Heat exchange module and electronic equipment

Abstract

The embodiment of the utility model discloses a heat exchange module and electronic equipment, the heat exchange module comprises a micropump and a heat exchange piece, the micropump comprises a substrate, and the substrate comprises a first layer; the heat exchange piece comprises a cover plate, the cover plate comprises a second layer, and the melting point of the second layer is different from that of the first layer; a first connecting area is arranged on the side, close to the second layer, of the first layer, a second connecting area is arranged on the side, close to the first layer, of the second layer, and the second connecting area is welded to the first connecting area, so that the micropump and the heat exchange piece are in sealed connection. Therefore, the sealing performance and the connecting strength of the connecting area can be enhanced by utilizing the melting point difference of the material of the connecting area of the substrate and the cover plate, so that the reliability and the stability of the sealing connection of the micropump and the heat exchange piece can be improved, and the stable operation of the heat exchange module can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, and more specifically, to a heat exchange module and an electronic device. Background Art

[0002] As electronic devices become increasingly integrated, heat transfer becomes a key factor restricting their performance. Liquid cooling plates, as highly efficient heat transfer components, are widely used in various high-power density electronic devices.

[0003] In practical cooling designs, it's often necessary to connect a liquid cooling plate to a pump to drive the flow of the working fluid within the plate. Currently, most systems simply stack the two, but due to the different materials used, this results in less than ideal sealing. Utility Model Content

[0004] In view of the above shortcomings of the prior art, the purpose of the present invention is to provide a new type of heat exchange module and electronic equipment.

[0005] According to one aspect of the present invention, a heat exchange module is provided.

[0006] The heat exchange module comprises:

[0007] A micropump, the micropump comprising a substrate, the substrate comprising a first layer;

[0008] a heat exchange element, the heat exchange element comprising a cover plate, the cover plate comprising a second layer, the second layer having a melting point different from that of the first layer;

[0009] The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area to form a sealed connection between the micro pump and the heat exchange element.

[0010] Optionally, the first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

[0011] Optionally, a through hole is opened on the substrate, and on a transverse plane of the substrate, the first connection area is arranged around the through hole, and a gap is provided between the first connection area and the through hole.

[0012] Optionally, the width of the gap is greater than or equal to 0.1 times the diameter of the through hole.

[0013] Optionally, the width of the gap ranges from 0.1 times to 0.25 times the diameter of the through hole.

[0014] Optionally, a connection groove and / or a connection protrusion is provided on the first connection area, and the second connection area is sealedly connected to the first connection area.

[0015] Optionally, the melting point of the second layer is lower than the melting point of the first layer.

[0016] Optionally, a linear connection groove is provided on the first connection area, and the second connection area is embedded in the linear connection groove to form a circumferential seal.

[0017] Optionally, a plurality of grooves are provided on the first connection area, and the second connection area is embedded in the grooves to form a circumferential seal.

[0018] Optionally, a through hole is provided on the substrate, an annular connecting groove is provided on the first connecting area, the annular connecting groove surrounds the circumference of the through hole, and the second connecting area is embedded in the annular connecting groove to form a seal.

[0019] Optionally, there are multiple annular connecting grooves, and the multiple annular connecting grooves are spaced around the circumference of the through hole.

[0020] Optionally, a ratio of a depth of any one of the linear connecting groove, the groove, and the annular connecting groove to a thickness of the substrate is in a range of 1:4 to 3:4.

[0021] Optionally, a ratio of a depth of any one of the linear connecting groove, the groove and the annular connecting groove to a thickness of the substrate is 1:2.

[0022] Optionally, the second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressing welding, friction welding, brazing or diffusion welding.

[0023] Optionally, the cover plate has a first working fluid inlet and a first working fluid outlet, the heat exchange element has a flow channel, and the substrate is provided with a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0024] According to another aspect of the present invention, an electronic device is provided, comprising the above-mentioned heat exchange module.

[0025] One technical effect of the embodiments of the present disclosure is:

[0026] The heat exchange module includes a micropump and a heat exchange element. The micropump includes a substrate, which includes a first layer. The heat exchange element includes a cover plate, which includes a second layer. The second layer has a melting point different from that of the first layer. The first layer has a first connection area on a side close to the second layer, and the second layer has a second connection area on a side close to the first layer. The second connection area is welded to the first connection area to form a sealed connection between the micropump and the heat exchange element.

[0027] This allows the difference in melting point between the materials in the connection area between the base and cover plates to be exploited to enhance the sealing and connection strength of the connection area, thereby improving the reliability and stability of the sealed connection between the micropump and the heat exchange element, thereby ensuring the stable operation of the heat exchange module. Furthermore, the provision of two connection areas, the first and second connection areas, avoids problems such as liquid and air leakage that may exist with traditional connection methods, improving the sealing performance of the heat exchange module and ensuring the safe and stable operation of electronic equipment using this heat exchange module.

[0028] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0030] Figure 1 is a schematic diagram of a heat exchange module according to an embodiment of the present disclosure;

[0031] Figure 2 is a schematic diagram of a first connection area according to an embodiment of the present disclosure;

[0032] Figure 3 is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0033] Figure 4 is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0034] Figure 5 This is a schematic diagram of another first connection area of an embodiment of the present disclosure.

[0035] Description of reference numerals:

[0036] 1. Micropump; 11. Base plate; 111. Second working fluid inlet; 112. Second working fluid outlet; 12. Main body; 2. Heat exchange element; 21. Cover plate; 211. First working fluid inlet; 212. First working fluid outlet; 22. Liquid cooling layer; 221. Flow channel; 3. Linear connecting groove; 4. Groove; 5. Annular connecting groove. DETAILED DESCRIPTION

[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0039] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0040] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0041] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] An embodiment of the present utility model provides a heat exchange module, which can be applied to heat exchange of small electronic devices such as tablet computers, laptop computers, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0043] like Figure 1 As shown, the heat exchange module provided by the embodiment of the present invention includes:

[0044] The micropump 1 includes a substrate 11, and the substrate 11 includes a first layer;

[0045] The heat exchange element 2 includes a cover plate 21, and the cover plate 21 includes a second layer, and the second layer has a different melting point from the first layer;

[0046] The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area to form a sealed connection between the micro pump 1 and the heat exchange element 2.

[0047] In this embodiment, depending on actual design requirements, the first layer can be a metal layer to meet the strength requirements of the substrate 11; the first layer can also be a polymer material layer to meet the lightweight requirements of the substrate 11; the first layer can also be a metal layer or a polymer material layer, and the substrate 11 also includes the other of the metal layer and the polymer material layer, which can improve the overall performance of the substrate 11. In addition, depending on the actual design, the substrate 11 can also include other material layers to form a multi-layer structure.

[0048] The micropump 1 further includes a body 12, which together with the substrate 11 form the structure of the micropump 1. For example, when the micropump 1 is a piezoelectric pump, the body 12 may include a housing and a piezoelectric element disposed within the housing; when the micropump 1 is an electromagnetic pump, the body 12 may include a housing and an electromagnet and liquid metal disposed within the housing.

[0049] Similarly, depending on actual design requirements, the second layer can be a metal layer to meet the strength requirements of the cover plate 21; the second layer can also be a polymer material layer to meet the lightweight requirements of the cover plate 21; the second layer can also be a metal layer or a polymer material layer, and the cover plate 21 also includes the other of the metal layer and the polymer material layer, which can improve the overall performance of the cover plate 21. In addition, depending on the actual design, the cover plate 21 can also include other material layers to form a multi-layer structure.

[0050] In the embodiment of the present invention, the second layer has a different melting point than the first layer, that is, the two layers facing each other, the substrate 11 and the cover plate 21, have different melting points. For example, the second layer and the first layer can be made of different materials, such as any two of metal materials, inorganic non-metallic materials, and polymer materials, which can result in a difference in melting point between the second layer and the first layer. The second layer and the first layer can also be made of the same type but different materials, such as different metal materials, different inorganic non-metallic materials, or different polymer materials, which can also result in a difference in melting point between the second layer and the first layer, thereby allowing the connection area between the substrate 11 and the cover plate 21 to be made of different materials.

[0051] The following description is made by taking two different types of materials, a metal layer and a polymer material layer, respectively, as an example. Inorganic non-metallic materials or other materials can also be used.

[0052] In one embodiment, when the second layer is a metal layer and the first layer is a polymer material layer, a second connection area is formed on the metal layer of the cover plate 21, and a first connection area is formed on the polymer material layer of the substrate 11, so that the second layer and the first layer are different types of materials.

[0053] In another embodiment, when the second layer is a polymer material layer and the first layer is a metal layer, a first connection area is formed on the metal layer of the substrate 11, and a second connection area is formed on the polymer material layer of the cover plate 21, so that the second layer and the first layer are different types of materials.

[0054] In addition, the different materials used in the connection area between the substrate 11 and the cover plate 21 can also enhance the flexible deformation capability of the heat exchange module, thereby meeting the requirements of using bendable electronic devices.

[0055] In summary, the connection area between the substrate 11 and the cover plate 21 is made of materials with different melting points. That is, the first connection area and the second connection area have different melting points. In the process of welding the first connection area and the second connection area, the difference in melting points of the materials in the connection area between the substrate 11 and the cover plate 21 can be used to enhance the sealing and connection strength of the connection area, thereby improving the reliability and stability of the sealed connection between the micropump 1 and the heat exchange element 2, thereby ensuring the stable operation of the heat exchange module. Moreover, the provision of the two connection areas can also avoid problems such as liquid leakage and air leakage that may exist in traditional connection methods, thereby improving the sealing performance of the heat exchange module, thereby ensuring the safe and stable operation of electronic equipment using the heat exchange module.

[0056] The first connection region can be formed through processes such as etching, surface activation, and laser cutting. The second connection region is typically positioned opposite the first connection region, allowing the lower melting point to partially melt during welding and form a strong bond with the higher melting point. Control of welding parameters such as temperature and pressure is necessary to prevent deformation of the lower melting point during welding, which could lead to overall structural failure.

[0057] Specifically, the first connection area may include a connection groove, a connection protrusion, or both, and the second connection area is embedded within the first connection area to form a seal. The first connection area may also have a roughened structure formed by surface treatment, and the second connection area is welded to the first connection area to form a tight bond with the roughened structure.

[0058] The welding methods for the first and second connection areas include, but are not limited to, laser welding, ultrasonic welding, hot pressing welding, and friction welding. The welding of the second and first connection areas strengthens the bond between the base plate 11 and the cover plate 21, making them less susceptible to falling off or breaking, and extending the service life and durability of the heat exchange module.

[0059] Optionally, along the thickness direction of the heat exchange module, the second connection area is located opposite to the first connection area, which can facilitate the sealed connection between the second connection area and the first connection area.

[0060] Optionally, the first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

[0061] In one embodiment, the first layer can be set as a metal layer and the second layer can be set as a polymer material layer. A first connection area is formed on the metal layer of the substrate 11, and a second connection area is formed on the polymer material layer of the cover plate 21. The second connection area is welded to the first connection area. The polymer material layer of the second connection area can be locally melted and form a strong bond with the metal layer of the first connection area, thereby realizing a sealed connection between the micropump 1 and the heat exchanger 2.

[0062] The first metal layer can enhance the support of the substrate 11 on the structure above it, thereby ensuring the structural strength of the micropump 1. The second polymer layer can also reduce the overall weight of the heat exchanger 2, thereby facilitating the lightweight development of the heat exchanger 2.

[0063] In another embodiment, the second layer can be set as a metal layer and the first layer can be set as a polymer material layer. The second connection area is formed on the metal layer of the cover plate 21, and the first connection area is formed on the polymer material layer of the substrate 11. The second connection area is welded to the first connection area. The polymer material layer of the first connection area can be locally melted and form a strong bond with the metal layer of the second connection area, thereby realizing a sealed connection between the substrate 11 and the cover plate 21.

[0064] In another embodiment, the first layer and the second layer may be made of different metal materials, or the first layer and the second layer may be made of different polymer materials, and both layers can achieve reliable connection by utilizing the difference in melting points.

[0065] Optionally, a through hole is opened on the substrate 11 , and on a transverse plane of the substrate 11 , the first connection area is arranged around the through hole, with a gap between the first connection area and the through hole.

[0066] In this embodiment, the substrate 11 is provided with a through hole along the vertical direction, i.e., the longitudinal direction. The through hole includes a second working fluid inlet 111 and a second working fluid outlet 112. The second working fluid inlet 111 and the second working fluid outlet 112 are respectively connected to the accommodating cavity in the micropump 1, so that the working fluid can enter the accommodating cavity from the second working fluid inlet 111 and discharge the accommodating cavity from the second working fluid outlet 112, thereby realizing the driving of the working fluid.

[0067] The first connection area is arranged on the transverse plane of the base plate 11, and is arranged around the through hole. That is, the first connection area surrounds the circumference of the through hole. While the first and second connection areas can achieve a seal between the cover plate 21 and the base plate 11, the risk of liquid leakage is reduced, thereby improving the reliability of the heat exchange module.

[0068] In addition, a gap is provided between the first connection area and the through hole on the transverse plane of the substrate 11, that is, a certain avoidance distance is maintained between the first connection area and the through hole. On the one hand, this can prevent the welding process between the first connection area and the second connection area from interfering with the through hole, and prevent the connection between the cover plate 21 and the substrate 11 from affecting the normal operation of the micropump 1, so as to ensure the normal and stable operation of the micropump 1.

[0069] On the other hand, the setting of the gap between the first connection area and the through hole can also prevent the working fluid from entering and exiting and causing erosion to the welding area of the first connection area and the second connection area, thereby ensuring the reliability of the sealed connection between the two and extending the service life and durability of the heat exchange module.

[0070] Optionally, the width of the gap is greater than or equal to 0.1 times the diameter of the through hole.

[0071] In this embodiment, the width of the gap is set to be no less than 0.1 times the diameter of the through hole, that is, the first connection area is located outside the area formed by 1.2 times the diameter of the through hole, so that a reliable avoidance distance can be formed between the first connection area and the through hole, which can avoid the welding process between the first connection area and the second connection area from interfering with the through hole, and avoid the connection between the cover plate 21 and the substrate 11 from affecting the normal operation of the micropump 1, so as to ensure the normal and stable operation of the micropump 1, and also facilitate the welding process between the first connection area and the second connection area, thereby simplifying the processing difficulty of the heat exchange module.

[0072] Optionally, the width of the gap ranges from 0.1 times to 0.25 times the diameter of the through hole.

[0073] In this embodiment, the width of the gap is set between 0.1 and 0.25 times the diameter of the through-hole, that is, the first connection area is located outside the area formed by 1.2 times the diameter of the through-hole and within the area formed by 1.5 times the diameter of the through-hole. Setting the first connection area within the annular area defined by the area formed by 1.2 times the diameter of the through-hole and within the area formed by 1.5 times the diameter of the through-hole can avoid the through-hole while also enhancing the reliability of the sealed connection between the cover plate 21 and the substrate 11, reducing the risk of sealing failure.

[0074] Optionally, a connection groove and / or a connection protrusion is provided on the first connection area, and the second connection area is sealedly connected to the first connection area.

[0075] In this embodiment, the first connection area may include a groove, a protrusion, or both, and the second connection area is embedded within the first connection area to form a sealed connection. The number and distribution of the connection grooves and / or connection protrusions may be adjusted to enhance sealing performance based on actual sealing requirements.

[0076] Optionally, the melting point of the second layer is lower than that of the first layer, so that during welding, the second connection area of the second layer with a lower melting point can be partially melted and form a strong bond with the first connection area of the first layer with a higher melting point.

[0077] Optionally, a linear connection groove 3 is provided on the first connection area, and the second connection area is embedded in the linear connection groove 3 to form a circumferential seal.

[0078] In this embodiment, a linear connection groove 3 can be formed in the first connection area, for example, by etching, cutting, or other processes. Welding the first and second connection areas can utilize the difference in melting points of the materials in the connecting regions of the first and second connection areas to partially melt the second connection area and embed it within the linear connection groove 3, thereby forming a secure bond with the first connection area. This allows for a sealed connection between the micropump 1 and the heat exchange element 2, thereby ensuring stable operation of the heat exchange module.

[0079] According to design requirements, the shape of the linear connection groove 3 includes but is not limited to S-shape, arc shape, spiral shape, cross line shape and racetrack shape. Figure 2 A cross-shaped linear connecting groove 3 is shown. The arrangement of the linear connecting groove 3 in this shape enables the first connecting area and the second connecting area to form a complete and reliable seal along the circumferential direction, thereby further enhancing the reliability of the sealing connection between the micro pump 1 and the heat exchange element 2.

[0080] Optionally, a plurality of grooves 4 are provided on the first connection area, and the second connection area is embedded in the grooves 4 to form a circumferential seal.

[0081] In this embodiment, a plurality of grooves 4, i.e., grooves or pits, can be formed on the first connection area, for example, by etching, cutting, or other processes. Welding the first connection area to the second connection area can utilize the difference in melting points of the materials in the connecting regions of the first and second connection areas to partially melt the second connection area and embed it into the plurality of grooves 4, thereby forming a strong bond with the first connection area. This can achieve a sealed connection between the micropump 1 and the heat exchange element 2, thereby ensuring stable operation of the heat exchange module.

[0082] According to design requirements, the cross-sectional shape of the groove 4 includes but is not limited to circular, elliptical, rectangular and irregular shapes. Figure 3The figure shows a distribution of grooves 4, where some grooves 4 are arranged along a first circle around the periphery of the through hole, and other grooves 4 are arranged along a second circle around the periphery of the through hole. The second circle is staggered with the first circle, so that the first connection area and the second connection area can be completely sealed along the circumferential direction by utilizing the staggered arrangement of multiple circles of grooves 4, thereby further enhancing the reliability of the sealed connection between the micro pump 1 and the heat exchange element 2.

[0083] In another embodiment, the number of arranged circles of the grooves 4 may be increased to enhance the reliability of the circumferential sealing connection between the first connection area and the second connection area and reduce the risk of sealing failure.

[0084] Optionally, a through hole is provided on the substrate 11 , an annular connecting groove 5 is provided on the first connecting area, the annular connecting groove 5 surrounds the circumference of the through hole, and the second connecting area is embedded in the annular connecting groove 5 to form a seal.

[0085] like Figure 4 As shown, in this embodiment, the annular connecting groove 5 provided on the first connecting area surrounds the circumference of the through hole. On the one hand, the gap between the annular connecting groove 5 and the through hole can be utilized to form a avoidance for the through hole, so as to ensure the normal and stable operation of the micro pump 1; on the other hand, the provision of the annular connecting groove 5 surrounding the circumference of the through hole enables the first connecting area and the second connecting area to form a complete circle of sealing along the circumferential direction, thereby further enhancing the reliability of the sealed connection between the micro pump 1 and the heat exchange element 2.

[0086] The through hole formed on the substrate 11 includes a second working fluid inlet 111 and a second working fluid outlet 112. The second working fluid inlet 111 and the second working fluid outlet 112 are respectively connected to the accommodating chamber within the micropump 1, allowing the working fluid to enter the accommodating chamber from the second working fluid inlet 111 and exit the accommodating chamber from the second working fluid outlet 112, thereby achieving the driving of the working fluid. Based on this, an annular connecting groove 5 can be provided on the outer periphery of the second working fluid inlet 111 and the outer periphery of the second working fluid outlet 112, respectively, or an annular connecting groove 5 can be provided circumferentially surrounding the second working fluid inlet 111 and the second working fluid outlet 112.

[0087] Optionally, there are multiple annular connecting grooves 5 , and the multiple annular connecting grooves 5 are spaced around the circumference of the through hole.

[0088] like Figure 5As shown, in this embodiment, a plurality of annular connecting grooves 5 can be respectively provided on the periphery of the second working fluid inlet 111 and the periphery of the second working fluid outlet 112, or a plurality of annular connecting grooves 5 can be provided to circumferentially surround the second working fluid inlet 111 and the second working fluid outlet 112. The plurality of annular connecting grooves 5 can be used to further enhance the reliability of the circumferential sealing between the first connection area and the second connection area, thereby further enhancing the sealing connection between the micro pump 1 and the heat exchange element 2, and avoiding the overall sealing failure of the heat exchange module caused by the failure of a single-layer seal, thereby extending the service life and durability of the heat exchange module.

[0089] Optionally, the ratio of the depth of any one of the linear connecting groove 3, the groove 4 and the annular connecting groove 5 to the thickness of the substrate 11 is in the range of 1:4 to 3:4.

[0090] In this embodiment, the connection grooves include, but are not limited to, linear connection grooves 3, grooves 4, and annular connection grooves 5. When the connection grooves are located on the substrate 11, the ratio of the depth of the connection grooves to the thickness of the substrate 11 is set in a range of 1:4 to 3:4, that is, the minimum depth of the connection grooves is 1 / 4 of the thickness of the substrate 11, and the maximum depth of the connection grooves is 3 / 4 of the thickness of the substrate 11. This allows the second connection area to be embedded in the connection groove to form a sealed connection while preventing the strength of the substrate 11 from being affected by excessive hollowing out of the substrate 11, thereby ensuring the normal and stable operation of the heat exchange module.

[0091] Optionally, the ratio of the depth of any one of the linear connecting groove 3 , the groove 4 and the annular connecting groove 5 to the thickness of the substrate 11 is 1:2.

[0092] In this embodiment, the connection grooves include but are not limited to the linear connection groove 3, the groove 4, and the annular connection groove 5. When the connection grooves are located on the substrate 11, the ratio of the depth of the connection groove to the thickness of the substrate 11 is preferably 1 / 2. This ensures sufficient contact area between the second connection area and the connection groove, thereby ensuring a good sealing effect between the second connection area and the first connection area, simplifying the formation of the connection groove, and reducing the risk of deformation of the cover plate 21.

[0093] Optionally, the second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressing welding, friction welding, brazing, or diffusion welding. The welding of the second connection area to the first connection area can make the connection between the base plate 11 and the cover plate 21 more secure, making it less likely to fall off or break, and also extending the service life and durability of the heat exchange module.

[0094] Among them, ultrasonic welding and hot pressing welding are preferred, which can simplify the sealing process of the micro pump 1 and the heat exchange element 2, reduce the difficulty of connection, and thus improve the processing efficiency of the heat exchange module.

[0095] Optionally, the cover plate 21 has a first working fluid inlet 211 and a first working fluid outlet 212, the heat exchange element 2 has a flow channel 221, and the base plate 11 has a second working fluid inlet 111 and a second working fluid outlet 112. The first working fluid inlet 211 and the first working fluid outlet 212 are respectively connected to the flow channel 221, and the first working fluid inlet 211 is connected to the second working fluid outlet 112, and the first working fluid outlet 212 is connected to the second working fluid inlet 111.

[0096] like Figure 1 As shown, the heat exchange element 2 also includes a liquid cooling layer 22 having a flow channel groove formed therein. The cover plate 21 is sealed with the liquid cooling layer 22, and a flow channel 221 is formed in the flow channel groove. The working fluid can enter the flow channel 221 through the second working fluid outlet 112 and the first working fluid inlet 211, and then return from the flow channel 221 through the first working fluid outlet 212 and the second working fluid inlet 111 to the micropump 1, thereby achieving working fluid circulation.

[0097] The present invention also provides an electronic device including the aforementioned heat exchange module. The electronic device may be a small electronic device such as a tablet computer, a laptop computer, smart glasses, a smart watch, a smart headset, etc.

[0098] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0099] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat exchange module, characterized in that: include: A micropump (1), the micropump (1) comprising a substrate (11), the substrate (11) comprising a first layer; A heat exchange element (2), the heat exchange element (2) comprising a cover plate (21), the cover plate (21) comprising a second layer, the second layer having a different melting point from the first layer; The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area to form a sealed connection between the micro pump (1) and the heat exchange element (2).

2. The heat exchange module according to claim 1, characterized in that: The first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

3. The heat exchange module according to claim 1, characterized in that: A through hole is provided on the substrate (11); on a transverse plane of the substrate (11), the first connection area is arranged around the through hole, and a gap is provided between the first connection area and the through hole.

4. The heat exchange module according to claim 3, characterized in that: The width of the gap is greater than or equal to 0.1 times the diameter of the through hole.

5. The heat exchange module according to claim 4, characterized in that: The width of the gap ranges from 0.1 times to 0.25 times the diameter of the through hole.

6. The heat exchange module according to claim 1, characterized in that: The first connection area is provided with a connection groove and / or a connection protrusion, and the second connection area is sealedly connected to the first connection area.

7. The heat exchange module according to claim 6, characterized in that: The second layer has a melting point lower than that of the first layer.

8. The heat exchange module according to claim 7, characterized in that: A linear connection groove (3) is provided on the first connection area, and the second connection area is embedded in the linear connection groove (3) to form a circumferential seal.

9. The heat exchange module according to claim 7, characterized in that: A plurality of grooves (4) are provided on the first connection area, and the second connection area is embedded in the grooves (4) to form a circumferential seal.

10. The heat exchange module according to claim 7, characterized in that: A through hole is provided on the substrate (11), an annular connecting groove (5) is provided on the first connecting area, the annular connecting groove (5) surrounds the circumference of the through hole, and the second connecting area is embedded in the annular connecting groove (5) to form a seal.

11. The heat exchange module according to claim 10, characterized in that: There are multiple annular connecting grooves (5), and the multiple annular connecting grooves (5) are spaced around the circumference of the through hole.

12. The heat exchange module according to any one of claims 8 to 11, characterized in that: The first connection area is provided with a linear connection groove (3), a plurality of grooves (4) or an annular connection groove (5), and the ratio of the depth of any one of the linear connection groove (3), the groove (4) and the annular connection groove (5) to the thickness of the substrate (11) is in the range of 1:4 to 3:

4.

13. The heat exchange module according to claim 12, characterized in that: The ratio of the depth of any one of the linear connecting groove (3), the groove (4) and the annular connecting groove (5) to the thickness of the base plate (11) is 1:

2.

14. The heat exchange module according to claim 1, characterized in that: The second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressing welding, friction welding, brazing or diffusion welding.

15. The heat exchange module according to claim 1, characterized in that: The cover plate (21) is provided with a first working fluid inlet (211) and a first working fluid outlet (212); the heat exchange element (2) is provided with a flow channel (221); the base plate (11) is provided with a second working fluid inlet (111) and a second working fluid outlet (112); the first working fluid inlet (211) and the first working fluid outlet (212) are respectively connected to the flow channel (221); the first working fluid inlet (211) is connected to the second working fluid outlet (112); and the first working fluid outlet (212) is connected to the second working fluid inlet (111).

16. An electronic device, characterized in that: A heat exchange module comprising any one of claims 1 to 15.

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