Heat pipe, heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat pipe, a heat dissipation assembly and electronic equipment, the heat pipe comprises a heat pipe body, the heat pipe body comprises a cavity, the cavity is provided with a groove structure, the groove structure is annularly arranged on the inner wall of the cavity, and the heat pipe body comprises a first side wall making contact with a heating element and a second side wall opposite to the first side wall; and the capillary structure is positioned in the cavity, is arranged on the first side wall and is fully attached and connected with the groove structure. According to the heat pipe, the heat dissipation assembly and the electronic equipment, due to the fact that the heat pipe is provided with the capillary structure, liquid is adsorbed through the capillary structure, and the liquid returns to the end where the heating element is located and is heated and vaporized again to circulate; the groove structure is annularly arranged on the inner wall of the cavity and can store more working medium, so that the liquid absorption capacity of the heat pipe body is improved; the groove structure provides an additional liquid backflow channel for the heat pipe, more liquid working media can return to the evaporation end more quickly, and the performance of the heat pipe in the reverse gravity direction is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation devices, and in particular to a heat pipe, a heat dissipation component, and an electronic device. Background Art

[0002] As electronic devices become thinner and lighter, the heat dissipation devices in electronic devices have also changed accordingly. To meet the demand, ultra-thin heat pipes have come into being. The working principle of a heat pipe is that under the action of a small pressure difference, steam rises to the upper end of the heat pipe, releases heat to the outside world, and condenses into liquid. The liquid is adsorbed by the capillary structure of the inner wall of the heat pipe, and the liquid returns to the evaporation end, where it is heated and vaporized again, and the cycle repeats. However, in the case of existing ultra-thin heat pipes with liquid absorption and reflux capability only on one side, the liquid working medium cannot return to the evaporation end in time in the direction against gravity, resulting in a decrease in performance in the direction against gravity, and the overall liquid absorption and reflux capability of the heat pipe is insufficient. Utility Model Content

[0003] The present disclosure provides a heat pipe, a heat dissipation component and an electronic device to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, there is provided a heat pipe comprising:

[0005] A heat pipe body, comprising a cavity having a groove structure, wherein the groove structure is arranged on an inner wall of the cavity, and the heat pipe body comprises a first side wall in contact with a heating element and a second side wall opposite to the first side wall; and

[0006] A capillary structure is located in the cavity, and the capillary structure is arranged at the first side wall and is fully attached and connected to the groove structure.

[0007] In one embodiment, the capillary structure includes a supporting portion and an adsorption portion connected to the bottom of the supporting portion, the adsorption portion is attached to the first side wall, and the top of the supporting portion is attached to the second side wall for supporting the second side wall.

[0008] In one embodiment, at least a portion of the adsorption portion is embedded in the groove structure and tightly connected to the first sidewall.

[0009] In one embodiment, at both sides of the support portion, at least a portion of the adsorption portion, at least a portion of the support portion, and at least a portion of the second sidewall together form a first cavity and a second cavity.

[0010] In one embodiment, the first cavity and the second cavity are symmetrically arranged relative to the support portion.

[0011] In one embodiment, in a cross section of the heat pipe, the support portion is trapezoidal in shape.

[0012] In one embodiment, the groove structure includes a spike portion and a groove portion, and at least a portion of the capillary structure is filled in the groove portion.

[0013] In one embodiment, the capillary structure is configured by inserting a core rod into a circular heat pipe body to sinter high thermal conductivity powder.

[0014] According to a second aspect of the present disclosure, a heat dissipation assembly is provided, comprising a heat dissipation module and a heat dissipation fan, and also comprising a heat pipe as described in any one of the above-mentioned embodiments, wherein the first side wall is in contact with and connected to the heating element, the second side wall is connected to the heat dissipation module, and the heat dissipation module is connected to the heat dissipation fan.

[0015] According to a third aspect of the present disclosure, an electronic device is provided, comprising a heating element and further provided with a heat pipe as described in the above embodiment, wherein the first side wall is in contact with and connected to the heating element.

[0016] In the present disclosure, since the heat pipe has a capillary structure, the capillary structure is located at the first side wall in contact with the heating element in the cavity, and the liquid is adsorbed by the capillary structure, so that the liquid returns to the end where the heating element is located and is heated and vaporized again in a cycle; and since a groove structure is arranged on the inner wall of the cavity, the groove structure can store more liquid working fluid, thereby increasing the liquid absorption capacity of the heat pipe body; since the groove structure provides an additional liquid reflux channel for the heat pipe, the reflux of the liquid working fluid is greatly increased, and more liquid working fluid can be returned to the evaporation end faster, effectively reducing the thermal resistance of the heat pipe and improving the heat pipe performance in the direction against gravity.

[0017] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:

[0019] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0020] Figure 1 The figure shows the overall structure of a heat pipe according to an exemplary embodiment of the present disclosure;

[0021] Figure 2shows a cross-sectional view of a heat pipe according to an exemplary embodiment of the present disclosure;

[0022] Figure 3 A cross-sectional view of a heat pipe according to an exemplary embodiment of the present disclosure is shown (the junction between the first side wall and the second side wall is a smooth pipe wall);

[0023] Figure 4 A schematic structural diagram of a heat pipe before forming according to an exemplary embodiment of the present disclosure is shown.

[0024] Explanation of the numbers in the figure: 1. Heat pipe body; 2. Groove structure; 3. Capillary structure; 4. Core rod; 10. Cavity; 11. First side wall; 12. Second side wall; 21. Spike portion; 22. Groove portion; 31. Support portion; 32. Adsorption portion; 101. First cavity; 102. Second cavity. DETAILED DESCRIPTION

[0025] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.

[0026] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0027] Reference Figure 1 、 Figure 2 and Figure 3 As shown, a heat pipe of an exemplary embodiment of the present disclosure includes a heat pipe body 1 and a capillary structure 3. The heat pipe body 1 includes a cavity 10, the cavity 10 has a groove structure 2, and the groove structure 2 is arranged on the inner wall of the cavity 10. The heat pipe body 1 includes a first side wall 11 in contact with the heating element and a second side wall 12 opposite to the first side wall 11; the capillary structure 3 is located in the cavity 10, and the capillary structure 3 is arranged at the first side wall 11 and is fully attached to the groove structure 2.

[0028] In this embodiment, the heating element may specifically include, but is not limited to, a central processing unit, a chip, or a resistor. The heating element is in direct contact with the first side wall 11 outside the cavity 10. During heat conduction, the heat of the heating element is transferred to the capillary structure 3 via the first side wall 11. The heat pipe body 1 and the capillary structure 3 are generally made of the same high thermal conductivity material, including but not limited to metal, graphite, or ceramic. For example, metal materials may include, but are not limited to, materials with good thermal conductivity such as copper, silver, or aluminum. In the embodiments shown in this disclosure, the heat pipe body 1 and the capillary structure are each made of copper. A groove structure 2 is provided on the inner wall of the cavity 10 to ensure that when vapor reaches the second side wall 12 from the first side wall 11, condensed liquid is adsorbed by the groove structure 2 on the second side wall 12. This increases the channels for liquid reflux, thereby increasing the liquid absorption capacity of the heat pipe body 1, greatly increasing the reflux of the liquid working medium, and improving the heat pipe performance in the direction against gravity. Liquid can penetrate the groove structure 2, further improving the performance limit of the heat pipe. It is understood that the groove structure 2 is provided at least at the first side wall 11 and the second side wall 12 of the cavity 10, and the two connecting parts of the first side wall 11 and the second side wall 12 can be only smooth tube walls without the groove structure 2 (see Figure 2 Alternatively, the groove structure 2 is also provided at the two connections of the first side wall 11 and the second side wall 12 (see Figure 3 ) to increase the adsorption capacity of liquid working fluid.

[0029] Reference Figure 4 As shown, in one embodiment, the capillary structure 3 is configured by inserting a core rod 4 into the circular heat pipe body 1 to sinter high thermal conductivity powder.

[0030] In this embodiment, before the heat pipe is formed, a groove structure 2 is formed on the inner wall of the circular heat pipe body 1. The capillary structure 3 is formed by inserting a core rod 4 into the circular heat pipe body 1 after the groove structure 2 is formed and filling it with high thermal conductivity powder and then sintering. Among them, the core rod 4 has a structure that imitates the capillary structure 3 in the present disclosure. The high thermal conductivity powder can be copper powder. After the core rod 4 is inserted into the circular heat pipe body 1, the copper powder is filled into the imitation part of the capillary structure 3 between the core rod 4 and the first side wall 11. After high-temperature sintering, the core rod 4 is pulled out and the formed structure is flattened to obtain the heat pipe in the present disclosure. Due to the presence of the groove structure 2, the contact area between the capillary structure 3 and the groove structure 2 is increased, which makes the sintering strength of the copper powder stronger and can effectively reduce the contact thermal resistance in the longitudinal direction of the heat pipe. In addition, the cost of the heat pipe in the present disclosure can be reduced by about 15% compared with traditional heat pipes.

[0031] In one embodiment, the capillary structure 3 includes a supporting portion 31 and an adsorption portion 32 connected to the bottom of the supporting portion 31 , the adsorption portion 32 is attached to the first side wall 11 , and the top of the supporting portion 31 is attached to the second side wall 12 for supporting the second side wall 12 .

[0032] Specifically, in one embodiment, at least a portion of the adsorption portion 32 is embedded in the groove structure 2 and tightly connected to the first sidewall 11 .

[0033] In this embodiment, the adsorption portion 32 is laid on the first side wall 11 and is in full contact with the side wall, thereby ensuring that the heating element can conduct heat to the adsorption portion 32. The support portion 31 can support the second side wall 12, which can improve the overall structural stability of the heat pipe and capillary structure 3, and increase the contact surface for liquid fluid to absorb heat or vaporized molecules to release heat, thereby improving the heat dissipation efficiency of the heat pipe and reducing thermal resistance. The adsorption portion 32 formed after high-temperature sintering of the copper powder is embedded in the groove structure 2 and tightly connected to the first side wall 11.

[0034] In one embodiment, on both sides of the support portion 31 , at least a portion of the adsorption portion 32 , at least a portion of the support portion 31 , and at least a portion of the second sidewall 12 together form a first cavity 101 and a second cavity 102 .

[0035] In this embodiment, a first cavity 101 and a second cavity 102 are formed on either side of the support portion 31. Gas flows from the first sidewall 11 through the adsorption portion 32 and the support portion 31 to the first cavity 101 and the second cavity 102. Vaporized molecules can liquefy when cooled, and the liquid fluid can be adsorbed by the capillary structure 3 and the groove structure 2. The liquid fluid can then vaporize when heated, thereby utilizing the heat pipe of the present disclosure for circulation applications. The capillary structure 3 and the groove structure 2 increase the number of branching paths for the vaporized molecules to diffuse, thereby improving the heat dissipation efficiency of the heat pipe and reducing thermal resistance.

[0036] In one embodiment, the first cavity 101 and the second cavity 102 are symmetrically arranged relative to the support portion 31 .

[0037] In this embodiment, the first cavity 101 and the second cavity 102 are preferably of the same shape and symmetrically arranged relative to the support portion 31, which facilitates uniform heat dissipation by the heat pipe. It is understood that the shapes of the first cavity 101 and the second cavity 102 are not limited to this and can also be asymmetrical. Therefore, there is no specific limitation on the shapes of the first cavity 101 and the second cavity 102, which are determined by actual application and molding conditions.

[0038] In one embodiment, the support portion 31 is trapezoidal in shape in the cross section of the heat pipe.

[0039] In this embodiment, the support portion 31 is preferably trapezoidal in shape, ensuring that the heat pipe body 1 is stably supported and can be quickly sintered. It is understood that the shape of the support portion 31 on the heat pipe cross section is not limited to this and can also be rectangular, arc-shaped, or other polygonal, depending on the actual application and molding conditions, as long as it can support the second side wall 12.

[0040] In one embodiment, the groove structure 2 includes a spike portion 21 and a groove portion 22 , and at least a portion of the capillary structure 3 is filled in the groove portion 22 .

[0041] In this embodiment, the adsorption portion 32 formed after high-temperature sintering of the copper powder is embedded in the groove portion 22 and tightly connected to the first side wall 11. After the circular heat pipe body 1 is flattened, the top of the support portion 31 abuts the spike portion 21. The spike portion 21 can be a structure that extends continuously along the length of the inner wall of the cavity 10, or the spike portion 21 can be tapered and arranged at regular intervals on the inner wall of the cavity 10.

[0042] The present disclosure also provides a heat dissipation assembly (not shown in the figure), including a heat dissipation module and a heat dissipation fan, and also including a heat pipe as in any of the above-mentioned embodiments, wherein the first side wall 11 is in contact with the heating element, the second side wall 12 is connected to the heat dissipation module, the heat dissipation module is connected to the heat dissipation fan, the second side wall 12 transfers heat to the heat dissipation module, and the heat dissipation fan can cool the heat dissipation module. By arranging a heat pipe in the heat dissipation assembly, since the heat pipe has a capillary structure 3, the capillary structure 3 is located at the first side wall 11 in contact with the heating element in the cavity 10, the capillary structure 3 absorbs the liquid, so that the liquid returns to the end where the heating element is located and is heated and vaporized again in a cycle; and since the inner wall of the cavity 10 has a groove structure 2, the reflux channel of the liquid is increased, thereby increasing the liquid absorption capacity of the heat pipe body 1, greatly increasing the reflux of the liquid working medium, and improving the heat pipe performance in the direction against gravity.

[0043] The present disclosure also provides an electronic device, including a heating element, and is also provided with a heat pipe as in the above-mentioned embodiment. The first side wall 11 is in contact with the heating element and connected to achieve the effect of the heat pipe, which will not be elaborated here.

[0044] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0045] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figures, but also different orientations during use or operation. For example, if the components in the drawings are inverted as a whole, the situation where the components are "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Thus, the exemplary term "above" may include both the orientations "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document is intended to include all of these situations.

[0046] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, parts, components and / or combinations thereof.

[0047] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0048] The present disclosure has been described through the above-described embodiments, but it should be understood that the above-described embodiments are for illustrative and illustrative purposes only and are not intended to limit the present disclosure to the described embodiments. In addition, it will be understood by those skilled in the art that the present disclosure is not limited to the above-described embodiments, and that various variations and modifications may be made based on the teachings of the present disclosure, all of which fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the appended claims and their equivalents.

Claims

1. A heat pipe, characterized in that: include: A heat pipe body (1) comprises a cavity (10), the cavity (10) having a groove structure (2), the groove structure (2) being arranged on an inner wall of the cavity (10), the heat pipe body (1) comprising a first side wall (11) in contact with a heating element and a second side wall (12) opposite to the first side wall (11); as well as A capillary structure (3) is located in the cavity (10); the capillary structure (3) is arranged at the first side wall (11) and is fully attached and connected to the groove structure (2).

2. The heat pipe according to claim 1, wherein The capillary structure (3) comprises a supporting portion (31) and an adsorption portion (32) connected to the bottom of the supporting portion (31); the adsorption portion (32) is attached to the first side wall (11); and the top of the supporting portion (31) is attached to the second side wall (12) for supporting the second side wall (12).

3. The heat pipe according to claim 2, characterized in that At least a portion of the adsorption portion (32) is embedded in the groove structure (2) and tightly connected to the first side wall (11).

4. The heat pipe according to claim 2, wherein: On both sides of the support portion (31), at least part of the adsorption portion (32), at least part of the support portion (31), and at least part of the second side wall (12) jointly form a first cavity (101) and a second cavity (102).

5. The heat pipe according to claim 4, characterized in that The first cavity (101) and the second cavity (102) are symmetrically arranged relative to the support portion (31).

6. The heat pipe according to claim 2, wherein: In the cross section of the heat pipe, the support portion (31) is in a trapezoidal shape.

7. The heat pipe according to claim 1, wherein The groove structure (2) comprises a spike portion (21) and a groove portion (22), and at least a portion of the capillary structure (3) is filled in the groove portion (22).

8. The heat pipe according to claim 1, wherein The capillary structure (3) is configured such that a core rod (4) is inserted into a circular heat pipe body (1) to sinter and form high thermal conductivity powder.

9. A heat dissipation assembly, comprising a heat dissipation module and a heat dissipation fan, characterized in that: It also includes a heat pipe as described in any one of claims 1 to 8, the first side wall (11) is in contact with the heating element, the second side wall (12) is connected to the heat dissipation module, and the heat dissipation module is connected to the heat dissipation fan.

10. An electronic device comprising a heating element, characterized in that: A heat pipe as claimed in any one of claims 1 to 8 is also provided, and the first side wall (11) is in contact with and connected to the heating element.

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