
[0004] The purpose of this utility model is to address the shortcomings of the prior art, such as the limited size and windward surface of radiators. This tooth-shaped radiator effectively increases the heat dissipation area and windward surface, thereby resolving the problem of the radiator's windward surface being blocked by electronic components and enhancing the radiator's heat dissipation effect.
[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0006] A tooth-type heat sink is designed, including a chip connection base, a plurality of vertical heat dissipation teeth are provided in the middle of the chip connection base, and the plurality of vertical heat dissipation teeth are located in the middle of the chip connection base. At least one row of oblique heat dissipation teeth are provided on both sides of the chip connection base, and the oblique heat dissipation teeth are located between the gaps of surrounding electronic devices. The heat dissipation airflow on both sides of the chip connection base flows through the oblique heat dissipation teeth.
[0007] Furthermore, the oblique heat dissipation teeth are composed of a plurality of oblique heat dissipation fins, the oblique heat dissipation fins are arranged parallel to the direction of the heat dissipation airflow, and gaps for the heat dissipation airflow to pass through are provided between the oblique heat dissipation fins.
[0008] Furthermore, a guide plate is obliquely provided on the oblique heat dissipation fin located on one side of the vertical heat dissipation teeth, and the guide direction of the guide plate corresponds to the vertical heat dissipation teeth. The guide plates on both sides form convection between the vertical heat dissipation teeth in the middle.
[0009] Furthermore, each oblique heat dissipation tooth in the same row is provided with a guide plate, and the width of the guide plate increases gradually along the heat dissipation airflow direction.
[0010] Furthermore, the vertical heat dissipation teeth are composed of a plurality of vertical heat dissipation fins, the vertical heat dissipation fins are arranged perpendicular to the direction of the heat dissipation airflow, and gaps are provided between the vertical heat dissipation fins.
[0011] The tooth-type heat sink proposed in this utility model has the following beneficial effects: by providing oblique heat dissipation teeth on both sides of the chip connection base, the heat dissipation area of the heat dissipation teeth can be increased, while solving the problem of the heat sink being blocked by the electronic components. Specifically:
[0012] (1) The utility model can effectively increase the heat dissipation area of the aluminum profile radiator.
[0013] (2) The utility model can effectively increase the windward area and enhance the heat dissipation effect of the radiator.
[0014] (3) The utility model has a simple structure and is easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of a conventional radiator;
[0017] Figure 2 This is a top view of a conventional heat sink and electronic device layout;
[0018] Figure 3 This is a schematic diagram of conventional heat sink simulation verification of chip temperature;
[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the utility model in Example 1;
[0020] Figure 5 is a top view of the layout of the utility model and electronic devices in Example 1;
[0021] Figure 6 This is a schematic diagram of the simulation verification of chip temperature of the utility model;
[0022] Figure 7 This is a schematic diagram of the three-dimensional structure of the utility model in Example 2;
[0023] Figure 8 It is a front view of the utility model in embodiment 2;
[0024] Figure 9 This is a schematic diagram of the three-dimensional structure of the utility model in Example 3;
[0025] Figure 10 It is a top view of the utility model in Example 3;
[0026] Figure 11 This is a schematic diagram of the three-dimensional structure of the utility model in Example 4;
[0027] Figure 12 is a top view of the utility model in Example 4;
[0028] The markings in the figure are: 1. Chip connection base; 11. Vertical heat dissipation teeth; 111. Vertical heat dissipation fins; 12. Oblique heat dissipation teeth; 121. Oblique heat dissipation fins; 122. Guide plate, 3. Electronic components. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.
[0031] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0032] The structural features of the present invention are now described in detail with reference to the accompanying drawings.
[0033] Example 1
[0034] See also Figure 4-Figure 6A tooth-type heat sink includes a chip connection base 1, a plurality of vertical heat dissipation teeth 11 are provided in the middle of the chip connection base 1, and the plurality of vertical heat dissipation teeth 11 are located in the middle of the chip connection base 1. At least one row of oblique heat dissipation teeth 12 are provided on both sides of the chip connection base 1. The oblique heat dissipation teeth 12 are located between the gaps of the surrounding electronic components 3. The heat dissipation airflow on both sides of the chip connection base 1 flows through the oblique heat dissipation teeth 12. By arranging the oblique heat dissipation teeth 12 between the gaps of the horizontal electronic components 2 and the vertical electronic components 3, the heat dissipation airflow can take away the heat on the oblique heat dissipation teeth 12 in time, thereby avoiding blocking of the heat dissipation teeth by the surrounding horizontal electronic components 2 and the vertical electronic components 3.
[0035] The tooth-type heat sink of the present invention has a simple structure and is easy to implement. Specifically, by providing oblique heat dissipation teeth 12 on both sides of the chip connection base 1, the oblique heat dissipation teeth 12 extend to the left and right sides of the chip connection base 1 to increase the heat dissipation area. At the same time, the oblique heat dissipation teeth 12 on the left and right sides can be located between the gaps between the surrounding horizontal electronic components 2 and the vertical electronic components 3. The oblique heat dissipation teeth 12 are located in the heat dissipation airflow, which can effectively increase the windward area and reduce the temperature of the chip. The verification result is that the chip Tc is 101°C, which is lower than the specified temperature of 125°C.
[0036] Example 2
[0037] Reference Figure 7-Figure 8 As another preferred embodiment of the present invention, the difference from Example 1 is that the oblique heat dissipation teeth 12 are composed of multiple oblique heat dissipation fins 121, and the oblique heat dissipation fins 121 are arranged parallel to the direction of the heat dissipation airflow. There are gaps between the oblique heat dissipation fins 121 for the heat dissipation airflow to pass through. The oblique heat dissipation teeth 12 are arranged in a fin structure, which can increase the heat dissipation area and increase the heat dissipation amount, which is beneficial to improving the heat dissipation efficiency of the tooth-type radiator.
[0038] Example 3
[0039] Reference Figure 9-10The guide plates 122 on both sides can guide the airflow into the vertical heat dissipation teeth 11 to form convection, thereby improving the circulation of the airflow inside the radiator and further improving the heat dissipation efficiency of the tooth-type radiator.
[0040] Example 4
[0041] Reference Figure 11-12 As another preferred embodiment of the present invention, the difference from Example 1 is that the vertical heat dissipation teeth 11 are composed of multiple vertical heat dissipation fins 111, the vertical heat dissipation fins 111 are arranged perpendicular to the direction of the heat dissipation airflow, and gaps are provided between the vertical heat dissipation fins 111. The vertical heat dissipation teeth 11 are arranged into a fin structure, which can increase the heat dissipation area and increase the heat dissipation amount of the introduced airflow to the vertical heat dissipation teeth 11, which is beneficial to improving the heat dissipation efficiency of the tooth-type radiator.
[0042] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A tooth-type heat sink, comprising a chip connection base (1), wherein a plurality of vertical heat dissipation teeth (11) are provided in the middle of the chip connection base (1), characterized in that: A plurality of vertical heat dissipation teeth (11) are located in the middle of the chip connection base (1), and at least one row of oblique heat dissipation teeth (12) is provided on both sides of the chip connection base (1). The oblique heat dissipation teeth (12) are located between gaps of surrounding electronic devices (3), and heat dissipation airflow on both sides of the chip connection base (1) flows through the oblique heat dissipation teeth (12).
2. The tooth-type radiator according to claim 1, characterized in that: The oblique heat dissipation teeth (12) are composed of a plurality of oblique heat dissipation fins (121), the oblique heat dissipation fins (121) are arranged parallel to the direction of the heat dissipation airflow, and gaps for the heat dissipation airflow to pass through are provided between the oblique heat dissipation fins (121).
3. The tooth-type radiator according to claim 1, characterized in that: A guide plate (122) is obliquely provided on the oblique heat dissipation fin (121) located on one side of the vertical heat dissipation tooth (11); the guide direction of the guide plate (122) corresponds to the vertical heat dissipation tooth (11); and the guide plates (122) on both sides form convection between the vertical heat dissipation teeth (11) in the middle.
4. The tooth-type radiator according to claim 1, characterized in that: Each oblique heat dissipation tooth (12) in the same row is provided with a guide plate (122), and the width of the guide plate (122) increases gradually along the heat dissipation airflow direction.
5. The tooth-type radiator according to claim 1, characterized in that: The vertical heat dissipation teeth (11) are composed of a plurality of vertical heat dissipation fins (111), the vertical heat dissipation fins (111) are arranged perpendicular to the heat dissipation airflow direction, and gaps are provided between the vertical heat dissipation fins (111).