Sample holder
By designing a sample holder with an inclined support plate and guardrail structure, the problem of wafer cassettes being easily reversed and warped is solved, and the risk of dirt or scratches caused by the wafer cassette being knocked down and warped is reduced, and the stable storage of wafers is achieved.
Patent Information
- Application Number
- CN202421690283.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-07-16
AI Technical Summary
During the placement of ultra-thin wafer boxes, the box is easily knocked down due to manual misoperation, and the ultra-thin wafers are easily warped when placed regularly, which causes patches, resulting in dirt or scratches.
A sample rack is designed, including a support rack and an inclined support plate. The distance from the first side to the bottom end of the support plate is less than the distance from the second side to the bottom end. The inclination angle of the support plate is 5° to 10°. A through hole is provided on the support plate to discharge air flow. Both ends of the support plate are fixed on the support column assembly. The structure composed of the support plate and the guardrail prevents the wafer box from slipping off.
It effectively reduces the risk of wafer cassette being knocked down, reduces dirt or scratches caused by wafer warping and bonding. Through the tilting design of the support plate and the guardrail structure, ensures the wafer space and avoids warping and bonding.
Smart Images
Figure CN223233857U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor tooling technology, and in particular to a sample rack. Background Art
[0002] When placing an ultra-thin wafer box on a conventional table, the wafer box may be knocked over due to human error or accidental contact, and the ultra-thin wafers in the wafer box are prone to warping under conventional placement, which can easily cause patching and cause dirt or scratches. Utility Model Content
[0003] In view of this, the present application provides a method for reducing the risk of a wafer box being knocked over and reducing the risk of wafers in the wafer box being contaminated or scratched during bonding.
[0004] To solve the above problems, the technical solutions provided by this application are as follows:
[0005] The present application provides a sample rack, comprising:
[0006] The support frame includes a first support column assembly, a second support column assembly and a first guardrail, wherein the first support column assembly and the second support column assembly are arranged opposite to each other, and the two ends of the first guardrail are respectively fixed to the first support column assembly and the second support column assembly; the ends of the first support column assembly and the second support column assembly that contact the supporting surface of the sample holder are the bottom ends; and
[0007] A support plate configured to carry a wafer cassette; two ends of the support plate are respectively fixed to the first support column assembly and the second support column assembly;
[0008] In which, the support plate is inclined relative to the bearing surface and includes a first side arranged close to the first guardrail and a second side away from the first side, and the distance from the first side of the support plate to the bottom end is smaller than the distance from the second side of the support plate to the bottom end.
[0009] In some embodiments of the present application, the support plate is inclined at a certain angle relative to the bearing surface, and the angle is 5° to 10°.
[0010] In some embodiments of the present application, the distances between two adjacent support plates are equal.
[0011] In some embodiments of the present application, the first support column assembly includes two first support columns spaced apart;
[0012] The second support column assembly includes two second support columns arranged at intervals;
[0013] One end of the support plate is fixed to the two first support columns respectively, and the other end of the support plate is fixed to the two second support columns respectively; and
[0014] Two ends of the first guardrail are respectively fixed to the first support column and the second support column located on the first side of the support plate.
[0015] In some embodiments of the present application, the support frame further includes a second guardrail and a third guardrail;
[0016] The second guardrail is fixed on the two first support columns; and
[0017] The third guardrail is fixed on the two second support columns.
[0018] In some embodiments of the present application, the support plate is provided with a plurality of through holes distributed in an array, and the plurality of through holes penetrate the support plate along the thickness direction of the support plate.
[0019] In some embodiments of the present application, the plurality of through holes include a first through hole array and a second through hole array, wherein the first through hole array is located at one end of the support plate close to the first support column assembly, and the second through hole array is located at one end of the support plate close to the second support column assembly.
[0020] In some embodiments of the present application, the support frame further includes a reinforcing rib, one end of the reinforcing rib is fixed to the first guardrail, and the other end is fixed to the support plate.
[0021] In some embodiments of the present application, the sample rack further includes a conductive chain, and the conductive chain is fixed on one of the support plates closest to the carrying surface.
[0022] In some embodiments of the present application, the distances between the first guardrail, the second guardrail, and the third guardrail and the corresponding support plate are smaller than the height of the wafer box in the thickness direction of the support plate.
[0023] The sample rack provided in the present application includes a support rack and a support plate, the support rack includes a first support column assembly, a second support column assembly and a first guardrail, the first support column assembly and the second support column assembly are arranged opposite to each other, and the two ends of the first guardrail are respectively fixed on the first support column assembly and the second support column assembly; the end of the first support column assembly and the second support column assembly that contacts the bearing surface of the sample rack is the bottom end; the support plate is configured to bear a wafer box, and the two ends of the support plate are respectively fixed on the first support column assembly and the second support column assembly; wherein, the support plate is inclined relative to the bearing surface and includes a first side arranged close to the first guardrail and a second side away from the first side, and the distance from the first side of the support plate to the bottom end is smaller than the distance from the second side of the support plate to the bottom end. The present application tilts the support plate relative to the carrying surface. When the wafer box is placed on the support plate of the sample rack, the wafer box tends to tilt toward the first guardrail, making it difficult for an operator to bump into the wafer box. In addition, multiple adjacent ultra-thin wafers in the wafer box are also tilted toward the first guardrail, so that each wafer is attached to the support member of the wafer box that spaces the wafers apart. Thus, there is a gap between two adjacent wafers, making it less likely for warping to occur. This reduces the risk of dirt or scratches caused by wafer bonding due to wafer warping. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0025] Figure 1 A three-dimensional schematic diagram of a sample rack provided in this application;
[0026] Figure 2 for Figure 1 A front view of the sample holder is shown;
[0027] Figure 3 for Figure 1 A side view of the sample holder is shown;
[0028] Figure 4 Schematic diagram of the wafer box on the support plate. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.
[0030] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0031] The present application may repeat reference numerals and / or reference letters in different embodiments. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.
[0032] See also Figures 1 to 4 The present application provides a sample rack 100 , which includes a support frame 10 and a support plate 20 , wherein the support plate 20 is fixed on the support frame 10 .
[0033] The support frame 10 includes a first support column assembly 11, a second support column assembly 12 and a first guardrail 13. The first support column assembly 11 and the second support column assembly 12 are arranged opposite to each other, and the two ends of the first guardrail 13 are respectively fixed to the first support column assembly 11 and the second support column assembly 12; the ends of the first support column assembly 11 and the second support column assembly 12 that contact the supporting surface (horizontal line) 101 supporting the sample rack 100 are the bottom ends.
[0034] The support plate 20 is configured to carry the wafer box 30 , and both ends of the support plate 20 are fixed to the first support column assembly 11 and the second support column assembly 12 , respectively.
[0035] In which, the support plate 20 is arranged at an angle relative to the bearing surface 101 and includes a first side 21 arranged close to the first guardrail 13 and a second side 22 away from the first side 21, and the vertical distance d1 from the first side 21 of the support plate 20 to the bottom end is smaller than the vertical distance d2 from the second side 22 of the support plate 20 to the bottom end.
[0036] In some embodiments of the present application, the support plate 20 is inclined at a certain angle θ relative to the bearing surface 101, and the angle θ is 5° to 10°. In this embodiment, the angle θ is 5°.
[0037] In some embodiments of the present application, there are multiple support plates 20 , and the multiple support plates 20 are respectively fixed on the support frame 10 , and the distance between two adjacent support plates 20 is equal.
[0038] In some embodiments of the present application, the first support column assembly 11 includes two first support columns 111 arranged at intervals; the second support column assembly 12 includes two second support columns 121 arranged at intervals; one end of the support plate 20 is respectively fixed on the two first support columns 111, and the other end of the support plate 20 is respectively fixed on the two second support columns 121; the two ends of the first guardrail 13 are respectively fixed on a first support column 111 and a second support column 121 located on the first side 21 of the support plate 20.
[0039] In some embodiments of the present application, the support frame 10 further includes a second guardrail 14 and a third guardrail 15 . The second guardrail 14 is fixed on the two first support columns 111 , and the third guardrail 15 is fixed on the two second support columns 121 .
[0040] In some embodiments of the present application, the second guardrail 14 and the third guardrail 15 are arranged parallel to the supporting surface 101 .
[0041] In other embodiments of the present application, the first guardrail 13, the second guardrail 14, and the third guardrail 15 are parallel to the support plate 20. The second guardrail 14 and the third guardrail 15 are also inclined relative to the support surface, and the direction and angle of inclination of the second guardrail 14 and the third guardrail 15 relative to the support surface 101 are the same as the direction and angle of inclination of the support plate 20 relative to the support surface. In other words, the vertical distances of the first guardrail 13, the second guardrail 14, and the third guardrail 15 from the same support plate 20 are equal.
[0042] In some embodiments of the present application, the first guardrail 13, the second guardrail 14 and the third guardrail 15 are round tube guardrails with a diameter of 16 mm.
[0043] In some embodiments of the present application, the distances between the first guardrail 13, the second guardrail 14, and the third guardrail 15 and the corresponding support plate 20 are respectively less than the height of the wafer cassette 30 in the extension direction of the first support column assembly 11 or the second support column assembly 12. In this way, the wafer cassette 30 can be prevented from slipping off the first side 21 of the support plate 20 and from the side of the support plate 20 adjacent to the first support column assembly 11 or the second support column assembly 12.
[0044] In some embodiments of the present application, the support frame 10 further includes a reinforcing rib 16, one end of the reinforcing rib 16 being fixed to the first guardrail 13 and the other end being fixed to the support plate 20. The reinforcing rib 16 is used to reinforce the first guardrail 13 to increase the reliability of the first guardrail 13.
[0045] In some embodiments of the present application, the support plate 20 is provided with a plurality of through holes 23 distributed in an array, and the plurality of through holes 23 penetrate the support plate 20 along the thickness direction of the support plate 20. Since there is an upward airflow on the ceiling in the factory building, the plurality of through holes 23 provided in the support plate 20 can form an air path, so that any particulate dust that may be formed can be effectively discharged and prevent the accumulation of particulate dust.
[0046] In some embodiments of the present application, the plurality of through holes 23 include a first through hole array 231 and a second through hole array 232, wherein the first through hole array 231 is located at one end of the support plate 20 close to the first support column assembly 11, and the second through hole array 232 is located at one end of the support plate 20 close to the second support column assembly 12.
[0047] In some embodiments of the present application, positions of the through holes 23 on two adjacent support plates 20 are the same or different.
[0048] In some embodiments of the present application, the size of the through hole 23 satisfies: P40, among which It indicates that the diameter of the through hole 23 is 8 mm, and P40 indicates that the number of the through holes 23 is 40.
[0049] In some embodiments of the present application, the sample holder 100 further includes a conductive chain 40, at least part of which is fixed to the support plate 20 closest to the carrying surface, and the other part is grounded. The purpose of the conductive chain 40 is to ground to eliminate static electricity.
[0050] In this embodiment, the height of the first support column assembly 11 and the second support column assembly 12 is 1600 mm, the shortest distance from the support plate 20 to the bottom end of the first support column assembly 11 and the second support column assembly 12 is 442 mm, the inclination angle of the support plate 20 to one of the first support column assembly 11 or the second support column assembly 12 is 85°, and the distance between two adjacent support plates 20 is 300 mm.
[0051] Please continue to refer to Figure 4 When the wafer cassette 30 is placed on the support plate 20, the support plate 20 is tilted relative to the bearing surface (horizontal line). Due to the force of gravity G, the force applied to the wafer cassette 30 is tilted toward the first side 21 of the support plate 20. The wafer cassette 30 tends to slide toward the first side, thereby preventing the wafer cassette 30 from slipping. The multiple adjacent ultra-thin wafers 31 within the wafer cassette 30 are also tilted toward the first guardrail 13, so that each wafer 31 is attached to the wafer spacing support member 32 of the wafer cassette 30. This creates a gap between adjacent wafers 31, making them less likely to warp. This reduces wafer lamination caused by wafer warpage and further reduces the risk of wafer contamination or scratches.
[0052] When the wafer box 30 is placed on the support plate 20 , the first guardrail 13 , the second guardrail 14 and the third guardrail 15 also block the wafer box 30 to further prevent the wafer box 30 from slipping.
[0053] The sample rack provided in the present application includes a support rack and a support plate, the support rack includes a first support column assembly, a second support column assembly and a first guardrail, the first support column assembly and the second support column assembly are arranged opposite to each other, and the two ends of the first guardrail are respectively fixed on the first support column assembly and the second support column assembly; the end of the first support column assembly and the second support column assembly that contacts the bearing surface of the sample rack is the bottom end; the support plate is configured to bear a wafer box, and the two ends of the support plate are respectively fixed on the first support column assembly and the second support column assembly; wherein, the support plate is inclined relative to the bearing surface and includes a first side arranged close to the first guardrail and a second side away from the first side, and the distance from the first side of the support plate to the bottom end is smaller than the distance from the second side of the support plate to the bottom end. The present application tilts the support plate relative to the carrying surface. When the wafer box is placed on the support plate of the sample rack, the wafer box tends to tilt toward the first guardrail, making it difficult for an operator to bump into the wafer box. In addition, multiple adjacent ultra-thin wafers in the wafer box are also tilted toward the first guardrail, so that each wafer is attached to the support member of the wafer box that spaces the wafers apart. Thus, there is a gap between two adjacent wafers, making them less likely to warp. This can reduce wafer bonding caused by wafer warping, and further reduce the risk of wafer contamination or scratches.
[0054] In summary, although the present application has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.
Claims
1. A sample rack, characterized in that: include: The support frame includes a first support column assembly, a second support column assembly, and a first guardrail. The first support column assembly and the second support column assembly are arranged opposite to each other. The two ends of the first guardrail are respectively fixed to the first support column assembly and the second support column assembly. The ends of the first support column assembly and the second support column assembly that contact the supporting surface of the sample rack are the bottom ends. and A support plate configured to carry a wafer cassette; two ends of the support plate are respectively fixed to the first support column assembly and the second support column assembly; In which, the support plate is arranged at an angle relative to the bearing surface and includes a first side arranged close to the first guardrail and a second side away from the first side, and the vertical distance from the first side of the support plate to the bottom end is smaller than the vertical distance from the second side of the support plate to the bottom end.
2. The sample holder according to claim 1, wherein The support plate is inclined at a certain angle relative to the bearing surface, and the angle is 5° to 10°.
3. The sample holder according to claim 1, wherein The distances between two adjacent support plates are equal.
4. The sample holder according to claim 1, wherein The first support column assembly includes two first support columns arranged at intervals; The second support column assembly includes two second support columns arranged at intervals; One end of the support plate is fixed to the two first support columns respectively, and the other end of the support plate is fixed to the two second support columns respectively; and Two ends of the first guardrail are respectively fixed to the first support column and the second support column located on the first side of the support plate.
5. The sample holder according to claim 4, wherein The support frame also includes a second guardrail and a third guardrail; The second guardrail is fixed on the two first support columns; and The third guardrail is fixed on the two second support columns.
6. The sample holder according to claim 1, wherein The support plate is provided with a plurality of through holes distributed in an array, and the plurality of through holes penetrate the support plate along the thickness direction of the support plate.
7. The sample holder according to claim 6, wherein The plurality of through holes include a first through hole array and a second through hole array. The first through hole array is located at one end of the support plate close to the first support column assembly, and the second through hole array is located at one end of the support plate close to the second support column assembly.
8. The sample holder according to claim 1, wherein The support frame further includes a reinforcing rib, one end of which is fixed to the first guardrail, and the other end of which is fixed to the support plate.
9. The sample holder according to claim 1, wherein The sample rack further includes a conductive chain, which is fixed on the support plate closest to the carrying surface.
10. The sample holder according to claim 5, wherein The distances between the first guardrail, the second guardrail, and the third guardrail and the corresponding support plate are respectively smaller than the height of the wafer box in the thickness direction of the support plate.