Fixing structure of vacuum coating bearing device

Abstract

The utility model discloses a fixing structure of a vacuum coating bearing device, which comprises a silicon wafer bearing disc (100) and a silicon wafer bearing frame (101), a pin shaft (3) penetrates through a through hole formed in the silicon wafer bearing disc (100), an opening clamp spring (4) penetrates through double holes formed in the silicon wafer bearing frame (101), and the opening clamp spring (4) is clamped and matched with a groove of the pin shaft (3) for fastening. According to the utility model, the problem of connection and fixation of the bearing disc and the bearing frame is effectively solved, and meanwhile, the dependence of bearing disc processing on the thickness and flatness of raw materials is reduced, so that the production and processing efficiency of products is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of vacuum coating equipment and relates to a fixing structure of a vacuum coating carrying device. Background Art

[0002] Plasma Enhanced Chemical Vapor Deposition (PECVD) is a coating method widely used in the semiconductor and solar cell industries. The substrate to be coated is placed on the surface of a carrier frame to complete the coating process. The carrier serves as a loading device for the solar cell during the coating process, placing the cells into the coating equipment. Therefore, the entire coating process places high demands on the carrier, as its quality directly affects the quality of the silicon wafers used in subsequent processes.

[0003] Early carrier plates were secured to the carrier frame using bolts and integrated clips. These components, exposed to various factors such as high temperatures and mechanical vibration, suffered from issues such as short lifespan and loosening screws. This resulted in inconsistent surface features on the carrier plate and uneven coating. Furthermore, the integrated clips for the carrier plate were highly dependent on the thickness and flatness of the raw material, significantly impacting production efficiency. Utility Model Content

[0004] In response to the above-mentioned problems existing in the prior art, the present application provides a fixing structure of a vacuum coating carrying device.

[0005] The technical solution of the utility model is as follows:

[0006] A fixing structure of a vacuum coating carrier device includes a silicon wafer carrier plate and a silicon wafer carrier frame. A pin is passed through a through hole of the silicon wafer carrier plate, and an open retaining spring is passed through a double hole of the silicon wafer carrier frame. The open retaining spring engages with a groove of the pin for fastening.

[0007] As a preferred embodiment of the present invention: the silicon wafer carrying frame includes a plurality of support beams arranged in a crisscross pattern, and the support beams are provided with staggered assembly holes in vertical and horizontal directions.

[0008] As a preferred embodiment of the present invention: the silicon wafer carrier plate includes several silicon wafer storage slots, and cross countersunk holes and positioning through holes are opened at the cross intersections of the silicon wafer storage slots, and the direction of the cross countersunk holes is perpendicular to the placement direction of the silicon wafers.

[0009] As a preferred embodiment of the present invention, the pin and the open retaining spring are made of metal, and the metal material includes stainless steel, aluminum alloy, Invar alloy, and titanium alloy.

[0010] As a preferred embodiment of the present invention: the pin is made of non-metallic material, and the non-metallic material includes C / C composite material, ceramic, and PEEK.

[0011] As a preferred embodiment of the present invention, the head of the pin is in a cross structure.

[0012] As a preferred embodiment of the present invention: the pin shaft is provided with a notch, the width of the notch is greater than 0.1 mm, and the depth of the notch is less than the outer diameter of the pin shaft.

[0013] As a preferred embodiment of the present invention: a bending notch is provided at one end of the open retaining spring.

[0014] As a preferred embodiment of the present invention: the thickness of the open retaining spring is greater than 0.1 mm.

[0015] The beneficial effects of the utility model are:

[0016] The utility model discloses a fixing structure of a vacuum coating carrier device, wherein a pin is passed through a through hole provided on a silicon wafer carrier plate, and an open retaining spring is passed through a double hole provided on a silicon wafer carrier frame. The open retaining spring and the groove of the pin are engaged with each other for fastening, which effectively solves the problem of connecting and fixing the carrier plate and the carrier frame, and reduces the dependence of the carrier plate processing on the thickness and flatness of the raw materials, thereby improving the production and processing efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is an assembly diagram of a fixing structure of a vacuum coating carrying device of the utility model;

[0018] Figure 2 This is the enlarged view of point A;

[0019] Figure 3 This is a schematic diagram of the assembly of the pin and the open retaining ring;

[0020] Figure 4 This is a three-dimensional view of the open retaining ring before bending.

[0021] In the figure: 100 - silicon wafer carrier plate; 101 - silicon wafer carrier frame; 3 - pin shaft; 4 - open retaining spring. DETAILED DESCRIPTION

[0022] The present invention is described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the embodiments described are merely a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0023] like Figure 1-4As shown, a fixing structure of a vacuum coating carrier device includes a silicon wafer carrier plate 100 and a silicon wafer carrier frame 101. The through hole opened in the silicon wafer carrier plate 100 is penetrated by a pin shaft 3, and the double holes opened in the silicon wafer carrier frame 101 are penetrated by an open retaining spring 4. The open retaining spring 4 is engaged with the groove of the pin shaft 3 for fastening.

[0024] The silicon wafer carrier frame 101 includes several support beams arranged in a crisscross pattern, and the support beams are provided with staggered assembly holes in the vertical and horizontal directions; the silicon wafer carrier plate 100 includes several silicon wafer storage slots, and the cross intersections of the silicon wafer storage slots are provided with cross countersunk holes and positioning through holes, and the direction of the cross countersunk holes is perpendicular to the placement direction of the silicon wafer; the pin shaft 3 and the open retaining spring 4 are made of metal, and the metal materials include stainless steel, aluminum alloy, Invar alloy, and titanium alloy, which have good mechanical strength, can withstand pressure and impact, have good ductility, and are easy to process and form.

[0025] The pin 3 is made of non-metallic materials, including C / C composite materials, ceramics, and PEEK. PEEK material has excellent high-temperature stability and wear resistance. The head of the pin 3 is a cross structure, which allows the screwdriver to be better embedded during installation, provides a larger torque transmission area, and improves installation efficiency. The pin 3 is provided with a slot, the slot width is greater than 0.1mm, and the slot depth is less than the outer diameter of the pin 3. One end of the open retaining ring 4 is provided with a bending slot. The thickness of the open retaining ring 4 is greater than 0.1mm.

[0026] To sum up, the utility model provides a fixing structure for a vacuum coating carrier device, wherein the through hole opened in the silicon wafer carrier plate 100 is provided with a pin shaft 3, and the double holes opened in the silicon wafer carrier frame 101 are provided with an open retaining spring 4, and the open retaining spring 4 is engaged with the groove of the pin shaft 3 for fastening, and finally the open retaining spring 4 is bent, which effectively solves the problem of connecting and fixing the carrier plate and the carrier frame, and at the same time reduces the dependence of the carrier plate processing on the thickness and flatness of the raw materials, thereby improving the production and processing efficiency of the product.

[0027] Although the implementation scheme of the present invention has been disclosed as above, it is not limited to the applications listed in the description and implementation scheme. It can be fully applied to various fields suitable for the present invention. For those familiar with the art, for ordinary technicians in the art, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to specific details.

Claims

1. A fixing structure for a vacuum coating carrier, characterized in that: The present invention comprises a silicon wafer carrier plate (100) and a silicon wafer carrier frame (101), wherein a pin shaft (3) is penetrated through a through hole provided on the silicon wafer carrier plate (100), and an open retaining spring (4) is penetrated through a double hole provided on the silicon wafer carrier frame (101), and the open retaining spring (4) is engaged with a groove of the pin shaft (3) for fastening.

2. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: The silicon wafer carrying frame (101) comprises a plurality of support beams arranged in a crisscross pattern, and the support beams are provided with staggered assembly holes in vertical and horizontal directions.

3. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: The silicon wafer carrier plate (100) comprises a plurality of silicon wafer storage slots, wherein cross countersunk holes and positioning through holes are provided at the cross intersections of the silicon wafer storage slots, and the directions of the cross countersunk holes are perpendicular to the placement direction of the silicon wafers.

4. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: The head of the pin shaft (3) is in a cross structure.

5. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: The pin shaft (3) is provided with a slot, the slot width is greater than 0.1 mm, and the slot depth is less than the outer diameter of the pin shaft (3).

6. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: One end of the open clamping spring (4) is provided with a bending notch.

7. The fixing structure of the vacuum coating carrier according to claim 1, characterized in that: The thickness of the opening retaining spring (4) is greater than 0.1 mm.

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