Novel PI glue drying oven

Abstract

The utility model discloses a novel PI glue drying oven, which relates to the field of PI glue drying ovens and comprises a drying oven body, a heating source is mounted at the top of an inner cavity of the drying oven body, a placing frame is mounted at the top of the heating source, a heat conducting plate is arranged on the side edge of the placing frame, and an inert gas pipe is mounted on the side edge of the drying oven body. A box door is mounted at the top of the front of the oven body through hinges, a box lock is mounted on the right side of the oven body, universal wheels are symmetrically and fixedly connected to the periphery of the bottom of the oven body, and a switch is arranged at the bottom of the control panel. The novel PI glue drying oven is applied to the former procedure of semiconductor manufacturing, is used for baking and curing PI glue, has a high-temperature environment, a clean environment and a low-oxygen environment, and meets the requirement for high-temperature cleanliness by improving the production technology of materials in the cavity and a heating mode. And through the arrangement of the cavity and the inert gas pipe, inert gas can be introduced, so that the low-oxygen requirement can be met.

Description

Technical Field

[0001] The utility model relates to the field of PI glue drying ovens, in particular to a novel PI glue drying oven. Background Art

[0002] PI glue is polyimide, which is based on polyimide film and uses imported silicone pressure-sensitive adhesive. It has the properties of high and low temperature resistance, acid and alkali resistance, solvent resistance, electrical insulation, and radiation protection. It is suitable for wave soldering shielding of electronic circuit boards, protection of gold fingers and insulation of high-end electrical appliances, motor insulation, and fixation of positive and negative ears of lithium batteries.

[0003] Most ovens used to dry PI glue do not have a high temperature environment, a clean environment, or a low oxygen environment.

[0004] Therefore, it is necessary to propose a new type of PI glue oven to solve the above problems. Utility Model Content

[0005] The main purpose of the utility model is to provide a new type of PI glue drying oven, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A new type of PI glue oven includes an oven body, a heating source is installed on the top of the inner cavity of the oven body, a placement rack is installed on the top of the heating source, a heat conduction plate is provided on the side of the placement rack, an exhaust pipe is installed on the top of the oven body, and an inert gas pipe is installed on the side of the oven body.

[0008] Preferably, a door is installed on the top of the front of the oven body through a hinge, and a lock is installed on the right side of the oven body, and the door is locked to the front of the oven body through the lock.

[0009] Preferably, universal wheels are symmetrically fixedly connected to the four sides of the bottom of the oven body, a control panel is fixedly connected to the front of the oven door, a switch is provided at the bottom of the control panel, and the switch is installed on the front of the oven door.

[0010] Preferably, an inspection plate is threadedly connected to the front of the oven body, a three-color lamp is fixedly connected to the top of the oven body, a cavity is opened in the center of the oven body, the exhaust pipe is fixedly connected to the top of the oven door, and an inert gas pipe is fixedly connected to the right side of the oven body, and the inert gas pipe and the exhaust pipe are in communication with the inner cavity of the cavity.

[0011] Preferably, there are two placement racks, the heating source and the placement racks are both installed in the inner cavity of the cavity, the heat conduction plate is fixedly connected to the inner cavity of the cavity, an air vent is provided on the front of the heat conduction plate, a power socket is fixedly connected to the bottom of the front of the inner cavity of the cavity, a power cord is installed on the side of the power socket, and the power cord is electrically connected to the heating source.

[0012] Preferably, a heat dissipation groove is provided on the top of the back side of the oven body, and a vent is provided on the bottom of the back side of the oven body, and the heat dissipation groove and the vent are communicated with the inner cavity of the cavity.

[0013] Beneficial effects

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. This new type of PI glue oven is used in the front-end process of semiconductor manufacturing for baking and curing PI glue. This oven has a high-temperature environment, a clean environment, and a low-oxygen environment. This oven meets the requirements of high-temperature cleanliness by improving the production process of the cavity material and heating method. Through the cavity and inert gas pipe, inert gas can be introduced to meet the low-oxygen requirements.

[0016] 2. This new PI glue drying oven can be used to control the oven body through the control panel, which is convenient for drying the PI glue in its inner cavity. The oven body can be opened and closed through the switch. The three-color light can be used to display the working status of the oven body, which is convenient for staff to maintain and repair it. The exhaust pipe can be used to discharge the exhaust gas.

[0017] 3. The new PI glue drying oven is convenient for maintenance work on the inside of the oven body through the inspection panel. The power socket can be used to power the heating source through the power cord to heat the inner cavity of the cavity. The two placement racks can be used to place materials that need to be dried, which can effectively improve the drying efficiency. At the same time, during drying, the door can be locked through the box lock to prevent the loss of heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the front side of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the inner cavity of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the back of the utility model.

[0021] In the figure: 1. Oven body; 2. Inspection panel; 3. Universal wheel; 4. Inert gas pipe; 5. Oven lock; 6. Oven door; 7. Control panel; 8. Switch; 9. Three-color light; 10. Exhaust pipe; 11. Cavity; 12. Heat conduction plate; 13. Air vent; 14. Placement rack; 15. Heating source; 16. Power cord; 17. Power socket; 18. Heat sink; 19. Ventilation hole. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] like Figure 1-Figure 3 As shown, a new type of PI glue oven includes an oven body 1, a heating source 15 is installed on the top of the inner cavity of the oven body 1, a placement rack 14 is installed on the top of the heating source 15, a heat conducting plate 12 is provided on the side of the placement rack 14, an exhaust pipe 10 is installed on the top of the oven body 1, an inert gas pipe 4 is installed on the side of the oven body 1, a door 6 is installed on the top of the front of the oven body 1 through a hinge, a box lock 5 is installed on the right side of the oven body 1, and the door 6 is locked to the front of the oven body 1 through the box lock 5, universal wheels 3 are symmetrically fixedly connected to the four sides of the bottom of the oven body 1, a control panel 7 is fixedly connected to the front of the door 6, a switch 8 is provided at the bottom of the control panel 7, and the switch 8 is installed on the front of the door 6, an inspection panel 2 is threadedly connected to the front of the oven body 1, and three Color lamp 9, a cavity 11 is opened in the middle of the oven body 1, the exhaust pipe 10 is fixedly connected to the top of the oven door 6, an inert gas pipe 4 is fixedly connected to the right side of the oven body 1, the inert gas pipe 4 and the exhaust pipe 10 are communicated with the inner cavity of the cavity 11, there are two placement racks 14, the heating source 15 and the placement rack 14 are both installed in the inner cavity of the cavity 11, the heat conducting plate 12 is fixedly connected to the inner cavity of the cavity 11, and an air vent 13 is opened on the front of the heat conducting plate 12. A power socket 17 is fixedly connected to the bottom of the front of the inner cavity of the cavity 11, and a power cord 16 is installed on the side of the power socket 17. The power cord 16 is electrically connected to the heating source 15, a heat dissipation groove 18 is opened on the top of the back of the oven body 1, and a vent 19 is opened on the bottom of the back of the oven body 1, and the heat dissipation groove 18 and the vent 19 are communicated with the inner cavity of the cavity 11.

[0024] It is used in the front-end process of semiconductor manufacturing and is used for baking and curing PI glue. This oven has a high-temperature environment, a clean environment, and a low-oxygen environment. This oven meets the requirements of high-temperature cleanliness by improving the production process of the cavity material and the heating method. Through the cavity 11 and the inert gas pipe 4, inert gas can be introduced to meet the low-oxygen requirement. The control panel 7 can be used to control the oven body 1 to facilitate the drying of the PI glue in its inner cavity. The switch 8 can be used to open and close the oven body 1. The three-color light 9 can be used to adjust the temperature according to the oven body 1. The working status of the oven can be displayed to facilitate maintenance and overhaul by the staff. The exhaust pipe 10 can be used to discharge the exhaust gas. The inspection panel 2 can be used to facilitate overhaul of the interior of the oven body 1. The power socket 17 can be used to power the heating source 15 through the power cord 16 to heat the inner cavity of the cavity 11. The two placement racks 14 can be used to place materials that need to be dried, so as to effectively improve the drying efficiency. At the same time, during drying, the box door 6 can be locked through the box lock 5 to prevent the loss of heat.

[0025] It should be noted that the utility model is a new type of PI glue drying oven. When in use, open the box lock 5, open the box door 6, place the material to be dried on the placement rack 14, close the box door 6, lock the box door 6 through the box lock 5, and turn on the heating source 15 through the switch 8. At this time, the material can be dried. During drying, the exhaust gas will be discharged through the exhaust pipe 10 and the inert gas pipe 4. After drying is completed, open the box door 6 and take out the material.

[0026] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A novel PI glue drying oven, comprising an oven body (1), characterized in that: A heating source (15) is installed on the top of the inner cavity of the oven body (1), a placement rack (14) is installed on the top of the heating source (15), a heat conduction plate (12) is provided on the side of the placement rack (14), an exhaust pipe (10) is installed on the top of the oven body (1), and an inert gas pipe (4) is installed on the side of the oven body (1).

2. A novel PI adhesive drying oven according to claim 1, characterized in that: A door (6) is installed on the top of the front of the oven body (1) via a hinge, and a lock (5) is installed on the right side of the oven body (1). The door (6) is locked to the front of the oven body (1) via the lock (5).

3. The novel PI adhesive drying oven according to claim 2, characterized in that: Universal wheels (3) are symmetrically fixedly connected to the four sides of the bottom of the oven body (1), a control panel (7) is fixedly connected to the front of the oven door (6), a switch (8) is provided at the bottom of the control panel (7), and the switch (8) is installed on the front of the oven door (6).

4. The novel PI adhesive drying oven according to claim 1, characterized in that: The front of the oven body (1) is threadedly connected to an inspection plate (2), the top of the oven body (1) is fixedly connected to a three-color lamp (9), a cavity (11) is opened in the center of the oven body (1), the exhaust pipe (10) is fixedly connected to the top of the oven door (6), and the right side of the oven body (1) is fixedly connected to an inert gas pipe (4), and the inert gas pipe (4) and the exhaust pipe (10) are in communication with the inner cavity of the cavity (11).

5. The novel PI adhesive drying oven according to claim 1, characterized in that: There are two placement racks (14), the heating source (15) and the placement rack (14) are both installed in the inner cavity of the cavity (11), the heat conducting plate (12) is fixedly connected to the inner cavity of the cavity (11), an air vent (13) is provided on the front of the heat conducting plate (12), a power socket (17) is fixedly connected to the bottom of the front of the inner cavity of the cavity (11), a power cord (16) is installed on the side of the power socket (17), and the power cord (16) is electrically connected to the heating source (15).

6. The novel PI adhesive drying oven according to claim 1, characterized in that: A heat dissipation groove (18) is provided at the top of the back of the oven body (1), and a vent (19) is provided at the bottom of the back of the oven body (1). The heat dissipation groove (18) and the vent (19) are in communication with the inner cavity of the cavity (11).

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