Low-radiation coated glass

Abstract

The utility model relates to low-radiation coated glass which comprises a glass substrate and a low-radiation film layer arranged on the surface of the glass substrate. Wherein the low-radiation film layer is provided with a frequency selective surface, the frequency selective surface is attached to the glass substrate, and the value range of the line width of the frequency selective surface is 10 microns to 70 microns; wherein the frequency selection surface comprises a plurality of structural units which are distributed in an array, and the space period of the array distribution of the plurality of structural units is 0.5 mm to 10 mm. Through the application, the problem that the low-emissivity coated glass in the related technology can attenuate wireless communication signals is solved, and the technical effects of keeping the heat insulation effect of the low-emissivity coated glass and improving the transmittance of the electromagnetic waves of the target frequency band are achieved.

Description

Technical Field

[0001] The present application belongs to the field of glass technology, and in particular relates to a low-emissivity coated glass. Background Art

[0002] Low-E (Low Emissivity) coated glass is a type of glass that can prevent infrared (IR) and ultraviolet rays from penetrating, thereby achieving a heat-insulating effect. It is widely used in the construction and transportation industries and is of great significance to energy conservation in modern society.

[0003] The low-emissivity coating in low-emissivity coated glass provides thermal insulation. Typically, this coating consists of multiple nanoscale dielectric and conductive metal layers deposited on a glass substrate. This coating reflects the infrared portion of the solar spectrum while allowing visible light to pass through.

[0004] However, while the low-emissivity film layer of low-emissivity coated glass isolates heat, it also attenuates wireless communication signals, causing a decline in communication quality and a reduction in the effective communication band, bringing inconvenience to life and production. Utility Model Content

[0005] The embodiments of the present application provide a low-emissivity coated glass to at least solve the problem in the related art that low-emissivity coated glass may attenuate wireless communication signals.

[0006] An embodiment of the present application provides a low-emissivity coated glass, comprising: a glass substrate, and a low-emissivity film layer, wherein the low-emissivity film layer is disposed on a surface of the glass substrate; wherein the low-emissivity film layer has a frequency selective surface, the frequency selective surface is bonded to the glass substrate, and the line width of the frequency selective surface ranges from 10 μm to 70 μm; wherein the frequency selective surface includes a plurality of structural units distributed in an array, and the spatial period of the array distribution of the plurality of structural units is from 0.5 mm to 10 mm.

[0007] In some embodiments, the structural unit includes a first graphic structure in a square shape, and the side length of the first graphic structure ranges from 0.5 mm to 10 mm.

[0008] In some embodiments, the structural unit includes a second graphic structure in the shape of a cross; wherein the center of the second graphic structure coincides with the center of the first graphic structure, and the line width of the second graphic structure ranges from 10 μm to 70 μm.

[0009] In some embodiments, the second graphic structure includes two graphic substructures, both of which are rectangular in shape, and the two graphic substructures are perpendicular to each other and have the same size; wherein the two graphic substructures are respectively perpendicular to the edges of the first graphic structure, the length of the graphic substructure ranges from 0.5 mm to 10 mm, and the width of the graphic substructure ranges from 10 μm to 70 μm.

[0010] In some embodiments, the structural unit includes a third graphic structure having a square shape; wherein the center of the third graphic structure coincides with the center of the first graphic structure, and the line width of the third graphic structure ranges from 10 μm to 70 μm.

[0011] In some embodiments, the third graphic structure includes four sides; wherein the endpoints of the four sides coincide with the midpoints of the edges of the first graphic structure, and the lengths of the four sides are calculated as follows:

[0012]

[0013] Wherein, L1 is the length of the four sides, and D is the side length of the first graphic structure.

[0014] In some embodiments, the glass substrate includes a single-layer glass substrate, a double-layer glass substrate, or a triple-layer glass substrate.

[0015] In some embodiments, the interlayer between two glass substrates in the double-layer glass substrate or the triple-layer glass substrate includes one or more of an air cavity, a vacuum cavity, and an interlayer.

[0016] In some embodiments, the low-emissivity film layer is formed of a material comprising one or more of silver, indium tin oxide, zinc oxide, titanium dioxide, tin oxide, cadmium oxide, and indium oxide.

[0017] Compared to related technologies, the low-emissivity coated glass provided in the embodiments of this application, by forming a frequency-selective surface on the low-emissivity film layer, can achieve high transmittance for electromagnetic waves in the target frequency band while retaining the thermal insulation effect of the low-emissivity coated glass. This application solves the problem of low-emissivity coated glass attenuating wireless communication signals in related technologies, achieving the technical effect of improving transmittance for electromagnetic waves in the target frequency band while retaining the thermal insulation effect of the low-emissivity coated glass.

[0018] The details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 This is a schematic structural diagram of low-emissivity coated glass according to an embodiment of the present application;

[0021] Figure 2 is a structural diagram of a frequency selective surface and a structural unit according to an embodiment of the present application;

[0022] Figure 3 is a structural diagram of a frequency selective surface and a structural unit according to another embodiment of the present application;

[0023] Figure 4 2 is a schematic diagram of transmittance curves of low-emissivity coated glass at different etching line widths according to an embodiment of the present application;

[0024] Figure 5 1 is a schematic diagram of transmittance curves of low-emissivity coated glass according to an embodiment of the present application when electromagnetic waves are incident at different angles;

[0025] Figure 6 2 is a schematic diagram of transmittance curves of low-emissivity coated glass at different spatial periods according to an embodiment of the present application;

[0026] Figure 7 This is a schematic diagram of the transmittance curve of the low-emissivity coated glass to transverse electric polarization waves and transverse magnetic polarization waves according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0028] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0029] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0030] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0031] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0032] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0033] Traditional low-emissivity coated glass is a type of glass with excellent thermal insulation and good light transmittance. The low-emissivity film layer in low-emissivity coated glass usually has high transmittance to visible light and high reflection to mid- and far-infrared rays. Therefore, compared with ordinary glass and traditional coated glass, low-emissivity coated glass has better thermal insulation and light transmittance.

[0034] However, due to the introduction of a low-emissivity coating, traditional low-emissivity coated glass significantly shields wireless communication signals. Electromagnetic waves experience significant penetration loss when passing through this glass, which limits communication transmission. To improve signal strength, a common solution is to install signal repeaters in facilities equipped with traditional low-emissivity coated glass to enhance the signal. However, signal repeaters are expensive to produce, and changes in communication standards require the installation of new signal repeaters, resulting in high iterative maintenance costs.

[0035] Currently, no effective solution has been proposed to the problem that low-emissivity coated glass in related technologies may attenuate wireless communication signals.

[0036] In light of this, embodiments of the present application provide a low-emissivity coated glass. By forming a frequency-selective surface on the low-emissivity film layer, this glass achieves high transmittance for electromagnetic waves in a target frequency band while retaining the thermal insulation properties of the low-emissivity coated glass. This application addresses the issue in related art where low-emissivity coated glass attenuates wireless communication signals, achieving the technical effect of increasing transmittance for electromagnetic waves in the target frequency band while retaining the thermal insulation properties of the low-emissivity coated glass.

[0037] The following will be combined Figure 1 For an explanation of the low-emissivity coated glass 100 provided in one embodiment of the present application, please refer to Figure 1 , Figure 1 is a structural diagram of a low-emissivity coated glass 100 according to an embodiment of the present application. Figure 1 As shown, the low-emissivity coated glass 100 includes: a glass substrate 110, and a low-emissivity film layer 120, wherein the low-emissivity film layer 120 is disposed on the surface of the glass substrate 110; wherein the low-emissivity film layer 120 has a frequency selective surface 121, which is bonded to the glass substrate 110, and the line width of the frequency selective surface 121 ranges from 10 μm to 70 μm; wherein the frequency selective surface 121 includes a plurality of structural units 122 distributed in an array, and the spatial period of the array distribution of the plurality of structural units 122 is 0.5 mm to 10 mm.

[0038] In this embodiment, the shape of the low-emissivity coated glass 100 can be manufactured into any shape such as a rectangle, a trapezoid, a semicircle, etc. according to the needs of actual application scenarios. The thickness of the glass substrate 110 can be any value between 2 mm and 12 mm, such as 2 mm, 4 mm, 6 mm, 8 mm, 10 mm, 12 mm, etc. The thickness of the low-emissivity film layer 120 can be any value between 30 nm and 1000 nm, such as 30 nm, 50 nm, 100 nm, 200 nm, 400 nm, 600 nm, 800 nm, 1000 nm, etc. The spatial period can be any value between 0.5 mm and 10 mm, such as 0.5 mm, 1 mm, 2 mm, 4 mm, 6 mm, 8 mm, 10 mm, etc. The above parameters can be set according to actual processing conditions and application needs, and the embodiment of the present application is not limited to this.

[0039] A frequency selective surface (FSS) is a periodic array of structures created on a surface that can reflect, transmit, or absorb incident electromagnetic waves of specific frequencies. In this embodiment, the FSS 121 is a patterned structure array formed by laser etching a low-emissivity film layer 120. This patterned structure array includes multiple structural units 122, which have selective transmittance to electromagnetic waves. Specifically, this patterned structure array can achieve high transmittance for electromagnetic waves in the sub-6 GHz frequency band (i.e., the frequency range below 6 GHz).

[0040] In other embodiments, the frequency selective surface 121 may also be a pattern structure array formed by other means such as physical engraving or chemical etching of the low-emissivity film layer 120 . The present application does not limit the method for forming the frequency selective surface 121 .

[0041] Specifically, when laser etching is used to form the frequency selective surface 121, the line width of the frequency selective surface 121 can be the etching line width; when physical engraving is used to form the frequency selective surface 121, the line width of the frequency selective surface 121 can be the engraving line width; when chemical etching is used to form the frequency selective surface 121, the line width of the frequency selective surface 121 can be the etching line width.

[0042] In this embodiment, if Figure 1 As shown, the shape of the structural unit 122 is a square, and the spatial period of the array distribution of the structural unit 122 is the side length of the structural unit 122, that is, the side length of the structural unit 122 can be any value from 0.5 mm to 10 mm.

[0043] In some embodiments, the shape of each structural unit 122 can be a regular or irregular shape such as a square, a circle, or a rectangle.

[0044] In this embodiment, the etched linewidth of the frequency selective surface 121 can vary with the total etching amount of the low-emissivity film 120. For example, the etched linewidth of the frequency selective surface 121 can range from 10 μm to 70 μm, such as 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, etc., as long as the etching amount of each structural unit 122 is less than 5%. Accordingly, if the total etching amount of the low-emissivity film 120 is increased, the etched linewidth of the frequency selective surface 121 can be increased.

[0045] In some embodiments, the glass substrate 110 includes a single-layer glass substrate, a double-layer glass substrate, or a triple-layer glass substrate.

[0046] Specifically, if the glass substrate 110 includes a double-layer glass substrate, the low-emissivity film layer 120 can be arranged on the inner surface of any one of the glass substrates in the double-layer glass substrate; if the glass substrate 110 includes a triple-layer glass substrate, the low-emissivity film layer 120 can be arranged on any one side surface or both sides of the middle glass substrate in the triple-layer glass substrate, or the low-emissivity film layer 120 can be arranged on the inner surface of any one or both outer glass substrates in the triple-layer glass substrate.

[0047] In this embodiment, if the glass substrate 110 includes a single-layer glass substrate, the low-emissivity film layer 120 can be disposed on any largest surface of the single-layer glass substrate.

[0048] In this embodiment, if the glass substrate 110 includes a double-layer glass substrate or a triple-layer glass substrate, the thickness of each glass substrate in the double-layer glass substrate or the triple-layer glass substrate can range from 2 mm to 6 mm, and the distance between the two glass substrates can range from 6 mm to 15 mm.

[0049] In actual applications, the thickness of each glass substrate in a double-layer glass substrate or a triple-layer glass substrate can be set according to actual application requirements and processing conditions, for example, 2mm, 3.5mm, 4mm, 5mm, 6mm and other values, which is not limited in the embodiments of the present application.

[0050] In some embodiments, the interlayer between two glass substrates in the double-layer glass substrate or the triple-layer glass substrate includes one or more of an air cavity, a vacuum cavity, and an interlayer.

[0051] In practical applications, when the glass substrate 110 comprises a double-layer or triple-layer glass substrate, the relevant parameters of the low-emissivity film layer 120 can remain unchanged. Only the thickness of each layer of the double-layer or triple-layer glass substrate and the spacing between the two layers of glass substrates can be changed to obtain low-emissivity coated glass 100 with different thermal insulation and energy-saving properties. For example, when the application scenario requires different thermal insulation and energy-saving properties of the low-emissivity coated glass 100, the spacing between the two layers of glass substrates can be adjusted to values such as 3mm, 6mm, 9mm, 12mm, or 15mm, and different cavity layers such as vacuum cavities, air cavities, or interlayers can be formed to achieve different thermal insulation and energy-saving effects.

[0052] In some embodiments, the low-emissivity film layer 120 is formed of a material comprising one or more of silver, indium tin oxide, zinc oxide, titanium dioxide, tin oxide, cadmium oxide, and indium oxide.

[0053] In practical applications, the low-emissivity film layer 120 can be made of any material with specific low-emissivity properties, for example, one or more of silver, indium tin oxide, zinc oxide, titanium dioxide, tin oxide, cadmium oxide, indium oxide, etc., and this application does not impose any restrictions on this.

[0054] In some embodiments, the etching amount of the low-emissivity film layer 120 is less than 5%.

[0055] In practical applications, the smaller the etching amount, the better the thermal insulation and energy-saving properties of the low-emissivity coated glass 100. However, if the etching amount is too small, there may be a problem of large errors due to the too precise process requirements. Therefore, the most suitable etching amount can be selected according to the actual processing equipment and processing environment to process the low-emissivity film layer 120 of the low-emissivity coated glass 100.

[0056] The following will be combined Figure 2 For a structural diagram of the frequency selective surface 121 and the structural unit 122 provided in one embodiment of the present application, see Figure 2 , Figure 2 FIG. 1 is a structural diagram of a frequency selective surface and a structural unit according to an embodiment of the present application. Figure 2 As shown, in one embodiment, the structural unit 122 includes a first graphic structure 1221 in the shape of a square, and the side length D of the first graphic structure 1221 ranges from 0.5 mm to 10 mm; the structural unit 122 includes a second graphic structure 1222 in the shape of a cross formed by etching; wherein the center of the second graphic structure 1222 coincides with the center of the first graphic structure 1221, and the etching line width W of the second graphic structure 1222 ranges from 10 μm to 70 μm.

[0057] In this embodiment, the second graphic structure 1222 includes two graphic substructures formed by etching, both of which are rectangular in shape. The two graphic substructures are perpendicular to each other and have the same size. The two graphic substructures are respectively perpendicular to the edges of the first graphic structure 1221. The length D of the graphic substructure ranges from 0.5 mm to 10 mm, and the width W of the graphic substructure ranges from 10 μm to 70 μm.

[0058] In this embodiment, when multiple structural units 122 are arrayed on the surface of the low-radiation film layer, the second graphic structures 1222 in each structural unit 122 are connected to the second graphic structures 1222 in adjacent structural units 122, and multiple second graphic structures 1222 are interconnected to form multiple "field" shapes. The periodic spatial distribution of the multiple structural units 122 constitutes a frequency selective surface 121, which is equivalent to a band-pass filter, enabling electromagnetic waves within the target frequency band (i.e., the frequency range below 6 GHz) to have a high transmittance. In this application, by etching a small area of the low-radiation film layer to form a pattern with a specific shape, a frequency selective surface 121 is constituted to control the induced current and surface impedance of the low-radiation coated glass, thereby achieving a high transmittance of electromagnetic waves at the target frequency.

[0059] In this embodiment, the size and area of the second graphic structure 1222 are small and it has symmetry. Therefore, in actual processing applications, its process tolerance is large, the manufacturing cost is low, and the etching amount is small, which has high practical value in actual life and production application scenarios.

[0060] In some embodiments, the patterns of the first graphic structure 1221 and the second graphic structure 1222 can be set according to the needs of actual applications. The first graphic structure 1221 with a square shape and the second graphic structure 1222 with a cross shape in this embodiment are only exemplary. The first graphic structure 1221 and the second graphic structure 1222 can also be other shapes, such as circular, square, regular hexagon, regular octagon, or other specially designed symmetric or asymmetric shapes.

[0061] Specifically, when selecting symmetric shapes as the shapes of the first graphic structure 1221 and the second graphic structure 1222, the structural unit 122 composed of the first graphic structure 1221 and the second graphic structure 1222 is centrosymmetric at this time. Therefore, this structural unit 122 has polarization stability. Further, the low-radiation coated glass provided in the embodiment of this application using such a structural unit 122 also has the advantage of being polarization insensitive.

[0062] The following will combine Figure 3 to illustrate the schematic diagram of the structure of the frequency selective surface 121 and the structural unit 122 provided in another embodiment of this application. Please refer to Figure 3 According to the schematic diagram of the structure of the frequency selective surface 121 and the structural unit 122 in another embodiment of this application, as shown in Figure 3As shown, in one embodiment, the structural unit 122 includes a third graphic structure 1223 formed by etching and having a square shape; wherein, the center of the third graphic structure 1223 coincides with the center of the first graphic structure 1221, and the etching line width W of the third graphic structure 1223 ranges from 10 μm to 70 μm.

[0063] In this embodiment, the third graphic structure 1223 includes four sides formed by etching; wherein, the endpoints of the four sides respectively coincide with the midpoints of the edges of the first graphic structure 1221, and the calculation formula for the length L1 of the four sides is:

[0064]

[0065] wherein, L1 is the length of the four sides, and D is the side length of the first graphic structure 1221.

[0066] In practical applications, according to the actual application requirements, the spatial period of multiple structural units 122 (i.e., the side length D of the first graphic structure 1221) can be designed and determined, and then the length L1 of the four sides of the corresponding third graphic structure 1223 can be calculated according to the above formula.

[0067] In this embodiment, when multiple structural units 122 are arrayed on the surface of the low-radiation film layer, the vertices of the third graphic structure 1223 in each structural unit 122 are connected to the vertices of the third graphic structure 1223 in the adjacent structural unit 122, and multiple third graphic structures 1223 are connected to each other to form multiple "field" shapes tilted at 45°. The advantages and descriptions of the third graphic structure 1223 can be referred to the narration of the above embodiment, and will not be elaborated here.

[0068] Figure 4 It is a schematic diagram of the transmittance curve of a low-radiation coated glass according to an embodiment of the present application under different etching line widths. In this embodiment, the glass substrate of the low-radiation coated glass includes a double-layer glass substrate, the interlayer between the two glass substrates in the double-layer glass substrate includes an air cavity, the thickness of the glass substrate is 6 mm, the thickness of the air cavity is 12 mm, the spatial period of the array distribution of multiple structural units is 3 mm, and the structural unit of the low-radiation coated glass includes a first graphic structure having a square shape and a second graphic structure formed by etching and having a cross shape.

[0069] As Figure 4As shown, when the etching line width W varies within the range of 10μm to 70μm, there is a slight decrease in transmittance as the etching line width W increases. The transmittance of low-emissivity coated glass to electromagnetic waves varies little, while laser etching generally has an etching line width error of 5μm. Therefore, the low-emissivity coated glass provided by the embodiment of the present application has the advantage of a large processing error tolerance and can adapt to different processing equipment and processing environments. In addition, since the smaller the etching amount, the better the thermal insulation and energy-saving properties of the low-emissivity coated glass. However, if the etching amount is too small, there will be a problem of large errors caused by too precise process requirements. Therefore, the most suitable etching amount can be selected according to the actual processing equipment and processing environment to process the low-emissivity film layer of the low-emissivity coated glass.

[0070] Figure 5 This is a schematic diagram of the transmittance curve of the low-emissivity coated glass according to an embodiment of the present application when electromagnetic waves are incident at different angles. In this embodiment, the glass substrate of the low-emissivity coated glass includes a double-layer glass substrate, the interlayer between the two glass substrates in the double-layer glass substrate includes an air cavity, the thickness of the glass substrate is 6 mm, the thickness of the air cavity is 12 mm, the spatial period of the distribution of the multiple structural unit arrays is 3 mm, the etching line width of the frequency selective surface is 60 μm, and the structural units of the low-emissivity coated glass include a first graphic structure in the shape of a square and a second graphic structure in the shape of a cross formed by etching.

[0071] like Figure 5 As shown, when the incident angle gradually increases from 0 degrees to 50 degrees, the transmittance of electromagnetic waves in the frequency band of 0 GHz to 6 GHz gradually decreases, but the change range is small, the shape of the transmittance curve remains basically unchanged, and the frequency response is relatively stable. Therefore, the low-emissivity coated glass provided in the embodiment of the present application also has the advantage of being angle-insensitive, which is of great value in practical applications.

[0072] Figure 6 This is a schematic diagram of the transmittance curves of the low-emissivity coated glass at different spatial periods according to an embodiment of the present application. In this embodiment, the glass substrate of the low-emissivity coated glass includes a double-layer glass substrate, the interlayer between the two glass substrates in the double-layer glass substrate includes an air cavity, the thickness of the glass substrate is 6 mm, the thickness of the air cavity is 12 mm, the etching line width of the frequency selective surface is 70 μm, and the structural unit of the low-emissivity coated glass includes a first graphic structure in the shape of a square and a third graphic structure in the shape of a square formed by etching.

[0073] like Figure 6As shown in the figure, when the spatial period D varies between 2mm and 5mm, there is a slight decrease in transmittance as the spatial period D increases, and the transmittance of the low-emissivity coated glass to electromagnetic waves changes little. The smaller the spatial period D, the higher the transmittance of electromagnetic waves. However, the smaller the spatial period D, the higher the precision required for etching the low-emissivity film. Therefore, the most appropriate etching amount can be selected based on the actual processing equipment and environment to process the low-emissivity coated glass.

[0074] Figure 7 This is a schematic diagram of the transmittance curve of the low-emissivity coated glass to transverse electric polarization waves and transverse magnetic polarization waves according to an embodiment of the present application. In this embodiment, the glass substrate of the low-emissivity coated glass includes a double-layer glass substrate, the interlayer between the two glass substrates in the double-layer glass substrate includes an air cavity, the thickness of the glass substrate is 6 mm, the thickness of the air cavity is 12 mm, the spatial period D of the distribution of the multiple structural unit arrays is 4 mm, the etching line width W of the frequency selective surface is 80 μm, and the structural units of the low-emissivity coated glass include a first graphic structure in the shape of a square and a third graphic structure in the shape of a square formed by etching.

[0075] like Figure 7 As shown in the figure, when the transverse electric polarization wave and the transverse magnetic polarization wave are respectively incident on the low-emissivity coated glass provided by the embodiment of the present application, the transmittance curve of the transverse electric polarization wave and the transmittance curve of the transverse magnetic polarization wave completely overlap. Therefore, the low-emissivity coated glass provided by the embodiment of the present application has the advantage of being polarization-insensitive. In actual applications and deployments, the polarization of base station signals may change due to multipath and other propagation-related phenomena. It is crucial that the frequency selective surface exhibits similar transmission characteristics for the transverse electric wave and transverse magnetic wave modes, such as Figure 7 As shown, the low-emissivity coated glass provided in the embodiment of the present application has good polarization stability during actual deployment.

[0076] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A low-emissivity coated glass, characterized in that: include: a glass substrate (110), and A low-emissivity film layer (120), the low-emissivity film layer (120) being arranged on the surface of the glass substrate (110); wherein, The low-emissivity film layer (120) has a frequency selective surface (121), the frequency selective surface (121) is bonded to the glass substrate (110), and the line width of the frequency selective surface (121) ranges from 10 μm to 70 μm; wherein, The frequency selective surface (121) includes a plurality of structural units (122) distributed in an array, and the spatial period of the array distribution of the plurality of structural units (122) is 0.5 mm to 10 mm; The structural unit (122) includes a first graphic structure (1221) having a square shape and a second graphic structure (1222) having a cross shape; or, the structural unit (122) includes the first graphic structure (1221) and a third graphic structure (1223) having a square shape; In the case where the structural unit (122) includes the first graphic structure (1221) and the second graphic structure (1222), the center of the second graphic structure (1222) coincides with the center of the first graphic structure (1221), and the second graphic structure (1222) includes two graphic substructures, both of which are rectangular in shape, and the two graphic substructures are perpendicular to each other and have the same size; wherein the two graphic substructures are respectively perpendicular to the edges of the first graphic structure (1221); When the structural unit (122) includes the first graphic structure (1221) and the third graphic structure (1223), the center of the third graphic structure (1223) coincides with the center of the first graphic structure (1221), and the third graphic structure (1223) includes four edges; wherein the endpoints of the four edges respectively coincide with the midpoints of the edges of the first graphic structure (1221).

2. The low-emissivity coated glass according to claim 1, characterized in that: The side length of the first graphic structure (1221) ranges from 0.5 mm to 10 mm.

3. The low-emissivity coated glass according to claim 1, characterized in that: The length of the graphic substructure ranges from 0.5 mm to 10 mm, and the width of the graphic substructure ranges from 10 μm to 70 μm.

4. The low-emissivity coated glass according to claim 1, characterized in that: The calculation formula for the lengths of the four sides is: Wherein, L1 is the length of the four sides, and D is the side length of the first graphic structure (1221).

5. The low-emissivity coated glass according to any one of claims 1 to 4, characterized in that: The glass substrate (110) includes a single-layer glass substrate, a double-layer glass substrate, or a triple-layer glass substrate.

6. The low-emissivity coated glass according to claim 5, characterized in that: The interlayer between the two glass substrates in the double-layer glass substrate or the triple-layer glass substrate includes one or more of an air cavity, a vacuum cavity and an interlayer.

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