Board finishing device and substrate processing equipment

Abstract

The utility model discloses a plate finishing device and base plate machining equipment, the plate finishing device comprises a bearing plate, a limiting assembly and a positioning assembly, the bearing plate is provided with a bearing surface, and the limiting assembly is movably arranged on the peripheral side of the bearing plate and used for limiting a to-be-machined plate so that the to-be-machined plate can be located at a preset position; the positioning assembly is arranged in the bearing interval of the bearing plate and can move in the height direction of the bearing plate, when the to-be-machined plate is located at the preset position, the limiting assembly moves in the direction away from the to-be-machined plate, and the positioning assembly penetrates out of the bearing face and positions a positioning hole of the to-be-machined plate. When the to-be-machined plate is located at the preset position, the limiting assembly moves in the direction away from the to-be-machined plate, the positioning assembly can penetrate out of the bearing face and position the positioning hole of the to-be-machined plate, and the error of the position of the to-be-machined plate placed on the machining platform relative to the standard machining position is reduced; and the plate processing efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of substrate processing, and in particular to a whole-board device and substrate processing equipment. Background Art

[0002] With the rapid development of laser technology, laser processing of sheet metal has become a key application within the laser processing industry. Laser processing of sheet metal offers advantages such as high processing speed, high processing quality, minimal thermal impact, high precision, material savings, and easy automation of the processing process. Consequently, it is widely used in various fields, including automotive, aviation, chemical, electrical and electronics, and metallurgy.

[0003] With the widespread application of laser drilling in the electronic circuit board industry, machine automation has become increasingly diverse and complex. The positioning system in the laser processing platform requires very high positional accuracy of the substrate target. The deviation between the actual position of the substrate and the standard processing position must be within the allowable error range to meet the requirements of subsequent processing. Typically, a robot grasps the substrate and delivers it to the processing platform for processing.

[0004] In the existing technology, due to the combined influence of factors such as the manufacturing error of the robot, assembly error, swing error during lateral movement and feeding, and sliding bearing error of the lifting cylinder on the robot during the descent process, the position of the PCB directly placed on the processing platform after the robot grasps it will have a large error relative to the standard processing position, making it difficult to meet processing requirements, affecting the quality of the board, increasing costs, and reducing work efficiency. Utility Model Content

[0005] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of this application is to provide a whole-board device and substrate processing equipment that can ensure the quality of the board and improve work efficiency.

[0006] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0007] A whole-board device, comprising:

[0008] A carrying plate, wherein the carrying plate is provided with a carrying surface for placing the plate to be processed;

[0009] A limiting assembly, the limiting assembly being movably arranged on the peripheral side of the carrying plate and used for limiting the plate to be processed so that the plate to be processed is at a preset position;

[0010] A positioning assembly is provided in the bearing interval of the bearing plate, and the positioning assembly can move along the height direction of the bearing plate. When the plate to be processed is in a preset position, the limiting assembly moves in a direction away from the plate to be processed, and the positioning assembly passes through the bearing surface and positions the positioning hole of the plate to be processed.

[0011] In some embodiments, the positioning assembly includes a positioning member, the positioning member is disposed in the bearing interval of the bearing plate, and the positioning member is movable along the height direction of the bearing plate;

[0012] The positioning member includes a connecting portion and a positioning portion, the positioning portion is provided with a first end and a second end, the connecting portion is connected to the second end and is located at the lower part of the positioning portion, and the cross-sectional area of the positioning portion gradually decreases along the direction from the second end to the first end.

[0013] In some embodiments, the positioning assembly includes a positioning member, which is disposed in the bearing interval of the bearing plate and is capable of moving along the height direction of the bearing plate. The positioning member is configured as a conical pin.

[0014] In some embodiments, the positioning assembly further includes a driving cylinder, which is disposed on a side of the supporting plate facing away from the supporting surface and connected to the positioning member, for driving the positioning member to move along the height direction of the supporting plate.

[0015] In some embodiments, the positioning assembly further includes a position sensor and a controller. The supporting surface is provided with a groove, and the position sensor is arranged in the groove for sending a signal when the distance between the plate to be processed and the supporting surface is greater than a preset value. The controller is connected to the position sensor for issuing an alarm based on the signal sent by the position sensor.

[0016] In some embodiments, the groove is provided on a peripheral side of the positioning member.

[0017] In some embodiments, the limiting assembly includes a first movable part, a first limiting part and a first driving part. The first movable part and the first limiting part are respectively arranged on both sides of the supporting plate along the length direction of the supporting plate. The first driving part is arranged on the side of the supporting plate facing away from the supporting surface and is connected to the first movable part, and is used to drive the first movable part to push the plate to be processed to abut against the first limiting part.

[0018] In some embodiments, the limiting assembly also includes a second movable part, a second limiting part and a second driving part. The second movable part and the second limiting part are respectively arranged at both ends of the supporting plate along the width direction of the supporting plate. The second driving part is arranged on the side of the supporting plate facing away from the supporting surface and is connected to the second movable part, and is used to drive the second movable part to push the plate to be processed to abut against the second limiting part.

[0019] In some embodiments, the limiting assembly further includes a third driving member and a fourth driving member, wherein the third driving member is disposed on a side of the supporting plate facing away from the supporting surface and is connected to the first limiting member, and is configured to drive the first limiting member to move along a height direction of the supporting plate;

[0020] The fourth driving member is disposed on a side of the supporting plate facing away from the supporting surface and is connected to the second limiting member, and is used to drive the second limiting member to move along the height direction of the supporting plate.

[0021] A substrate processing equipment comprises a machine tool, a processing platform, a moving device and a whole-plate device as described in any one of the above, wherein the processing platform and the whole-plate device are respectively arranged on the machine tool, and the moving device is used to transport the substrate to the whole-plate device for whole-plate processing, and to transport the substrate on the whole-plate device to the processing platform for processing.

[0022] Compared with the prior art, the whole-board device provided by this application has at least the following beneficial effects:

[0023] The present application limits the plate to be processed by a limiting component so that the plate to be processed is in a preset position, thereby realizing rough positioning of the plate to be processed. When the plate to be processed is in the preset position, the limiting component moves in a direction away from the plate to be processed to reduce the situation where the limiting component and the positioning component work simultaneously to squeeze the plate to be processed. The positioning component can pass through the bearing surface and position the positioning hole of the plate to be processed, thereby realizing precise positioning of the plate to be processed, reducing the error of the position of the plate to be processed that is directly placed on the processing platform after being grasped by the robot arm relative to the standard processing position, ensuring that the deviation between the actual position of the plate to be processed and the standard processing position is within the allowable error range, meeting the processing requirements, and improving the quality and processing efficiency of the plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0025] Figure 1 A schematic structural diagram of a substrate processing device provided in an embodiment of the present application;

[0026] Figure 2 A schematic structural diagram of the whole-board device provided in an embodiment of the present application;

[0027] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0028] Figure 4 A schematic diagram of the structure of a whole-board device from a top view provided in an embodiment of the present application;

[0029] Figure 5 This is a schematic diagram of the structure of the whole panel device provided in an embodiment of the present application when viewed from above.

[0030] Reference numerals:

[0031] 1. Loading plate; 11. Loading surface; 110. Fine hole; 12. Groove;

[0032] 2. Limiting assembly; 21. First movable member; 22. First limiting member; 23. Second movable member; 24. Second limiting member; 25. First driving member; 26. Second driving member; 27. Third driving member; 28. Fourth driving member;

[0033] 3. Positioning assembly; 30. Driving cylinder; 31. Positioning member; 310. Connecting portion; 311. Positioning portion; 311a. First end; 311b. Second end; 32. Position sensor;

[0034] 4. Eccentric pin;

[0035] 100. Substrate processing equipment; 101. Machine tool; 102. Loading and unloading device; 103. Processing platform; 105. Panel processing device;

[0036] 200. Plates to be processed. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0038] In the description of this application, unless otherwise expressly specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more, and the term "multiple" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0039] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also indirectly connected to the other element "on" or "under" through an intermediate element.

[0040] Reference Figure 1 As shown, Figure 1 A schematic structural diagram of a substrate processing device provided in an embodiment of the present application. This embodiment discloses a substrate processing device 100, wherein a substrate refers to a circuit board used to package and interconnect different chips and / or electronic components, including a PCB (Print Circuit Board), an IC carrier, a glass substrate, etc. The substrate processing device 100 includes a machine tool 101, a loading and unloading device 102, a processing platform 103, a moving device, and a whole-board device 105. Two loading and unloading devices 102 are provided, and the two loading and unloading devices 102 are respectively arranged on both sides of the machine tool 101, wherein one loading and unloading device 102 is used for loading, and the other loading and unloading device 102 is used for unloading, that is, both sides of the substrate processing device 100 can be used for loading and unloading, so as to improve the applicability of the substrate processing device 100. The processing platform 103 is arranged on the machine tool 101 and is located between the two loading and unloading devices 102. The panel-straightening device 105 is installed on the machine tool 101 between the loading and unloading device 102 and the processing platform 103. It adjusts the position of substrates to minimize the error between the substrates placed on the processing platform 103 and the standard processing position, thereby meeting processing requirements. The moving device is used to transport substrates from the loading and unloading device 102 to the panel-straightening device 105, transport the panel-straightened substrates to the processing platform 103, and transport the processed substrates to the loading and unloading device 102 for unloading.

[0041] In this embodiment, two processing platforms 103 are provided, and the processing efficiency is improved through double-station operation. It can be understood that in other embodiments, the number of processing platforms 103 can be set as needed and is not limited here.

[0042] In some embodiments, the loading and unloading device 102 can be replaced by a material robot.

[0043] Reference Figure 2-Figure 4 As shown, Figure 2 This is a schematic diagram of the structure of the whole board device provided in the embodiment of the present application. Figure 3 for Figure 2 A partial enlarged view of point A in the middle. Figure 4 This is a schematic diagram of the structure of a plate assembly 105 from above, provided in an embodiment of the present application. The plate assembly 105 comprises a support plate 1, a position limiting assembly 2, and a positioning assembly 3. The support plate 1 is provided with a support surface 11 for placing a plate 200 to be processed, which serves as a substrate. The position limiting assembly 2 is movably disposed on the periphery of the support plate 1 and is used to position the plate 200 to be processed, such that the plate 200 is in a predetermined position, which is the position where the plate 200 abuts the position limiting assembly 2. The position limiting assembly 2 is also capable of moving away from the plate 200 to be processed. The positioning assembly 3 is disposed within the load-bearing region of the carrier plate 1. The load-bearing region is the area covered when the plate 200 to be processed is in a preset position. The positioning assembly 3 is movable along the height direction of the carrier plate 1. When the plate 200 to be processed is in the preset position, the limiting assembly 2 moves along the height direction of the carrier plate 1 so that the upper surface of the limiting assembly 2 is flush with or lower than the load surface 11. The positioning assembly 3 extends through the load surface 11 and positions the positioning holes of the plate 200 to be processed. The length direction of the carrier plate 1 is the X direction in the figure, the width direction of the carrier plate 1 is the Y direction in the figure, and the height direction of the carrier plate 1 is the Z direction in the figure.

[0044] In the present embodiment, the movement of the limiting assembly 2 in the direction away from the plate to be processed 200 refers to the movement of the limiting assembly 2 in the height direction of the supporting plate 1 so that the upper surface of the limiting assembly 2 is flush with or lower than the supporting surface 11, thereby avoiding the situation where the limiting assembly 2 and the positioning assembly 3 work simultaneously to squeeze the plate to be processed 200. It can be understood that in other embodiments, the limiting assembly 2 can also be moved in the direction away from the plate to be processed 200 in other ways, such as away from the plate to be processed 200 along the length direction of the supporting plate 1, or by being folded. By setting the limiting assembly 2 to be movable in the direction away from the plate to be processed 200, the positioning assembly 3 can be positioned in the positioning hole of the plate to be processed 200 without being affected by the limiting assembly 2, thereby improving the flexibility of using the limiting assembly 2 and the positioning assembly 3 to jointly position the plate to be processed.

[0045] In this embodiment, the supporting surface 11 is provided with a plurality of fine holes 110, and the supporting plate 1 is provided with cavities respectively connected to at least some of the fine holes 110. The whole plate device 105 also includes an air supply component, which is connected to the cavity and is used to transport gas into the cavity. The gas flows out through at least some of the fine holes 110 to float the plate 200 to be processed, so that a preset distance is set between the plate 200 to be processed and the supporting surface 11, thereby reducing the friction between the plate 200 to be processed and the supporting surface 11, preventing damage to the plate 200 to be processed, and facilitating the movement of the plate 200 to be processed.

[0046] In this embodiment, the plate 200 to be processed is limited by the limiting component 2 so that the plate 200 to be processed is in a preset position, thereby realizing rough positioning of the plate 200 to be processed. When the plate 200 to be processed is in the preset position, the limiting component 2 moves in a direction away from the plate 200 to be processed to reduce the situation where the limiting component 2 and the positioning component 3 work simultaneously to squeeze the plate 200 to be processed. The positioning component 3 can pass through the bearing surface 11 and position the positioning hole of the plate 200 to be processed, thereby realizing precise positioning of the plate 200 to be processed, reducing the error of the position of the plate 200 to be processed that is directly placed on the processing platform 103 after being grasped by the robot arm relative to the standard processing position, ensuring that the deviation between the actual position of the plate 200 to be processed and the standard processing position is within the allowable error range, meeting the processing requirements, and improving the quality and processing efficiency of the plate.

[0047] Reference Figure 2-Figure 4 As shown, the carrier plate 1 is provided with a receiving hole, and the positioning assembly 3 includes a drive cylinder 30 and a positioning member 31. The positioning member 31 is movably inserted into the receiving hole. The drive cylinder 30 is disposed on the side of the carrier plate 1 facing away from the supporting surface 11 and is connected to the positioning member 31. When the plate 200 to be processed is in a predetermined position, the drive cylinder 30 is used to drive the positioning member 31 to move along the height direction of the carrier plate 1, so that the positioning member 31 passes through the supporting surface 11 and is positioned in the positioning hole of the plate 200 to be processed.

[0048] Specifically, the positioning member 31 includes a connecting portion 310 and a positioning portion 311. The connecting portion 310 is connected to the driving cylinder 30, and the size of the connecting portion 310 is set to correspond to the size of the positioning hole in the plate 200 to be processed. The positioning portion 311 has a first end 311a and a second end 311b, and the second end 311b is connected to the connecting portion 310. The cross-sectional area of the positioning portion 311 gradually decreases from the second end 311b to the first end 311a. The outer surface of the positioning portion 311 is configured as an inclined surface, which facilitates the first end 311a to penetrate the positioning hole in the plate 200 to be processed, thereby providing a larger margin for error during positioning and improving the working efficiency of the plate-forming device 105.

[0049] In this embodiment, there are two positioning members 31, and the number of positioning members 31 corresponds to the number of positioning holes on the plate 200 to be processed. The two positioning members 31 are respectively arranged on both sides of the carrier plate 1 along the width direction of the carrier plate 1, and the position of each positioning member 31 corresponds to the position of each positioning hole on the plate 200 to be processed. It can be understood that in other embodiments, the number and position of the positioning members 31 can be set according to the needs of use. Among them, the position and size of the pins on the processing platform 103 correspond to the position and size of the positioning members 31 on the plate-forming device 105, so that when the mobile device grabs the plate 200 to be processed onto the processing platform 103, it can ensure that the plate 200 to be processed and the processing platform 103 are accurately molded.

[0050] In one embodiment, the positioning member 31 is configured as a conical pin, for example, a conical pin with a diameter of 3 mm, and the diameter of the top thereof is only 1 mm, that is, along the direction from the bottom to the top of the positioning member 31, the diameter of the positioning member 31 gradually becomes smaller, thereby facilitating the positioning member 31 to pass through the positioning hole on the plate 200 to be processed, so that there is a larger tolerance space during positioning, thereby improving the working efficiency of the whole plate device 105.

[0051] Continue to refer to Figure 2-Figure 4 As shown, the positioning component 3 also includes a position sensor 32 and a controller. The bearing surface 11 is provided with a groove 12, and the position sensor 32 is arranged in the groove 12. The position sensor 32 is used to send a signal when the distance between the plate 200 to be processed and the bearing surface 11 is greater than a preset value. The controller is connected to the position sensor 32 and is used to alarm based on the signal sent by the position sensor 32 to inform that the plate 200 to be processed is lifted up by the positioning member 31 and the entire plate fails. The controller transmits the alarm signal to the host computer to prompt the abnormality and request manual intervention.

[0052] In this embodiment, the groove 12 is arranged on the peripheral side of the positioning member 31. Since when the positioning member 31 lifts the plate 200 to be processed, only one side of the plate 200 to be processed may be tilted, resulting in the distance between the place where the plate 200 to be processed is away from the positioning member 31 and the supporting surface 11 not reaching the preset value, thereby causing the position sensor 32 to fail to issue an alarm signal and fail to inform the whole plate of failure, affecting the normal operation of the whole plate device 105. By locating the position sensor 32 on the peripheral side of the positioning member 31, an alarm signal can be issued in time when the positioning member 31 lifts the plate 200 to be processed, thereby ensuring the normal operation of the whole plate device 105.

[0053] Reference Figure 2-Figure 5 As shown, Figure 5This is a schematic diagram of the structure of the whole plate device provided in an embodiment of the present application, viewed from above. The limiting assembly 2 includes a first movable member 21, a first limiting member 22, a first driving member 25, a second movable member 23, a second limiting member 24, and a second driving member 26. The first movable member 21 and the first limiting member 22 are respectively arranged on either side of the support plate 1 along its length. The first driving member 25 is arranged on the side of the support plate 1 facing away from the support surface 11 and is connected to the first movable member 21. It is used to drive the first movable member 21 to push the plate 200 to be processed into contact with the first limiting member 22, thereby limiting the plate 200 to be processed in its length direction.

[0054] The second movable member 23 and the second limiting member 24 are respectively disposed at both ends of the carrier plate 1 along the width direction of the carrier plate 1. The second driving member 26 is disposed on the side of the carrier plate 1 facing away from the carrier surface 11 and is connected to the second movable member 23. It is used to drive the second movable member 23 to push the plate 200 to be processed into contact with the second limiting member 24, thereby limiting the position of the plate 200 to be processed in the width direction. The preset position is the position of the plate 200 to be processed when it contacts the first limiting member 22 and the second limiting member 24, respectively.

[0055] In this embodiment, four first movable members 21 and four second movable members 23 are provided respectively to ensure stability when pushing the plate 200 to be processed. It can be understood that in other embodiments, the number of first movable members 21 and second movable members 23 can be set as needed.

[0056] Reference Figure 4 and Figure 5 As shown, the supporting plate 1 is provided with a first through hole and a second through hole. A first limiting member 22 is movably disposed in the first through hole. A second limiting member 24 is movably disposed in the second through hole. The limiting assembly 2 further includes a third driving member 27 and a fourth driving member 28. The third driving member 27 is disposed on the side of the supporting plate 1 facing away from the supporting surface 11 and is connected to the first limiting member 22, and is used to drive the first limiting member 22 to move along the height direction of the supporting plate 1. The fourth driving member 28 is disposed on the side of the supporting plate 1 facing away from the supporting surface 11 and is connected to the second limiting member 24, and is used to drive the second limiting member 24 to move along the height direction of the supporting plate 1.

[0057] When the plate 200 to be processed is in a preset position, the first limiting member 22 is driven to move along the height direction of the supporting plate 1 by the third driving member 27, and the second limiting member 24 is driven to move along the height direction of the supporting plate 1 by the fourth driving member 28, so that the upper surfaces of the first limiting member 22 and the second limiting member 24 are flush with or lower than the supporting surface 11, so as to reduce the situation where the first limiting member 22, the second limiting member 24 and the positioning member 31 squeeze the plate 200 to be processed at the same time, thereby ensuring the quality of the plate 200 to be processed.

[0058] Reference Figure 2 and Figure 4 As shown, the whole plate device 105 also includes an eccentric pin 4, which is arranged on the supporting plate 1 and is used to position the plate 200 to be processed when the processing accuracy required for the plate 200 is not high, so as to improve the working efficiency of the whole plate device 105, and the applicability of the whole plate device 105 is improved by the two positioning methods of the limit component 2 plus the positioning component 3 and the eccentric pin 4.

[0059] In a specific application scenario, during processing, the moving device grabs the substrate from the loading and unloading device 102 for loading to the carrying plate 1, and then drives the first movable member 21 to move in a direction close to the first limit member 22 through the first driving member 25, and drives the second movable member 23 to move in a direction close to the second limit member 24 through the second driving member 26, so that the substrate abuts against the first limit member 22 and the first limit member 22 respectively, completing the rough positioning of the substrate;

[0060] The first limiting member 22 is driven by the third driving member 27 to move in the height direction of the carrying plate 1, and the second limiting member 24 is driven by the fourth driving member 28 to move in the height direction of the carrying plate 1, so that the upper surfaces of the first limiting member 22 and the second limiting member 24 are flush with or lower than the carrying surface 11. Then, the positioning member 31 is driven by the driving cylinder 30 to move in the height direction of the carrying plate 1, so that the positioning member 31 passes through the carrying surface 11 and penetrates the positioning hole provided in the substrate, thereby achieving precise positioning of the substrate;

[0061] After the position adjustment of the substrate is completed, the substrate is grabbed from the carrier plate 1 to the processing platform 103 by the moving device for processing. After processing, the processed substrate is transported to the loading and unloading device 102 for unloading by the moving device;

[0062] If the position sensor 32 sends a signal, it proves that the plate 200 to be processed is lifted by the positioning member 31. The controller issues an alarm based on the signal sent by the position sensor 32, and transmits the alarm signal to the host computer to request manual intervention.

[0063] Alternatively, positioning can also be performed using the eccentric pin 4. First, the substrate is placed on the processing platform 103, and the substrate is positioned through the positioning holes of the substrate and the pins on the processing platform 103. The Y-axis coordinate of the processing platform 103 is initially set, and then the substrate is translated from the processing platform 103 to the carrier plate 1 through the moving device. The position of the eccentric pin 4 is rotated so that the eccentric pin 4 abuts against the substrate to complete the positioning of the substrate.

[0064] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A whole board device, characterized in that, include: A carrying plate, wherein the carrying plate is provided with a carrying surface for placing the plate to be processed; A limiting assembly, the limiting assembly being movably arranged on the peripheral side of the carrying plate and used for limiting the plate to be processed so that the plate to be processed is at a preset position; A positioning assembly is provided in the bearing interval of the bearing plate, and the positioning assembly can move along the height direction of the bearing plate. When the plate to be processed is in a preset position, the limiting assembly moves in a direction away from the plate to be processed, and the positioning assembly passes through the bearing surface and positions the positioning hole of the plate to be processed.

2. The whole board device according to claim 1, characterized in that: The positioning assembly includes a positioning member, the positioning member is arranged in the bearing interval of the bearing plate, and the positioning member can move along the height direction of the bearing plate; The positioning member includes a connecting portion and a positioning portion, the positioning portion is provided with a first end and a second end, the connecting portion is connected to the second end and is located at the lower part of the positioning portion, and the cross-sectional area of the positioning portion gradually decreases along the direction from the second end to the first end.

3. The whole board device according to claim 1, characterized in that: The positioning assembly includes a positioning member, which is arranged in the bearing interval of the bearing plate and can move along the height direction of the bearing plate. The positioning member is configured as a conical pin.

4. The whole board device according to claim 2, characterized in that: The positioning assembly further includes a driving cylinder, which is disposed on a side of the supporting plate facing away from the supporting surface and connected to the positioning member, and is used to drive the positioning member to move along the height direction of the supporting plate.

5. The whole board device according to claim 2, characterized in that: The positioning assembly also includes a position sensor and a controller. The supporting surface is provided with a groove. The position sensor is arranged in the groove and is used to send a signal when the distance between the plate to be processed and the supporting surface is greater than a preset value. The controller is connected to the position sensor and is used to issue an alarm based on the signal sent by the position sensor.

6. The whole board device according to claim 5, characterized in that: The groove is arranged on the peripheral side of the positioning member.

7. The panel-forming device according to any one of claims 1 to 6, characterized in that: The limiting assembly includes a first movable part, a first limiting part and a first driving part. The first movable part and the first limiting part are respectively arranged on both sides of the supporting plate along the length direction of the supporting plate. The first driving part is arranged on the side of the supporting plate facing away from the supporting surface and is connected to the first movable part, and is used to drive the first movable part to push the plate to be processed to abut against the first limiting part.

8. The whole board device according to claim 7, characterized in that: The limiting assembly also includes a second movable part, a second limiting part and a second driving part. The second movable part and the second limiting part are respectively arranged at both ends of the supporting plate along the width direction of the supporting plate. The second driving part is arranged on the side of the supporting plate facing away from the supporting surface and is connected to the second movable part, and is used to drive the second movable part to push the plate to be processed to abut against the second limiting part.

9. The whole board device according to claim 8, characterized in that: The limiting assembly further includes a third driving member and a fourth driving member, wherein the third driving member is disposed on a side of the supporting plate facing away from the supporting surface and connected to the first limiting member, and is used to drive the first limiting member to move along the height direction of the supporting plate; The fourth driving member is disposed on a side of the supporting plate facing away from the supporting surface and is connected to the second limiting member, and is used to drive the second limiting member to move along the height direction of the supporting plate.

10. A substrate processing device, characterized in that: It includes a machine tool, a processing platform, a moving device and a whole-plate device as described in any one of claims 1 to 9, the processing platform and the whole-plate device are respectively arranged on the machine tool, and the moving device is used to transport the substrate to the whole-plate device for whole-plate processing, and to transport the substrate on the whole-plate device to the processing platform for processing.

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