Server case

Abstract

The utility model discloses a server case and relates to the technical field of servers, the server case comprises a case body, an air inlet and an air outlet are formed in the case body, a fan, a flow guide structure and a part to be cooled are sequentially arranged between the air inlet and the air outlet in the flow direction of airflow, and the flow guide structure comprises a first flow guide section communicated with the interior of the case body; in the arrangement direction from the air inlet to the air outlet, the circulation sectional area of the first flow guide section is gradually reduced, so that airflow is introduced into the first flow guide section from the air inlet through the fan and is output from the outlet end of the first flow guide section, and heat dissipation is carried out on the part to be cooled; the problems that in the prior art, heat dissipation is not uniform and surge or vortex is likely to be formed due to the fact that only a fan and a flat plate type wind scooper are relied on are at least solved.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a server chassis. Background Art

[0002] With the innovation of chip manufacturing technology, chip performance has greatly improved, but power consumption has also increased. If heat dissipation is not effectively dissipated, the chip temperature will exceed the standard, causing performance degradation or even hardware failure, seriously affecting the stability and service life of the server. Therefore, the efficiency of heat dissipation technology has become a key factor that cannot be ignored in server design.

[0003] Currently, server cooling relies primarily on fans and flat-panel air scoops, but this traditional approach is ineffective in high-density server environments. The compact interior space of cabinets, densely stacked equipment, and complex airflow paths can easily create turbulence, eddies, and localized low-pressure zones, leading to uneven heat dissipation and hotspot temperatures exceeding 80°C, threatening equipment safety. Furthermore, straight-tube or flat-panel air scoops lack active airflow acceleration and rely solely on forced convection from fans, resulting in high energy consumption and high noise levels. This makes it difficult to meet the high-efficiency, low-energy, and low-noise cooling requirements of servers. Utility Model Content

[0004] The present application provides a server chassis to at least solve the problem in the related art of uneven heat dissipation and easy formation of turbulence or eddy currents caused by relying solely on fans and flat-plate air guide covers.

[0005] The present application provides a server chassis, including a chassis, which is provided with an air inlet and an air outlet. Along the flow direction of the air flow, a fan, a guide structure and a component to be cooled are sequentially provided between the air inlet and the air outlet. The guide structure is arranged along the arrangement direction from the air inlet to the air outlet and is connected to the chassis via a first guide section, a third guide section and a second guide section. Along the arrangement direction from the air inlet to the air outlet, the flow cross-sectional area of the first guide section gradually decreases, the flow cross-sectional area of the third guide section is constant, and the flow cross-sectional area of the second guide section gradually increases. The guide structure also includes a first guide part, a second guide part and a third guide part connected in sequence, at least a portion of the first guide part is rotatable relative to the second guide part; and / or at least a portion of the third guide part is rotatable relative to the second guide part, so that the airflow is introduced from the air inlet into the first guide section by the fan, and output from the outlet end of the third guide section to dissipate heat from the component to be cooled.

[0006] Furthermore, along the arrangement direction from the air inlet to the air outlet, the length of the first guide section is L1, and the value range of L1 is 100mm~300mm; and / or, the length of the second guide section is L2, and the value range of L2 is 150mm~400mm; and / or, the length of the third guide section is L3, and the value range of L3 is 20mm~50mm.

[0007] Furthermore, there are multiple flow-guiding structures, which are arranged along the width direction of the box body, and every two adjacent flow-guiding structures are not connected to each other.

[0008] Furthermore, a heat dissipation channel for placing a CPU radiator is provided between every two adjacent guide structures, and the flow cross-sectional area of the heat dissipation channel is constant along the arrangement direction from the air inlet to the air outlet.

[0009] Furthermore, the guide structure includes a first guide plate in contact with the bottom wall of the box, and two second guide plates arranged on the first guide plate along the width direction of the box, along the arrangement direction from the air inlet to the air outlet, wherein the first guide part, the first guide plate and the second guide plate together form a first guide section, the second guide part, the first guide plate and the second guide plate together form a third guide section, and the third guide part, the first guide plate and the second guide plate together form a second guide section.

[0010] Furthermore, the included angle between the first guide portion and the second guide portion is 150° to 170°, and the included angle between the third guide portion and the second guide portion is 165° to 175°.

[0011] Furthermore, a control unit is provided on the second air guide portion, and the server chassis also includes a temperature sensor provided on the component to be dissipated heat and an airflow sensor provided in the second air guide section. The temperature sensor and the airflow sensor are respectively connected to the control unit to control the angle between the first air guide portion and the second air guide portion or the angle between the third air guide portion and the second air guide portion according to the detection results of the temperature sensor and the airflow sensor.

[0012] The server chassis design of this application sequentially arranges a fan, a guide structure, and components to be dissipated along the airflow path between the air inlet and outlet, and the cross-sectional area of the first guide section of the guide structure gradually decreases along the airflow direction. This design follows the principles of fluid mechanics, accelerating the airflow through the contraction of the cross-sectional area, increasing the speed of the airflow through the first guide section, and thus more effectively removing the heat generated by the components to be dissipated. This achieves precise acceleration of the airflow and uniform coverage of the area to be dissipated, thereby improving heat dissipation efficiency.

[0013] As the cross-sectional area of the first guide section gradually decreases, the airflow is accelerated during this phase, reducing the need for subsequent airflow acceleration and thus lowering the energy consumption of the entire cooling system. Furthermore, since the airflow is effectively guided and accelerated within the first guide section, fan overload is avoided, reducing airflow turbulence and noise, thereby achieving low power consumption and quiet operation of the server cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 The overall schematic diagram of the flow guide structure of the embodiment of the present application is shown;

[0016] Figure 2 A top view of the flow guide structure according to an embodiment of the present application is shown;

[0017] Figure 3 A cross-sectional view of the flow guide structure of an embodiment of the present application is shown.

[0018] The above drawings include the following reference numerals:

[0019] 1. First guide section; 2. Second guide section; 3. Third guide section; 4. Heat dissipation channel; 5. First guide plate; 6. Second guide plate; 7. First guide part; 8. Second guide part; 9. Third guide part; 10. Guide structure. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0021] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0022] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0023] With the innovation of chip manufacturing technology, chip performance has greatly improved, but power consumption has also increased. If heat dissipation is not effectively dissipated, the chip temperature will exceed the standard, causing performance degradation or even hardware failure, seriously affecting the stability and service life of the server. Therefore, the efficiency of heat dissipation technology has become a key factor that cannot be ignored in server design.

[0024] Currently, server cooling relies primarily on fans and flat-panel air scoops, but this traditional approach is ineffective in high-density server environments. The compact interior space of cabinets, densely stacked equipment, and complex airflow paths can easily create turbulence, eddies, and localized low-pressure zones, leading to uneven heat dissipation and hotspot temperatures exceeding 80°C, threatening equipment safety. Furthermore, straight-tube or flat-panel air scoops lack active airflow acceleration and rely solely on forced convection from fans, resulting in high energy consumption and high noise levels. This makes it difficult to meet the high-efficiency, low-energy, and low-noise cooling requirements of servers.

[0025] Therefore, the purpose of this application is to provide a server chassis to address the above problems. The server chassis includes a chassis body, which is provided with an air inlet and an air outlet. Along the flow direction of the air flow, a fan, a guide structure 10 and a component to be dissipated heat are sequentially provided between the air inlet and the air outlet. The guide structure 10 includes a first guide section 1 connected to the interior of the chassis body. Along the arrangement direction from the air inlet to the air outlet, the flow cross-sectional area of the first guide section 1 gradually decreases, so that the airflow is introduced from the air inlet into the first guide section 1 through the fan, and output from the outlet end of the first guide section 1 to dissipate heat to the component to be dissipated heat.

[0026] Specifically, if Figure 1 、 Figure 2 and Figure 3 As shown, the server chassis provided in the present application includes a chassis, on which an air inlet and an air outlet are provided. Along the flow direction of the air from the air inlet to the air outlet, a fan, a guide structure 10 and components to be cooled are sequentially provided in the chassis. The components to be cooled in this embodiment are memory and a central processing unit, wherein the guide structure 10 includes a first guide section 1 connected to the interior of the chassis, and along the flow direction of the airflow, the flow cross-sectional area of the first guide section 1 gradually decreases. In actual use, the fan introduces external airflow from the air inlet, and the airflow enters the first guide section 1 and is blown from the other end of the first guide section 1 to the surface of the component to be cooled, so as to cool the component to be cooled. The airflow after cooling flows out from the air outlet, completing the cooling of the component to be cooled.

[0027] Because the cross-sectional area of the first flow-guiding section 1 gradually decreases along the airflow direction, the airflow is actively accelerated as it passes through this section, according to the Bernoulli principle and continuity equation in fluid mechanics. This acceleration not only increases air velocity but also focuses the airflow, directly and forcefully blowing toward the components to be cooled (memory and CPU), enhancing heat dissipation efficiency.

[0028] The design of the first guide section 1 ensures that the airflow can be precisely aimed at heat sources such as the memory and central processing unit, avoiding unnecessary diffusion of the airflow inside the server, allowing the cooling airflow to act more directly and effectively on the heat generation point, reducing the temperature near the heat source.

[0029] The low-temperature airflow from the outside is introduced through the air inlet. After being accelerated inside the first guide section 1 by the power generated by the fan, the airflow impacts the surface of the memory and the central processing unit with higher kinetic energy, effectively taking away a large amount of heat, reducing the hardware temperature, and ensuring that the server can maintain stable operation even under high load.

[0030] The optimized guide structure 10 effectively manages the heat flow, so that the airflow after heat dissipation can flow smoothly to the air outlet and finally be discharged outside the box, avoiding the circulation of hot air inside the box, reducing local overheating, and improving the overall heat dissipation efficiency and heat dissipation uniformity.

[0031] Based on the above analysis, the server chassis provided by the present application can significantly improve the speed and concentration of airflow by integrating the air guide structure 10 having the first air guide section 1, directly and efficiently dissipate heat from heat-dissipating components (such as memory and central processing unit), and ultimately achieve the following technical effects:

[0032] By optimizing airflow paths and speeds, the surface temperature of heat sources such as memory and CPUs is effectively controlled, reducing it by 10-15°C, extending hardware life and improving server operational stability.

[0033] The optimized airflow distribution ensures that all heat source areas inside the server can be effectively cooled, reducing hot spots and improving the uniformity and efficiency of overall heat dissipation.

[0034] Through the above analysis, the server chassis provided in this application not only significantly improves the heat dissipation effect of key hardware through its diversion structure design, but also optimizes the overall operating environment of the server, achieving the comprehensive goals of high efficiency, low energy consumption, low noise and high maintenance convenience.

[0035] Furthermore, the guide structure 10 also includes a second guide section 2 connected to the first guide section 1. Along the direction from the air inlet to the air outlet, the second guide section 2 is located downstream of the first guide section 1, and the flow cross-sectional area of the second guide section 2 gradually increases.

[0036] Specifically, the flow guiding structure 10 further includes a second flow guiding section 2 which is arranged downstream of the first flow guiding section 1 and communicates with the first flow guiding section 1 , and the flow cross-sectional area of the second flow guiding section 2 gradually increases.

[0037] The design of the second guide section 2, with its gradually increasing cross-sectional area, accelerates the airflow in the first guide section 1 and gracefully decelerates and diffuses it in the second guide section 2. This process effectively restores static pressure, reduces airflow separation, and allows the airflow to more evenly cover the surface of the heat dissipating component, avoiding the localized impact and vortexes that can occur with high-speed airflow.

[0038] The synergistic effect of the first and second guide sections 1 and 2 not only increases airflow velocity but also optimizes airflow distribution, allowing airflow to reach the heat source at the most appropriate speed and distribution pattern, significantly improving heat dissipation efficiency. Compared to solutions using only the first guide section 1, this design provides better airflow control and avoids rebound and localized overheating caused by excessive airflow.

[0039] The progressive expansion design of the second air guide section 2 not only optimizes airflow performance but also takes space utilization into account. Compared to traditional straight-tube or flat-plate air guide structures, this design better matches the internal layout of the server chassis, reduces dead space, and improves overall cooling system efficiency.

[0040] Furthermore, the guide structure 10 also includes a third guide section 3, which is arranged between the first guide section 1 and the second guide section 2, and is connected to both the first guide section 1 and the second guide section 2. Along the direction from the air inlet to the air outlet, the flow cross-sectional area of the third guide section 3 is constant.

[0041] Specifically, the guide structure 10 also includes a third guide section 3 arranged between the first guide section 1 and the second guide section 2. The flow cross-sectional area of the third guide section 3 is constant along the direction from the air inlet to the air outlet, wherein the first guide section 1, the second guide section 2 and the third guide section 3 are interconnected, and the external airflow is introduced by the fan from the air inlet, gradually enters the first guide section 1, the second guide section 2 and the third guide section 3, and is led out from the third guide section 3 to dissipate heat to the heat dissipation components.

[0042] The third guide section 3 has a constant flow cross-sectional area. After the rapid acceleration of the first guide section 1, the airflow enters the third guide section 3 for stabilization. Simultaneously, the static pressure recovery principle is utilized to convert some of the dynamic pressure into static pressure. This improves airflow stability, avoids fluctuations caused by sudden acceleration or deceleration, and facilitates more efficient static pressure recovery in the second guide section 2. It also reduces the impact of the airflow on the heat source, protecting the components to be cooled.

[0043] The cross-sectional area of the flow gradually increases from the second guide section 2. The airflow decelerates during this process, accompanied by the restoration of static pressure and the diffusion of airflow, covering the heat source more evenly. This ensures that when the airflow impacts the heat dissipation component, it can exchange heat at the optimal speed and distribution pattern, while also reducing airflow separation and improving heat dissipation efficiency.

[0044] The three-stage fluid channel design, especially the presence of the third guide section 3, ensures a stable transition of the airflow after acceleration, creating favorable conditions for static pressure recovery in the second guide section 2, thereby achieving optimal airflow coverage of the heat source, significantly improving heat dissipation efficiency, reducing the surface temperature of the CPU and memory, and extending hardware life.

[0045] The third guide section 3 reduces unnecessary acceleration and deceleration of the airflow in the second guide section 2 by stabilizing the airflow and converting part of the dynamic pressure into static pressure, thereby lowering the energy demand of the entire system, reducing the noise generated by airflow impact and diffusion, and improving the operating environment of the server.

[0046] The combination of the first guide section 1 and the third guide section 3 provides uniform airflow input to the second guide section 2, making the airflow more uniform when diffusing in the second guide section 2, avoiding local concentration and overheating of the airflow in the heat source area, and improving the uniformity of heat dissipation and the reliability of the overall heat dissipation effect.

[0047] The three-section fluid channel not only optimizes airflow performance but also enhances structural adaptability and flexibility. The constant cross-sectional area design of the third guide section 3 allows the guide structure 10 to better adapt to the complex internal layout of the server, supporting rapid installation and maintenance while ensuring the continuity and integrity of the airflow path, making it compatible with servers and cabinets of different specifications.

[0048] Based on the above analysis, the three-segment flow guide structure 10 proposed in this application achieves an optimal combination of airflow velocity, pressure distribution, and heat source coverage through airflow acceleration in the first flow guide segment 1, airflow stabilization and energy conversion in the third flow guide segment 3, and static pressure recovery and airflow diffusion in the second flow guide segment 2. This design not only improves the heat dissipation efficiency of components to be cooled (such as the CPU and memory), reduces energy consumption and noise, but also enhances heat dissipation uniformity.

[0049] Furthermore, along the arrangement direction from the air inlet to the air outlet, the length of the first guide section 1 is L1, and the value range of L1 is 100mm~300mm; and / or, the length of the second guide section 2 is L2, and the value range of L2 is 150mm~400mm; and / or, the length of the third guide section 3 is L3, and the value range of L3 is 20mm~50mm.

[0050] The first guide section 1 accelerates the airflow to the third guide section 3 through a linear reduction in cross-sectional area. The length of the first guide section 1 directly affects the efficiency of airflow acceleration and the speed of airflow formed in the third guide section 3. The range of 100mm to 300mm provides sufficient space for sufficient airflow acceleration while avoiding turbulence and airflow separation caused by excessive speed, ensuring smooth airflow acceleration and controllable final speed.

[0051] The length of the second guide section 2 determines the time and space required for the airflow to recover from a high-speed, high-dynamic-pressure state to a suitable static pressure state, as well as the degree of airflow diffusion. The 150mm to 400mm length of the second guide section 2 ensures sufficient space for the airflow to recover static pressure while allowing the airflow to effectively diffuse within the heat dissipation component area, covering a wider area and improving heat dissipation uniformity and efficiency.

[0052] Although short, the third guide section 3 serves as a crucial bridge connecting the first and second guide sections 1 and 2. The size of L3 ensures that the high-speed airflow exiting the first guide section 1 experiences a smooth transition before entering the second guide section 2. The 20mm to 50mm length of the third guide section 3 allows for a brief period of smooth flow after the third guide section 3, facilitating smooth static pressure recovery and avoiding unnecessary energy consumption and noise.

[0053] The optimized lengths of the first and second guide sections 1 and 2, combined with the bridging effect of the third guide section 3, effectively control the airflow velocity, pressure distribution, and diffusion pattern. This design ensures optimal airflow coverage of the heat source, improving heat exchange efficiency, significantly reducing the temperatures of key components like the CPU and memory, and enhancing the server's cooling performance and stability.

[0054] Careful selection of L1 and L2 avoids unnecessary airflow acceleration and deceleration, reducing unnecessary energy consumption while also minimizing airflow fluctuations and noise. The appropriate size of the third guide section 3 further reduces the impact of high-speed airflow on the system, achieving efficient heat dissipation with low energy consumption and low noise.

[0055] The length of the second guide section 2 is directly related to the degree of airflow diffusion. The value range of L2 ensures that the airflow can be evenly diffused in the heat source area, avoids local over-dense or over-sparse airflow, and improves the uniformity of heat dissipation and the reliability of the overall system.

[0056] The precise control of the length of each section takes into account the limitations of the internal space of the server chassis and the diversity of the heat source layout, so that the guide structure 10 can better match the server architecture and support rapid installation and adjustment, while ensuring the continuity and integrity of the airflow path and enhancing the adaptability and modularity of the structure.

[0057] Furthermore, there are multiple flow-guiding structures 10 , which are arranged along the width direction of the box, and every two adjacent flow-guiding structures 10 are not connected to each other.

[0058] Multiple independent guide structures 10 can be precisely aligned with heat sources at different locations inside the server. By adjusting the position of each guide structure 10, it is possible to ensure that the airflow directly and effectively acts on specific components to be cooled, thereby improving the accuracy of heat source positioning.

[0059] The design of adjacent guide structures 10 being non-connected avoids mutual interference between airflows, allowing each guide structure 10 to work independently, optimizing the airflow acceleration, static pressure recovery and diffusion processes within it, thereby improving the overall heat dissipation efficiency.

[0060] The design of the independent guide structure 10 makes the system more modular. The number of guide structures can be flexibly increased or decreased according to the heat source distribution and server layout, adapting to the internal structure and heat dissipation requirements of different server chassis, thereby improving the adaptability of the system and the convenience of maintenance.

[0061] The provision of multiple guide structures 10 makes the airflow distribution inside the server more precise and concentrated, reduces the ineffective circulation and turbulence of the airflow, improves the heat exchange efficiency between the airflow and the heat source, significantly reduces the temperature of key hardware, and improves the stability and operating efficiency of the server.

[0062] Because the airflow is independently accelerated and diffused within each airflow guide structure 10, mutual interference and energy loss between airflows are avoided, reducing energy consumption for the entire system. Furthermore, the independent operation of each airflow guide structure 10 reduces airflow fluctuations, further lowering the noise level during system operation and improving the server's operating environment.

[0063] By arranging multiple guide structures 10 in the width direction, the airflow can be evenly distributed to the heat source area of the entire server chassis, avoiding the uneven airflow distribution problem that may be caused by a single large guide structure 10, and improving the uniformity of heat dissipation and the reliability of the overall heat dissipation effect.

[0064] Furthermore, a heat dissipation channel 4 for placing a CPU radiator is provided between every two adjacent guide structures 10 , and the flow cross-sectional area of the heat dissipation channel 4 is constant along the arrangement direction from the air inlet to the air outlet.

[0065] The flow cross-sectional area of the heat dissipation channel 4 remains constant, ensuring that the airflow can flow through the heat dissipation channel at a stable speed after the acceleration and recovery process, thereby evenly and effectively cooling the components to be dissipated placed therein.

[0066] Combined with the layout of the independent guide structure 10, the heat dissipation channel 4 further realizes the local isolation of the airflow, avoids the cross interference of the airflow inside the server, ensures the optimal flow state of the airflow on the radiator of the heat dissipation component, and improves the heat dissipation efficiency.

[0067] Since the flow cross-sectional area of the heat dissipation channel 4 is constant, it can provide a stable cooling environment for the CPU radiator, ensuring that the airflow contacts the radiator directly, continuously and evenly, thereby improving the heat exchange efficiency, thereby further reducing the temperature of the components to be dissipated and improving the heat dissipation performance of the server.

[0068] The heat dissipation channel 4 with a constant cross-sectional area reduces the need for secondary acceleration of the airflow after it recovers after passing through the third guide section 3, avoiding additional energy consumption and increased noise. At the same time, the direct alignment design of the heat dissipation channel reduces the unnecessary diffusion of the airflow inside the server, further reducing energy consumption and noise.

[0069] The constant flow cross-sectional area design of the heat dissipation channel 4, combined with the precise positioning of the multi-flow guide structure 10, ensures that the airflow can evenly cover the components to be dissipated after a series of optimization treatments, avoiding local overheating and improving the uniformity of heat dissipation and overall system stability.

[0070] Furthermore, the guide structure 10 includes a first guide plate 5 in contact with the bottom wall of the box, and two second guide plates 6 arranged on the first guide plate 5 along the width direction of the box. Along the arrangement direction from the air inlet to the air outlet, the guide structure 10 also includes a first guide part 7, a second guide part 8 and a third guide part 9 connected in sequence, wherein the first guide part 7, the first guide plate 5 and the second guide plate 6 together form a first guide section 1, the second guide part 8, the first guide plate 5 and the second guide plate 6 together form a third guide section 3, and the third guide part 9, the first guide plate 5 and the second guide plate 6 together form a second guide section 2.

[0071] Specifically, if Figure 3 As shown, the guide structure 10 includes a first guide plate 5, which is a bottom plate and directly contacts the bottom wall of the box body. It also includes two second guide plates 6 arranged on both side walls of the first guide plate 5. The two second guide plates 6 are arranged along the width direction of the box body. Along the arrangement direction from the air inlet to the air outlet, the guide structure 10 also includes a first guide part 7, a second guide part 8 and a third guide part 9 connected in sequence. Along the arrangement direction from the air inlet to the air outlet, the first guide part 7 and the first guide plate 5 are vertically spaced apart. The distance in the vertical direction gradually decreases, the distance between the second guide part 8 and the first guide plate 5 along the vertical direction is constant, and the distance between the third guide part 9 and the first guide plate 5 along the vertical direction gradually increases, wherein the first guide part 7, the first guide plate 5 and the second guide plate 6 together form the first guide section 1, the second guide part 8, the first guide plate 5 and the second guide plate 6 together form the third guide section 3, and the third guide part 9, the first guide plate 5 and the second guide plate 6 together form the second guide section 2.

[0072] The first guide section 1 consists of a first guide plate 5, a second guide plate 6, and a first guide portion 7. The distance between the first guide portion 7 and the first guide plate 5 gradually decreases from the air inlet to the air outlet. This design adheres to the principle of the Rafale nozzle effect, which accelerates the airflow through the gradual reduction of cross-sectional area until it reaches the third guide section 3. Precise control of the first guide section 1 ensures that the airflow quickly reaches the required high speed when initially introduced into the cabinet, laying the foundation for the subsequent cooling process.

[0073] The third guide section 3 consists of the second guide portion 8, the first guide plate 5, and the second guide plates 6 on either side. This section is characterized by a constant vertical distance from the first guide plate 5, meaning that the cross-sectional flow area remains unchanged. This design provides a critical bridge for the transition from high-speed airflow to static pressure recovery. On this stable platform, the airflow effectively slows down and static pressure is restored, paving the way for subsequent diffusion and efficient heat exchange with the heat source.

[0074] The second guide section 2 is composed of a third guide portion 9, a first guide plate 5, and two flanking second guide plates 6. Its notable feature is that the distance from the first guide plate 5 gradually increases vertically, resulting in a gradually larger cross-sectional area. This design facilitates airflow expansion after exiting the third guide section 3, while further restoring static pressure based on the second guide section 2. This ensures that airflow reaches the components to be cooled at an appropriate speed, improving heat exchange efficiency while reducing airflow separation and turbulence, thereby optimizing heat dissipation.

[0075] The rapid acceleration of the first guide section 1 combined with the airflow diffusion of the second guide section 2 avoids excessive airflow acceleration and unnecessary energy loss, while reducing the noise generated by the collision of airflow and hardware, and achieving a server cooling system that maintains efficient heat dissipation while reducing operating costs and environmental interference.

[0076] The airflow acceleration in the first guide section 1 and the airflow diffusion in the second guide section 2 ensure more even airflow across the entire heat dissipation area, avoiding the localized overheating common in traditional heat dissipation designs. The stable platform design of the third guide section 3 also ensures system operational stability and reduces thermal management challenges caused by unstable airflow.

[0077] The first guide plate 5 acts as a bottom plate in contact with the bottom wall of the box, providing a stable installation foundation; the arrangement of the second guide plate 6 along the width direction, combined with the orderly connection from the first guide part 7 to the third guide part 9, enables the guide structure 10 to easily adapt to the internal layout of different server chassis, supports rapid installation and adjustment, and enhances the adaptability of the system and the convenience of maintenance.

[0078] Further, at least a portion of the first air guide portion 7 is rotatable relative to the second air guide portion 8 ; and / or at least a portion of the third air guide portion 9 is rotatable relative to the second air guide portion 8 .

[0079] Specifically, the first air guide portion 7 and the second air guide portion 8 are connected via a rotating shaft. The air guide structure 10 further includes a first driving member, a driving end of which is connected to the rotating shaft to drive the rotating shaft to rotate, thereby driving the first air guide portion 7 to rotate relative to the second air guide portion 8, thereby being able to adjust the angle between the first air guide portion 7 and the second air guide portion 8.

[0080] The third air guide portion 9 is also connected to the second air guide portion 8 via a rotating shaft. The air guide structure 10 also includes a second driving member. The driving end of the second driving member is connected to the rotating shaft to drive the rotating shaft to rotate, thereby driving the third air guide portion 9 to rotate relative to the second air guide portion 8, so as to adjust the size of the angle between the third air guide portion 9 and the second air guide portion 8. In this embodiment, the first driving member and the second driving member are both driving motors, and the first driving member and the second driving member are both arranged on the second air guide portion 8.

[0081] The first air guide section 7 and the second air guide section 8 are connected by a rotating shaft and are equipped with a first drive element, namely a drive motor. When the first drive element is activated, the torque of the drive motor is transmitted through the rotating shaft, causing the first air guide section 7 to rotate relative to the second air guide section 8. This adjusts the angle between the first air guide section 7 and the second air guide section 8, changes the acceleration curve and throat shape of the airflow in the first air guide section 1, and thus affects the acceleration efficiency and speed of the airflow.

[0082] Similarly, the third air guide section 9 is connected to the second air guide section 8 via a rotating shaft and equipped with a second drive element, also a drive motor. Activation of the second drive element changes the angle of the third air guide section 9 relative to the second air guide section 8, optimizing the airflow diffusion pattern and static pressure recovery within the third air guide section 3, thereby affecting heat dissipation efficiency and airflow distribution uniformity.

[0083] By driving the motor to dynamically adjust the angles of the first guide part 7 and the third guide part 9, the airflow acceleration and diffusion characteristics can be adjusted in real time according to the actual operating status and load changes of the server. This adaptive adjustment mechanism can ensure that the airflow is always in an optimized state under different working conditions, improve the response speed and adaptability of the cooling system, significantly improve the cooling efficiency, and ensure the stable operation of the server under high load conditions.

[0084] Dynamic adjustment of the angles of the first and third guides 7 and 9 allows the airflow path and diffusion pattern to be adjusted to changes in the heat distribution within the server, preventing excessive airflow concentration or dispersion, improving heat dissipation uniformity and overall system stability. Furthermore, precise control of the airflow path reduces airflow separation and eddy currents, ensuring smooth airflow and further enhancing heat dissipation efficiency.

[0085] Furthermore, the included angle between the first guide portion 7 and the second guide portion 8 is 150° to 170°, and the included angle between the third guide portion 9 and the second guide portion 8 is 165° to 175°.

[0086] Specifically, the angle between the first air guide portion 7 and the second air guide portion 8 can be adjusted by the first driving member, and the angle between the third air guide portion 9 and the second air guide portion 8 can be adjusted by the second driving member.

[0087] Within the adjustment range of 150° to 170°, the angle between the first and second guide portions 7, 8 directly affects the efficiency of airflow acceleration within the first guide section 1. A smaller angle (closer to 150°) achieves a steeper acceleration curve, suitable for providing higher airflow velocities under high load conditions to enhance heat dissipation. Conversely, a larger angle (closer to 170°) is suitable for low load conditions, where airflow acceleration is more moderate, reducing unnecessary energy consumption and noise generation while maintaining stable operation of the cooling system.

[0088] The angle (165°-175°) between the third guide section 9 and the second guide section 8 determines the airflow diffusion pattern and the degree of static pressure recovery in the third guide section 3. A larger divergence angle (close to 165°) helps increase the airflow diffusion range, ensuring sufficient coverage of heat sources such as radiators, thereby improving heat dissipation uniformity and efficiency. A smaller divergence angle (close to 175°) helps the airflow diffuse more smoothly, reducing turbulence and airflow separation, thereby lowering system energy consumption and noise.

[0089] By dynamically adjusting the angles of the first and third air guides 7 and 9, the server cooling system intelligently adjusts airflow acceleration and diffusion based on the current load, achieving a dynamic balance between cooling efficiency, energy consumption, and noise. Under high loads, the system provides stronger airflow acceleration to meet increased cooling demands; under low loads, it reduces airflow acceleration, reducing unnecessary energy consumption and noise, thereby improving overall system efficiency and stability.

[0090] The dynamic adjustment of the angle between the third guide portion 9 and the second guide portion 8 not only increases the diffusion range of the airflow, but also ensures the uniform distribution of the airflow in heat source areas such as the radiator, avoids local overheating, and improves the uniformity of the internal thermal management of the server and the overall heat dissipation performance.

[0091] The adjustable angles of the first and third air guides 7 and 9 provide more flexible airflow path control and optimized cooling strategies for the server cooling system. This dynamic adjustment mechanism, combined with intelligent algorithms, monitors the heat source distribution and operating status within the server in real time, dynamically adjusting the angle to ensure efficient operation of the cooling system and enhance the system's intelligence.

[0092] Furthermore, a control unit is provided on the second air guide portion 8, and the server chassis also includes a temperature sensor provided on the component to be dissipated heat and an air flow sensor provided in the second air guide section 2. The temperature sensor and the air flow sensor are respectively connected to the control unit to control the angle between the first air guide portion 7 and the second air guide portion 8 or the angle between the third air guide portion 9 and the second air guide portion 8 according to the detection results of the temperature sensor and the air flow sensor.

[0093] Specifically, a control unit is also provided on the second air guide portion 8, and the server chassis also includes a temperature sensor provided on the component to be cooled and an air flow sensor provided in the second air guide section 2. The temperature sensor is used to detect the real-time temperature of the component to be cooled, and the air flow sensor is used to detect the flow rate of the air flow flowing through the air guide structure 10. Both the temperature sensor and the air flow sensor are connected to the control unit, wherein the control unit is provided on the upper surface of the second air guide portion 8, and can control the angle between the first air guide portion 7 and the second air guide portion 8 or the angle between the third air guide portion 9 and the second air guide portion 8 according to the detection result of the temperature sensor and / or the detection structure of the air flow sensor.

[0094] Regarding the installation method of the box body and the guide structure 10: an opening is provided on the side wall of the box body, connecting side panels are provided on the two side walls of the guide structure 10, a first connecting hole is provided on the connecting side panel, a second connecting hole corresponding to the first connecting hole is provided on the side wall of the box body, and the guide structure 10 is fixed to the side wall of the box body by bolts, wherein the first connecting hole and the second connecting hole can both be bolt holes. Alternatively, a slide is provided on the side wall of the box body, and sliders are provided on the two side walls of the guide structure 10, and the sliders are slidably connected to the slide. In this way, the guide structure 10 can also be installed on the box body. Regarding the installation method of the box body and the guide structure 10, the side wall of the guide structure 10 refers to Figure 3 Along the airflow to the two side walls of the branch.

[0095] The control unit installed on the second air guide part 8 can receive real-time data from the temperature sensor and the airflow sensor. These sensors monitor the temperature of the components to be dissipated and the airflow velocity respectively. Based on the detection results of the temperature sensor and the airflow sensor, the control unit can judge the current heat dissipation requirements and airflow status of the server. If the temperature is too high or the airflow velocity is insufficient, the control unit will adjust the angle between the first air guide part 7 and the second air guide part 8 or between the third air guide part 9 and the second air guide part 8 to optimize the airflow acceleration or expansion process, ensure the reasonable distribution of the airflow inside the server, and improve the heat dissipation efficiency.

[0096] By providing corresponding first and second connection holes on the sidewalls of the enclosure and the sidewalls of the air guide structure 10, and using bolts to connect them, not only does the installation remain secure, but it also ensures precise alignment between the air guide structure and the server chassis. This installation method facilitates quick assembly and disassembly of the air guide structure 10, supporting maintenance and upgrades. Furthermore, the flexibility of the bolted connection allows the air guide structure to adapt to servers of varying specifications, improving the system's versatility and compatibility.

[0097] Another installation solution uses slide rails and sliders. This allows the guide structure 10 to slide easily on the sidewall of the server chassis, facilitating position adjustment and quick installation and removal of the guide structure 10. The slide rail connection is particularly suitable for scenarios where frequent adjustments to the internal server layout or maintenance operations are required, improving system flexibility and maintenance efficiency.

[0098] Whether it is bolt fixation or slide connection, it ensures a stable connection between the guide structure 10 and the server chassis. At the same time, it has good versatility and easy maintenance, supports rapid deployment and flexible adjustment, and enhances the adaptability and maintainability of the server cooling system.

[0099] The above is a detailed introduction to a server chassis provided by the present application. This document uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core concept of the present application. It should be noted that, for those skilled in the art, various improvements and modifications may be made to the present application without departing from the principles of the present application, and such improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server chassis, characterized in that: The server chassis comprises a box body, an air inlet and an air outlet are provided on the box body, and a fan, a guide structure (10) and a heat dissipation component are sequentially provided between the air inlet and the air outlet along the flow direction of the air flow, the guide structure (10) comprises a first guide section (1), a third guide section (3) and a second guide section (2) which are arranged along the arrangement direction from the air inlet to the air outlet and are connected to the box body, and along the arrangement direction from the air inlet to the air outlet, the flow cross-sectional area of the first guide section (1) gradually decreases, the flow cross-sectional area of the third guide section (3) is constant, and the flow cross-sectional area of the second guide section (2) is constant. The flow cross-sectional area of the section (2) gradually increases, wherein the guide structure (10) further includes a first guide portion (7), a second guide portion (8) and a third guide portion (9) connected in sequence, at least a portion of the first guide portion (7) is rotatable relative to the second guide portion (8); and / or, at least a portion of the third guide portion (9) is rotatable relative to the second guide portion (8), so that the airflow is introduced from the air inlet into the first guide section (1) through the fan, and output from the outlet end of the third guide section (3) to dissipate heat to the component to be dissipated.

2. The server chassis according to claim 1, wherein: Along the arrangement direction from the air inlet to the air outlet, the length of the first guide section (1) is L1, and the value range of L1 is 100mm~300mm; and / or, the length of the second guide section (2) is L2, and the value range of L2 is 150mm~400mm; and / or, the length of the third guide section (3) is L3, and the value range of L3 is 20mm~50mm.

3. The server chassis according to claim 1, wherein: There are a plurality of the flow-guiding structures (10), and the plurality of the flow-guiding structures (10) are arranged along the width direction of the box body, and each two adjacent flow-guiding structures (10) are not connected to each other.

4. The server chassis according to claim 3, wherein: A heat dissipation channel (4) for placing a CPU radiator is further provided between each two adjacent guide structures (10), and the flow cross-sectional area of the heat dissipation channel (4) is constant along the arrangement direction from the air inlet to the air outlet.

5. The server chassis according to claim 1, wherein: The guide structure (10) comprises a first guide plate (5) in contact with the bottom wall of the box body, and two second guide plates (6) arranged on the first guide plate (5) and arranged along the width direction of the box body, wherein the first guide portion (7), the first guide plate (5) and the second guide plate (6) together form the first guide section (1), the second guide portion (8), the first guide plate (5) and the second guide plate (6) together form the third guide section (3), and the third guide portion (9), the first guide plate (5) and the second guide plate (6) together form the second guide section (2).

6. The server chassis according to claim 1, wherein: The included angle between the first guide portion (7) and the second guide portion (8) is 150° to 170°, and the included angle between the third guide portion (9) and the second guide portion (8) is 165° to 175°.

7. The server chassis according to claim 1, wherein: A control unit is provided on the second air guide portion (8), and the server chassis further comprises a temperature sensor provided on the component to be dissipated heat and an air flow sensor provided in the second air guide section (2). The temperature sensor and the air flow sensor are respectively connected to the control unit to control the angle between the first air guide portion (7) and the second air guide portion (8) or the angle between the third air guide portion (9) and the second air guide portion (8) according to the detection results of the temperature sensor and the air flow sensor.

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