Adsorption device and PCB processing equipment

Abstract

The utility model relates to an adsorption device and PCB processing equipment. The adsorption device comprises a bearing plate and an adsorption platform, wherein the bearing plate is provided with a first surface and a second surface which are oppositely arranged; a plurality of adsorption holes are formed in the bearing plate and penetrate from the first surface to the second surface; the adsorption platform comprises a bottom plate and a side plate arranged around the periphery of the bottom plate; one end, far away from the bottom plate, of the side plate is connected with the second surface; an adsorption cavity is defined by the bottom plate, the side plates and the bearing plate, and the adsorption cavity communicates with the adsorption holes; the adsorption holes are provided with first ends located on the first face and second ends located on the second face, and the inner diameter of the second ends is larger than that of the first ends. According to the adsorption device and the PCB processing equipment provided by the invention, the adsorption effect of the adsorption device can be improved, so that the reliability of fixing the PCB is improved and simplified, and the processing precision and the processing efficiency of the PCB are improved.

Description

Technical Field

[0001] The present application relates to the technical field of plate processing, and in particular to an adsorption device and PCB board processing equipment. Background Art

[0002] PCB (Printed Circuit Board) is an essential component in electronic devices. When a machine tool processes a PCB, the PCB needs to be positioned and fixed to ensure normal processing.

[0003] Typically, pins are placed on the processing table, and mounting holes are reserved on the PCB board. The pins and mounting holes cooperate to secure the PCB board to the processing table, ensuring the board is fixed in place during processing. However, if the PCB board is large, multiple mounting holes must be machined on the PCB board to secure it. Furthermore, the processing table must also be equipped with corresponding pin holes according to the number of mounting holes on the PCB board. This method of securing the PCB board is cumbersome and inconvenient to manufacture. Furthermore, with the increasing market demand for PCB boards with blind gong functions, the difficulty of positioning and securing the PCB board has further increased.

[0004] In the related art, the use of an adsorption device to adsorb and fix the PCB board can overcome the problems of the pin fixing method. However, the existing adsorption device has problems such as poor adsorption effect, which affects the reliability of the PCB board fixation during the processing, thereby affecting the processing accuracy and efficiency of the PCB board. Utility Model Content

[0005] Based on this, it is necessary to provide an adsorption device and a PCB board processing equipment, aiming to improve the adsorption effect of the adsorption device, thereby improving the reliability of PCB board fixation, and further improving the processing accuracy and processing efficiency of the PCB board.

[0006] An embodiment of the first aspect of the present application provides an adsorption device, which includes a supporting plate and an adsorption platform, the supporting plate having a first surface and a second surface arranged opposite to each other; a plurality of adsorption holes are provided on the supporting plate, and the adsorption holes extend from the first surface to the second surface; the adsorption platform includes a bottom plate and a side plate arranged around the periphery of the bottom plate, and the end of the side plate away from the bottom plate is connected to the second surface; the bottom plate, the side plate and the supporting plate are arranged to form an adsorption cavity, and the adsorption cavity is connected to the adsorption hole; the adsorption hole has a first end located on the first surface and a second end located on the second surface, and the inner diameter of the second end is larger than the inner diameter of the first end.

[0007] The adsorption device provided in the embodiment of the present application can reduce the probability of external dust and other impurities entering the adsorption hole through the first end by making the inner diameter of the second end of the adsorption hole larger than the inner diameter of the first end, that is, the inner diameter of the first end of the adsorption hole exposed to the external environment is smaller, thereby reducing the probability of the adsorption hole being blocked, ensuring the adsorption effect of the adsorption device, and further improving the reliability of the PCB board fixation, thereby improving the processing accuracy and processing efficiency of the PCB board. In addition, the adsorption device replaces the pins to fix the PCB board through the adsorption effect of the adsorption cavity and the adsorption hole, which can simplify the fixing method of the PCB board, and can simply and conveniently fix and replace the PCB board during the processing process, thereby improving the processing efficiency of the PCB board. Multiple adsorption holes can make the PCB board fit tightly on the first surface of the carrier plate, which can reduce the probability of processing errors caused by non-fitting in some areas of the PCB board during processing, thereby improving the processing accuracy of the PCB board.

[0008] In some embodiments, the adsorption chamber includes a plurality of sub-adsorption chambers arranged at intervals, and a plurality of independent air flow channels are provided on the side plate, and any of the sub-adsorption chambers is connected to at least one of the air flow channels.

[0009] In some embodiments, the adsorption platform further includes a partition disposed in the adsorption chamber at intervals, wherein one end of the partition is connected to the supporting plate and the other end is connected to the bottom plate to divide the adsorption chamber into at least two sub-adsorption chambers.

[0010] In some embodiments, the separator includes a first separator, a second separator, and a third separator, all of which are connected to the supporting plate and the bottom plate. The first separator is located in the middle of the bottom plate and is arranged to form a first sub-adsorption chamber. The second separator is arranged around the first separator and is arranged to form a second sub-adsorption chamber. The third separator is arranged around the second separator and is arranged to form a third sub-adsorption chamber.

[0011] In some embodiments, the separator includes a fourth separator and a fifth separator disposed in the adsorption chamber. The fourth separator and the fifth separator are cross- or spaced apart and divide the adsorption chamber into at least two sub-adsorption chambers.

[0012] In some embodiments, a detection air channel is provided on the side panel, and at least one of the sub-adsorption chambers is connected to the detection air channel.

[0013] In some embodiments, the adsorption device further includes a first sealing member, and the first sealing member is provided at one end of the partition facing away from the bottom plate.

[0014] In some embodiments, the adsorption device also includes a lifting plate, which is arranged on the side of the adsorption platform away from the supporting plate, and the lifting plate can move in the direction close to or away from the adsorption platform. A plurality of lifting rods are provided on the side of the lifting plate close to the adsorption platform; a plurality of first through holes corresponding to the positions of the lifting rods are provided on the bottom plate, and a plurality of second through holes corresponding to the positions of the lifting rods are provided on the supporting plate, and the lifting rods are passed through the first through holes and the second through holes.

[0015] In some embodiments, a plurality of second sealing members are disposed between the bottom plate and the supporting plate, and the second sealing members are disposed around the periphery of the first through hole.

[0016] In some embodiments, the adsorption device also includes a bracket, which is arranged on the side of the top plate facing away from the bottom plate, and a plurality of bosses are provided on the side of the bracket close to the top plate, and a plurality of third through holes corresponding to the positions of the bosses are provided on the top plate, and the bosses are connected to the bottom plate through the third through holes.

[0017] In some embodiments, the bracket is provided with a receiving groove at one end close to the supporting plate, and the multiple bosses are arranged at intervals in the receiving groove; the ejecting plate is located in the receiving groove, and a fourth through hole is provided on the ejecting plate; the adsorption device also includes multiple ejecting guide shafts, which are installed on the bracket and passed through the fourth through hole.

[0018] In some embodiments, the boss is connected to the adsorption platform via a fastener; a third sealing member is provided between the boss and the base plate, and the third sealing member is provided around the periphery of the fastener.

[0019] In some embodiments, the adsorption device further includes a valve assembly, which includes a manual sliding valve and an interruption valve. One end of the manual sliding valve is connected to the side plate and communicates with the air flow channel, and the other end is connected to the interruption valve.

[0020] In a second aspect, embodiments of the present application provide PCB processing equipment, including a processing assembly and the suction device of any of the aforementioned embodiments. The processing assembly is configured to process a PCB secured to the suction device. This improves the reliability of PCB securement during processing, and enhances the processing accuracy and efficiency of the PCB processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of an adsorption device in one embodiment of the present application;

[0022] Figure 2This is a schematic structural diagram of a carrier plate in one embodiment of the present application;

[0023] Figure 3 is a schematic cross-sectional structural diagram of a carrier plate in one embodiment of the present application;

[0024] Figure 4 for Figure 3 Enlarged view of middle area A;

[0025] Figure 5 Schematic diagram of the structure of the adsorption platform in one embodiment of the present application;

[0026] Figure 6 Schematic diagram of a partial cross-sectional structure of an adsorption platform in one embodiment of the present application;

[0027] Figure 7 This is a schematic structural diagram of a bracket in one embodiment of the present application;

[0028] Figure 8 Schematic diagram of the structure of an adsorption device in one embodiment of the present application;

[0029] Figure 9 This is a schematic structural diagram of an adsorption device in another embodiment of the present application;

[0030] Figure 10 Schematic diagram of the structure of the speed regulating assembly in one embodiment of the present application;

[0031] Figure 11 This is a structural diagram of a manual sliding valve in one embodiment of the present application;

[0032] Figure 12 This is a schematic structural diagram of an interruption valve in one embodiment of the present application;

[0033] Figure 13 This is a schematic structural diagram of a pipe joint in an embodiment of the present application;

[0034] Figure 1: Adsorption device 10, supporting plate 1, first surface 101, second surface 102, adsorption hole 11, first end 111, second end 112, second through hole 12, adsorption platform 2, bottom plate 21, side plate 22, air flow channel 23, detection air channel 24, first through hole 25, support platform 26, adsorption chamber 3, sub-adsorption chamber 31, first sub-adsorption chamber 311, second sub-adsorption chamber 312, third sub-adsorption chamber 313, partition 300, first partition 301, second partition 30 2. Third partition -303, ejector plate -4, ejector rod -41, third through hole -42, ejector guide shaft -43, fourth through hole -44, drive assembly -45, speed control assembly -46, bracket -5, boss -51, connecting hole -52, valve assembly -6, manual sliding valve -61, interruption valve -62, pipe joint -63, first seal -71, first sealing groove -72, second seal -73, third seal -74, fourth seal -751, second sealing groove -752, linear drive -81, slider -82, tool magazine assembly -9. DETAILED DESCRIPTION

[0035] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0037] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, when a layer is referred to as being "under" another layer, it can be directly under or one or more intervening elements may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening elements may also be present.

[0038] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0039] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.

[0040] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately," "approximately," or "substantially" can mean within one or more standard deviations, and is not limited here.

[0041] Furthermore, in the specification, the phrase “planar distribution diagram” refers to a drawing when the target portion is viewed from above, and the phrase “cross-sectional diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0042] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0043] PCB (Printed Circuit Board) is an essential component in electronic devices. When a machine tool processes a PCB, the PCB needs to be positioned and fixed to ensure normal processing.

[0044] Typically, pins are placed on the processing table, and mounting holes are reserved on the PCB board. The pins and mounting holes cooperate to secure the PCB board to the processing table, ensuring the board is fixed in place during processing. However, if the PCB board is large, multiple mounting holes must be machined on the PCB board to secure it. Furthermore, the processing table must also be equipped with corresponding pin holes according to the number of mounting holes on the PCB board. This method of securing the PCB board is cumbersome and inconvenient to manufacture. Furthermore, with the increasing market demand for PCB boards with blind gong functions, the difficulty of positioning and securing the PCB board has further increased.

[0045] In the related art, the use of an adsorption device to adsorb and fix the PCB board can overcome the problems of the pin fixing method. However, the adsorption device has problems such as poor adsorption effect, which affects the reliability of the PCB board fixation during the processing, thereby affecting the processing accuracy and efficiency of the PCB board.

[0046] Based on the above problems, the present application provides an adsorption device and a PCB board processing equipment to improve the adsorption effect of the adsorption device, thereby improving the reliability of PCB board fixation, and further improving the processing accuracy and processing efficiency of the PCB board.

[0047] The embodiment of the first aspect of the present application provides an adsorption device 10, such as Figures 1 to 5 As shown, the adsorption device 10 includes a carrier plate 1 and an adsorption platform 2, the carrier plate 1 has a first surface 101 and a second surface 102 arranged opposite to each other; a plurality of adsorption holes 11 are provided on the carrier plate 1, and the adsorption holes 11 extend from the first surface 101 to the second surface 102; the adsorption platform 2 includes a bottom plate 21 and a side plate 22 arranged around the periphery of the bottom plate 21, and the end of the side plate 22 away from the bottom plate 21 is connected to the second surface 102; the bottom plate 21, the side plate 22 and the carrier plate 1 are surrounded to form an adsorption chamber 3, and the adsorption chamber 3 is connected to the adsorption holes 11; Figure 4 As shown, the adsorption hole 11 has a first end 111 located on the first surface 101 and a second end 112 located on the second surface 102 , and an inner diameter D2 of the second end 112 is greater than an inner diameter D1 of the first end 111 ;

[0048] In the embodiment of this application, Figure 1 As shown, the adsorption device 10 replaces pins to secure the PCB board through the adsorption effect of the adsorption chamber 3 and the adsorption holes 11. Specifically, the adsorption chamber 3 is connected to the adsorption holes 11. When the adsorption chamber 3 is evacuated to generate negative pressure, the adsorption holes 11 can generate adsorption force to firmly hold the PCB board. When processing is completed, the vacuum operation is stopped and the PCB board can be removed. This simplifies the fixing method of the PCB board, making it simple and convenient to fix and replace the PCB board during the processing process, thereby improving the processing efficiency of the PCB board. The multiple adsorption holes 11 can ensure that the PCB board is tightly attached to the first surface 101 of the carrier plate 1, reducing the probability of processing errors caused by misalignment in some areas of the PCB board during processing, thereby improving the processing accuracy of the PCB board.

[0049] In the embodiment of this application, Figure 4As shown, the inner diameter D2 of the second end 112 of the adsorption hole 11 is larger than the inner diameter D1 of the first end 111, that is, the inner diameter D1 of the first end 111 of the adsorption hole 11 exposed to the external environment is smaller, which can reduce the probability of external dust and other impurities entering the adsorption hole 11 through the first end 111, thereby reducing the probability of clogging of the adsorption hole 11, ensuring the adsorption effect of the adsorption device 10, and further improving the reliability of PCB board fixation, thereby improving the processing accuracy and processing efficiency of the PCB board.

[0050] In some specific examples, such as Figure 2 As shown, the carrier plate 1 is used to support the PCB board. The carrier plate 1 can be a rectangular plate, or a circular plate, a polygonal plate, or other irregular-shaped plate. The material of the carrier plate 1 includes but is not limited to metal, rubber, and silicone. The metal carrier plate 1 has excellent properties such as good rigidity, high hardness, strong wear resistance, and high stability. During the PCB board processing process, the PCB board can be better positioned and the processing accuracy of the PCB board can be improved. The rubber or silicone carrier plate 1 can undergo slight deformation during use, so that the PCB board can better fit with the carrier plate 1, reducing the processing error of the PCB board. The shape, size, and material of the carrier plate 1 can be set according to actual needs and are not limited in this application.

[0051] In some specific examples, such as Figure 3 As shown, the adsorption holes 11 can be circular holes, in which case the axes of the adsorption holes 11 are arranged perpendicular to the first surface 101. Multiple adsorption holes 11 can be evenly distributed on the carrier board 1, so that each area of the PCB on the carrier board 1 is subjected to the same adsorption force, allowing each area of the PCB to fit tightly against the carrier board 1. This can improve the connection stability between the PCB and the carrier board 1 and reduce the probability of gaps between the PCB and the carrier board 1 due to uneven adsorption force. This can reduce the probability of machining errors during the PCB processing and improve the machining accuracy of the PCB.

[0052] In some specific examples, the adsorption platform 2 and the carrier plate 1 can be connected by threaded fasteners. Multiple threaded holes corresponding to each other can be provided on the periphery of the carrier plate 1 and the adsorption platform 2, and the threaded fasteners are inserted through the threaded holes at the same position to connect the carrier plate 1 and the adsorption platform 2. The adsorption platform 2 and the carrier plate 1 can also be connected by gluing, snapping, or integral molding, etc., which can be configured according to actual needs and is not limited in this application.

[0053] In some embodiments, as Figure 5 and Figure 6As shown, a plurality of support platforms 26 are provided on the surface of one side of the bottom plate 21 close to the carrier plate 1. The plurality of support platforms 26 can be evenly and spaced apart on the bottom plate 21. The support platforms 26 are used to support the carrier plate 1, reduce the probability of the adsorption platform 2 being concave and deformed during the formation of negative pressure in the adsorption chamber 3, and improve the reliability of the adsorption platform 2 and the carrier plate 1. The support platforms 26 are provided in the adsorption chamber 3, and can also reduce the cavity volume of the adsorption chamber 3. They cooperate with the bottom plate 21 and the carrier plate 1 to form multiple adsorption flow channels in the adsorption chamber 3, making it easier to form negative pressure in the adsorption chamber 3 during the vacuuming process, thereby enhancing the adsorption force of the adsorption chamber 3 and improving the fixation stability of the PCB board.

[0054] In some specific examples, the support platform 26 may be made of rubber or silicone, or the same material as the adsorption platform 2. The support platform 26 and the adsorption platform 2 may be integrally formed to improve the connection stability between the support platform 26 and the adsorption platform 2.

[0055] In some embodiments, as Figure 5 and Figure 6 As shown, the adsorption chamber 3 includes a plurality of spaced-apart sub-adsorption chambers 31. A plurality of independent airflow channels 23 are provided on the side plate 22. Each sub-adsorption chamber 31 is connected to at least one airflow channel 23. The airflow channel 23 can be connected to an exhaust member (not shown), which includes a vacuum pump.

[0056] Thus, the adsorption platform 2 can be divided into multiple areas, each of which can be independently controlled, and the PCB board can be fixed more precisely. When the size of the PCB board is small, the adsorption device 10 can even adsorb multiple PCB boards at the same time, and the adsorption force applied to different PCB boards can be different, which can improve the adsorption effect of the adsorption device 10 on the PCB board and improve the processing efficiency of the PCB board. In addition, in the present application, the air flow channel 23 connected to the adsorption chamber 3 is set on the side plate 22, that is, the air flow channel is integrated on the adsorption platform, and the exhaust part can be directly connected to the air flow channel and exposed outside the adsorption chamber 31, thereby simplifying the internal structure of the adsorption device 10, reducing the use of parts, facilitating the installation and maintenance of the adsorption device, and reducing the probability of air leakage in the adsorption device.

[0057] It is understood that the adsorption chamber 3 may include two sub-adsorption chambers 31, or may include three or four sub-adsorption chambers 31. The multiple sub-adsorption chambers 31 may be arranged in an enclosed manner from the inside out, or may be arranged in parallel. The sub-adsorption chambers 31 may be rectangular, circular, elliptical, square ring, annular, L-shaped, T-shaped, etc. The number, location, shape, and size of the sub-adsorption chambers 31 can be set according to actual needs, for example, according to the size and shape of the PCB board to be processed, and this application does not limit this.

[0058] In some embodiments, as Figure 5and Figure 6 As shown, multiple air flow channels 23 are arranged on the same side panel 22, and the extension directions of the multiple air flow channels 23 are parallel to each other, so that the multiple air flow channels 23 can be simply and conveniently arranged on the adsorption platform 2, which is convenient for centralized control and maintenance of the gas flow channels 23, can simplify the structure of the adsorption device 10, and improve the installation efficiency and maintenance efficiency of the adsorption device 10.

[0059] In some embodiments, as Figure 5 and Figure 6 As shown, the adsorption platform 2 further includes a partition 300 spaced apart in the adsorption chamber 3 , one end of the partition 300 is connected to the supporting plate 1 , and the other end is connected to the bottom plate 21 to divide the adsorption chamber 3 into at least two sub-adsorption chambers 31 .

[0060] Thus, the adsorption chamber 3 in the adsorption platform 2 can be conveniently divided into at least two sub-adsorption chambers 31, thereby conveniently improving the adsorption effect of the adsorption device 10 on the PCB board, and further facilitating the improvement of the processing accuracy and efficiency of the PCB board.

[0061] In some embodiments, the partitions 300 are all connected to the first partition 301, the second partition 302 and the third partition 303 of the supporting plate 1 and the bottom plate 21. The first partition 301 is located in the middle of the bottom plate 21 and is surrounded to form a first sub-adsorption chamber 311; the second partition 302 is arranged around the first partition 301 and is surrounded to form a second sub-adsorption chamber 312; the third partition 303 is arranged around the second partition 302 and is surrounded to form a third sub-adsorption chamber 313.

[0062] Therefore, when fixing the PCB board, the first sub-adsorption chamber 311, the second sub-adsorption chamber 312 and / or the third sub-adsorption chamber 313 can be used to adsorb and fix the PCB board according to the area size of the PCB board. Moreover, since the second partition 302 is arranged around the first partition 301 and encloses the second sub-adsorption chamber 312; the third partition 303 is arranged around the second partition 302 and encloses the third sub-adsorption chamber 313, the second sub-adsorption chamber 312 and the third sub-adsorption chamber 313 are both annular. In this way, the second sub-adsorption chamber 312 and the third sub-adsorption chamber 313 can both adsorb and fix the PCB board at all circumferential locations, thereby effectively improving the adsorption effect of the adsorption device and improving the reliability of PCB board fixation.

[0063] In some embodiments, the separator 300 includes a fourth separator (not shown) and a fifth separator (not shown) disposed in the adsorption chamber 3 . The fourth separator and the fifth separator are cross- or spaced apart and separate the adsorption chamber 3 into at least two sub-adsorption chambers 31 .

[0064] This allows the adsorption chamber within the adsorption platform to be divided into multiple zones, allowing for more precise positioning of the PCBs. When the PCBs are small, the adsorption device 10 can even simultaneously adsorb multiple PCBs, thereby enhancing the adsorption effect of the adsorption device 10 on the PCBs and improving PCB processing efficiency.

[0065] In some embodiments, as Figure 6 As shown, a detection air channel 24 is provided on the side panel, and at least one sub-adsorption chamber 31 is connected to the detection air channel 24 .

[0066] Therefore, the air pressure in at least one sub-adsorption chamber 31 located in the adsorption platform 2 can be detected through the detection air channel 24, so that the staff can judge the fixing condition of the PCB board based on the detected air pressure, so that the staff can respond in time when a sub-adsorption chamber 31 has an air leak, thereby improving the working reliability of the adsorption device 10.

[0067] In a specific example, the detection air channel 24 can be connected to a detection device, so as to facilitate the detection of the air pressure in the sub-adsorption chamber 31 and improve the reliability of the adsorption device.

[0068] In some embodiments, as Figure 6 As shown, a plurality of detection air channels are provided on the side panel 22, and the plurality of detection air channels are connected to the plurality of sub-adsorption chambers 31 in a one-to-one correspondence, so that the staff can detect the air pressure in each sub-adsorption chamber 31 and judge the fixing condition of the PCB board according to the detected air pressure, so that if a certain sub-adsorption chamber 31 has an air leakage, the staff can respond in time, thereby further improving the working reliability of the adsorption device 10.

[0069] In some embodiments, the adsorption device further includes a first sealing member 71 , and the first sealing member 71 is provided on one end of the partition 300 facing away from the bottom plate 21 .

[0070] Therefore, the adjacent sub-adsorption chambers 31 can be separated by the first sealing member 71, and the sealing of the sub-adsorption chamber 31 can be achieved, thereby preventing air leakage in a certain sub-adsorption chamber 31 or gas leakage between adjacent sub-adsorption chambers 31, ensuring that the adsorption force in the sub-adsorption chamber 31 is constant, and improving the adsorption effect of the sub-adsorption chamber 31.

[0071] Specifically, the first, second, and third separators 301, 302, and 303 are each provided with a first seal 71 on the side facing away from the base plate 21. Each of these first seals 71 is an annular seal. The fourth and fifth separators are also provided with a first seal 71 on the side facing away from the base plate 21. The first seal 71 can be a strip-shaped seal. Of course, the shape of the first seal 71 is not limited to this and can be configured based on the distribution of the sub-adsorption chambers 31. Materials for the first seal 71 include, but are not limited to, rubber or silicone.

[0072] In some embodiments, as Figure 5 and Figure 6 As shown, a first sealing groove 72 is provided on the partition 300 and / or the supporting plate 1, and the first sealing member 71 is provided in the first sealing groove 72, thereby limiting and fixing the first sealing member 71 to prevent the first sealing member 71 from moving during the processing, thereby improving the reliability of the adsorption device 10.

[0073] In some embodiments, as Figure 1 As shown, the adsorption device 10 further includes a fourth sealing member 751, which is disposed between the side plate 22 and the supporting plate 1, and is used to ensure the sealing of the adsorption chamber 3 and the adsorption effect of the adsorption device 10. Figure 5 and Figure 6 As shown, a second sealing groove 752 is provided on the side plate 22 , and the second sealing groove 752 is used for installing and fixing the fourth sealing member 751 .

[0074] In some embodiments, as Figure 1 As shown, the adsorption device 10 also includes a ejection plate 4, which is arranged on the side of the adsorption platform 2 away from the supporting plate 1. The ejection plate 4 can move in the direction close to or away from the adsorption platform 2, and a plurality of ejection rods 41 are provided on the side of the ejection plate 4 close to the adsorption platform 2; a plurality of first through holes 25 corresponding to the positions of the ejection rods 41 are provided on the bottom plate 21, and a plurality of second through holes 12 corresponding to the positions of the ejection rods 41 are provided on the supporting plate 1, and the ejection rods 41 are passed through the first through holes 25 and the second through holes 12.

[0075] Therefore, if Figure 1 As shown, before the adsorption device 10 adsorbs the PCB, the ejector plate 4 first moves away from the adsorption platform 2 until it fully extends into the second through-hole 12. This prevents the ejector pin 41 from obstructing the adsorption of the PCB, allowing the PCB to fit tightly against the carrier plate 1 and improving the processing accuracy of the PCB. After the PCB is processed, the ejector plate 4 can be controlled to move toward the adsorption platform 2. The ejector pin 41 on the ejector plate 4 passes through the first through-hole 25 and the second through-hole 12 and can partially extend out of the carrier plate 1 to abut against the PCB on the carrier plate 1, thereby lifting the PCB and automatically detaching the PCB from the carrier plate 1, facilitating its removal and removal.

[0076] In addition, the ejector pin 41 has a certain positioning effect on the adsorption platform 2 and the carrier plate 1, which can simply and conveniently assist the adsorption platform 2 and the carrier plate 1 to achieve initial alignment, thereby improving the assembly efficiency of the adsorption device 10. Correspondingly, the first through hole 25 and the second through hole 12 not only provide movement space for the ejector pin 41, but also play a certain role in limiting and guiding the ejector pin 41, limiting the movement direction of the ejector plate 4, and thus improving the movement stability of the ejector plate 4 and the ejection effect.

[0077] In some embodiments, as Figure 1 As shown, a second sealing member 73 is provided between the bottom plate 21 and the carrying plate 1 , and the second sealing member 73 is provided at the periphery of the first through hole 25 .

[0078] In this way, the probability of the airflow in the adsorption chamber 3 escaping from the first through hole 25 and the second through hole 12 can be avoided, thereby ensuring the sealing of the adsorption chamber 3.

[0079] In some embodiments, as Figure 1 and Figure 7 As shown, the adsorption device 10 also includes a bracket 5, which is arranged on the side of the top plate 4 facing away from the bottom plate 21. A plurality of bosses 51 are provided on the side of the bracket 5 close to the top plate 4, and a plurality of third through holes 42 corresponding to the positions of the bosses 51 are provided on the top plate 4. The bosses 51 are connected to the bottom plate 21 through the third through holes 42.

[0080] Therefore, the bracket 5 can provide support for the structures above it, such as the top plate 4, the adsorption platform 2 and the supporting plate 1. The boss 51 is connected to the adsorption platform 2 through the third through hole 42. The boss 51 can provide support for the adsorption platform 2, thereby balancing the force on the adsorption platform 2, reducing the probability of the adsorption platform 2 bending and deforming during the adsorption process, and improving the working stability of the adsorption device 10.

[0081] In some embodiments, as Figure 1 and Figure 7 As shown, the bracket 5 has a receiving groove at one end near the carrier plate 1, with multiple bosses 51 evenly and spaced apart within the receiving groove. The ejector plate 4 is positioned within the receiving groove and has a fourth through hole 44 formed therein. The adsorption device 10 also includes an ejector guide shaft 43 mounted on the bracket 5 and extending through the fourth through hole 44.

[0082] Therefore, when the ejection plate 4 is connected to the bracket 5, the ejection guide shaft 43 can position the ejection plate 4 to ensure the installation distance tolerance of the ejection plate 4, and can also guide the movement of the ejection plate 4, further improving the ejection stability of the ejection plate 4 and improving the ejection effect.

[0083] In some embodiments, there are multiple ejection guide shafts 43 , and the bracket 5 is provided with a connecting hole 52 , in which the ejection guide shaft 43 can be installed, so that the ejection guide shaft 43 can be installed on the bracket 5 .

[0084] In some embodiments, as Figure 1 As shown, the boss 51 is connected to the adsorption platform 2 through a fastener, and a third sealing member 74 is provided between the boss 51 and the bottom plate 21. The third sealing member 74 is provided at the periphery of the fastener.

[0085] In this way, the probability of the airflow in the adsorption chamber 3 escaping from the installation position of the fastener can be avoided, thereby ensuring the sealing performance of the adsorption chamber 3.

[0086] In some embodiments, as Figure 1 As shown, the adsorption device 10 further includes a drive assembly 45, which is disposed on a side of the bracket 5 away from the adsorption platform 2. The drive assembly 45 is connected to the ejection plate 4 and is configured to drive the ejection plate 4 to move toward or away from the adsorption platform 2. The drive assembly 45 includes a plurality of drive members, which are evenly and spaced apart below the bracket 5. The drive members may be cylinders, air bags, or airbags.

[0087] In one example, the number of driving members can be four, and the four driving members are evenly and spaced apart below the bracket 5. This can balance the forces on all sides of the ejection plate 4, improve the ejection stability of the ejection plate 4, and enhance the ejection effect. The type, number, and installation position of the driving members can be set according to actual needs and are not limited in this application.

[0088] In some embodiments, as Figures 8 to 10 As shown, the adsorption device 10 also includes a speed control assembly 46, which is connected to the drive assembly 45. The speed control assembly 46 is used to adjust the driving force of the drive assembly 45, thereby adjusting the displacement and movement rate of the ejector plate 4. The speed control assembly 46 can be mounted on the side wall of the bracket 5 to facilitate commissioning and maintenance of the speed control assembly 46. If the driving element is a cylinder, the speed control assembly 46 can be a speed control valve, which adjusts the airflow within the cylinder and thus adjusts the driving force of the cylinder.

[0089] In some embodiments, as Figures 11 to 13 As shown, the adsorption device 10 also includes a valve assembly 6, which includes a manual sliding valve 61 and an interruption valve 62. One end of the manual sliding valve 61 is connected to the side plate and communicates with the air flow channel, and the other end is connected to the interruption valve 62.

[0090] Thus, when the interrupt valve 62 is closed, the vacuum pump and the sub-adsorption chamber 31 connected to the interrupt valve 62 are disconnected, and the vacuum pump and sub-adsorption chamber 31 are disconnected. When the interrupt valve 62 is open, but the manual valve 61 is closed, the manual valve 61 allows the vacuum pump to continue pumping normally, but does not provide negative pressure to the platform. This ensures that the air path on the adsorption platform 2 is not disconnected, preventing the adsorption platform 2 from losing its negative pressure. This prevents the vacuum pump from burning out due to heat generated by prolonged dry pumping, thereby improving the reliability and operational safety of the adsorption device 10. The interrupt valve 62 and the manual valve 61 also have the advantages of taking up less space and being inexpensive, which can reduce the application cost of the adsorption device 10.

[0091] In some examples, such as Figure 13 As shown, a pipe joint 63 is provided on the airflow channel 23 connected to one of the sub-adsorption chambers 31. In other words, one of the airflow channels 23 is not provided with a valve assembly 6. This ensures that the vacuum pump always maintains an evacuation state with one of the sub-adsorption chambers 31, preventing operator error from causing dry pumping of the vacuum pump. This protects the vacuum pump and improves the reliability and operating safety of the adsorption device 10.

[0092] like Figure 1 As shown, the adsorption device 10 provided in the present application is a split structure. When one of the supporting plate 1, the adsorption platform 2, the top plate 4 and the bracket 5 is damaged and fails during the subsequent processing, they can be maintained and replaced separately, which can extend the service life of the adsorption device 10 and reduce the use cost of the adsorption device 10.

[0093] In some embodiments, as Figure 8 and Figure 9 As shown, the adsorption device 10 further includes a tool magazine assembly 9 , which is disposed on a side of the adsorption device 10 , and a detection device connected to the detection air channel 24 can be disposed on the tool magazine assembly 9 .

[0094] In a second aspect, embodiments of the present application provide PCB processing equipment, including a processing assembly and the adsorption device 10 described in any of the above embodiments. The processing assembly is configured to process a PCB secured to the adsorption device 10. This improves the reliability of the PCB's securement during processing, and enhances the processing accuracy and efficiency of the PCB processing equipment. The PCB processing equipment can be a PCB forming machine or a PCB drilling machine, and the adsorption device 10 is applicable to both types of equipment.

[0095] In some embodiments, the processing equipment includes a processing table, the adsorption device 10 is arranged on the processing table, and the processing table is provided with a slide rail, such as Figure 1 and Figure 9As shown, a slider 82 is provided on the side of the bracket 5 away from the adsorption platform 2. The slider 82 is slidably connected to the slide rail. A linear actuator 81 is also provided on the side of the bracket 5 away from the adsorption platform 2. The linear actuator 81 is used to drive the slider 82 to move linearly along the extension direction of the slide rail, thereby driving the entire adsorption device 10 to adjust the position of the PCB and improve the processing accuracy of the PCB. The linear actuator 81 includes but is not limited to a linear motor and a ball screw mechanism.

[0096] In one example, the processing table is further provided with two slide rails parallel to each other, such as Figure 1 and Figure 9 As shown, a plurality of sliders 82 are arranged evenly and spaced apart under the bracket 5, a linear drive 81 is arranged in the middle area of the bracket 5, and a plurality of sliders 82 are evenly distributed on both sides of the linear drive 81, which can improve the stability of the sliding connection between the processing table and the bracket 5, and make the bracket 5 balanced in force during the sliding process, thereby improving the movement stability of the adsorption device 10.

[0097] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0098] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An adsorption device for fixing a PCB board, characterized in that: include: A carrier plate having a first surface and a second surface arranged opposite to each other; the first surface is used to support the PCB board, and a plurality of adsorption holes are provided on the carrier plate, and the adsorption holes extend from the first surface to the second surface; The adsorption platform includes a bottom plate and a side plate arranged around the periphery of the bottom plate, wherein one end of the side plate away from the bottom plate is connected to the second surface; the bottom plate, the side plate and the supporting plate are arranged to form an adsorption cavity, and the adsorption cavity is connected to the adsorption hole; the adsorption hole has a first end located on the first surface and a second end located on the second surface, and the inner diameter of the second end is larger than the inner diameter of the first end.

2. The adsorption device according to claim 1, characterized in that The adsorption chamber includes a plurality of sub-adsorption chambers arranged at intervals, and a plurality of independent air flow channels are provided on the side plate. Any of the sub-adsorption chambers is communicated with at least one of the air flow channels.

3. The adsorption device according to claim 2, characterized in that: The adsorption platform further includes a partition disposed in the adsorption chamber at intervals, wherein one end of the partition is connected to the supporting plate, and the other end is connected to the bottom plate, so as to divide the adsorption chamber into at least two sub-adsorption chambers.

4. The adsorption device according to claim 3, characterized in that The separator includes a first separator, a second separator and a third separator, all of which are connected to the supporting plate and the bottom plate. The first separator is located in the middle of the bottom plate and is arranged to form a first sub-adsorption chamber. The second separator is arranged around the first separator and is arranged to form a second sub-adsorption chamber. The third separator is arranged around the second separator and is arranged to form a third sub-adsorption chamber.

5. The adsorption device according to claim 3, characterized in that: The separator includes a fourth separator and a fifth separator disposed in the adsorption chamber. The fourth separator and the fifth separator are arranged to cross or space apart, and divide the adsorption chamber into at least two sub-adsorption chambers.

6. The adsorption device according to claim 2, characterized in that: The side plate is provided with a detection air channel, and at least one of the sub-adsorption chambers is connected to the detection air channel.

7. The adsorption device according to claim 3, characterized in that The adsorption device further includes a first sealing member, and the first sealing member is provided on one end of the partition facing away from the bottom plate.

8. The adsorption device according to claim 1, characterized in that The adsorption device further includes a lifting plate, which is arranged on a side of the adsorption platform away from the carrying plate, and is capable of moving in a direction close to or away from the adsorption platform. A plurality of lifting rods are provided on the side of the lifting plate close to the adsorption platform; The bottom plate is provided with a plurality of first through holes corresponding to the positions of the ejecting rods, and the supporting plate is provided with a plurality of second through holes corresponding to the positions of the ejecting rods. The ejecting rods can be inserted into the first through holes and the second through holes.

9. The adsorption device according to claim 8, characterized in that: A plurality of second sealing members are arranged between the bottom plate and the supporting plate, and the second sealing members are arranged around the periphery of the first through hole.

10. The adsorption device according to claim 8, characterized in that: The adsorption device also includes a bracket, which is arranged on the side of the top plate facing away from the bottom plate. A plurality of bosses are provided on the side of the bracket close to the top plate. A plurality of third through holes corresponding to the positions of the bosses are provided on the top plate, and the bosses are connected to the bottom plate through the third through holes.

11. The adsorption device according to claim 10, characterized in that: The bracket is provided with a receiving groove at one end close to the carrying plate, and the plurality of bosses are arranged in the receiving groove at intervals; The ejection plate is located in the accommodating groove, and a fourth through hole is formed on the ejection plate; the adsorption device further includes an ejection guide shaft, which is mounted on the bracket and passes through the fourth through hole.

12. The adsorption device according to claim 10, characterized in that: The boss is connected to the adsorption platform through a fastener; a third sealing member is provided between the boss and the base plate, and the third sealing member is arranged around the periphery of the fastener.

13. The adsorption device according to claim 2, characterized in that: The adsorption device further includes a valve assembly, which includes a manual sliding valve and an interruption valve. One end of the manual sliding valve is connected to the side plate and communicates with the air flow channel, and the other end is connected to the interruption valve.

14. A PCB board processing equipment, characterized in that, The invention comprises a processing component and an adsorption device according to any one of claims 1 to 13, wherein the processing component is used for processing a PCB board fixed on the adsorption device.

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