Sound loudspeaker with heat dissipation function

Abstract

The utility model discloses a sound speaker with a heat dissipation function, which comprises a speaker body and a heat dissipation adjusting part, the speaker body is provided with a placing box for storing the speaker body, the speaker body is clamped in the placing box, the speaker body is provided with an installation shell and a voice coil resistor, and the voice coil resistor is clamped in the placing box. The voice coil resistor is located on the installation shell, a heat dissipation piece surrounds the outer wall of the voice coil resistor, heat dissipation channels are formed in the positions, located at the top and the bottom of the voice coil resistor, of the loudspeaker body, the heat dissipation adjusting component is arranged on the loudspeaker body, and the heat dissipation adjusting component is in sliding fit with the loudspeaker body. And the heat dissipation end of the heat dissipation adjusting part is arranged towards the voice coil resistor. According to the utility model, the spacing distance between the heat dissipation fan and the voice coil resistor is adjusted according to the use environment of the loudspeaker body in the use process, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of audio speakers, in particular to an audio speaker with a heat dissipation function. Background Art

[0002] In modern audio systems, the pursuit of high volume and high-quality sound has driven the power of speakers to ever-increasing levels. For example, speakers used in large-scale concerts, outdoor music festivals, and stadium sound reinforcement often reach several kilowatts or even higher. This high power operation means that components like the speaker's voice coil generate significant heat. According to Joule's law (where π is heat, π is current, π is resistance, and π is time), when current is high, the heat generated by the voice coil resistor during operation increases dramatically. Failure to effectively dissipate this heat can severely impact the speaker's performance and lifespan.

[0003] However, the distance between the voice coil resistor that generates heat during the use of the speaker and the heat dissipation mechanism is different and needs to be adjusted according to the use environment, resulting in poor heat dissipation effect. For example, the current use environment requires the speaker to output high power, while some environments require the speaker to output low power. The heat generated by the speaker will also be different. For example, in hot summer or in special environments such as high-temperature workshops, the air heat dissipation capacity decreases. Utility Model Content

[0004] The purpose of the present invention is to provide an audio speaker with a heat dissipation function to solve the problems raised in the above background technology.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] An audio speaker with a heat dissipation function includes a speaker body and a heat dissipation adjustment component. The speaker body is provided with a placement box for storing the speaker body, and the speaker body is engaged in the placement box. The speaker body is provided with a mounting shell and a voice coil resistor. The voice coil resistor is located on the mounting shell. A heat sink is surrounded by an outer wall of the voice coil resistor. The speaker body is provided with heat dissipation channels at the top and bottom of the voice coil resistor. The heat dissipation adjustment component is arranged on the speaker body, and the heat dissipation adjustment component and the speaker body are slidably matched. The heat dissipation end of the heat dissipation adjustment component is arranged toward the voice coil resistor.

[0007] According to a further technical solution, the heat dissipation adjustment component includes a mounting plate, a heat dissipation mounting pipe and a heat dissipation fan. The heat dissipation mounting pipe is horizontally arranged on the mounting plate, and the heat dissipation mounting pipe is slidably fitted with the mounting shell. The heat dissipation fan is located at the end position of the heat dissipation mounting pipe.

[0008] According to a further technical solution, the heat dissipation adjustment component also includes two adjusting parts, which are respectively arranged between the mounting plate and the mounting shell. The adjusting parts include a horizontal screw rod horizontally arranged on the mounting shell, and the horizontal screw rod is provided with a bolt rod threadedly connected to it. The bolt rod is provided with a rotating rod, and the rotating rod is rotatably connected to the mounting plate.

[0009] According to a further technical solution, the heat dissipation channel is provided with a plurality of equally spaced hexagonal honeycomb structures, and the hexagonal honeycomb structures are provided with a graphite coating.

[0010] According to a further technical solution, the heat sink is a ring-shaped heat dissipation fin group arranged around the outer wall of the voice coil resistor.

[0011] According to a further technical solution, a mounting channel is provided inside the placement box, a detachable mounting cover is provided at the rear of the placement box, and a plurality of heat dissipation holes are provided on the mounting cover.

[0012] Beneficial effects of the utility model:

[0013] The utility model can rotate the two bolt rods separately in different usage environments. The rotation of the bolt rods will drive the rotating rod to rotate on the mounting plate, so that the bolt rods can rotate on the horizontal screw rod, so that the heat dissipation mounting pipe on the mounting plate is moved from the mounting shell. The position movement of the heat dissipation mounting pipe can drive the position of the heat dissipation fan to move, thereby changing the spacing distance between the heat dissipation fan and the voice coil resistor. The different spacing distances of the heat dissipation fan can be adjusted in different usage environments. Under high-power output conditions, hot summer conditions, or high-temperature workshops, the spacing distance between the heat dissipation fan and the voice coil resistor is reduced. Under low-power output conditions and indoor conditions of normal temperature, the spacing distance between the heat dissipation fan and the voice coil resistor is increased.

[0014] When the voice coil resistor generates heat during operation, the annular heat sink assembly quickly absorbs and conducts the heat away. Copper's excellent electrical conductivity also helps reduce the heating of the voice coil resistor, thus reducing heat generation at the source.

[0015] Other features and advantages of the present invention will be described in detail in the subsequent detailed description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 : Schematic diagram of the three-dimensional structure of the speaker body installed in the placement box in the utility model Figure 1 .

[0017] Figure 2 : Schematic diagram of the three-dimensional structure of the speaker body installed in the placement box in the utility model Figure 2 .

[0018] Figure 3 : A three-dimensional structural diagram of the present invention.

[0019] Figure 4 : A schematic diagram of the local three-dimensional structure of the present invention.

[0020] Figure 5 : A schematic diagram of the three-dimensional structure of the heat dissipation adjustment component of the present invention.

[0021] Figure 6 : Schematic diagram of the three-dimensional structure of the annular heat dissipation fin group of the present invention.

[0022] Figure 7 : Schematic diagram of the three-dimensional structure of the heat dissipation channel of the utility model.

[0023] Figure numerals: speaker body 1, mounting shell 10, voice coil resistor 11, heat dissipation adjustment component 2, mounting plate 21, heat dissipation mounting pipe 22, heat dissipation fan 23, horizontal screw 24, bolt rod 25, rotating rod 26, heat dissipation part 3, annular heat dissipation fin group 31, heat dissipation channel 4, placement box 5, mounting cover 51, heat dissipation hole 52. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0025] Please refer to Figure 1-7 As shown; the utility model provides a technical solution for an audio speaker with a heat dissipation function: an audio speaker with a heat dissipation function, comprising a speaker body 1 and a heat dissipation adjustment component 2, the speaker body 1 is provided with a placement box 5 for storing the speaker body 1, the speaker body 1 is engaged in the placement box 5, the speaker body 1 is provided with a mounting shell 10 and a voice coil resistor 11, the voice coil resistor 11 is located on the mounting shell 10, the outer wall of the voice coil resistor 11 is surrounded by a heat dissipation member 3, the speaker body 1 is provided with a heat dissipation channel 4 at the top and bottom positions of the voice coil resistor 11, the heat dissipation adjustment component 2 is arranged on the speaker body 1, the heat dissipation adjustment component 2 is slidably fitted with the speaker body 1, and the heat dissipation end of the heat dissipation adjustment component 2 is arranged toward the voice coil resistor 11.

[0026] The voice coil resistor 11 generates heat when it is working. The heat generated can be quickly discharged and conducted outward through the surrounding heat sink 3. The heat is quickly discharged outward through the operation of the heat dissipation fan 23 on the heat dissipation adjustment component 2. During use, the distance between the heat dissipation fan 23 and the voice coil resistor 11 is adjusted according to the environment in which the speaker body 1 is used to improve the heat dissipation efficiency.

[0027] In this embodiment, referring to Figure 4 and Figure 5 As shown, the heat dissipation adjustment component 2 includes a mounting plate 21, a heat dissipation mounting pipe 22 and a heat dissipation fan 23. The heat dissipation mounting pipe 22 is horizontally arranged on the mounting plate 21, and the heat dissipation mounting pipe 22 is slidably fitted with the mounting shell 10. The heat dissipation fan 23 is located at the end position of the heat dissipation mounting pipe 22; the heat dissipation adjustment component 2 also includes two adjusting members, and the two adjusting members are respectively arranged between the mounting plate 21 and the mounting shell 10. The adjusting member includes a horizontal screw rod 24 horizontally arranged on the mounting shell 10, and the horizontal screw rod 24 is provided with a bolt rod 25 threadedly connected thereto, and the bolt rod 25 is provided with a rotating rod 26, and the rotating rod 26 is rotatably connected to the mounting plate 21.

[0028] Under different usage environments, the two bolt rods 25 can be rotated separately. The rotation of the bolt rod 25 will drive the rotating rod 26 to rotate on the mounting plate 21, so that the bolt rod 25 can rotate on the horizontal screw rod 24, so that the heat dissipation mounting pipe 22 on the mounting plate 21 is moved from the mounting shell 10. The position movement of the heat dissipation mounting pipe 22 can drive the position of the heat dissipation fan 23 to move, thereby changing the distance between the heat dissipation fan 23 and the voice coil resistor 11. The different distances of the heat dissipation fan 23 can be adjusted under different usage environments. In the case of high power output and in hot summer or in a high-temperature workshop, the distance between the heat dissipation fan 23 and the voice coil resistor 11 is reduced. In the case of low power output and indoor use at normal temperature, the distance between the heat dissipation fan 23 and the voice coil resistor 11 is increased.

[0029] When the cooling fan 23 is positioned appropriately from the voice coil resistor 11, the airflow can be directed more precisely to the heat source. When the cooling fan 23 is properly positioned, the airflow can effectively and directly remove the heat from the voice coil resistor 11. If the distance is too far, the airflow speed and volume may be reduced upon reaching the voice coil resistor 11, significantly reducing the cooling effect. If the distance is too close, it may interfere with the speaker's acoustic structure or cause unnecessary vibration. The appropriate distance ensures optimal cooling.

[0030] While meeting heat dissipation requirements, properly adjusting the heat dissipation distance between the cooling fan 23 and the voice coil resistor 11 can prevent excessive airflow. This eliminates the need for the cooling fan 23 to operate at excessively high speeds to achieve effective heat dissipation, thereby reducing its energy consumption. For example, when the cooling fan 23 is at an appropriate distance, it can operate at a lower power level to promptly dissipate heat generated by the speaker, reducing power waste.

[0031] In this embodiment, referring to Figure 7 As shown, the heat dissipation channel 4 is arranged as a plurality of equally spaced hexagonal honeycomb structures, and the hexagonal honeycomb structures are coated with graphite.

[0032] Heat dissipation channels 4 quickly dissipate and absorb dissipated heat. Graphite has excellent thermal conductivity, with a thermal conductivity along the layer direction reaching up to 1950 W / (m·K). In speakers, graphite can be present as a thin film or coating to absorb and conduct heat. Graphite's high thermal conductivity stems from its unique layered structure, which allows it to quickly transfer heat.

[0033] In this embodiment, referring to Figure 6 As shown, the heat sink 3 comprises an annular heat sink fin assembly 31 disposed around the outer wall of the voice coil resistor 11. Made of copper, the annular heat sink fin assembly 31 quickly absorbs and conducts away heat generated by the voice coil resistor 11. Copper's excellent electrical conductivity also helps reduce heat generation from the voice coil resistor 11, thus reducing heat generation at its source.

[0034] In this embodiment, referring to Figure 2 As shown, the interior of the placement box 5 is provided with a mounting channel, and the rear portion of the placement box 5 is provided with a detachable mounting cover 51, and the mounting cover 51 is provided with a plurality of heat dissipation holes 52; during use, the mounting cover 51 is removed from the placement box 5, and the mounting plate 21 can be moved in the mounting channel to change the distance between the cooling fan 23 and the voice coil resistor 11, thereby adjusting different distance positions under different environments, and the heat dissipation holes 52 can discharge heat outward from the placement box 5.

[0035] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An audio speaker with heat dissipation function, characterized by: It comprises a speaker body (1) and a heat dissipation adjustment component (2); The speaker body (1) is provided with a placement box (5) for storing the speaker body (1), and the speaker body (1) is engaged in the placement box (5); The speaker body (1) is provided with a mounting shell (10) and a voice coil resistor (11), the voice coil resistor (11) is located on the mounting shell (10), and a heat sink (3) surrounds the outer wall of the voice coil resistor (11); The speaker body (1) is provided with heat dissipation channels (4) at the top and bottom of the voice coil resistor (11); The heat dissipation adjustment component (2) is arranged on the speaker body (1), the heat dissipation adjustment component (2) and the speaker body (1) are slidably matched, and the heat dissipation end of the heat dissipation adjustment component (2) is arranged toward the voice coil resistor (11).

2. The audio speaker with heat dissipation function according to claim 1, characterized in that: The heat dissipation adjustment component (2) comprises a mounting plate (21), a heat dissipation mounting pipe (22) and a heat dissipation fan (23); the heat dissipation mounting pipe (22) is horizontally arranged on the mounting plate (21), and the heat dissipation mounting pipe (22) is slidably fitted with the mounting housing (10); and the heat dissipation fan (23) is located at the end of the heat dissipation mounting pipe (22).

3. The audio speaker with heat dissipation function according to claim 2, characterized in that: The heat dissipation adjustment component (2) further includes two adjustment members, and the two adjustment members are respectively arranged between the mounting plate (21) and the mounting housing (10); The adjusting member comprises a horizontal screw rod (24) horizontally arranged on the mounting housing (10); a bolt rod (25) threadedly connected to the horizontal screw rod (24); a rotating rod (26) being provided on the bolt rod (25); and the rotating rod (26) being rotatably connected to the mounting plate (21).

4. The audio speaker with heat dissipation function according to claim 1, characterized in that: The heat dissipation channels (4) are arranged in a plurality of equally spaced hexagonal honeycomb structures, and a graphite coating is provided on the hexagonal honeycomb structures.

5. The audio speaker with heat dissipation function according to claim 1, characterized in that: The heat sink (3) is an annular heat dissipation fin group (31) arranged around the outer wall of the voice coil resistor (11).

6. The audio speaker with heat dissipation function according to claim 1, characterized in that: The interior of the placement box (5) is provided with a mounting channel, the rear portion of the placement box (5) is provided with a detachable mounting cover (51), and the mounting cover (51) is provided with a plurality of heat dissipation holes (52).

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