Cleaning device

Abstract

The embodiment of the utility model provides cleaning equipment (100) which is used for cleaning the surface of a component bearing part (200). The cleaning device (100) comprises: a housing (110), wherein the housing (110) defines an internal accommodating space; and a cleaning mechanism (120), wherein the cleaning mechanism (120) is arranged in the internal accommodating space. The cleaning mechanism (120) comprises: a spraying device (130) configured to spray a pressurized cleaning fluid (400) to a surface (210) to be cleaned of the component carrier (200) such that at least part of the foreign matter (300) located on the surface (210) to be cleaned is disengaged from the surface (210) to be cleaned under the action of the pressurized cleaning fluid (400); and a vacuum generating device (140) configured to form a negative pressure in a partial space of the internal accommodation space to discharge the separated foreign matter (300) from the cleaning apparatus (100).

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor device manufacturing, and in particular, to a cleaning device for cleaning a surface of a component carrier. Background Art

[0002] This section provides background information related to the present application but does not necessarily constitute prior art.

[0003] The process of manufacturing component carriers such as printed circuit boards (PCBs) is generally divided into the process of manufacturing the substrate body (bare board) and the process of mounting integrated circuits (ICs) and electronic components on the substrate body. During the bare board manufacturing process, contaminants such as acids and alkalis used in printing and etching operations may remain on the surface of the printed circuit board, while during the mounting process, contaminants such as solder and flux used when soldering and mounting components may remain on the surface of the printed circuit board. In addition, fingerprints, grease, dust in the environment, dust, debris and metal particles generated during mechanical processing such as cutting and drilling, and oxide layers on metal surfaces are also common contaminants that need to be removed.

[0004] Therefore, in the manufacturing technology of component carriers such as printed circuit boards, cleaning the surface of the component carriers is crucial, which is directly related to the performance and reliability of the component carriers. Utility Model Content

[0005] This section provides a general summary of the application, and is not a comprehensive disclosure of its full scope or all of its features.

[0006] An embodiment of the present application provides a cleaning device for cleaning the surface of a component carrier. The cleaning device includes a housing defining an internal accommodating space and a cleaning mechanism disposed within the internal accommodating space. The cleaning mechanism includes a spray device and a vacuum generating device, wherein the spray device is configured to spray a pressurized cleaning fluid onto the surface to be cleaned of the component carrier, so that at least some foreign matter located on the surface to be cleaned is detached from the surface to be cleaned under the action of the pressurized cleaning fluid; and wherein the vacuum generating device is configured to form a negative pressure in a portion of the internal accommodating space to discharge the detached foreign matter from the cleaning device.

[0007] In the context of the present application, the term "component carrier" may specifically denote any support structure on which and / or in which one or more components can be accommodated to provide mechanical support and / or electrical connection. In other words, the component carrier can be configured as a mechanical and / or electronic carrier for the components. In particular, the component carrier can be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. In particular, the component carrier can also be embodied as a flexible or semi-rigid substrate. The component carrier can also be a hybrid board combining different component carriers of the above-mentioned types of component carriers.

[0008] In the context of the present application, the term "surface to be cleaned" of a component carrier generally denotes the main surface of the component carrier to be cleaned.

[0009] In the context of this application, the term "main surface" of a component carrier may specifically refer to the following surface of the component carrier, which, when the component carrier is in normal use, is configured with most electronic components used to implement circuit functions, such as but not limited to integrated circuits (ICs), resistors, capacitors and connectors. The main surface is usually the upper and lower surfaces located on the outermost sides of the component carrier, which may contain pads, conductive traces, and other features for mounting and electrically connecting electronic components. In some embodiments, the main surface may be further defined as a surface with specific functional areas, such as a signal processing area, a power management area or a user interface area. The definition of the main surface may vary depending on the design and application of the component carrier, but its common feature is that it is the main working surface on the component carrier for mounting electronic components and implementing electrical functions. The thickness of the component carrier can be defined by the distance between the two opposing main surfaces.

[0010] In the context of the present application, the term "internal accommodating space" may specifically refer to an internal space with a certain volume enclosed by the shell body.

[0011] In the context of this application, the term "foreign matter" may specifically refer to contaminants that remain or adhere to the surface of the component carrier during the manufacture and / or use of the component carrier and need to be removed, for example, including but not limited to etchants such as acids and alkalis used in printing and etching operations, solder and flux used in the welding process, fingerprints left by operators, grease (such as lubricating oil, cutting fluid, hand grease, etc.), dust in the production environment, dust, debris and metal particles generated during machining, and oxide layers on the metal surface.

[0012] In the context of the present application, the term "forming a negative pressure in a partial space in the internal accommodating space" can specifically mean that when the cleaning equipment is in normal working condition, the vacuum generating device can form a negative pressure in the internal accommodating space along the direction of the thickness of the component carrier in at least a partial area above a certain height level from the surface to be cleaned of the component carrier, thereby forming a pressure difference between the partial space and another partial space where the component carrier is located, so that foreign matter detached from the surface to be cleaned of the component carrier can move toward the negative pressure area under the action of the pressure difference formed, and then be discharged from the cleaning mechanism.

[0013] In the context of the present application, the term "cleaning fluid" can specifically refer to a fluid that can be used to clean one or more foreign matter on the surface to be cleaned of a component carrier, for example, including but not limited to water, electronic cleaning agents, fluorinated solvents such as HFE (hydrofluoroether) and PFC (perfluorinated compounds), ethanol, acetone and / or isopropyl alcohol, etc. It will be understood that the possible examples of the cleaning fluids listed above are schematic, and the cleaning fluids used in different embodiments can be adjusted or changed accordingly according to actual cleaning needs and environment, etc. In some embodiments, the cleaning fluid can preferably have the characteristic of rapid evaporation. In some embodiments, the cleaning fluid can also preferably have an electrostatic discharge characteristic.

[0014] According to an exemplary embodiment, a cleaning device for cleaning a surface to be cleaned of a component carrier includes a housing defining an internal accommodating space and a cleaning mechanism disposed in the internal accommodating space of the housing. The cleaning mechanism may include an injection device adapted to spray a cleaning fluid, such as a jet, mist, columnar and / or conical shape, toward the surface to be cleaned of the component carrier and a vacuum generator adapted to form a negative pressure in a specific area. The injection device may inject a pressurized cleaning fluid onto the surface to be cleaned of the component carrier, and at least some of the foreign matter (such as grease, solvents, particulate matter, etc.) on the surface to be cleaned will be detached from the surface to be cleaned under the action (such as impact and / or dissolution) of the pressurized cleaning fluid. In addition, when the pressurized cleaning fluid is injected onto the surface to be cleaned of the component carrier, the pressure generated can promote the rate of physical contact / chemical reaction between the cleaning fluid and the foreign matter, making the cleaning process more efficient. However, it will be understood that the pressure of the pressurized cleaning fluid will be controlled within a reasonable range, that is, the pressure is not enough to cause damage to the component carrier itself or the components on its main surface. The vacuum generating device can create a negative pressure in a portion of the internal storage space, thereby forming a pressure differential between this portion and another portion of the space where the component carrier is located. Dislodged foreign matter will, under the action of this pressure differential, move toward the area with the negative pressure and be discharged from the cleaning device. In this way, the cleaning device according to the exemplary embodiment can achieve efficient and high-quality cleaning of the surface to be cleaned of the component carrier. Furthermore, the cleaning device according to the exemplary embodiment completes the cleaning of the component carrier surface in a relatively independent, isolated space, improving the safety of the cleaning operation, while also providing excellent environmental performance for the cleaning device as a whole.

[0015] In some optional embodiments, the cleaning mechanism further includes a channel-defining structure. The channel-defining structure defines a guide channel, the guide channel including a channel inlet and a channel outlet. The vacuum generating device is arranged downstream of the guide channel along the foreign matter discharge path and is configured to generate a negative pressure outside the guide channel and / or near the channel outlet of the guide channel to cause foreign matter detached from the surface to be cleaned to be discharged from the cleaning mechanism through the guide channel.

[0016] In the context of this application, "channel defining structure" may specifically refer to a physical structure in a cleaning mechanism that defines a channel for discharging foreign matter. In some examples, at least part of the channel defining structure may constitute at least part of the housing of the cleaning device.

[0017] In the context of this application, the "exhaust path" of foreign matter can specifically refer to the movement path followed by foreign matter that has detached from the surface to be cleaned of the component carrier and moves from the vicinity of the surface along the guide channel toward the negative pressure area under the action of the vacuum generating device and then moves out of the cleaning mechanism through the guide channel.

[0018] The guide channel helps collect foreign matter, concentrating the vacuum's suction force within the channel. Furthermore, foreign matter that escapes from the surface being cleaned can be moved along the defined guide channel and out of the cleaning mechanism, significantly improving the efficiency of foreign matter removal. Furthermore, the defined guide channel helps prevent foreign matter from dispersing during the cleaning process, thereby reducing contamination outside the cleaning area. The defined guide channel also prevents the vacuum from damaging printed circuit boards or substrates, particularly those with sensitive or delicate components mounted on their surfaces.

[0019] In some optional embodiments, the channel-defining structure includes a first physical entity structure and a second physical entity structure that is at least partially circumferentially spaced apart from the first physical entity structure, and the guide channel is at least partially defined by a space between the first physical entity structure and the second physical entity structure.

[0020] In some optional embodiments, the second physical structure at least partially extends circumferentially around the first physical structure, and includes a lower extension and an upper extension joined to the lower extension. The lower extension is laterally spaced from the first physical structure, and at least a portion of the lower extension is vertically lower than the first physical structure, thereby appropriately forming an entrance for detached foreign matter to enter the guide channel. At least a portion of the upper extension is laterally spaced from a corresponding portion of the first physical structure, and at least a portion of the upper extension is vertically higher than the corresponding portion of the first physical structure. The upper extension forms an exit at an end distal to the lower extension for detached foreign matter to exit the guide channel.

[0021] In this way, the cleaning device according to the optional exemplary embodiment can achieve the definition of the guide channel with a simple and ingenious structural configuration, which contributes to the miniaturization of the entire device. In addition, arranging the first physical body and the second physical body to be circumferentially spaced apart facilitates the separate removal and / or cleaning of the first physical body and / or the second physical body, especially the cleaning of the guide channel area that may come into contact with foreign matter.

[0022] In some optional embodiments, the distance between the upper extension and the first physical entity structure in the transverse direction and / or longitudinal direction gradually increases from the end side of the upper extension close to the lower extension to the end side of the upper extension away from the lower extension.

[0023] From the component carrier loading position to the guide channel exit, the upper extension of the second physical structure gradually increases in lateral and / or longitudinal separation from the first physical structure. This allows the narrower lower portion to help maintain negative pressure, while the wider upper portion facilitates the removal of foreign matter without sacrificing the vacuum effect. This further improves the efficiency of foreign matter removal.

[0024] In some optional embodiments, the spraying device is mounted to another part of the cleaning equipment in a detachable manner and / or the spraying device is mounted to another part of the cleaning equipment in a removable manner. The spraying device is mounted to another part of the cleaning equipment except the spraying device in a detachable and / or removable manner, so that the spraying device can be maintained (such as repaired or replaced) as needed and the operating position of the spraying device can be adjusted as needed according to the cleaning needs, thereby enhancing the operational flexibility and universality of the spraying device. In the event of manual intervention or an emergency, the detachable and / or removable spraying device design can also reduce operational risks and improve overall safety.

[0025] In some optional embodiments, the first physical entity structure is configured to have a dome-shaped portion. The dome shape may help optimize the distribution and coverage of the spray flow, thereby improving cleaning efficiency and effectiveness.

[0026] In some embodiments, the first physical structure is removably mounted in the inner housing space, and the spray device is detachably and / or movably mounted on the dome-shaped portion of the first physical structure and oriented toward a predetermined operating position of the cleaning device.

[0027] Such a structural design significantly improves the operational flexibility of the cleaning equipment. For example, the first physical entity structure can be removed from the housing to facilitate maintenance, cleaning and / or replacement of the spray device, thereby helping to maintain efficient operation of the equipment and extend its service life. In addition, the removable and / or detachable spray device can allow customization and modular design according to different cleaning needs or operating conditions to provide more usage scenarios and functional options. In the event of a failure or maintenance, the spray device can be removed individually without affecting other parts of the entire cleaning equipment, facilitating fault diagnosis and isolation. In short, this design not only provides operational flexibility, but also helps to improve the maintainability, reliability, customization and safety of the equipment, while also improving cleaning efficiency and the ability to adapt to different cleaning tasks.

[0028] In some optional embodiments, the spraying device includes a plurality of spraying units, and the plurality of spraying units are arranged along the conveying direction of the component carrier. In particular, the plurality of spraying units are arranged in an array along the conveying direction of the component carrier, so that the pressurized cleaning fluid (e.g., in a cone shape) sprayed by the plurality of spraying units completely covers the surface to be cleaned of the component carrier. Achieving full coverage of the surface to be cleaned of the component carrier by providing a plurality of spraying units allows for highly efficient cleaning.

[0029] In some optional embodiments, the cleaning device includes a control mechanism, and the plurality of spray units are mechanically and / or electrically connected to the control mechanism. Each of the plurality of spray units can be individually activated or deactivated under the control of the control mechanism; and / or the plurality of spray units include a plurality of groups, each group including at least one spray unit, and each of the plurality of groups can be individually activated or deactivated under the control of the control mechanism.

[0030] Because each spray unit or group of spray units can be individually activated or deactivated by the control mechanism, the operator can precisely control the operation of the spray units according to cleaning requirements. This flexibility allows the equipment to adapt to different cleaning tasks and target area sizes. The ability to individually control the spray units means that unnecessary spraying can be reduced, thereby saving water, detergent, or other cleaning resources. This not only helps to reduce operating costs but also benefits environmental protection. When certain areas do not need to be cleaned or have already been cleaned, the corresponding spray units can be deactivated, which improves overall cleaning efficiency and reduces cleaning time. If a spray unit malfunctions, it can be individually deactivated without affecting the normal operation of other units, which helps maintain continuous operation of the equipment and simplifies troubleshooting and repair. Different groups of spray units can be configured and activated to meet specific cleaning needs. For example, the appropriate spray unit group can be selected to clean different types of foreign matter or different surfaces.

[0031] In some optional embodiments, the spraying device includes a pair of spraying units, the pair of spraying units being arranged along the conveying direction of the component carrier at opposite sides of the component carrier in the thickness direction at a predetermined operating position to be loaded into the cleaning apparatus. In particular, the pair of spraying units can be configured to simultaneously operate (e.g., apply pressurized cleaning fluid at the same pressure) on corresponding positions of two opposing main surfaces of the component carrier, thereby facilitating relative stability of the component carrier during cleaning and preventing undesirable displacement or warping.

[0032] In some optional embodiments, the vacuum generating device includes one or more vacuum generators, one or more of which are arranged on the second physical structure and near the channel outlet of the guide channel. The negative pressure provided by the one or more vacuum generators is sufficient to be transmitted into the guide channel, thereby forcing foreign matter that has been separated from the surface to be cleaned of the component carrier to move to the channel outlet of the guide channel due to the pressure difference and then be discharged from the cleaning device through the channel outlet.

[0033] In some optional embodiments, the second physical entity structure forms part of the housing to simplify the design and thus promote miniaturization of the device.

[0034] In some optional embodiments, the cleaning device further comprises a fluid supply mechanism, which is connected to the spray device via a fluid supply pipeline to supply cleaning fluid to the spray device.

[0035] In some optional embodiments, the fluid supply mechanism includes at least one first-stage tank. The first-stage tank is configured to store the cleaning fluid to be supplied to the spraying device.

[0036] In some optional embodiments, the fluid supply mechanism further comprises at least one replaceable second-stage tank. At least one of the at least one replaceable second-stage tank is in fluid communication with at least one corresponding one of the at least one first-stage tank, the second-stage tank being configured to store the cleaning fluid to be fed to the first-stage tank.

[0037] When the cleaning fluid in the first-stage tank is exhausted, the second-stage tank can be quickly replaced to continue supplying it, ensuring the continuity of the fluid supply and reducing equipment downtime. In addition, the interchangeable tank allows the use of different types of cleaning fluids, providing greater flexibility to adapt to different cleaning needs or working conditions.

[0038] In some optional embodiments, the fluid supply mechanism further includes a fluid drive device. The fluid drive device is configured to apply pneumatic pressure to the clean fluid stored in the second-stage tank, causing the clean fluid in the second-stage tank to flow to the first-stage tank. Pneumatic pressure can precisely control the flow rate and volume of the fluid, ensuring that the fluid is delivered to the first-stage tank at the appropriate rate and volume. The use of pneumatic pressure can reduce the need for pumps and other mechanical drive devices, thereby simplifying system design and reducing maintenance costs.

[0039] In some optional embodiments, the fluid supply mechanism further includes a detection device. The detection device is configured to issue an alarm signal upon detecting that the amount of clean fluid in the secondary tank has reached a critical threshold. This alarm signal can promptly alert an operator or automated control system to take action, such as replenishing fluid or adjusting the supply rate, to ensure a continuous and stable fluid supply. The automated detection device also reduces reliance on manual inspections.

[0040] In some optional embodiments, the cleaning device further comprises a conveying mechanism configured to convey the component carrier to a predetermined operating position of the cleaning device.

[0041] In some optional embodiments, the conveying mechanism includes at least two pairs of conveying rollers, which are arranged at intervals along the conveying direction of the component carrier, and each pair of conveying rollers is arranged on opposite sides of the component carrier along the thickness direction of the component carrier perpendicular to the conveying direction, and each pair of conveying rollers holds the component carrier and applies a driving force to the component carrier to move the component carrier toward a predetermined operating position of the cleaning device.

[0042] In some optional embodiments, the distance between the two rollers in each pair of conveyor rollers is adjustable to accommodate component carriers of different thicknesses.

[0043] In some optional embodiments, each pair of conveying rollers is arranged to intermittently contact the component carrier to allow the cleaning fluid to pass through, thereby preventing a portion of the surface of the component carrier from being left uncleaned due to continuous contact with the conveying rollers.

[0044] In some optional embodiments, the cleaning device includes two cleaning mechanisms. The two cleaning mechanisms are arranged in mirror-image configuration relative to the component carrier at a predetermined operating position of the cleaning device, perpendicular to the conveying direction of the component carrier. These mirror-image configurations enable the cleaning of two opposing surfaces of the component carrier, significantly improving cleaning efficiency.

[0045] In some optional embodiments, the spray device is configured to spray pressurized cleaning fluid including an electronics cleaning agent toward the surface to be cleaned of the component carrier.

[0046] In some embodiments, the component carrier may be configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0047] In the context of the present application, the term "printed circuit board" may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying heat. As a preferred material for printed circuit board technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and / or glass fiber, so-called prepreg, or FR4 material. The individual electrically conductive layer structures may be connected to one another in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling these holes with electrically conductive material (in particular copper) to form vias or any other through-hole connections. The filled holes connect the entire stack (i.e., the through-hole connection extends through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, so-called vias. Similarly, optical interconnects may be formed through the various layers of the stack to accommodate an electro-optical circuit board. Printed circuit boards are typically configured to accommodate one or more components on one surface or two opposing surfaces of a plate-like printed circuit board. The one or more components may be connected to the respective major surfaces by soldering.The dielectric portion of the printed circuit board may comprise a resin with reinforcing fibers, such as glass fibers.

[0048] In the context of this application, the term "substrate" can particularly refer to a small component carrier. Relative to a printed circuit board, a substrate can be a relatively small component carrier on which one or more components can be mounted and which can serve as a connecting medium between one or more chips and another printed circuit board. For example, a substrate can have approximately the same size as the components (particularly electronic components) to be mounted on the substrate (for example, in the case of a chip scale package (CSP)). More specifically, a substrate can be understood as a carrier for electrical connectors or power grids, as well as a component carrier for connectors arranged laterally and / or vertically, which is comparable to a printed circuit board but has a relatively high density. Lateral connectors are, for example, conductive paths, while vertical connectors can be, for example, drilled holes. These lateral connectors and / or vertical connectors are arranged within the substrate and can be used to provide electrical, thermal and / or mechanical connections between accommodated or unaccommodated components (for example, bare wafers), in particular IC chips, and a printed circuit board or an intermediate printed circuit board. Therefore, the term "substrate" also includes an "IC substrate". The dielectric portion of the substrate may include a resin with reinforcement particles, such as reinforcement balls, particularly glass balls.

[0049] The interposer may include or be composed of at least one layer of: glass; silicon and / or a photosensitive or dry-etchable organic material, such as an epoxy-based laminate material (e.g., an epoxy-based laminate film); or a polymer compound (the polymer compound may or may not include photosensitive and / or heat-sensitive molecules).

[0050] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The features and advantages of the embodiments of the present application will become more readily understood through the following description with reference to the accompanying drawings, which are not drawn to scale and in which some features are exaggerated or minimized to show details of particular components.

[0052] Figure 1 The schematic structure of a cleaning device according to an exemplary embodiment of the present application is shown.

[0053] Figure 2 A schematic cross-sectional view shows a first physical entity structure and a second physical entity structure in a cleaning device according to an exemplary embodiment of the present application.

[0054] Figure 3 Another schematic structural diagram of a cleaning device according to an exemplary embodiment of the present application is shown.

[0055] Figure 4 A schematic three-dimensional structural diagram of a cleaning device according to an exemplary embodiment of the present application is shown. DETAILED DESCRIPTION

[0056] The present application will be described in detail below with reference to the accompanying drawings by way of exemplary embodiments of the present application. It should be noted that the following detailed description of the present application is for illustrative purposes only and is not intended to limit the present application. In addition, the same reference numerals are used throughout the various drawings to represent the same components.

[0057] It should also be pointed out that, for the sake of clarity, not all features of an actual specific embodiment are described and shown in the specification and drawings. In addition, in order to avoid unnecessary details that obscure the technical solutions focused on by this application, only the arrangement structures closely related to the technical content of this application are described and shown in the specification and drawings, while other details that are not closely related to the technical content of this application and are known to those skilled in the art are omitted.

[0058] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below with reference to the accompanying drawings. However, it will be understood by those skilled in the art that in each embodiment of the present application, many technical details are proposed to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can be implemented. The division of the following embodiments is for convenience of description and should not constitute any limitation on the specific implementation of the present application. The various embodiments can be combined with each other and referenced to each other under the premise of no contradiction.

[0059] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0060] In this application document, terms such as "upper," "lower," "outer," and "inner" used to describe directions are for descriptive purposes only and should not be construed as limiting. Furthermore, although this application has been described with reference to exemplary embodiments, it should be understood that this application is not limited to the specific embodiments described and illustrated in detail herein. Those skilled in the art may make various modifications to the exemplary embodiments without departing from the scope of the claims of this application.

[0061] Figure 1 Schematic diagram of the structure of a cleaning device 100 according to an exemplary embodiment of the present application is shown. Figure 2 Schematic cross-sectional views of a first physical entity structure 154 and a second physical entity structure 156 in a cleaning device 100 according to an exemplary embodiment of the present application are shown.

[0062] The cleaning device 100 includes a housing 110 (see Figure 4 ), the housing 110 defines an internal accommodating space. Figure 1As shown, the cleaning mechanism 120 of the cleaning device 100 is disposed in the internal accommodation space defined by the housing 110. The cleaning mechanism 120 may include a spraying device 130 and a vacuum generating device 140 that cooperates with the spraying device 130. The spraying device 130 is adapted to spray the pressurized cleaning fluid 400 onto the component carrier 200 (e.g., according to the embodiment of the present invention). Figure 1 The pressurized cleaning fluid 400 is used to move the pressurized cleaning fluid 400 to the surface 210 to be cleaned (being transported to a predetermined cleaning position) in the direction indicated by the middle arrow, so that foreign matter 300, such as dust, particles, and / or grease, located on the surface 210 to be cleaned is detached from the surface 210 to be cleaned. Some of the foreign matter on the surface 210 to be cleaned may be directly detached from the surface of the component carrier due to the impact force of the cleaning fluid, while other foreign matter may first dissolve in the cleaning fluid 400 sprayed onto the surface 210 to be cleaned and then detach from the surface along with the cleaning fluid, while other foreign matter, such as fingerprints, may be directly washed away.

[0063] The vacuum generating device 140 can form a negative pressure in a portion of the internal accommodating space and / or in the external environment of the internal accommodating space to discharge the detached foreign matter 300 from the cleaning mechanism 120. In some embodiments, the vacuum generating device 140 can be located in the internal accommodating space near a communication passage / opening between the internal accommodating space and the external environment (e.g., Figure 1 In some embodiments, the vacuum generating device 140 may also generate negative pressure in an area outside the internal accommodating space and near a communication passage / opening between the internal accommodating space and the external environment.

[0064] It is understandable that the location of the vacuum generating device 140 and the target area where negative pressure is to be formed may vary, but the need to discharge foreign matter must be met.

[0065] For each surface 210 to be cleaned, the cleaning process may last from 20 seconds to 30 seconds, in particular 30 seconds.

[0066] According to the exemplary practical mode of the present application, the cleaning device 100 can effectively remove foreign matter on the surface to be cleaned, such as grease and fingerprints with strong adhesion, by the pressurized cleaning fluid sprayed by the injection device 130. Different types of foreign matter can be removed by different mechanisms (such as direct impact, dissolution or flushing), which improves the applicability and efficiency of cleaning. Negative pressure is formed by the vacuum generating device 140 to promote the removal and collection of detached foreign matter, thereby improving the overall effect of the cleaning process. In addition, the use of the vacuum generating device 140 reduces the mechanical damage that may be caused to the parts to be cleaned, particularly for sensitive or precise parts. The entire cleaning process can be carried out inside the housing 110, reducing the damage that may be caused to the operator during the cleaning process and the pollution caused to the environment. In addition, this cleaning device 100 provided in the embodiment of the present application can be integrated into an automated production line, improves the speed and consistency of the cleaning process, thereby improving overall production efficiency.

[0067] Still refer to Figure 1 The cleaning mechanism 120 may further include a channel-defining structure 150. The channel-defining structure 150 defines a guide channel 152. The vacuum generating device 140 may be arranged downstream of the guide channel 152 along the discharge path of the foreign matter 300. By means of the guide channel 152, the vacuum effect generated by the vacuum generating device 140 can be locally concentrated within the guide channel 152, allowing the foreign matter to move along the predetermined discharge path, thereby improving cleaning efficiency and quality.

[0068] In some embodiments, the vacuum generating device 140 can generate a negative pressure around the guide channel 152, particularly near the outlet of the guide channel 152. In some embodiments, the vacuum generating device 140 can also generate a negative pressure in the external environment of the guide channel 152, particularly in the area near the outlet 1524 of the guide channel, so that the foreign matter 300 detached from the surface to be cleaned 210 is discharged from the cleaning mechanism 120 through the guide channel 152 due to the pressure difference. In some embodiments, the vacuum generating device 140 can generate a negative pressure in the area adjacent to the outlet 1524 of the guide channel 152. In some embodiments, the vacuum generating device 140 can generate a negative pressure in the external environment of the guide channel 152 and in the area adjacent to the outlet 1524 of the guide channel 152, so that the detached foreign matter 300 moves toward the negative pressure area under the action of the pressure difference and then moves out of the device.

[0069] The vacuum generating device 140 may include one or more vacuum generators. The vacuum generator may be, for example, a mechanical pump, a liquid ring pump, a molecular pump, or a Venturi vacuum generator. The one or more vacuum generators may, for example, be arranged on the second physical structure 156 and near the channel outlet 1524 of the guide channel 152. The one or more vacuum generators may also, for example, be arranged at a location away from the channel outlet 1524 and connected to the guide channel 152 via a pipe.

[0070] In some embodiments, the cleaning apparatus 100 may further include a drying module for drying the surface of the component carrier after cleaning. In other embodiments, the cleaning fluid sprayed by the spray device 130 has rapid self-evaporation properties, making the drying module unnecessary. For example, the spray device 130 may spray pressurized cleaning fluid 400 including an electronics cleaning agent onto the surface to be cleaned 210 of the component carrier 200.

[0071] The channel defining structure 150 may include a first physical entity structure 154 and a second physical entity structure 156. Figure 1 The second physical structure 156 can be disposed around the first physical structure 154. Specifically, the second physical structure 156 at least partially covers the first physical structure 154. The second physical structure 156 is at least partially circumferentially spaced apart from the first physical structure 154. In other words, the second physical structure 156 is spaced apart from the first physical structure 154 along at least a portion of the circumference of the first physical structure 154. In some embodiments, the first physical structure 154 can be partially circumferentially spaced apart from the second physical structure 156. In some embodiments, the first physical structure 154 can be completely circumferentially spaced apart from the second physical structure 156.

[0072] The guide channel 152 may be at least partially defined by the space between the first physical structure 154 and the second physical structure 156. In some embodiments, the guide channel 152 may be entirely defined by the space between the first physical structure 154 and the second physical structure 156. In other embodiments, a portion of the guide channel 152 is defined by the space between the first physical structure 154 and the second physical structure 156, while another portion of the guide channel is defined by the second physical structure 156 itself (e.g., Figure 1 shown).

[0073] The guide channel 152 includes a channel inlet 1522, a channel outlet 1524, and a passage extending between the channel inlet 1522 and the channel outlet 1524. Under the action of the vacuum effect, the detached foreign matter 300 can enter the guide channel 152 through the channel inlet 1522 and exit the guide channel 152 through the channel outlet 1524. In some embodiments, the channel inlet 1522 can also be configured as an entrance for transporting the component carrier 200 to a predetermined operating position of the cleaning device 100 (also referred to as a cleaning position or a predetermined loading position of the component carrier 200).

[0074] Reference Figure 1 and Figure 2 The second physical structure 156 can extend circumferentially at least partially around the first physical structure 154. The second physical structure 156 can constitute at least a portion of the housing 110 of the cleaning device 100. In particular, the second physical structure 156 is a portion of the housing 110 of the cleaning device 100. The second physical structure 156 can include a lower extension 1562 and an upper extension 1564 joined to the lower extension 1562.

[0075] like Figure 2 In the cross section shown, the lower extension 1562 is spaced apart from the first physical entity structure 154 by distances B and B' in the transverse direction X. The values of B and B' may be the same or different. Figure 2 In cross-sections different from the illustrated cross-section (not shown), the distance between the lower extension 1562 and the first physical structure 154 in the transverse direction X can be any predetermined value different from B or B'. It is also understood that even in one or more cross-sections, there is no separation between the lower extension 1562 and the first physical structure 154 in the transverse direction X, that is, the two are in direct physical contact. In other words, in some embodiments, the first and second physical structures can be intermittently in contact or spaced apart along the entire circumference, that is, they can be in direct physical contact over a portion of the area rather than being continuously spaced apart along the entire circumference. This enhances the flexibility of the configuration design of the first and second physical structures. Specifically, for example, the first and second physical structures can be designed to include multiple guide channels, at least some of which are interconnected, or at least some of which are disconnected, if desired. At least a portion of the lower extension 1562 is smaller than the first physical structure 154 in the vertical direction Y to appropriately form a channel entrance 1522 for detached foreign matter 300 to enter the guide channel 152. In the present embodiment, the transverse direction X is parallel to the transport direction of the component carrier 200 and to the main extension direction of the surface to be cleaned 210 of the component carrier 200. The vertical direction Y is perpendicular to the transverse direction X.

[0076] Still refer to Figure 2 , the upper extension 1564 is located above the first physical entity structure 154. Figure 2 In the illustrated cross-section, the upper extension 1564 on the left side is tilted at an angle α relative to the vertical plane 157, while the first physical structure 154 on the left side is tilted at an angle β relative to the vertical plane 157. α may be less than or equal to β. This ensures that at least a portion of the upper extension 1564 on the left side is spaced apart from a corresponding portion of the first physical structure 154 on the left side in the transverse direction X, and at least a portion of the upper extension 1564 on the left side is at a greater height in the vertical direction Y than a corresponding portion of the first physical structure 154 on the left side. The upper extension 1564 on the right side is tilted at an angle α1 relative to the vertical plane 157, while the first physical structure 154 on the right side is tilted at an angle β1 relative to the vertical plane 157. α1 may be less than or equal to β1. This allows at least a portion of the upper extension 1564 on the right side to be spaced apart from a corresponding portion of the first physical entity structure 154 on the right side in the lateral direction X, and at least a portion of the upper extension 1564 on the right side to have a height level in the vertical direction Y greater than that of the corresponding portion of the first physical entity structure 154 on the right side.

[0077] It should be noted that Figure 2 The substantially linear configurations of the upper extension 1564, lower extension 1562, and first physical structure 154 shown in the figure, and in particular the substantially linear configurations of the upper extension 1564, lower extension 1562, and sidewalls of the first physical structure 154, are merely illustrative. In some embodiments, any of the upper and lower extensions, and the first physical structure, may have configurations other than linear, such as streamlined, irregularly curved, or curved. In some embodiments, both the inner sidewall of the upper extension 1564 (i.e., the sidewall of the upper extension facing the first physical structure) and the outer sidewall of the first physical structure 154 (i.e., the sidewall of the first physical structure facing the upper extension) are curved. In some embodiments, at least one of the inner sidewall of the upper extension 1564 and the outer sidewall of the first physical structure 154 may be provided with a fluid guide to facilitate the movement of foreign matter.

[0078] From the end side of the upper extension portion 1564 close to the lower extension portion 1562 to the end side of the upper extension portion 1564 away from the lower extension portion 1562, the distance between the upper extension portion 1564 and the first physical entity structure 154 in the transverse direction X and / or the vertical direction Y may be substantially gradually increased. Figure 2In the cross-section shown, from the channel entrance 1522 along the extension path of the channel to the channel exit 1524, both the lateral distance and the vertical distance between the upper extension 1564 on the left hand side and the first physical entity structure 154 are basically on a gradually increasing trend. For example, the vertical distance D1 < D2 < D3. Similarly, from the channel entrance 1522 along the extension path of the channel to the channel exit 1524, both the lateral distance and the vertical distance between the upper extension 1564 on the right hand side and the first physical entity structure 154 are basically on a gradually increasing trend. For example, the vertical distance d1 < d2 < d3. However, it can be understood that in some embodiments, from the channel entrance 1522 to the channel exit 1524, the lateral distance and / or the vertical distance between the upper extension 1564 and the first physical entity structure 154 can be basically constant.

[0079] In an embodiment, for the positions at the same height level on both sides of the second physical entity structure 156 with respect to the vertical symmetry plane 155 (such as Figure 2 the positions indicated by P2 and P3 shown in), the first quantity (such as the lateral distance or the vertical distance from the first physical entity structure) on one side of the two sides of the second physical entity structure 156 with respect to the vertical symmetry plane 155 of the second physical entity structure can be the same as the second quantity (such as the lateral distance or the vertical distance from the first physical entity structure) on the other side of the two sides of the second physical entity structure 156 with respect to the vertical symmetry plane 155, or there can be a difference. For example, the difference between the first quantity and the second quantity is within the range of 5% to 50% of the first quantity or not greater than 10% of the first quantity. For example, Figure 2 the vertical distances D2 and D2' shown in are basically the same. The vertical symmetry plane 155 can divide the second physical entity structure 156 into two basically symmetric halves along the vertical direction.

[0080] The upper extension 1564 forms a channel exit 1524 at the end side away from the lower extension 1562 for the foreign object 300 to leave the guiding channel 152. Figure 1 and Figure 2 Only one channel exit 1524 is shown in. However, it can be understood that in other embodiments, the guiding channel 152 can include two or more channel exits 1524. For example, in some embodiments, the guiding channel 152 can also open another channel exit 1524 at the position P1.

[0081] In some embodiments, the first physical entity structure 154 can be configured to have a dome-shaped part. The dome shape may help optimize the distribution and coverage of the jet flow. Of course, such a shape is only illustrative.

[0082] In an embodiment of the present application, the spraying device can be mounted to another part of the cleaning equipment 100 in a detachable manner and / or mounted to another part of the cleaning equipment 100 in a removable manner. For example, the spraying device 130 can be mounted on the dome-shaped part of the first physical entity structure 154 in a detachable and / or removable manner and oriented towards the predetermined operating position of the cleaning equipment 100. In addition, the first physical entity structure 154 can be installed in the internal accommodating space in a removable manner. In this way, the first physical entity structure 154 can be removed from the housing 110 to facilitate maintenance, cleaning and / or replacement of the spraying device 130, thereby helping to maintain the efficient operation of the equipment and extend its service life. In addition, the removable and / or detachable spraying device can allow customization and modular design according to different cleaning requirements or operating conditions to provide more usage scenarios and functional options.

[0083] Figure 3 Another schematic structural diagram of the cleaning device 100 according to an exemplary embodiment of the present application is shown.

[0084] like Figure 3 As shown, the spraying device 130 may include a plurality of spraying units 1302. Specifically, the plurality of spraying units 1302 may be connected to a common manifold 301. The spraying units 1302 may be, for example, nozzles. The plurality of spraying units 1302 are arranged along the conveying direction of the component carrier 200. Specifically, the plurality of spraying units 1302 are arranged in an array along the conveying direction of the component carrier 200. The pressurized conical cleaning fluid 400 sprayed by the plurality of spraying units 1302 preferably completely covers the surface 210 to be cleaned of the component carrier 200. It will be appreciated that in other embodiments, the cleaning fluid 400 sprayed by the plurality of spraying units 1302 may only cover a predetermined portion of the surface 210 to be cleaned.

[0085] The cleaning device 100 may further include a control mechanism 190. A plurality of spray units 1302 are mechanically and / or electrically connected to the control mechanism 190. In some embodiments, each of the plurality of spray units 1302 can be individually controlled by the control mechanism 190 to be activated or deactivated. In some embodiments, the plurality of spray units 1302 are divided into a plurality of groups, wherein each group includes at least one spray unit 1302. Each of the plurality of groups can be individually controlled by the control mechanism 190 to be activated or deactivated. In other embodiments, the control mechanism may further control the spray units to perform a swinging motion within a predetermined amplitude, for example, preferably to swing with a smaller amplitude, so that the cleaning fluid sprayed by each spray unit can cover a relatively large surface area of the surface to be cleaned.

[0086] Since each spray unit 1302 or each group of spray units can be individually controlled by the control mechanism 190 and enabled or disabled, the operation of the spray units can be precisely controlled according to the cleaning requirements. For example, the activation and deactivation of the spray units can be controlled accordingly based on the type and location of the foreign matter on the surface 210 to be cleaned. In addition, different spray units 1302 can spray different cleaning fluids to achieve the purpose of removing different types of foreign matter. In addition, different groups of spray units can be configured and enabled according to specific cleaning requirements. For example, for different types of foreign matter or different surfaces to be cleaned, the appropriate spray unit group can be selected to operate.

[0087] In some embodiments, the spraying device 130 may include a pair of spraying units 1302. The pair of spraying units 1302 is configured to be arranged on opposite sides (upper and lower sides in the figure) of the thickness direction of the component carrier 200 to be loaded at a predetermined operating position of the cleaning device 100 along the conveying direction of the component carrier 200. Figure 3 In the embodiment, there may be only one pair of spraying units 1302 and the pair of spraying units 1302 may be provided on opposite sides (left and right in the figure) of the component carrier 200 along the length direction of the component carrier.

[0088] Still refer to Figure 3 The cleaning apparatus 100 may further include a fluid supply mechanism 160. The fluid supply mechanism 160 may be connected to the spray device 130 via a fluid supply line 170 to supply the cleaning fluid 400 to the spray device 130. The fluid supply mechanism 160 may include at least one first-stage tank 162. The first-stage tank 162 is used to store the cleaning fluid 400 to be supplied to the spray device 130.

[0089] In some embodiments, the fluid supply mechanism 160 is provided with a plurality of first-stage tanks 162, each of which can store a different cleaning fluid and is connected to a different spray unit 1302, and each spray unit 1302 is individually activated and deactivated by the control structure 190. In some embodiments, the fluid supply mechanism 160 is provided with a plurality of first-stage tanks 162, some of which can store the same cleaning fluid and are connected to a different spray unit 1302, and each spray unit 1302 is individually activated and deactivated by the control structure 190. In some embodiments, the fluid supply mechanism 160 is provided with a plurality of first-stage tanks 162, and the plurality of first-stage tanks 162 are divided into a plurality of groups, each first-stage tank group corresponding to a spray unit group, and each spray unit group is individually activated and deactivated by the control structure 190.

[0090] In other embodiments, the first-stage tank 162 may include multiple compartments (not shown). The primary compartment may be in fluid communication with the injection device 130 via a fluid line, and the secondary compartments may store cleaning fluid to be delivered to the primary compartment via pneumatic pressure. In some embodiments, the secondary compartments may be removable to facilitate replacement or replenishment of the cleaning fluid 400. In some embodiments, all of the multiple compartments included in the first-stage tank 162 may be primary compartments. In some embodiments, different primary compartments may store different cleaning fluids.

[0091] The fluid supply mechanism 160 may further include at least one replaceable second-stage tank (also referred to as a backup tank) 164. At least one of the at least one replaceable second-stage tank 164 is in fluid communication with at least one corresponding one of the at least one first-stage tank 162. The second-stage tank 164 may store a clean fluid 400 to be fed to the first-stage tank 162. The clean fluid 400 stored in the second-stage tank 164 flows toward the first-stage tank 162 under the action of pneumatic pressure applied by a fluid drive device 166. The fluid drive device 166 may, for example, direct compressed gas 500 (particularly nitrogen) into the second-stage tank 164 so as to contact the fluid to be driven. The pressure of the nitrogen acts on the surface of the fluid, thereby pushing the fluid from a high-pressure area to a low-pressure area.

[0092] In some embodiments, at least a portion of the at least one replaceable secondary tank 164 may be replaced by a different form of pump that performs the same function as the secondary tank.

[0093] The fluid supply mechanism 160 may further include a detection device 168. The detection device 168 may generate an alarm signal when it detects that the amount of cleaning fluid 400 in the first-stage tank 162 and / or the second-stage tank 164 has reached a critical threshold. The detection device 168 may be, for example, any of a float switch, a capacitive level sensor, an ultrasonic level sensor, a laser level sensor, and a photoelectric level sensor.

[0094] Figure 4 A schematic perspective structural diagram of a cleaning device 100 according to an exemplary embodiment of the present application is shown.

[0095] Reference Figure 1 and Figure 4The cleaning device 100 may further include a conveying mechanism 180. The conveying mechanism 180 may convey the component carrier 200 to a predetermined operating position of the cleaning device 100. The conveying mechanism 180 may include at least two pairs of conveying rollers 182. The at least two pairs of conveying rollers 182 are arranged at intervals along the conveying direction of the component carrier 200. Each pair of conveying rollers 182 is arranged on opposite sides of the component carrier 200 along the thickness direction of the component carrier 200 perpendicular to the conveying direction. Each pair of conveying rollers 182 is used to hold the component carrier 200 and apply a driving force to the component carrier 200 to move the component carrier 200 toward the predetermined operating position of the cleaning device 100.

[0096] In some embodiments, the distance between the two rollers in each pair of conveyor rollers 182 is adjustable to accommodate component carriers 200 of varying thicknesses. Each pair of conveyor rollers 182 can be configured to intermittently contact the component carrier 200 to allow the cleaning fluid to pass through, thereby preventing portions of the component carrier 200 from being left uncleaned due to continuous contact with the conveyor rollers 182.

[0097] After the component carrier 200 to be cleaned is transferred to the predetermined position, the cleaning fluid 400 can be freely Figure 4 The position indicated by the arrow in the middle is supplied to the cleaning device 100, and then the spraying device 130 cooperates with the vacuum generating device 140 to perform the cleaning operation. During the cleaning process, the foreign matter 300 can be freely Figure 4 The cleaning device 100 is discharged from the location indicated by the middle arrow (eg, channel outlet 1524 ).

[0098] Return to reference Figure 1 The cleaning device 100 may include two cleaning mechanisms 120. The two cleaning mechanisms 120 are arranged in a mirror image relative to the component carrier 200 in a direction perpendicular to the conveying direction of the component carrier 200 at a predetermined operating position of the cleaning device 100. However, it will be understood that in other embodiments, the cleaning device 100 may include three or more cleaning mechanisms 120. Three or more cleaning mechanisms 120 can be arranged in the internal accommodating space of the housing 110 as needed.

[0099] Although the present application has been described with reference to exemplary embodiments, it should be understood that the present application is not limited to the specific embodiments described and illustrated in detail herein. Those skilled in the art may make various changes to the exemplary embodiments without departing from the scope defined by the claims of the present application.

[0100] The features mentioned and / or illustrated in the above description of the exemplary embodiments of the present application may be incorporated into one or more other embodiments in the same or similar manner, combined with features in other embodiments, or substituted for corresponding features in other embodiments. The technical solutions obtained by such combination or substitution shall also be deemed to be included in the scope of protection of the present application.

Claims

1. A cleaning device (100) for cleaning the surface of a component carrier (200), characterized in that The cleaning device (100) comprises: a housing (110), the housing (110) defining an internal accommodation space; and A cleaning mechanism (120), the cleaning mechanism (120) being arranged in the internal accommodating space, the cleaning mechanism (120) comprising: a spraying device (130) configured to spray a pressurized cleaning fluid (400) onto a surface to be cleaned (210) of the component carrier (200), allowing at least a portion of the foreign matter (300) located on the surface to be cleaned (210) to be detached from the surface to be cleaned (210) under the action of the pressurized cleaning fluid (400); a vacuum generating device (140) configured to generate negative pressure in a portion of the internal accommodating space to discharge the detached foreign matter (300) from the cleaning device (100); and A channel defining structure (150) is provided, wherein the channel defining structure (150) defines a guide channel (152), wherein the guide channel (152) includes a channel inlet (1522) and a channel outlet (1524), and the vacuum generating device (140) is arranged downstream of the guide channel (152) along the discharge path of the foreign matter (300) and is configured to form the negative pressure near the channel outlet (1524) of the guide channel (152) so that the foreign matter (300) detached from the surface to be cleaned (210) is discharged from the cleaning mechanism (120) through the guide channel (152).

2. The cleaning device (100) according to claim 1, characterized in that The channel defining structure (150) includes a first physical entity structure (154) and a second physical entity structure (156) arranged in a manner of being at least partially spaced apart from the first physical entity structure (154) in the circumferential direction, and the guide channel (152) is at least partially defined by the space between the first physical entity structure (154) and the second physical entity structure (156).

3. The cleaning device (100) according to claim 2, characterized in that The second physical structure (156) extends circumferentially at least partially around the first physical structure (154), the second physical structure (156) including a lower extension (1562) and an upper extension (1564) joined to the lower extension (1562); wherein the lower extension portion (1562) is spaced apart from the first physical entity structure (154) in the lateral direction and at least a portion of the lower extension portion (1562) has a lower height level in the vertical direction than the first physical entity structure (154), so as to appropriately form a channel entrance (1522) for the detached foreign matter (300) to enter the guide channel (152); and wherein at least a portion of the upper extension portion (1564) is spaced apart from a corresponding portion of the first physical entity structure (154) in a lateral direction, and at least a portion of the upper extension portion (1564) has a height level greater than a corresponding portion of the first physical entity structure (154) in a vertical direction, wherein the upper extension portion (1564) is formed with a channel outlet (1524) on an end side away from the lower extension portion (1562) for the detached foreign matter (300) to leave the guide channel (152).

4. The cleaning device (100) according to claim 3, characterized in that From the end side of the upper extension portion (1564) close to the lower extension portion (1562) to the end side of the upper extension portion (1564) away from the lower extension portion (1562), the distance between the upper extension portion (1564) and the first physical entity structure (154) in the lateral direction and / or the vertical direction gradually increases.

5. The cleaning device (100) according to claim 1, characterized in that The spraying device (130) is detachably mounted to another part of the cleaning device (100); and / or The spraying device (130) is movably mounted to another part of the cleaning apparatus (100).

6. The cleaning device (100) according to claim 2, characterized in that The first physical entity (154) is configured to have a dome-shaped portion.

7. The cleaning device (100) according to claim 6, characterized in that The spraying device (130) is mounted on the dome-shaped portion of the first physical structure (154) in a detachable and / or movable manner and is oriented toward a predetermined operating position of the cleaning device (100).

8. The cleaning device (100) according to claim 2, characterized in that The first physical entity structure (154) is removably mounted in the interior housing space.

9. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The spraying device (130) includes a plurality of spraying units (1302), which are arranged along the conveying direction of the component carrier (200) so that the pressurized cleaning fluid (400) sprayed by the plurality of spraying units (1302) completely covers the surface to be cleaned (210) of the component carrier (200).

10. The cleaning device (100) according to claim 9, characterized in that The plurality of spraying units (1302) are arranged in an array along a conveying direction of the component carrier (200).

11. The cleaning device (100) according to claim 9, characterized in that The cleaning device (100) further comprises a control mechanism (190), the plurality of spray units (1302) being mechanically and / or electrically connected to the control mechanism (190), wherein: Each of the plurality of spray units (1302) is individually controlled by the control mechanism (190) to be activated or deactivated; and / or The plurality of spray units (1302) include a plurality of groups, each group including at least one spray unit (1302), and each of the plurality of groups is individually controlled by the control mechanism (190) to be activated or deactivated.

12. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The spraying device (130) includes a pair of spraying units (1302) configured to be arranged on opposite sides of the component carrier (200) to be loaded into a predetermined operating position of the cleaning apparatus (100) along a conveying direction of the component carrier (200).

13. The cleaning device (100) according to any one of claims 2 to 4, characterized in that The vacuum generating device (140) includes one or more vacuum generators, and the one or more vacuum generators are arranged on the second physical entity structure (156) and are located near the channel outlet (1524) of the guide channel (152).

14. The cleaning device (100) according to any one of claims 2 to 4, characterized in that The second physical entity structure (156) forms part of the housing (110).

15. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The cleaning device (100) further comprises a fluid supply mechanism (160), which is connected to the spray device (130) via a fluid supply line (170) to supply the cleaning fluid (400) to the spray device (130).

16. The cleaning device (100) according to claim 15, characterized in that The fluid supply mechanism (160) includes at least one first-stage tank (162) configured to store the cleaning fluid (400) to be supplied to the spraying device (130).

17. The cleaning device (100) according to claim 16, characterized in that The fluid supply mechanism (160) further includes at least one replaceable second-stage tank (164), at least one of the at least one replaceable second-stage tank (164) being in fluid communication with a corresponding at least one of the at least one first-stage tank (162), the second-stage tank (164) being configured to store cleaning fluid (400) to be fed to the first-stage tank (162).

18. The cleaning device (100) according to claim 17, characterized in that The fluid supply mechanism (160) further includes a fluid driving device (166) configured to apply pneumatic pressure to the cleaning fluid (400) stored in the second-stage tank (164) so as to cause the cleaning fluid (400) in the second-stage tank (164) to flow toward the first-stage tank (162).

19. The cleaning device (100) according to claim 17, characterized in that The fluid supply mechanism (160) further includes a detection device (168) configured to generate an alarm signal when detecting that the amount of the cleaning fluid (400) in the second-stage tank (164) reaches a critical threshold.

20. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The cleaning device (100) further comprises a transport mechanism (180) configured to transport the component carrier (200) to a predetermined operating position of the cleaning device (100).

21. The cleaning device (100) according to claim 20, characterized in that The conveying mechanism (180) includes at least two pairs of conveying rollers (182), which are arranged at intervals along the conveying direction of the component carrier (200), and each pair of conveying rollers (182) is arranged on opposite sides of the component carrier (200) along the thickness direction of the component carrier (200) perpendicular to the conveying direction, and each pair of conveying rollers (182) holds the component carrier (200) and applies a driving force to the component carrier (200) to move the component carrier (200) toward a predetermined operating position of the cleaning device (100).

22. The cleaning device (100) according to claim 21, characterized in that The distance between the two rollers in each pair of conveying rollers (182) is adjustable.

23. The cleaning device (100) according to claim 21, characterized in that Each pair of conveyor rollers (182) is arranged to be in intermittent contact with the component carrier (200).

24. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The cleaning device (100) comprises two cleaning mechanisms (120), which are arranged in a mirror image relative to the component carrier (200) in a direction perpendicular to the conveying direction of the component carrier (200) at a predetermined operating position of the cleaning device (100).

25. The cleaning device (100) according to any one of claims 1 to 8, characterized in that The spraying device (130) is configured to spray pressurized cleaning fluid (400) including an electronic cleaning agent toward a surface (210) to be cleaned of the component carrier (200).

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