Ceramic surface polishing device

Abstract

The utility model discloses a ceramic surface polishing device in the field of ceramic machining, the ceramic surface polishing device comprises an equipment box, a drying mechanism, a moving mechanism and a polishing mechanism, the drying mechanism and the polishing mechanism are both fixedly connected to the top end of the equipment box, and the moving mechanism is slidably connected among the equipment box, the drying mechanism and the polishing mechanism; the drying mechanism and the polishing mechanism communicate with the interior of the equipment box, telescopic hoses are arranged on the two sides of the polishing mechanism and communicate with an external water source, the side wall of the equipment box communicates with a water pumping pipe, the water pumping pipe is provided with a water suction pump, the drying mechanism comprises a drying box and a plurality of water suction assemblies, and the water suction ends of the water suction assemblies point to one side of the equipment box; and the water absorption assembly is telescopic. The device can use the drying mechanism to wipe off residual water spots on the ceramic tiles after polishing, so that workers can conveniently observe whether the ceramic tiles are polished in place or not.

Description

Technical Field

[0001] The utility model belongs to the field of ceramic processing, in particular to a ceramic surface polishing device. Background Art

[0002] Ceramic tiles are a kind of acid- and alkali-resistant porcelain or stone building or decorative material made of refractory metal oxides and semi-metal oxides through a process of grinding, mixing, pressing, glazing, and sintering. Their raw materials are mostly a mixture of clay, quartz sand, etc., and are smoother than solid tiles. Polished tiles are mainly used in kitchens and interior decoration projects, such as our usual floor tiles, interior wall tiles, and many side wall tiles. The main advantage of polished tiles is that they are composed of natural minerals, so they do not contain any radioactive elements and are not harmful to the human body. Existing polishing devices for tile production generally do not have fixing and dust removal functions. During the polishing process of tiles, the tiles may move because they are not fixed properly, affecting the polishing effect and work efficiency of the tiles. At the same time, a large amount of dust will be generated during the polishing process of tiles. If it is not handled, it will not only affect the operation of the machine, but also make the working environment of the workers worse and endanger the health of the workers.

[0003] The patent with the announcement number "CN 115533724 A" discloses "a surface polishing device for ceramic tile production", which includes a ceramic tile production polishing device body, the ceramic tile production polishing device body includes a working platform and a support frame, and the upper surface of the working platform is provided with four slide grooves for assisting translation. The present invention adopts the cooperation between the filtering mechanism, the spraying mechanism and the barrier leakage plate, and the mutual cooperation between the filter screen plate and the sealing door to receive and filter the polished dust and spray water, which is convenient for replacement and cleaning. The mutual cooperation between the suction pump, the circulation pipe and the spray head can cool the polishing head when it is operating at high speed, and at the same time effectively reduce the dust from polishing, thereby reducing the physical harm to the workers. The provision of the telescopic hose facilitates the cleaning of the corners above the working platform, thereby enhancing the overall practical effect of the device.

[0004] During the polishing process, the device sprays water on the tiles through the sprinkler head to reduce temperature and prevent dust. However, after spraying, the water mixed with the polished dust accumulates on the surface of the tiles. Since the tiles are parallel to the ground, the water cannot flow down along the tiles, so the polishing condition of the tiles cannot be clearly observed. After the polishing is completed, the water stains on the surface need to be wiped off manually to observe whether the polishing is complete. Utility Model Content

[0005] The utility model is intended to provide a ceramic surface polishing device to solve the problem that in the existing polishing process, water mixed with polished dust accumulates on the surface of the tile, resulting in the inability to clearly observe whether the tile is completely polished.

[0006] A ceramic surface polishing device in this scheme includes an equipment box, a drying mechanism, a moving mechanism and a polishing mechanism. The drying mechanism and the polishing mechanism are both fixedly connected to the top of the equipment box, and the drying mechanism and the polishing mechanism are located on the same horizontal line. The moving mechanism is slidably connected between the drying mechanism and the polishing mechanism. The drying mechanism and the polishing mechanism are both connected to the interior of the equipment box. Telescopic hoses are provided on both sides of the polishing mechanism, and the telescopic hoses are connected to an external water source. The drying mechanism includes a drying box and multiple water absorption components. The water absorption end of the water absorption component points to one side of the equipment box, and the water absorption component is retractable. The side wall of the equipment box is connected to a water suction pipe, and the water suction pipe is provided with a water pump.

[0007] The working principle of this solution is as follows: when in use, the ceramic tile is placed on the surface of the moving mechanism, the moving mechanism drives the ceramic tile to enter the bottom of the polishing mechanism, the polishing mechanism is started to polish the ceramic tile, and the external water source is turned on during polishing. The external water source sprays water to the polishing area through the telescopic hose to achieve the functions of dust prevention and temperature reduction. When polishing is completed, the moving mechanism is started to drive the ceramic tile to move to the bottom of the drying mechanism, the water absorption component is started to descend, the water absorption end contacts the ceramic tile surface, and the water stains on the ceramic tile surface are absorbed. The ceramic tile is then removed, and it can be observed in the device whether the ceramic tile is completely polished. If not, it can be moved to the bottom of the polishing mechanism for re-polishing.

[0008] Beneficial effects: 1. The device can use the drying mechanism to wipe off the residual water stains on the tiles after polishing, making it easier for workers to observe whether the tiles are polished properly;

[0009] 2. The device can spray water during polishing to avoid dust generated during polishing that affects the health of workers, and can effectively cool the tiles being polished;

[0010] 3. The water sprayed during polishing and the impurities polished out can directly flow into the equipment box below and be extracted through the suction pipe and water pump to facilitate the cleaning of the device.

[0011] Furthermore, the water absorption assembly includes a first electric telescopic rod and water-absorbing cotton. The first electric telescopic rod is fixedly connected to the inner top of the drying box, and the telescopic end of the first electric telescopic rod is fixedly connected to the water-absorbing cotton. During use, the first electric telescopic rod drives the water-absorbing cotton downward until it contacts the surface of the tile. When the moving mechanism drives the tile back and forth, the water stains on the tile surface are wiped away.

[0012] Furthermore, the polishing mechanism includes a polishing frame, multiple polishing pads, and multiple second electric telescopic rods. The polishing frame is fixedly connected to the equipment box. The multiple second electric telescopic rods are rotatably connected to the inner top of the polishing frame. The multiple second electric telescopic rods are fixedly connected to a motor that drives their rotation. The telescopic ends of the multiple second electric telescopic rods are all pointed toward the equipment box. The multiple polishing pads are fixedly connected to the telescopic ends of the second electric telescopic rods. The multiple electric telescopic rods can drive the polishing pads to descend until they contact the surface of the tile. Then, the motor of the second electric telescopic rod is activated to drive the second electric telescopic rod and the polishing pads below to rotate, thereby polishing the tile surface.

[0013] The moving mechanism further comprises a moving plate and two tracks. The two tracks are formed on the inner sidewalls of the equipment box and extend from one end of the drying mechanism to one end of the polishing mechanism. The two ends of the moving plate are slidably connected to the two tracks, and the moving plate is fixedly connected to a motor that drives its translation. When a tile is placed on the moving plate, the moving plate drives the tile along the tracks, driving the tile into the polishing and drying mechanisms for the corresponding operations.

[0014] Furthermore, a non-slip pad is fixedly connected to the surface of the movable plate, and the non-slip pad is slightly smaller than the movable plate. The non-slip pad can ensure that the tiles do not shift during the movement, polishing, and drying process on the movable plate.

[0015] Furthermore, multiple third electric telescopic rods are installed on both sides of the movable plate near the track. The telescopic ends of each of the third electric telescopic rods point toward the center of the movable plate, and each of the third electric telescopic rods is fixedly connected to a rubber pad. When a tile is placed on the anti-slip mat, the third electric telescopic rods on both sides can be activated and moved simultaneously toward the movable plate until the rubber pads on both sides clamp the tile, preventing it from falling off and ensuring that the tile is positioned in the center of the movable plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of a ceramic surface polishing device according to the present invention;

[0017] Figure 2 for Figure 1 A partial cross-sectional view of . DETAILED DESCRIPTION

[0018] The following is further described in detail through specific implementation methods:

[0019] The figure marks in the drawings of the specification include: equipment box 1, drying mechanism 2, drying box 21, first electric telescopic rod 22, absorbent cotton 23, polishing mechanism 3, polishing frame 31, second electric telescopic rod 32, polishing sheet 33, moving mechanism 4, third electric telescopic rod 41, rubber pad 42, track 43, anti-slip pad 44, moving plate 45, water suction pipe 5, telescopic hose 6.

[0020] The embodiment is basically as shown in the attached Figures 1 and 2 As shown: A ceramic surface polishing device includes an equipment box 1, a drying mechanism 2, a polishing mechanism 3 and a moving mechanism 4. The drying mechanism 2 and the polishing mechanism 3 are respectively fixedly connected to the two ends of the equipment box 1, and the bottoms of the drying mechanism 2 and the polishing mechanism 3 are connected to the equipment box 1. The moving mechanism 4 is located at the top of the equipment box 1 and can pass through the interiors of the drying mechanism 2 and the polishing mechanism 3. The side wall of the equipment box 1 is connected to a water pump 5, and the water pump 5 is provided with a water pump. Both sides of the polishing mechanism 3 are provided with a telescopic hose 6, which is connected to an external water source.

[0021] The drying mechanism 2 includes a drying box 21 and two first electric telescopic rods 22. The drying box 21 is fixedly connected to the top of the equipment box 1. The two first electric telescopic rods 22 are fixedly connected to the inner top of the drying box 21, and the telescopic ends are both directed towards the equipment box 1. The telescopic ends of the two first electric telescopic rods 22 are both fixedly connected to absorbent cotton 23.

[0022] The polishing mechanism 3 includes a polishing frame 31, six second electric telescopic rods 32 and six polishing pads 33. The polishing frame 31 is fixedly connected to the top of the equipment box 1. The six second electric telescopic rods 32 are all rotatably connected to the side of the polishing frame 31 facing the equipment box 1, and the telescopic ends are all pointing to the equipment box 1. The second electric telescopic rods 32 are all fixedly connected to the motor, and the six polishing pads 33 are all fixedly connected to the telescopic ends of the second electric telescopic rods 32.

[0023] The moving mechanism 4 includes a moving plate 45, an anti-slip pad 44 and two rails 43. The two rails 43 are located on the front and rear sides of the equipment box 1, and the two rails 43 are parallel to each other. Both rails 43 extend from one end containing the drying mechanism 2 to one end of the polishing mechanism 3. The moving plate 45 is slidably connected between the two rails 43. The moving plate 45 is fixedly connected to a linear motor. The anti-slip pad 44 is fixedly connected to the top of the moving plate 45, and the anti-slip pad 44 is slightly smaller than the moving plate 45. Two third electric telescopic rods 41 are provided on one side of the moving plate 45 close to the two rails 43. The third electric telescopic rod 41 is fixedly connected to the moving plate 45. The telescopic ends of the third electric telescopic rod 41 both point to the center of the moving plate 45, and the telescopic ends of the third electric telescopic rod 41 are fixedly connected to rubber pads 42.

[0024] The specific implementation process is as follows: when in use, place the tile on the anti-slip pad 44, then start the four third electric telescopic rods 41 to drive the rubber pad 42 to move toward the tile, so that the rubber pad 42 contacts the side wall of the tile, and fix the tile on the rubber pad 42, then drive the linear motor of the movable plate 45 to drive the tile to enter the bottom of the polishing rack 31, start the second electric telescopic rod 32, and make the polishing plate 33 drop down until it contacts the surface of the tile, and then start the motor to drive the second electric telescopic rod 32 to rotate to polish the surface of the tile. At the same time, turn on the external water source so that the external water source flows out through the telescopic hose 6. The telescopic hose 6 can be arbitrarily extended to the desired position to cool the tile and prevent dust. When polishing is completed, the linear motor of the movable plate 45 can be started to drive the tile into the drying box 21, and then start the first electric telescopic rod 22 to drive the absorbent cotton 23 to drop until the absorbent cotton 23 contacts the surface of the tile. During the movement, the absorbent cotton 23 wipes off the water stains on the surface of the tile, and you can intuitively observe whether the tile is polished perfectly.

[0025] The above is only an embodiment of the present invention, and the commonly known specific structures and characteristics of the scheme are not described in detail here. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the structure of the present invention, and these should also be regarded as the scope of protection of the present invention. These will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection claimed by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A ceramic surface polishing device, characterized in that: It includes an equipment box, a drying mechanism, a moving mechanism and a polishing mechanism. The drying mechanism and the polishing mechanism are fixedly connected to the top of the equipment box, and the drying mechanism and the polishing mechanism are located on the same horizontal line. The moving mechanism is slidably connected between the drying mechanism and the polishing mechanism. The drying mechanism and the polishing mechanism are both connected to the interior of the equipment box. Telescopic hoses are provided on both sides of the polishing mechanism, and the telescopic hoses are connected to an external water source. The drying mechanism includes a drying box and multiple water absorption components. The water absorption end of the water absorption component points to one side of the equipment box, and the water absorption component is retractable. The side wall of the equipment box is connected to a water suction pipe, and the water suction pipe is provided with a water pump.

2. A ceramic surface polishing device according to claim 1, characterized in that: The water absorption component includes a first electric telescopic rod and water-absorbing cotton. The first electric telescopic rod is fixedly connected to the inner top of the drying box, and the telescopic end of the first electric telescopic rod is fixedly connected to the water-absorbing cotton.

3. A ceramic surface polishing device according to claim 2, characterized in that: The polishing mechanism includes a polishing frame, multiple polishing plates and multiple second electric telescopic rods. The polishing frame is fixedly connected to the equipment box. The multiple second electric telescopic rods are rotatably connected to the inner top of the polishing frame. The multiple second electric telescopic rods are fixedly connected to a motor that drives them to rotate. The telescopic ends of the multiple second electric telescopic rods all point to the equipment box. The multiple polishing plates are fixedly connected to the telescopic ends of the second electric telescopic rods.

4. A ceramic surface polishing device according to claim 3, characterized in that: The moving mechanism includes a moving plate and two tracks. The two tracks are opened on the inner wall of the equipment box, and the two tracks extend from one end of the drying mechanism to one end of the polishing mechanism. The two ends of the moving plate are respectively slidably connected to the two tracks, and the moving plate is fixedly connected to a motor that drives it to move horizontally.

5. A ceramic surface polishing device according to claim 4, characterized in that: The surface of the movable plate is fixedly connected with an anti-skid pad, which is slightly smaller than the movable plate.

6. A ceramic surface polishing device according to claim 5, characterized in that: A plurality of third electric telescopic rods are provided on both sides of the movable plate close to the track, the telescopic ends of the plurality of third electric telescopic rods all point to the center of the movable plate, and the telescopic ends of the plurality of third electric telescopic rods are all fixedly connected with rubber pads.

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