Splicing type cooling fin

Abstract

The utility model relates to a splicing type radiating fin in the field of radiating fins, which comprises a bottom plate and a radiator, a radiating cavity is arranged between the bottom plate and the radiator, a positioning groove is arranged on the surface of the bottom plate, an elastic clamping piece is arranged in the positioning groove, two ends of the elastic clamping piece extend to the edge of the radiator and are provided with buckling parts, and the buckling parts are arranged on the bottom plate. The radiator comprises a heat absorption base, a heat dissipation piece and a convection channel, the bottom face of the heat absorption base makes contact with the heat dissipation cavity, the heat dissipation piece and the convection channel are arranged at the end, away from the heat dissipation cavity, of the heat absorption base, the edge of the heat absorption base is a regular polygon, and the number of the edges of the heat absorption base is larger than four and is an even number. The number of the positioning clamping grooves is consistent with the number of the edges of the heat absorption base, the buckling part can be meshed with any two opposite positioning clamping grooves in the multiple positioning clamping grooves, the heat absorption base can be adjusted at different angles, the direction of the convection channel is made to be matched with the flow direction of air in the case, and the application range is larger.

Description

Technical Field

[0001] The utility model relates to the field of heat sinks, in particular to a spliced heat sink. Background Art

[0002] A heat sink is a device used to dissipate heat from heat-prone electronic components in electrical appliances. It achieves this by increasing the surface area to transfer heat from the heat source to the air. It is widely used in various electronic devices, mechanical equipment, and automotive engines that require heat dissipation, such as computer CPUs, power transistors, line transistors, and amplifier transistors in televisions, as well as automotive engines and braking systems.

[0003] A hard drive heat sink is a device installed on the hard drive's surface that reduces the drive's operating temperature by increasing the heat dissipation area and improving heat conduction efficiency. For solid-state drives, internal chips generate heat during operation. If this heat can't be dissipated quickly, the drive's temperature will rise, affecting data read and write speeds and stability, and even shortening the drive's lifespan. Therefore, the role of a hard drive heat sink is particularly important.

[0004] Existing hard drive heat sinks consist of a bottom fixture, a thermally conductive medium, and heat dissipating fins or a grid. These components work together to quickly conduct heat generated by the SSD and dissipate it to the surrounding environment. However, the orientation of the heat dissipating fins is often fixed. If the convection channels between the fins do not align with the air flow direction within the chassis, the heat dissipation efficiency will be significantly reduced. Utility Model Content

[0005] In order to overcome the deficiencies of the existing technical solutions, the utility model provides a spliced heat sink, which can effectively solve the technical problem of fixing the direction of the convection channels between the heat sink fins.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] The heat dissipation device is a heat dissipation device, a heat dissipation device, a heat dissipation device, and a heat dissipation device. The heat dissipation device is a heat dissipation device, a heat dissipation device being installed in an off-center position to dissipate heat.

[0008] Furthermore, both ends of the elastic clip are bent to form a buckle portion, which is bent toward the heat dissipation cavity. A pressing portion is provided at one end of the buckle portion away from the elastic clip, and the bending direction of the pressing portion is opposite to that of the buckle portion.

[0009] Furthermore, there are more than three heat sinks, elastic clips and positioning grooves, and the numbers of heat sinks, elastic clips and positioning grooves are the same, and the heat sinks are evenly arranged above the bottom plate.

[0010] Furthermore, the inner wall of the bottom plate and the end of the heat-absorbing base away from the heat sink are both provided with thermally conductive silicone sheets, and are both connected to the thermally conductive silicone sheets through adhesive backing. The opposite sides of the two thermally conductive silicone sheets can be closely attached to the surface of the circuit board that needs heat dissipation.

[0011] Furthermore, the heat sink is a plurality of heat sink blocks, which are evenly and equidistantly arranged, and convection channels are formed between adjacent heat sink blocks, and the convection channels are parallel to each other.

[0012] Furthermore, the heat sink is a plurality of heat sink fins, which are evenly and equidistantly arranged, and convection channels are formed between adjacent heat sink fins, and the convection channels are parallel to each other.

[0013] Furthermore, the heat absorbing base and the heat dissipating element are integrally formed, and both the heat absorbing base and the heat dissipating element are made of aluminum alloy.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: a radiator and a base plate are provided, the solid-state hard disk can be arranged in the heat dissipation cavity, the inner wall of the base plate and the bottom surface of the heat-absorbing base are in contact with the front and back surfaces of the solid-state hard disk respectively, the radiator is connected to the base plate through an elastic clip, the clip portion can be engaged with any two opposite dry positioning slots, the heat-absorbing base can be adjusted to different angles, so that the direction of the convection channel matches the air flow direction in the chassis, and the scope of application is wider. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 It is an exploded view of the utility model;

[0017] Figure 3 This is a structural diagram of the radiator in the present utility model;

[0018] Figure 4 This is a front view of the elastic clip in the present utility model;

[0019] Figure 5 This is a schematic diagram of the elastic clip and the radiator in the present invention being connected;

[0020] Numbers in the figure: 1-base plate, 2-radiator, 201-heat absorbing base, 202-heat dissipation element, 203-convection channel, 204-positioning slot, 3-heat dissipation cavity, 4-positioning slot, 5-elastic clip, 501-clamping part, 502-pressing part, 6-thermal conductive silicone sheet, 7-hard disk. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The following combination Figure 1-Figure 5 A detailed description of a spliced heat sink of the utility model is given below:

[0023] A spliced heat sink includes a base plate 1 and a radiator 2. The radiator 2 is arranged above the base plate 1. A heat dissipation cavity 3 is provided between the base plate 1 and the radiator 2. The heat dissipation cavity 3 is used to install a circuit board that needs to dissipate heat. The surface of the base plate 1 is provided with a positioning groove 4. An elastic clip 5 is provided in the positioning groove 4. Both ends of the elastic clip 5 extend to the edge of the radiator 2 and are provided with a buckle portion 501. The radiator 2 includes a heat absorbing base 201, a heat dissipating element 202 and a convection channel 203. The bottom surface of the heat absorbing base 201 is in contact with the heat dissipation cavity 3. The heat dissipating element 202 and the convection channel 203 are provided on the heat absorbing base 201 away from the heat dissipation cavity 3. One end of the heat absorbing base 201 is a regular octagon, and each side of the heat absorbing base 201 is provided with a positioning slot 204. The buckle portion 501 can be engaged with any two opposite positioning slots 204 among the plurality of positioning slots 204. The two ends of the elastic clip 5 are bent to form a buckle portion 501, and the buckle portion 501 is bent toward the direction of the heat dissipation cavity 3. A pressing portion 502 is provided at the end of the buckle portion 501 away from the elastic clip 5. The bending direction of the pressing portion 502 is opposite to that of the buckle portion 501. Pressing the pressing portion 502 can make the buckle portion 501 tilt away from the positioning slot 204, making disassembly and assembly more convenient.

[0024] The radiator 2, elastic clip 5 and positioning groove 4 are each provided with three, and the radiator 2 is evenly arranged above the base plate 1. The three radiators 2 can be individually disassembled, installed and adjusted. The heat sink 202 is a plurality of heat sink blocks, and the plurality of heat sink blocks are evenly arranged at equal distances. Convection channels 203 are formed between adjacent heat sink blocks, and the convection channels 203 are parallel to each other. The heat-absorbing base 201 and the heat sink 202 are integrally formed, and the heat-absorbing base 201 and the heat sink 202 are both made of aluminum alloy. The inner wall of the base plate 1 and the end of the heat-absorbing base 201 away from the heat sink 202 are both provided with a thermally conductive silicone sheet 6, and are connected to the thermally conductive silicone sheet 6 by adhesive. The opposite sides of the two thermally conductive silicone sheets 6 can be close to the surface of the circuit board that needs heat dissipation, thereby improving the speed and efficiency of heat transfer from the hard disk 7 to the radiator 2 and the base.

[0025] A spliced heat sink of this embodiment is provided with a radiator 2 and a base plate 1. The solid-state hard disk 7 can be arranged in the heat dissipation cavity 3. The inner wall of the base plate 1 and the bottom surface of the heat absorption base 201 respectively contact the front and back surfaces of the solid-state hard disk 7. The radiator 2 is connected to the base plate 1 via an elastic clip 5. The clip portion 501 can be engaged with any two opposite dry positioning slots 204. The heat absorption base 201 can be adjusted to different angles to match the direction of the convection channel 203 with the air flow direction in the chassis, thereby expanding the scope of application.

[0026] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A spliced heat sink, comprising a base plate and a radiator, wherein the radiator is arranged above the base plate, characterized in that: A heat dissipation cavity is provided between the base plate and the radiator, and the heat dissipation cavity is used to install a circuit board that needs to dissipate heat. A positioning groove is provided on the surface of the base plate, and an elastic clip is provided in the positioning groove. Both ends of the elastic clip extend to the edge of the radiator and are provided with a snap portion. The radiator includes a heat absorbing base, a heat dissipation element and a convection channel. The bottom surface of the heat absorbing base contacts the heat dissipation cavity, and the heat dissipation element and the convection channel are arranged at an end of the heat absorbing base away from the heat dissipation cavity. The edge of the heat absorbing base is a regular polygon, and the number of sides of the heat absorbing base is greater than four and is an even number. A plurality of positioning slots are provided on the edge of the heat absorbing base, and the number of the positioning slots is consistent with the number of sides of the heat absorbing base. The snap portion can engage with any two opposite positioning slots among the plurality of positioning slots.

2. The spliced heat sink according to claim 1, characterized in that: The two ends of the elastic clip are bent to form a buckle part, which is bent toward the heat dissipation cavity. A pressing part is provided at one end of the buckle part away from the elastic clip, and the bending direction of the pressing part is opposite to that of the buckle part.

3. The spliced heat sink according to claim 1, characterized in that: There are more than three radiators, elastic clamps and positioning grooves, and the numbers of radiators, elastic clamps and positioning grooves are the same. The radiators are evenly arranged above the bottom plate.

4. A spliced heat sink according to any one of claims 1 to 3, characterized in that: The inner wall of the bottom plate and the end of the heat-absorbing base away from the heat sink are both provided with thermally conductive silicone sheets, and are both connected to the thermally conductive silicone sheets through adhesive. The opposite sides of the two thermally conductive silicone sheets can be closely attached to the surface of the circuit board that needs heat dissipation.

5. The spliced heat sink according to any one of claims 1 to 3, characterized in that: The heat sink is a plurality of heat sink blocks, which are evenly and equidistantly arranged. Convection channels are formed between adjacent heat sink blocks, and the convection channels are parallel to each other.

6. The spliced heat sink according to any one of claims 1 to 3, characterized in that: The heat sink is a plurality of heat sink fins, which are evenly and equidistantly arranged. Convection channels are formed between adjacent heat sink fins, and the convection channels are parallel to each other.

7. The spliced heat sink according to any one of claims 1 to 3, characterized in that: The heat absorbing base and the heat dissipating element are integrally formed, and both the heat absorbing base and the heat dissipating element are made of aluminum alloy.

Images