Cold plate and testing device
By designing high-efficiency and low-efficiency areas on the cold plate and using the combination of heat pipes and thermal conductivity strips, the chip overtemperature problem caused by uneven distribution of the cold plate flow channel is solved, and the heat dissipation effect with uniform temperature is achieved.
Patent Information
- Application Number
- CN202422398001.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-29
AI Technical Summary
When existing cold plates are laid out with high-power chips, the uneven flow channel distribution leads to insufficient cooling capacity in the high-power chip area, and the cooling capacity in the low-power chip area overflows, resulting in local chip overtemperature problems.
A cold plate is designed with a first area with high efficiency and a second area with low efficiency. The heat in the high-temperature low-power consumption area is directed to the high-temperature high-power consumption area with low temperature through a heat conducting strip, and heat exchange with the heat dissipation part is ensured to ensure temperature uniformity.
The temperature uniformity of high power consumption and low power consumption areas is achieved, which meets the heat dissipation needs of the heat dissipation parts and avoids local overtemperature.
Smart Images
Figure CN223219369U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of testing equipment, in particular to a cold plate and a testing device. Background Art
[0002] A board is a type of printed circuit board, and indirect liquid cooling is often used to dissipate heat from the board. That is, the cooling medium in the cold plate flows in the flow channel, exchanging heat between the cold plate and the chip on the board to achieve the purpose of dissipating heat from the board.
[0003] Existing boards have a relatively concentrated layout of high-power chips. If the flow channels were evenly distributed across the cold plate, the areas corresponding to low-power chips would overflow with cooling, while the areas corresponding to high-power chips would be insufficiently cooled, leading to chip overheating. Therefore, to meet the cooling requirements for high-power chips, the flow channels on the cold plate are concentrated in a specific area. However, due to the irregular nature of some cold plates or the fact that liquid cooling systems restrict the flow rate and flow resistance of each cold plate, the flow channel layout is restricted. In some areas of the cold plate, there are fewer or no flow channels, resulting in insufficient cooling for chips in certain locations on the board, leading to high temperatures. Utility Model Content
[0004] Based on this, it is necessary to provide a cold plate and a testing device that can improve the above problems.
[0005] A cold plate comprising:
[0006] The plate body has a heat exchange side, the heat exchange side having a first area and a second area, the heat exchange efficiency of the first area is greater than the heat exchange efficiency of the second area, the first area is used to achieve heat dissipation of a high power consumption area of the heat dissipation element, and the second area is used to achieve heat dissipation of a low power consumption area of the heat dissipation element;
[0007] A heat pipe provided on the heat exchange side, for guiding heat from the second region with a higher temperature to the first region with a lower temperature;
[0008] The heat-conducting strips connected to the heat pipes are used to exchange heat with the heat dissipated element; and a heat exchange portion for exchanging heat with the heat dissipated element is provided at a position on the heat exchange side where the heat pipes are not provided.
[0009] In one embodiment, the plate is provided with a flow channel for the cooling medium to flow through;
[0010] The first region is a region with dense flow channels, and the second region is a region with sparse flow channels.
[0011] In one embodiment, the cold plate includes a plurality of heat pipes;
[0012] The second region includes a flow channel region and a non-flow channel region, and at least one heat pipe extends from the first region to the non-flow channel region.
[0013] In one embodiment, the thermally conductive strips are arranged in a one-to-one correspondence with the heat pipes, and the thermally conductive strips extend longitudinally along the extension direction of the corresponding heat pipes.
[0014] In one embodiment, the heat conducting strip has a first projection toward the plane where the plate is located, and the heat pipe has a second projection toward the plane where the plate is located, and the first projection covers the second projection.
[0015] In one embodiment, the heat exchange side is provided with an assembly groove, the heat pipe is installed in the assembly groove, and the heat conductive strip abuts against the plate body and closes the assembly groove.
[0016] In one embodiment, the cold plate further comprises a first filler, wherein the first filler is thermally filled between the thermally conductive strip and the plate body;
[0017] and / or
[0018] The cold plate further includes a second filling member, which is heat-conducting and filled between the heat-conducting strip and the heat pipe.
[0019] In one embodiment, the first filling piece and the second filling piece are made of thermal conductive silicone grease, thermal conductive silica gel or thermal conductive gel.
[0020] In one embodiment, at least part of the heat exchange portion is a first protrusion protruding from the heat exchange side;
[0021] and / or
[0022] The heat conducting strip is provided with a second protrusion and a groove for exchanging heat with the heat dissipation element.
[0023] A testing device comprises the cold plate as described above.
[0024] In the aforementioned cold plate and test device, the heat sink is placed on the heat exchange side of the plate, in contact with the heat conducting strips and heat exchange portion. In this case, the first area dissipates heat from the high-power consumption area of the heat sink, while the second area dissipates heat from the low-power consumption area of the heat sink. Because the first area has a higher heat exchange efficiency than the second area, the second area's temperature is higher than the second area. The heat pipe can direct heat from the second area to the first area, reducing the temperature difference between the two areas on the plate and making the temperature more uniform between the two areas. This ensures that both the high-power consumption area and the low-power consumption area of the heat sink meet the requirements for not overheating, thus satisfying the heat sink's heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A structural diagram of a cold plate provided in one embodiment of the present application;
[0026] Figure 2 This is a structural diagram of the heat dissipation component and the cold plate in contact with each other for heat exchange;
[0027] Figure 3 for Figure 2 An exploded view of the structure shown in;
[0028] Figure 4 for Figure 2 Another exploded view of the structure shown in;
[0029] Figure 5 for Figure 1 Exploded view of the cold plate shown in .
[0030] Description of reference numerals:
[0031] 100, cold plate; 10, plate body; 11, heat exchange side; 111, first area; 112, second area; 113, heat exchange part; 114, assembly groove; 12, flow channel groove; 13, first plate body; 14, second plate body; 20, heat pipe; 30, thermal conductive strip; 31, second bump; 32, groove; 200, heat dissipation element; 201, high power consumption area; 202, low power consumption area. DETAILED DESCRIPTION
[0032] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0035] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.
[0036] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.
[0038] See Figure 1 and Figure 2 One embodiment of the present application provides a cold plate 100. The cold plate 100 includes a plate body 10 having a heat exchange side 11. The plate body 10 exchanges heat with a heat dissipation element 200 via the heat exchange side 11 to prevent the heat dissipation element 200 from overheating. Optionally, the heat dissipation element 200 is a board, which is a type of printed circuit board (PCB). It should be understood that in other embodiments, the type of heat dissipation element 200 is not limited. For example, the heat dissipation element 200 can also be other types of PCBs.
[0039] Further, see Figure 3 and Figure 4 The heat exchange side 11 has a first area 111 and a second area 112. The heat exchange efficiency of the first area 111 is greater than the heat exchange efficiency of the second area 112. The first area 111 is used to achieve heat dissipation in the high power consumption area 201 of the heat dissipation element 200, and the second area 112 is used to achieve heat dissipation in the low power consumption area 202 of the heat dissipation element 200. Among them, the heat exchange efficiency is an important indicator of the heat transfer ability of the cold plate 100 during actual operation. The heat exchange efficiency can be defined as the difference between the actual heat transfer Q and the theoretical maximum heat transfer Q. max The ratio.
[0040] Because the heat transfer efficiency of the first region 111 is greater than that of the second region 112, the actual heat transfer and theoretical maximum heat transfer of the first region 111 are greater than those of the second region 112. That is, the ability of the first region 111 to transfer heat to the heat element 200 is greater than the ability of the second region 112 to transfer heat to the heat element 200, and the heat transfer performance of the first region 111 is superior to that of the second region 112. Because the high-power consumption region 201 requires more heat transfer than the low-power consumption region 202, when used to dissipate heat from the heat element 200, the high-power consumption region 201 of the heat element 200 corresponds to the first region 111, and the first region 111 dissipates heat from the high-power consumption region 201 of the heat element 200. The low-power consumption region 202 of the heat element 200 corresponds to the second region 112, and the second region 112 dissipates heat from the low-power consumption region 202 of the heat element 200.
[0041] In some specific embodiments, the heat dissipated element 200 is a card. Cards are developing toward smaller sizes, higher integration, and higher heat dissipation. Therefore, high-power-consuming chips are concentrated in one or more areas of the card. These areas are referred to as the card's high-power consumption area 201. Low-power-consuming chips, memory modules, and relays are located in another or more areas of the card. These areas are referred to as the card's low-power consumption area 202. When cooling the card, the area where the high-power-consuming chips are concentrated corresponds to the first area 111, while the area where the low-power-consuming chips, memory modules, and relays are located corresponds to the second area 112.
[0042] It is worth noting that the first area 111 can directly transition to the second area 112, that is, the first area 111 is connected to the second area 112 without a clear boundary between them. Alternatively, the first area 111 and the second area 112 can also be set at intervals, that is, there is a transition area between the first area 111 and the second area 112, and the first area 111 is connected to the second area 112 through the transition area. It should be noted that in this application, there is no limitation on the number of first areas 111 and second areas 112. The number of first areas 111 and second areas 112 can be set according to the number of high power consumption areas 201 and low power consumption areas 202 on the heat dissipation element 200. For example, in some specific embodiments, the heat dissipation element 200 has a high power consumption area 201 and a low power consumption area 202. In this case, the plate body 10 has at least one first area 111 and at least one second area 112. In some other specific embodiments, the heat dissipated element 200 has a high power consumption area 201 and two low power consumption areas 202 , and the board 10 has at least one first area 111 and at least two second areas 112 .
[0043] See Figure 5 The cold plate 100 also includes a heat pipe 20, which is disposed on the heat exchange side 11 of the plate body 10. The heat pipe 20 is used to direct heat from the second region 112, which has a higher temperature, to the first region 111, which has a lower temperature. Because the heat exchange efficiency of the first region 111 is greater than that of the second region 112, the temperature of the second region 112 is greater than that of the first region 111. Because the heat pipe 20 can direct heat from the second region 112 to the first region 111, the temperature difference between the two regions on the plate body 10 is reduced, making the temperature between the two regions more uniform. This ensures that both the high-power consumption region 201 and the low-power consumption region 202 of the heat element 200 do not overheat, that is, the heat dissipation requirements of the heat element 200 are met.
[0044] It should be noted that the heat pipe 20 is a heat transfer element that relies on the phase change of the working fluid inside itself to achieve heat transfer. Its specific configuration can refer to the existing technology and will not be described in detail here.
[0045] It is worth noting that, in the present application, there is no limitation on the specific position of the heat pipe 20 on the heat exchange side 11. For example, in some specific embodiments, one end of the heat pipe 20 extends into the range defined by the first area 111, and the other end of the heat pipe 20 extends into the range defined by the second area 112. In other specific embodiments, one end of the heat pipe 20 is arranged close to the first area 111 but outside the range defined by the first area 111, and the other end of the heat pipe 20 is arranged close to the second area 112 but outside the range defined by the second area 112. In still other specific embodiments, one end of the heat pipe 20 is arranged close to the first area 111 but outside the range defined by the first area 111, and the other end of the heat pipe 20 extends into the range defined by the second area 112.
[0046] Continue reading Figure 1 and Figure 5 The cold plate 100 also includes a heat-conducting strip 30, which is connected to the heat pipe 20. Since it is inconvenient to set a heat exchange structure (such as a protrusion or a groove, etc.) on the heat pipe 20 for exchanging heat with the heat receiving element 200, the heat-conducting strip 30 is provided to facilitate the setting of the heat exchange structure, and the heat exchange structure is used to contact and exchange heat with the heat receiving element 200; at the same time, the provision of the heat-conducting strip 30 can increase the contact area with the heat receiving element 200, which is beneficial to the heat dissipation of the heat receiving element 200. The heat-conducting strip 30 can be made of aluminum alloy or copper material, which is not limited here. Among them, a heat exchange part 113 is provided at a position where the heat pipe 20 is not provided on the heat exchange side 11, and the heat exchange part 113 is used for contacting and exchanging heat with the heat receiving element 200.
[0047] In the cold plate 100 provided in the embodiment of the present application, the heat sink 200 is placed on the heat exchange side 11 of the plate body 10 and in contact with the heat conductive strip 30 and the heat exchange portion 113. In this case, the first region 111 is used to dissipate heat from the high-power consumption region 201 of the heat sink 200, and the second region 112 is used to dissipate heat from the low-power consumption region 202 of the heat sink 200. Because the heat exchange efficiency of the first region 111 is greater than that of the second region 112, the temperature of the second region 112 is higher than that of the second region 112. The heat pipe 20 can guide the heat from the second region 112 to the first region 111, thereby reducing the temperature difference between the two regions on the plate body 10 and making the temperature between the two regions more uniform. This ensures that both the high-power consumption region 201 and the low-power consumption region 202 of the heat sink 200 meet the requirement of not overheating, that is, the heat dissipation requirement of the heat sink 200 is met.
[0048] In some embodiments, the plate 10 is provided with a flow channel for the cooling medium to flow through. Figure 4Specifically, the plate body 10 includes a first plate body 13 and a second plate body 14. At least one of the first plate body 13 and the second plate body 14 is provided with a flow channel groove 12. The first plate body 13 and the second plate body 14 are spliced together to close the opening of the flow channel groove 12 to form a flow channel. In one specific embodiment, the second plate body 14 has a flow channel groove 12, and the surface of the first plate body 13 facing the second plate body 14 is not provided with the flow channel groove 12. When the first plate body 13 and the second plate body 14 are spliced together, the first plate body 13 closes the opening of the flow channel groove 12 to form a flow channel.
[0049] The first region 111 is a region with dense flow channels, while the second region 112 is a region with sparse flow channels. Since the flow channels in the first region 111 are denser than those in the second region 112, more cooling medium can flow through, making the heat exchange efficiency in the first region 111 greater than that in the second region 112.
[0050] Optionally, continue to Figure 5 , the cold plate 100 includes a plurality of heat pipes 20. The second region 112 includes a flow channel region and a non-flow channel region, and at least one heat pipe 20 extends from the first region 111 to the non-flow channel region. That is, in the present application, a first region 111 and a second region 112 are provided with a plurality of heat pipes 20 correspondingly, and at least one heat pipe 20 extends from the first region 111 to the non-flow channel region of the second region 112. Since the cooling medium flows through the flow channel region, the temperature is lower than that of the non-flow channel region. At least one heat pipe 20 extends from the first region 111 to the non-flow channel region, so that the temperature of the non-flow channel region is reduced, thereby ensuring the temperature uniformity between the regions.
[0051] Continue reading Figure 1 In some specific embodiments, four heat pipes 20 are provided corresponding to one first region 111 and one second region 112, wherein one heat pipe 20 ( Figure 1 The heat pipe 20 corresponding to the rightmost heat conductive strip 30 in the figure extends from the first region 111 to the non-flow channel region. Of course, in other embodiments, the number of heat pipes 20 provided in each first region 111 and each second region 112 is not limited, and may be one, two, three, or more than four. Furthermore, the number of heat pipes 20 extending from the first region 111 to the non-flow channel region is not limited, and may be one or more than two.
[0052] In some embodiments, the thermal strip 30 has a first projection toward the plane of the plate 10, and the heat pipe 20 has a second projection toward the plane of the plate 10, with the first projection covering the second projection. In this way, the thermal strip 30 can completely cover the heat pipe 20, facilitating the placement of heat exchange structures at different locations corresponding to the heat pipe 20 for heat exchange with the heat sink 200.
[0053] Optionally, at least part of the heat exchange portion 113 is a first protrusion protruding from the heat exchange side 11, and the heat conducting strip 30 is provided with a second protrusion 31 and a groove 32 for exchanging heat with the heat dissipating element 200 (see Figure 1 ). Through the first protrusion, the second protrusion 31 and the groove 32, heat exchange with the heat dissipation element 200 is facilitated.
[0054] It should be noted that the number, height and arrangement positions of the first protrusions, the second protrusions 31 and the grooves 32 are adjusted accordingly according to the type of the heat dissipation element 200 and are not limited here.
[0055] It is conceivable that in some other embodiments, at least part of the heat exchange portion 113 may be recessed in the heat exchange side 11 or directly provided on the surface of the heat exchange side 11 , and may be provided as needed, which is not limited here.
[0056] In some specific implementations, please refer to Figure 5 The thermal conductive strips 30 are arranged in a one-to-one correspondence with the heat pipes 20, and the thermal conductive strips 30 extend longitudinally along the extension direction of the corresponding heat pipe 20. In this way, during installation, each heat pipe 20 is installed with a corresponding thermal conductive strip 30, avoiding interference with other structures (such as the first bump) caused by the larger thermal conductive strip 30 when multiple heat pipes 20 are installed with one thermal conductive strip 30. Of course, in other embodiments, multiple heat pipes 20 can also be installed with one thermal conductive strip 30, and this is not limited here.
[0057] Continue reading Figure 5 , the heat exchange side 11 is provided with an assembly groove 114, and the heat pipe 20 is installed in the assembly groove 114. Optionally, the heat pipe 20 is fixedly installed in the assembly groove 114 by soldering, or bonded to the assembly groove 114 by thermal conductive gel. The thermal conductive strip 30 is in contact with the heat pipe 20, and abuts against the plate body 10 to close the assembly groove 114. By providing the assembly groove 114 on the heat exchange side 11 and installing the heat pipe 20 into the assembly groove 114, it is ensured that the heat pipe 20 is firmly fixed to the heat exchange side 11; at the same time, the thermal conductive strip 30 abuts against the plate body 10 and closes the assembly groove 114 to ensure that the thermal conductive strip 30 completely covers the heat pipe 20, so as to facilitate the arrangement of heat exchange structures and heat dissipation components 200 at different positions corresponding to the heat pipe 20.
[0058] Optionally, the heat conducting strip 30 may be fixedly connected to the plate body 10 by fastening screws. In other embodiments, the heat conducting strip 30 may also be fixedly connected to the plate body 10 in other ways, such as by snapping.
[0059] The cold plate 100 further includes a first filler (not shown), which is thermally conductively filled between the thermally conductive strip 30 and the plate body 10. The first filler can fill the gap between the thermally conductive strip 30 and the plate body 10, facilitating heat transfer between the thermally conductive strip 30 and the plate body 10.
[0060] Furthermore, the cold plate 100 further includes a second filler (not shown), which is thermally conductively filled between the thermally conductive strip 30 and the heat pipe 20. The second filler can fill the gap between the thermally conductive strip 30 and the heat pipe 20, facilitating heat transfer between the thermally conductive strip 30 and the heat pipe 20.
[0061] Optionally, the first filler and the second filler are made of thermally conductive silicone grease, thermally conductive silica gel or thermally conductive gel. Of course, in other embodiments, there is no limitation on the material of the first filler and the second filler, as long as they can fill the gap and conduct heat.
[0062] Another embodiment of the present application provides a testing device including the aforementioned cold plate 100. The cold plate 100 is capable of exchanging heat with a heat dissipation element 200 to dissipate heat from the heat dissipation element 200. Since the cold plate 100 has beneficial effects, a testing device including the cold plate 100 accordingly has the same beneficial effects, which will not be described in detail here.
[0063] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0064] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.
Claims
1. A cold plate, characterized in that: include: The plate body (10) has a heat exchange side (11), the heat exchange side (11) having a first area (111) and a second area (112), the heat exchange efficiency of the first area (111) being greater than the heat exchange efficiency of the second area (112), the first area (111) being used to achieve heat dissipation of a high power consumption area (201) of the heat dissipating element (200), and the second area (112) being used to achieve heat dissipation of a low power consumption area (202) of the heat dissipating element (200); A heat pipe (20) provided on the heat exchange side (11) is used to guide heat from the second region (112) with a higher temperature to the first region (111) with a lower temperature; A heat-conducting strip (30) in heat-conducting connection with the heat pipe (20) is used for exchanging heat with the heat dissipated element (200); and a heat exchange portion (113) for exchanging heat with the heat dissipated element (200) is provided at a position on the heat exchange side (11) where the heat pipe (20) is not provided.
2. The cold plate according to claim 1, wherein The plate body (10) is provided with a flow channel for the cooling medium to flow through; The first region (111) is a region with dense flow channels, and the second region (112) is a region with sparse flow channels.
3. The cold plate according to claim 2, characterized in that The cold plate includes a plurality of heat pipes (20); The second region (112) includes a flow channel region and a non-flow channel region, and at least one heat pipe (20) extends from the first region (111) to the non-flow channel region.
4. The cold plate according to claim 1, wherein The heat conducting strips (30) are arranged in a one-to-one correspondence with the heat pipes (20), and the heat conducting strips (30) extend longitudinally along the extension direction of the corresponding heat pipes (20).
5. The cold plate according to claim 1, wherein The heat conducting strip (30) has a first projection toward the plane where the plate body (10) is located, and the heat pipe (20) has a second projection toward the plane where the plate body (10) is located, and the first projection covers the second projection.
6. The cold plate according to claim 1, wherein The heat exchange side (11) is provided with an assembly groove (114), the heat pipe (20) is installed in the assembly groove (114), and the heat conducting strip (30) abuts against the plate body (10) and closes the assembly groove (114).
7. The cold plate according to claim 6, characterized in that The cold plate further comprises a first filling member, the first filling member being heat-conductingly filled between the heat-conducting strip (30) and the plate body (10); and / or The cold plate further comprises a second filling piece, which is heat-conductingly filled between the heat-conducting strip (30) and the heat pipe (20).
8. The cold plate according to claim 7, characterized in that The first filling piece and the second filling piece are made of thermal conductive silicone grease, thermal conductive silica gel or thermal conductive gel.
9. The cold plate according to claim 1, wherein At least a portion of the heat exchange portion (113) is a first protrusion protruding from the heat exchange side (11); and / or The heat conducting strip (30) is provided with a second protrusion (31) and a groove (32) for exchanging heat with the heat dissipating element (200).
10. A testing device, characterized in that: The testing device comprises the cold plate according to any one of claims 1 to 9.