Air draft structure of silicon wafer groove type machine
By designing a double-layer exhaust frame structure and reasonably allocating exhaust resources, the problems of large exhaust flow and high energy consumption in silicon wafer production are solved, and low-energy consumption and high-efficiency harmful gas control is achieved.
Patent Information
- Application Number
- CN202422381917.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-29
AI Technical Summary
During the production process of existing silicon wafers, the exhaust hood is arranged above the tank body, resulting in a large exhaust flow rate and high energy consumption, making it difficult to effectively control the concentration of harmful gases.
Design a double-layer structure exhaust frame, including the inner and outer walls and upper cover, and set up exhaust chambers 1 and exhaust chambers 2. By reasonably allocating exhaust resources, ensure effective gas extraction, reduce exhaust air volume and reduce energy consumption.
When the total exhaust area remains unchanged, the exhaust energy consumption is reduced and the concentration of harmful gases inside and outside the tank is effectively reduced.
Smart Images
Figure CN223219417U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer slot-type machine exhaust structure. Background Art
[0002] In the production process of solar cells, silicon wafers need to go through multiple processes such as texturing and cleaning. Therefore, multiple working tanks filled with corresponding chemical liquids are needed. During operation, a stream of chemical liquid vapor will be formed inside the tank. The conventional method is to set a unified exhaust hood above the multi-process tank. During exhaust, the chemical liquid vapor will be discharged upward along with the air.
[0003] Since the exhaust hood is arranged above the trough body and has a certain distance from the trough body to ensure the operating space of the manipulator, in order to ensure that the harmful gases in the equipment are controlled within the allowable range, a large exhaust flow rate is required, resulting in higher energy consumption. Utility Model Content
[0004] The technical problem to be solved by the utility model is to overcome the existing defects and provide a silicon wafer slot machine exhaust structure, comprising an exhaust frame covering the outside of a plurality of slots arranged in parallel;
[0005] The tank body is a double-layer structure, comprising an inner wall located in the inner layer and an outer wall located in the outer layer, and an upper cover is provided above the inner wall;
[0006] An exhaust chamber 1 is provided along the parallel direction of the tank body to extract high-concentration harmful gases in the tank body;
[0007] The side wall of the exhaust frame is provided with an exhaust cavity 2 corresponding to the upper space of the trough body, and the lower end of the exhaust cavity 2 is connected to the exhaust cavity 1, and the side wall of the exhaust cavity 2 is provided with an exhaust hole corresponding to the upper space of the trough body;
[0008] An exhaust pipe connected to the second exhaust chamber is provided at the upper end of the exhaust frame, and the exhaust pipe is connected to an external exhaust fan.
[0009] The ventilation holes are arranged at intervals that gradually increase from bottom to top, so as to ensure that the space near the trough body can more effectively remove the escaping gas.
[0010] Wherein: the exhaust chamber 1 includes a wind shield 1 vertically arranged on the inner side of the exhaust chamber 2, a wind shield 2 horizontally arranged on the inner side of the inner wall, an exhaust grille vertically arranged on the wind shield 2, and a wind shield 3 whose two ends are respectively connected to the outer wall and the outer side of the exhaust chamber 2. The wind shield 1, wind shield 2 and wind shield 3 cooperate with the upper cover, inner wall and outer wall to form a gas air path.
[0011] Furthermore: the exhaust chamber 1 also includes a wind blocking plate 1 located at the air outlet end of the exhaust grille, and the wind blocking plate 1 is provided with exhaust ports in parallel.
[0012] Furthermore: the exhaust chamber 1 also includes a baffle plate 2 located at the air outlet end of the baffle plate 1.
[0013] Compared with the existing technology, the beneficial effects of the present invention are: while ensuring that the total exhaust area remains unchanged, the exhaust volume can be reduced, the exhaust energy consumption can be reduced by reasonably allocating exhaust resources, and the concentration of harmful gases inside and outside the trough (inside the exhaust frame) can be effectively reduced while reducing the exhaust volume. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the main structure of the utility model (partial cross-section);
[0016] Figure 3 for Figure 2 AA-axis cross-sectional structural diagram;
[0017] Figure 4 for Figure 3 Schematic diagram of the enlarged structure of part B in the middle.
[0018] In the figure: 10. trough body; 11. upper cover; 12. inner wall; 13. outer wall; 20. exhaust frame; 21. exhaust chamber 1; 211. wind shield 1; 212. wind shield 2; 213. exhaust grille; 214. wind shield 3; 215. wind block 1; 216. wind block 2; 22. exhaust chamber 2; 221. exhaust hole; 23. exhaust duct. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.
[0020] See also Figure 1-4 This embodiment provides an exhaust structure for a silicon wafer trough machine, comprising an exhaust frame 20 covering the outside of a plurality of trough bodies 10 arranged in parallel; the trough bodies 10 are double-layer structures, including an inner wall 12 located on the inner layer and an outer wall 13 located on the outer layer, and an upper cover 11 is provided above the inner wall 12;
[0021] An exhaust chamber 21 is provided in parallel with the trough body 10; the exhaust chamber 21 includes a wind shield 1 211 vertically arranged on the inner side of the exhaust chamber 22, a wind shield 2 212 horizontally arranged on the inner side of the inner wall 12, an exhaust grille 213 vertically arranged on the wind shield 2 212, and a wind shield 3 214 whose two ends are respectively connected to the outer wall 13 and the outer side of the exhaust chamber 2 22. The wind shield 1 211, the wind shield 2 212 and the wind shield 3 214 cooperate with the upper cover 11, the inner wall 12 and the outer wall 13 to form a gas wind path; the exhaust chamber 21 also includes a wind blocker 1 215 located at the air outlet end of the exhaust grille 213 and a wind blocker 2 216 located at the air outlet end of the wind blocker 1 215, and exhaust ports are opened in parallel on the wind blocker 1 215 to increase the exhaust negative pressure through the double-layer wind blocker design to improve the exhaust effect;
[0022] The side wall of the exhaust frame 20 is provided with an exhaust chamber 22 corresponding to the space above the tank body 10, and the lower end of the exhaust chamber 22 is connected to the exhaust chamber 1 21. The side wall of the exhaust chamber 22 is provided with exhaust holes 221 corresponding to the space above the tank body 10, and the exhaust holes 221 are arranged at gradually increasing intervals from bottom to top to ensure that the space near the tank body 10 is more effectively evacuated from the escaped gas.
[0023] An exhaust pipe 23 connected to the second exhaust chamber 22 is provided at the upper end of the exhaust frame 20 , and the exhaust pipe 23 is connected to an external exhaust fan.
[0024] By providing a first exhaust chamber 21 for direct exhaust from the interior of the tank body 10, this new design allows the majority of the exhaust pressure to be directed to the hazardous gas production area, removing high-concentration harmful gases and rapidly reducing their concentration within the tank. Simultaneously, a second exhaust chamber 22, corresponding to the upper space, removes any escaping low-concentration harmful gases. This solution reduces exhaust volume and energy consumption by rationally allocating exhaust resources while maintaining a constant total exhaust area. Furthermore, it effectively reduces the concentration of harmful gases within the exhaust frame 20, both inside and outside the tank, while minimizing exhaust volume.
[0025] The above are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A silicon wafer slot machine exhaust structure, characterized by: It comprises an exhaust frame (20) covering the outside of a plurality of trough bodies (10) arranged in parallel; The tank body (10) is a double-layer structure, comprising an inner wall (12) located in the inner layer and an outer wall (13) located in the outer layer, and an upper cover (11) is provided above the inner wall (12); An exhaust chamber (21) is provided along the parallel direction of the trough body (10); The side wall of the exhaust frame (20) is provided with an exhaust chamber 2 (22) corresponding to the upper space of the trough body (10), and the lower end of the exhaust chamber 2 (22) is connected to the exhaust chamber 1 (21), and the side wall of the exhaust chamber 2 (22) is provided with an exhaust hole (221) corresponding to the upper space of the trough body (10); An exhaust pipe (23) connected to the second exhaust chamber (22) is provided at the upper end of the exhaust frame (20), and the exhaust pipe (23) is connected to an external exhaust fan.
2. The silicon wafer slot machine exhaust structure according to claim 1, characterized in that: The ventilation holes (221) are arranged at intervals that gradually increase from bottom to top, so as to ensure that the space near the position of the tank body (10) can more effectively remove the escaping gas.
3. The silicon wafer slot machine exhaust structure according to claim 1, characterized in that: The exhaust chamber one (21) includes a windshield one (211) vertically arranged on the inner side of the exhaust chamber two (22), a windshield two (212) horizontally arranged on the inner side of the inner wall (12), an exhaust grille (213) vertically arranged on the windshield two (212), and a windshield three (214) whose two ends are respectively connected to the outer wall (13) and the outer side of the exhaust chamber two (22). The windshield one (211), the windshield two (212) and the windshield three (214) cooperate with the upper cover (11), the inner wall (12) and the outer wall (13) to form a gas air path.
4. The silicon wafer slot machine exhaust structure according to claim 3, characterized in that: The exhaust chamber (21) further comprises a wind blocker (215) located at the air outlet end of the exhaust grille (213), and the wind blocker (215) is provided with exhaust ports in parallel.
5. The silicon wafer slot machine exhaust structure according to claim 4, characterized in that: The exhaust chamber 1 (21) further includes a second air blocking plate (216) located at the air outlet end of the first air blocking plate (215).