Spray head for semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor coating equipment, in particular to a spray header for semiconductor equipment, and aims to solve the problem that plasmas are sprayed out through the spray header. The spray head comprises a plasma elimination box, a mixing box arranged below the plasma elimination box, a gas outlet box arranged below the mixing box, a gas inlet pipe arranged on the plasma elimination box, a first guide pipe communicating the plasma elimination box with the mixing box, and a second guide pipe communicating the gas outlet box with the gas outlet box, a plasma eliminating plate is arranged in the plasma eliminating box, and a plurality of gas channels are formed in the plasma eliminating plate; a stirring device is arranged in the mixing box; a plurality of air outlet holes are formed in the bottom of the air outlet box.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor coating equipment, in particular to a shower head used for semiconductor equipment. Background Art

[0002] Semiconductor coating equipment, when performing hard film deposition reactions, requires the introduction of a small amount of one or more doping gases into the chamber for thin film deposition. Once these gases enter the chamber, they diffuse evenly across the wafer surface. In some production processes, plasma within the coating chamber can pass through the shower plate and into the showerhead, where it is ejected. This can also accumulate within the piping, impacting wafer coating uniformity over time. Therefore, a new showerhead system is needed to address the technical challenges of plasma ejection through the showerhead. Summary of the Invention

[0003] In view of this, an object of the present invention is to provide a shower head for semiconductor equipment to solve the problem of plasma ejection through the shower head.

[0004] Based on the above-mentioned purpose, the utility model provides a shower head for semiconductor equipment, including a plasma elimination box, a mixing box arranged below the plasma elimination box, an air outlet box arranged below the mixing box, an air inlet pipe arranged on the plasma elimination box, a first conduit connecting the plasma elimination box and the mixing box, and a second conduit connecting the air outlet box and the air outlet box; a plasma elimination plate is provided in the plasma elimination box, and a plurality of gas channels are provided on the plasma elimination plate; a stirring device is provided in the mixing box; and a plurality of air outlet holes are provided at the bottom of the air outlet box.

[0005] As a further improvement of the present application, the diameter or length of the cross section of the gas channel is less than 1.5 mm.

[0006] As a further improvement of the present application, the sum of the cross-sectional areas of all the gas channels is larger than the inner cross-sectional area of the air inlet pipe, and is also larger than the sum of the cross-sectional areas of all the air outlet holes.

[0007] As a further improvement of the present application, there are two plasma elimination plates, which are stacked up and down with a gap between them. The two plasma elimination plates are respectively positively charged and negatively charged.

[0008] As a further improvement of the present application, the upper and lower plasma elimination plates are staggered at a certain angle, and the gas channel of the upper plasma elimination plate and the gas channel of the lower plasma elimination plate do not intersect in vertical projection.

[0009] As a further improvement of the present application, the periphery of the plasma elimination plate is sealed and connected to the inner wall of the plasma elimination box.

[0010] As a further improvement of the present application, the stirring device includes a stirring motor arranged in the mixing box and a stirring blade arranged on the output shaft of the stirring motor, and a plurality of holes are evenly arranged on the stirring blade.

[0011] As a further improvement of the present application, there are two or more second conduits, and the connection between the upper end of the second conduit and the mixing box is close to the edge of the mixing box.

[0012] As a further improvement of the present application, a separation block is further provided in the plasma elimination box. The separation block is conical in shape, with its tip facing the air outlet of the air inlet pipe. The bottom of the separation block is connected to the plasma elimination plate, and the bottom diameter of the separation block is larger than the diameter of the air inlet pipe.

[0013] The beneficial effects of the utility model are as follows: the plasma is eliminated and retained by the plasma elimination box, thereby effectively avoiding the problem of plasma being ejected through the air outlet of the shower head. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 This is a schematic structural diagram of a shower head for semiconductor equipment according to an embodiment of the present invention.

[0016] The following are marked in the figure:

[0017] 1. Plasma elimination box; 11. Plasma elimination plate; 12. Gas channel; 13. Separation block; 2. Mixing box; 21. Stirring motor; 22. Stirring blade; 3. Air outlet box; 4. Air inlet pipe; 5. First conduit; 6. Second conduit. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the usual meanings understood by people with ordinary skills in the field to which this utility model belongs. The "first", "second" and similar words used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0020] like Figure 1 As shown, a shower head for semiconductor equipment includes a plasma elimination box 1, a mixing box 2 arranged below the plasma elimination box 1, an air outlet box 3 arranged below the mixing box 2, an air inlet pipe 4 arranged on the plasma elimination box 1, a first conduit 5 connecting the plasma elimination box 1 and the mixing box 2, and a second conduit 6 connecting the air outlet box 3 and the air outlet box 3; a plasma elimination plate 11 is provided in the plasma elimination box 1, and a plurality of gas channels 12 are provided on the plasma elimination plate 11; a stirring device is provided in the mixing box 2; and a plurality of air outlet holes are provided at the bottom of the air outlet box 3.

[0021] The plasma is filtered through the gas channel 12, thereby being retained within the plasma elimination box 1, effectively preventing the plasma from being ejected through the showerhead's air outlet. The filtering ensures that the gas passes through the plasma elimination plate 11 while reducing the probability of plasma passing through the plate 11, thereby preventing plasma from accumulating below the plate 11.

[0022] In order to filter the plasma sufficiently, the diameter or length of the cross section of the gas channel 12 is less than 1.5 mm.

[0023] Preferably, in order to ensure both gas flow and filterability, the diameter or length of the cross section of the gas channel 12 is 1 mm.

[0024] In order to prevent the plasma elimination plate 11 from excessively increasing the resistance to gas passage, the sum of the cross-sectional areas of all the gas channels 12 is larger than the inner cross-sectional area of the air inlet pipe 4 and is also larger than the sum of the cross-sectional areas of all the air outlet holes.

[0025] Furthermore, in order to enhance the plasma adsorption capability, the plasma elimination plates 11 are two, stacked one above the other with a gap between them, and the two plasma elimination plates 11 are respectively positively charged and negatively charged. The plasma elimination plates 11 adsorb the charged plasma in the plasma.

[0026] In order to enhance the filtering capability, the upper and lower plasma elimination plates 11 are staggered at a certain angle, and the gas channel 12 of the upper plasma elimination plate 11 and the gas channel 12 of the lower plasma elimination plate 11 do not intersect in vertical projection.

[0027] In order to filter completely, the periphery of the plasma elimination plate 11 is sealed and connected to the inner wall of the plasma elimination box 1 to prevent plasma from escaping from the edge.

[0028] In order to fully stir and mix the filtered gas, the stirring device includes a stirring motor 21 disposed in the mixing box 2 and a stirring blade 22 disposed on the output shaft of the stirring motor 21 , and a plurality of holes are evenly arranged on the stirring blade 22 .

[0029] In order to ensure that the passing gas is stirred, there are more than two second conduits 6 , and the connection between the upper end of the second conduit 6 and the mixing box 2 is close to the edge of the mixing box 2 .

[0030] To ensure adequate filtration of incoming gas, a separator 13 is provided within the plasma elimination box 1. The separator 13 is conical in shape, with its tip facing the outlet of the inlet pipe 4. The bottom of the separator 13 is connected to the plasma elimination plate 11, and the bottom diameter of the separator 13 is larger than the diameter of the inlet pipe 4. As soon as the gas enters, it is dispersed and redirected by the separator 13 to prevent it from directly impacting the plasma elimination plate 11.

[0031] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Within the scope of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0032] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A shower head for semiconductor equipment, characterized in that: The invention comprises a plasma elimination box (1), a mixing box (2) arranged below the plasma elimination box (1), an air outlet box (3) arranged below the mixing box (2), an air inlet pipe (4) arranged on the plasma elimination box (1), a first conduit (5) connecting the plasma elimination box (1) and the mixing box (2), and a second conduit (6) connecting the air outlet box (3) and the air outlet box (3); A plasma elimination plate (11) is provided in the plasma elimination box (1), and a plurality of gas channels (12) are provided on the plasma elimination plate (11); The mixing box (2) is provided with a stirring device; The bottom of the air outlet box (3) is provided with a plurality of air outlet holes.

2. The shower head for semiconductor equipment according to claim 1, wherein: The diameter or length of the cross section of the gas channel (12) is less than 1.5 mm.

3. The shower head for semiconductor equipment according to claim 1, wherein: The sum of the cross-sectional areas of all the gas channels (12) is greater than the inner cross-sectional area of the air inlet pipe (4), and is also greater than the sum of the cross-sectional areas of all the air outlet holes.

4. The shower head for semiconductor equipment according to claim 1, wherein: There are two plasma elimination plates (11), which are stacked up and down with a gap between them. The two plasma elimination plates (11) are respectively charged with positive charge and negative charge.

5. The shower head for semiconductor equipment according to claim 4, wherein: The upper and lower plasma elimination plates (11) are staggered at a certain angle with each other, and the gas channel (12) of the upper plasma elimination plate (11) and the gas channel (12) of the lower plasma elimination plate (11) do not intersect in vertical projection.

6. The shower head for semiconductor equipment according to claim 1, wherein The periphery of the plasma elimination plate (11) is sealed and connected to the inner side wall of the plasma elimination box (1).

7. The shower head for semiconductor equipment according to claim 1, wherein: The stirring device includes A stirring motor (21) is arranged in the mixing box (2) and a stirring blade (22) is arranged on the output shaft of the stirring motor (21), and a plurality of holes are evenly arranged on the stirring blade (22).

8. The shower head for semiconductor equipment according to claim 1, wherein There are more than two second conduits (6), and the connection between the upper ends of the second conduits (6) and the mixing box (2) is close to the edge of the mixing box (2).

9. The shower head for semiconductor equipment according to claim 1, wherein The plasma elimination box (1) is further provided with a separation block (13), which is conical in shape, with its tip facing the air outlet of the air inlet pipe (4), and the bottom of the separation block (13) is connected to the plasma elimination plate (11), and the bottom diameter of the separation block (13) is larger than the diameter of the air inlet pipe (4).

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