Heat dissipation device and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation, aims to solve the technical problem that some known heat dissipation structures are not high in heat dissipation efficiency, and provides a heat dissipation device and electronic equipment. The heat dissipation device comprises a plurality of heat exchange units, the heat exchange units define heat exchange cavities, the heat exchange cavities are used for being filled with heat exchange media, each heat exchange unit comprises a conveying section and a heat exchange section, each conveying section is connected to one end of the corresponding heat exchange section, the height of each conveying section is gradually increased in the direction close to the corresponding heat exchange section, and the heat exchange units are mutually spaced in the first direction; a containing space used for containing a heat source piece is defined between every two adjacent heat exchange units. The heat exchange unit has a first state and a second state, in the first state, the heat exchange cavity is filled with a heat exchange medium, the heat exchange unit expands outwards and makes contact with the adjacent heat source piece, and in the second state, the heat exchange cavity discharges the heat exchange medium, the heat exchange unit shrinks inwards and is spaced from the adjacent heat source piece. The heat dissipation device has the beneficial effect that the heat exchange efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to heat dissipation devices and electronic equipment. Background Art

[0002] During computer operation, memory, central processing unit (CPU), and graphics processing unit (GPU) account for the vast majority of the computer's power consumption and are therefore crucial for heat dissipation. Some known technologies primarily use air cooling to dissipate heat from memory modules, but this approach is inefficient. Utility Model Content

[0003] The present application provides a heat dissipation device and an electronic device to solve the technical problem that some known heat dissipation structures have low heat dissipation efficiency.

[0004] The present application provides a heat dissipation device, comprising a plurality of heat exchange units, each of which defines a heat exchange cavity, wherein the heat exchange cavity is used to fill a heat exchange medium, the plurality of heat exchange units are spaced apart from each other along a first direction, and a receiving space is defined between two adjacent heat exchange units, wherein the receiving space is used to receive a heat source component, the heat exchange unit comprises a conveying section and a heat exchange section, and along a second direction, the conveying section is connected to one end of the heat exchange section, and the height of the conveying section gradually increases in a direction approaching the heat exchange section, and the second direction intersects with the first direction; wherein, the heat exchange unit has a first state and a second state, in the first state, the heat exchange cavity is filled with the heat exchange medium, the heat exchange unit expands outward, and contacts the adjacent heat source component, and in the second state, the heat exchange cavity discharges the heat exchange medium, the heat exchange unit contracts inward, and is spaced apart from the adjacent heat source component.

[0005] Because the height of the conveying section gradually increases as it approaches the heat exchange section, the overall height of the conveying section is smaller than that of the heat exchange section, resulting in a gap at the end of the heat exchange unit. This gap can be used to avoid other components in the installation environment of the heat sink, thereby increasing the installation scope of the heat sink. At the same time, the heat exchange medium is transported to the heat exchange section through the smaller conveying section, which not only ensures the overall capacity and heat exchange capacity of the heat exchange section, but also reduces the space occupied by the heat exchange unit, thereby increasing the application scope of the heat exchange unit. In addition, the height of the conveying section gradually increases as it approaches the heat exchange section, allowing the heat exchange medium to be transported to the heat exchange section more slowly, thereby avoiding excessive flow in the conveying section and improving the protection of the conveying section. When installing the heat source component, the heat exchange medium in the heat exchange cavity is discharged, the heat exchange unit is in the second state, and the distance between two adjacent heat exchange sections is less than the width of the heat source component, making it easier to remove or install the heat source component. After the heat source component is installed, the heat exchange medium is injected into the heat exchange cavity to switch the heat exchange unit from the second state to the first state. The expanded heat exchange section forms a certain contact area with the surface of the heat source component, so that the heat exchange medium can pass through the heat exchange unit and exchange heat with the heat source component. In this way, it can ensure that the heat dissipation device exchanges heat with the heat source component and the heat source component can be easily disassembled and assembled.

[0006] In one possible implementation:

[0007] The heat dissipation device further includes a medium transmission component, which defines a transmission cavity. The transmission cavity is used to transmit heat exchange medium, and a plurality of heat exchange cavities are all connected to the transmission cavity.

[0008] In one possible implementation:

[0009] The length direction of the medium transmission component is parallel to the first direction, and the plurality of heat exchange chambers are connected in parallel to the transmission chamber.

[0010] In one possible implementation:

[0011] The heat dissipation device includes a first medium transmission member and a second medium transmission member, the first medium transmission member and the second medium transmission member being spaced apart along the second direction, and the plurality of heat exchange units being located between the first medium transmission member and the second medium transmission member. The heat exchange unit includes a first conveying section and a second conveying section, the first conveying section being connected to one end of the heat exchange section and connected to the first medium transmission member, and the second conveying section being connected to the other end of the heat exchange section and connected to the second medium transmission member.

[0012] In one possible implementation:

[0013] The medium transmission component is provided with a connection hole, and the conveying section extends into the connection hole and is sealed and connected with the medium transmission component.

[0014] In one possible implementation:

[0015] Along a cross section perpendicular to the second direction, the heat exchange unit includes a top wall, a first side wall, a bottom wall, and a second side wall. The top wall and the bottom wall are spaced apart along a third direction, the first side wall and the second side wall are spaced apart along the first direction, and the third direction intersects with the first direction and the second direction. The top wall, the first side wall, the bottom wall, and the second side wall are connected in sequence along the circumference of the heat exchange unit to enclose the heat exchange cavity.

[0016] In one possible implementation:

[0017] When the heat exchange unit switches from the second state to the first state, the dimensions of the first side wall and the second side wall along the third direction increase to correspond to the heat generation area of the heat source element.

[0018] In one possible implementation:

[0019] When the heat exchange unit is in a first state, the top wall protrudes outward in a direction away from the bottom wall, and the bottom wall protrudes outward in a direction away from the top wall; when the heat exchange unit is in a second state, the top wall includes a first straight section and two first arc sections, one first arc section is connected to one end of the first straight section and to the first side wall, and another first arc section is connected to the other end of the first straight section and to the second side wall, and the bottom wall includes a second straight section and two second arc sections, one second arc section is connected to one end of the second straight section and to the first side wall, and another second arc section is connected to the other end of the second straight section and to the second side wall.

[0020] In one possible implementation:

[0021] The top wall, the first side wall, the bottom wall and the second side wall are integrally formed with each other to form the heat exchange unit.

[0022] The present application also provides an electronic device, comprising the aforementioned heat dissipation device and a heat source component, wherein the heat source component is installed in a receiving space of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic structural diagram of an electronic device according to an embodiment of the present application.

[0025] Figure 2 Schematic diagram of the structure of a heat dissipation device according to an embodiment of the present application.

[0026] Figure 3 Schematic diagram of a partial explosion structure of a heat dissipation device according to an embodiment of the present application.

[0027] Figure 4 This is a cross-sectional view of a heat dissipation device according to an embodiment of the present application, wherein the heat exchange unit is in the second state.

[0028] Figure 5 This is a cross-sectional view of a heat dissipation device according to an embodiment of the present application, wherein the heat exchange unit is in a first state.

[0029] Figure 6 This is a cross-sectional view of a heat dissipation device according to an embodiment of the present application at another angle.

[0030] Figure 7 This is another cross-sectional view of a heat dissipation device according to an embodiment of the present application.

[0031] Figure 8 This is another cross-sectional view of a heat dissipation device according to an embodiment of the present application.

[0032] Figure 9 This is a cross-sectional view of the connection between the heat exchange unit and the medium transmission component according to one embodiment of the present application.

[0033] Figure 10 This is a cross-sectional view of a heat exchange unit according to another embodiment of the present application.

[0034] Description of main component symbols:

[0035]

[0036] DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be an element centered therein. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be an element centered therein. When an element is considered to be "set on" another element, it may be directly set on the other element or there may also be an element centered therein. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" as used herein includes any and all combinations of one or more of the relevant listed items.

[0040] Some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0041] See also Figure 1 , this embodiment provides an electronic device 200. The electronic device 200 can be various network devices or computer devices such as computers, servers, switches, base stations, etc. The electronic device 200 includes a housing, a circuit board 202, a heat source 201 and a heat dissipation device 100. The heat source 201 is detachably connected to the circuit board 202. The heat source 201 can be any component that can generate heat during operation and requires liquid cooling and heat dissipation treatment. For example, the heat source 201 can be any electrical component such as a CPU, a power chip, a processor chip, a control chip, various functional chips, circuits, memory bars (memory particles) or a graphics card. The heat dissipation device 100 is arranged on the circuit board 202 and is used for heat exchange with the heat source 201 to dissipate heat from the heat source 201.

[0042] In this embodiment, heat source 201 is a memory stick, and circuit board 202 is a motherboard. The memory stick can be configured as an in-line memory module (SIMM) or a dual in-line memory module (DIMM). The following description uses a DIMM-type memory stick as an example. The memory stick includes a substrate 2011, with memory chips 2012 disposed on both sides of the substrate 2011. Gold fingers 2013 are disposed on the bottom of the substrate 2011. Gold fingers 2013 are used to plug into and out of the motherboard socket to facilitate installation and removal of the memory stick.

[0043] In this embodiment, the width direction of the memory bar is defined as a first direction X, the length direction of the memory bar is defined as a second direction Y, and the height direction of the memory bar is defined as a third direction Z.

[0044] See also Figures 2 to 5 In this embodiment, the heat dissipation device 100 includes a plurality of heat exchange units 10. Each of the plurality of heat exchange units 10 defines a heat exchange cavity Q1 for filling with a heat exchange medium. The plurality of heat exchange units 10 are spaced apart from each other along a first direction X, and a receiving space Q2 is defined between adjacent heat exchange units 10 for receiving a heat source element 201. The heat exchange unit 10 includes a conveying section 11 and a heat exchange section 12. Along a second direction Y, the conveying section 11 is connected to one end of the heat exchange section 12. The height of the conveying section 11 gradually increases as it approaches the heat exchange section 12. The second direction Y intersects with the first direction X. The heat exchange unit 10 has a first state and a second state. In the first state, the heat exchange cavity Q1 is filled with heat exchange medium, the heat exchange unit 10 expands outward, and contacts the adjacent heat source element 201. In the second state, the heat exchange cavity Q1 is exhausted of heat exchange medium, the heat exchange unit 10 contracts inward, and is spaced apart from the adjacent heat source element 201.

[0045] In this embodiment, because the height of the conveying section 11 gradually increases as it approaches the heat exchange section 12, the overall height of the conveying section 11 is smaller than the height of the heat exchange section 12, resulting in a gap C2 at the end of the heat exchange unit 10. This gap C2 can be used to avoid other components in the installation environment of the heat dissipation device 100, thereby increasing the installation applicability of the heat dissipation device 100. At the same time, by transporting the heat exchange medium to the heat exchange section 12 through the smaller conveying section 11, the overall capacity and heat exchange capability of the heat exchange section 12 are ensured, the space occupied by the heat exchange unit 10 is reduced, and the applicability of the heat exchange unit 10 is increased. In addition, the height of the conveying section 11 gradually increases as it approaches the heat exchange section 12, allowing the heat exchange medium to be transported to the heat exchange section 12 more slowly, thereby preventing the conveying section 11 from carrying excessive flow and improving the protection of the conveying section 11.

[0046] See also Figure 4 When installing the heat source 201, the heat exchange medium in the heat exchange cavity Q1 is discharged, the heat exchange unit 10 is in the second state, and the distance between two adjacent heat exchange sections 12 is smaller than the width of the heat source 201, so that the heat source 201 can be removed or installed more conveniently. Figure 5 After the heat source 201 is installed, the heat exchange medium is injected into the heat exchange cavity Q1, so that the heat exchange unit 10 switches from the second state to the first state. The expanded heat exchange section 12 forms a certain contact area with the surface of the heat source 201, so that the heat exchange medium exchanges heat with the heat source 201 through the heat exchange unit 10. In this way, it is ensured that the heat dissipation device 100 exchanges heat with the heat source 201, and the heat source 201 can be easily assembled and disassembled.

[0047] In addition, when installing heat source elements 201 with different thicknesses, for example, when the memory chips 2012 of the memory stick have different heights, the different surfaces of the expanded heat exchange unit 10 can abut against all the memory chips 2012, thereby exchanging heat with each memory chip 2012. Compared with the existing heat sink with greater rigidity, it ensures that the heat exchange unit 10 can maintain thermal contact with heat source elements 201 of different heights with a sufficient fitting area.

[0048] In some embodiments, see Figure 3 The electronic device 200 further includes a card holder 203. The card holder 203 is provided on the mainboard, and the card holder 203 is used to cooperate with the gold finger 2013 of the memory stick to realize the installation or removal of the memory stick.

[0049] In some embodiments, see Figure 3 The card holder 203 includes a plug-in portion 2031 and two engaging portions 2032. The two engaging portions 2032 are connected to the two ends of the plug-in portion 2031. The plug-in portion 2031 defines a slot C1 into which the gold fingers 2013 of the memory module can be inserted. The engaging portions 2032 are used to secure the baseboard 2011, thereby stably inserting the memory module into the card holder 203 and ensuring a secure connection between the memory module and the motherboard. The engaging portion 2032 and the baseboard 2011 can employ a known snap-fit structure, which will not be described in detail here.

[0050] In some embodiments, see Figure 3 Along the third direction Z, the conveying section 11 has a conveying top wall P1 and a conveying bottom wall P2, and the heat exchange section 12 has a heat exchange top wall P3 and a heat exchange bottom wall P4. The heat exchange top wall P3 is connected to and parallel to the conveying top wall P1, and the conveying bottom wall P2 is located between the heat exchange top wall P3 and the heat exchange bottom wall P4. The distance between the conveying bottom wall P2 and the conveying top wall P1 gradually increases as it approaches the heat exchange section 12. The conveying bottom wall P2 defines a notch C2. The notch C2 is used to avoid the engaging portion 2032.

[0051] In some embodiments, see Figure 6 , the heat exchange section 12 corresponds to the plug-in portion 2031. The heat exchange unit 10 includes a first conveying section 111 and a second conveying section 112. The first conveying section 111 is connected to one end of the heat exchange section 12, and the second conveying section 112 is connected to the other end of the heat exchange section 12. The first conveying section 111 and the second conveying section 112 correspond to the two engaging portions 2032, respectively. The first conveying section 111 and the second conveying section 112 are respectively located above the two engaging portions 2032. In this way, when the heat exchange unit 10 is in the first state, the conveying section 11 will not interfere with the engaging portion 2032, thereby ensuring the installation reliability of the heat dissipation device 100.

[0052] In some embodiments, see Figure 7The plug-in portion 2031 includes a plug-in bottom wall 20311 and two plug-in side walls 20312. The two plug-in side walls 20312 are spaced apart from the plug-in bottom wall 20311 and define a slot C1 between them. When the heat exchange unit 10 is in the first state, the two plug-in side walls 20312 support the heat exchange unit 10, thereby reducing the risk of the heat exchange unit 10 breaking under the weight of the heat exchange medium.

[0053] In other embodiments, see Figure 8 The heat dissipation device 100 further includes a plurality of support portions 50. Each support portion 50 is provided on either side of each plug-in portion 2031. The support portions 50 are taller than the plug-in portion 2031 but no taller than the memory chip 2012. The support portions 50 are used to support the heat exchange section 12 of the heat exchange unit 10, providing a stable support for the heat exchange section 12 and preventing the heat exchange section 12 from falling onto the sides of the capacitor and resistor 2014.

[0054] In some embodiments, the heat exchange medium may be a coolant, and the coolant may be water (deionized water), mineral oil, silicone oil, synthetic ester oil, fluorinated oil, fluorinated liquid, etc.

[0055] In some embodiments, there are multiple memory bars, and the multiple memory bars are spaced apart from each other along the first direction X. In other embodiments, one receiving space Q2 can also accommodate two or three memory bars, and the multiple memory bars in one receiving space Q2 are sequentially distributed along the second direction Y.

[0056] In some embodiments, see Figure 1 and Figure 2 The heat dissipation device 100 further includes a medium transmission member 20. The medium transmission member 20 is disposed on the mainboard. The medium transmission member 20 defines a transmission cavity Q3 for transmitting heat exchange medium. The plurality of heat exchange cavities Q1 are connected to the transmission cavity Q3. The medium transmission member 20 facilitates the transmission of heat exchange medium into the heat exchange cavity Q1 and the discharge of heat exchange medium from the heat exchange cavity Q1.

[0057] In this manner, the medium transmission member 20 can transport the heat exchange medium into the heat exchange cavity Q1, switching the heat exchange unit 10 to the first state. The medium transmission member 20 can also extract the heat exchange medium from the heat exchange cavity Q1, switching the heat exchange unit 10 to the second state. Furthermore, because the heat exchange section 12 is connected to the medium transmission member 20 via the delivery section 11, the side dimensions of the medium transmission member 20 only need to meet the connectivity requirements of the delivery section 11. This reduces the cross-sectional area of the medium transmission member 20 and increases the installation and applicability of the heat dissipation device 100.

[0058] In some embodiments, see Figure 9The medium transmission component 20 defines a connection hole K1 , and the conveying section 11 extends into the connection hole K1 and is sealed and connected to the medium transmission component 20 .

[0059] In some embodiments, the heat exchange unit 10 and the medium transmission member 20 are integrally molded. This reduces the risk of heat exchange medium leakage caused by connecting pipes. Specifically, the heat exchange unit 10 and the medium transmission member 20 can be bonded using an adhesive, which can be a UV adhesive. The heat exchange unit 10 and the medium transmission member 20 can also be integrally molded using various molding methods, such as package injection molding and double-injection molding. The medium transmission member 20 can be made of copper, stainless steel, plastic, rubber tubing, EPDM, Teflon tubing, and other materials.

[0060] In some embodiments, see Figure 1 and Figure 2 The length direction of the medium transmission member 20 is parallel to the first direction X, the multiple heat exchange units 10 are spaced apart along the first direction X, and the multiple heat exchange chambers Q1 are connected in parallel to the transmission chamber Q3.

[0061] In some embodiments, see Figure 2 The medium transmission member 20 includes a first medium transmission member 21 and a second medium transmission member 22. The first medium transmission member 21 and the second medium transmission member 22 are spaced apart along the second direction Y. The plurality of heat exchange units 10 are located between the first medium transmission member 21 and the second medium transmission member 22. The heat exchange unit 10 includes a first conveying section 111 and a second conveying section 112. The first conveying section 111 is connected to one end of the heat exchange section 12 and is connected to the first medium transmission member 21. The second conveying section 112 is connected to the other end of the heat exchange section 12 and is connected to the second medium transmission member 22.

[0062] The first medium transmission component 21 is connected to the second medium transmission component 22 . The first medium transmission component 21 is used to input the heat exchange medium to the second medium transmission component 22 , and the second medium transmission component 22 is used to output the heat exchanged medium.

[0063] In other embodiments, see Figure 6 The heat exchange unit 10 has a medium inlet K3 and a medium outlet K2, which are located at both ends of the heat exchange unit 10. The medium inlets K3 and medium outlets K2 of multiple heat exchange units 10 are connected end to end in series. The first heat exchange unit 10 is connected to the first medium transmission member 21, and the last heat exchange unit 10 is connected to the second medium transmission member 22. In this way, the heat exchange medium in the first medium transmission member 21 passes through the multiple heat exchange units 10 in sequence, is transferred to the second medium transmission member 22, and is discharged from the second medium transmission member 22.

[0064] In other embodiments, the plurality of heat exchange units 10 may be connected in parallel and in series with the first medium transmission member 21 and the second medium transmission member 22 .

[0065] In some embodiments, see Figure 1 The first medium transmission member 21 includes a first transmission pipe 211 and a first transmission joint 212. The first transmission joint 212 is connected to one end of the first transmission pipe 211. A transmission section 11 is connected to the side of the first transmission pipe 211. The second medium transmission member 22 includes a second transmission pipe 221 and a second transmission joint 222. The second transmission joint 222 is connected to one end of the second transmission pipe 221. Another transmission section 11 is connected to the side of the second transmission pipe 221.

[0066] In some embodiments, see Figure 1 The heat dissipation device 100 further includes a liquid cooling plate 33, a first transmission pipeline 31, and a second transmission pipeline 32. The liquid cooling plate 33 is connected between the first transmission pipeline 31 and the second transmission pipeline 32. The first transmission pipeline 31 is connected to the first transmission connector 212. The second transmission pipeline 32 is connected to the second transmission connector 222. In this manner, after the heat exchange medium has exchanged heat with the liquid cooling plate 33 and cooled, it is transferred back to the first medium transmission member 21. This achieves a cyclic heat exchange, improves heat exchange efficiency, and enhances the integration of the heat dissipation device 100.

[0067] In some embodiments, see Figure 6 The memory module also includes a capacitor and resistor 2014. The capacitor and resistor 2014 are located below the memory chip 2012. The heat exchange section 12 corresponds to the memory chip 2012 and is located above the capacitor and resistor 2014. This allows the heat exchange section 12 to avoid the capacitor and resistor 2014, reducing the possibility of damage to the heat exchange section 12 and increasing the service life of the heat dissipation device 100.

[0068] In some embodiments, see Figure 4 and Figure 7 In a cross-section of the heat exchange unit 10 perpendicular to the second direction Y, the heat exchange unit 10 includes a top wall 14, a first side wall 15, a bottom wall 16, and a second side wall 17. The top wall 14 and the bottom wall 16 are spaced apart along the third direction Z, and the first side wall 15 and the second side wall 17 are spaced apart along the first direction X. The top wall 14, the first side wall 15, the bottom wall 16, and the second side wall 17 are sequentially connected along the circumference of the heat exchange unit 10 and enclose a heat exchange cavity Q1. Thus, in the first state, the first side wall 15 contacts the side of the memory stick on one side of the heat exchange unit 10, and the second side wall 17 contacts the side of the memory stick on the other side of the heat exchange unit 10, enabling a single heat exchange unit 10 to simultaneously exchange heat with two memory sticks.

[0069] In some embodiments, see Figure 7 When the heat exchange unit 10 switches from the second state to the first state, the dimensions of the first side wall 15 and the second side wall 17 along the third direction Z increase to correspond to the heat generation area of the heat source 201. The heat generation area of the heat source 201 is the memory chip 2012 of the memory module.

[0070] Specifically, the size of the first side wall 15 along the third direction Z is increased to cover the size of the memory chip 2012 along the third direction Z, and the size of the second side wall 17 along the third direction Z is increased to cover the size of the memory chip 2012 along the third direction Z. In this way, the memory chip 2012 can be ensured to be in full contact with the heat exchange unit 10, thereby improving the heat exchange efficiency.

[0071] In some embodiments, see Figure 7 When the heat exchange unit 10 is in the first state, the top wall 14 protrudes outward in a direction away from the bottom wall 16, and the bottom wall 16 protrudes outward in a direction away from the top wall 14; when the heat exchange unit 10 is in the second state, the top wall 14 includes a first straight section 141 and two first arc sections 142, one first arc section 142 is connected to one end of the first straight section 141 and connected to the first side wall 15, and the other first arc section 142 is connected to the other end of the first straight section 141 and connected to the second side wall 17, and the bottom wall 16 includes a second straight section 161 and two second arc sections 162, one second arc section 162 is connected to one end of the second straight section 161 and connected to the first side wall 15, and the other second arc section 162 is connected to the other end of the second straight section 161 and connected to the second side wall 17.

[0072] During the transition of the heat exchange unit 10 from the second state to the first state, the top wall 14 and the bottom wall 16 both deform and are expanded by the heat exchange medium, simultaneously causing the first side wall 15 and the second side wall 17 to deform along the third direction Z, thereby increasing the contact area between the first side wall 15 and the second side wall 17 and the heat source element 201. The first curved segment 142 can improve the connection reliability between the first straight segment 141 and the first side wall 15 or the second side wall 17. The second curved segment 162 can improve the connection reliability between the second straight segment 161 and the first side wall 15 or the second side wall 17.

[0073] In some embodiments, the top wall 14, the first side wall 15, the bottom wall 16, and the second side wall 17 are integrally formed to form the heat exchange unit 10. In this way, the anti-permeability performance of the heat exchange unit 10 can be further improved.

[0074] In some embodiments, the heat exchange unit 10 can be integrally formed from a single layer of silicone rubber into a tubular structure. In other embodiments, the tubular wall of the heat exchange unit 10 can also be formed by compositely pressing multiple functional membrane layers, wherein each functional membrane layer can include various functional layers such as an anti-permeation layer, a strength layer, and a thermal conductive layer to improve the strength, anti-permeation performance, and thermal conductivity of the heat exchange unit 10.

[0075] In some embodiments, see Figure 10 , the heat dissipation device 100 also includes a thermal interface layer 41 and a protective layer 42. The thermal interface layer 41 covers the heat exchange unit 10. The protective layer 42 covers the thermal interface layer 41. The thermal interface layer 41 can be made of a flexible thermally conductive material such as a heat dissipation gasket, a thermally conductive adhesive, or a silicone grease, which not only improves the heat exchange performance of the heat exchange unit 10, but also makes the flexible thermal interface layer 41 more easily deformable, thereby increasing the contact area between the heat exchange unit 10 and the memory chip 2012 of the memory stick, thereby further improving the heat exchange efficiency. The protective layer 42 can be made of a flexible thermally conductive material, such as a polyimide film, which has flexibility, heat exchange performance, and wear resistance, thereby slowing down the friction loss of the contact between the heat exchange unit 10 and the memory stick, reducing the risk of leakage of the heat exchange unit 10, and increasing the service life of the heat exchange unit 10.

[0076] The above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent replacements of the technical solutions of the present application should not depart from the spirit and scope of the technical solutions of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A plurality of heat exchange units, each of the plurality of heat exchange units defining a heat exchange cavity, the heat exchange cavity being used to be filled with a heat exchange medium, the plurality of heat exchange units being spaced apart from each other along a first direction, a receiving space being defined between two adjacent heat exchange units, the receiving space being used to receive a heat source component, the heat exchange unit comprising a conveying section and a heat exchange section, the conveying section being connected to one end of the heat exchange section along a second direction, the height of the conveying section gradually increasing in a direction approaching the heat exchange section, the second direction intersecting the first direction; The heat exchange unit has a first state and a second state. In the first state, the heat exchange cavity is filled with the heat exchange medium, the heat exchange unit expands outward and contacts the adjacent heat source component. In the second state, the heat exchange cavity discharges the heat exchange medium, the heat exchange unit contracts inward, and is spaced apart from the adjacent heat source component.

2. The heat dissipation device according to claim 1, wherein: The heat dissipation device further includes a medium transmission component, which defines a transmission cavity. The transmission cavity is used to transmit heat exchange medium, and a plurality of heat exchange cavities are all connected to the transmission cavity.

3. The heat dissipation device according to claim 2, wherein: The length direction of the medium transmission component is parallel to the first direction, and the plurality of heat exchange chambers are connected in parallel to the transmission chamber.

4. The heat dissipation device according to claim 2, wherein: The heat dissipation device includes a first medium transmission member and a second medium transmission member, the first medium transmission member and the second medium transmission member are spaced apart along the second direction, and the plurality of heat exchange units are located between the first medium transmission member and the second medium transmission member; The heat exchange unit includes a first conveying section and a second conveying section. The first conveying section is connected to one end of the heat exchange section and is connected to the first medium transmission component. The second conveying section is connected to the other end of the heat exchange section and is connected to the second medium transmission component.

5. The heat dissipation device according to claim 2, wherein: The medium transmission component is provided with a connection hole, and the conveying section extends into the connection hole and is sealed and connected with the medium transmission component.

6. The heat dissipation device according to claim 1, wherein: Along a cross section perpendicular to the second direction, the heat exchange unit includes a top wall, a first side wall, a bottom wall, and a second side wall. The top wall and the bottom wall are spaced apart along a third direction, the first side wall and the second side wall are spaced apart along the first direction, and the third direction intersects with the first direction and the second direction. The top wall, the first side wall, the bottom wall, and the second side wall are connected in sequence along the circumference of the heat exchange unit to enclose the heat exchange cavity.

7. The heat dissipation device according to claim 6, wherein: When the heat exchange unit switches from the second state to the first state, the dimensions of the first side wall and the second side wall along the third direction increase to correspond to the heat generation area of the heat source element.

8. The heat dissipation device according to claim 6, wherein: When the heat exchange unit is in a first state, the top wall protrudes outward in a direction away from the bottom wall, and the bottom wall protrudes outward in a direction away from the top wall; when the heat exchange unit is in a second state, the top wall includes a first straight section and two first arc sections, one first arc section is connected to one end of the first straight section and to the first side wall, and another first arc section is connected to the other end of the first straight section and to the second side wall, and the bottom wall includes a second straight section and two second arc sections, one second arc section is connected to one end of the second straight section and to the first side wall, and another second arc section is connected to the other end of the second straight section and to the second side wall.

9. The heat dissipation device according to claim 6, wherein: The top wall, the first side wall, the bottom wall and the second side wall are integrally formed with each other to form the heat exchange unit.

10. An electronic device, characterized in that: include: The heat dissipation device according to any one of claims 1 to 9; A heat source component is installed in the receiving space of the heat dissipation device.

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