Multi-layer lifting material receiving mechanism for circuit boards
By designing a multi-layer lifting and collecting mechanism for circuit boards, and using partition strips and sensors to achieve multi-layer accurate positioning, the existing problems of time-consuming, labor-intensive and untidy collection are solved, and efficient and stable collection of circuit boards is achieved.
Patent Information
- Application Number
- CN202422146307.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-03
AI Technical Summary
The existing circuit board collection method is time-consuming and labor-intensive, the positioning is inaccurate and not neat enough, which leads to high human resources consumption and is not conducive to subsequent packaging or packaging.
A multi-layer lifting and collecting mechanism for circuit boards is designed, using vertical mounting plates, lifting devices and collecting mechanisms. The material is collected in layers through partition strips, combined with sensors and limiting parts to ensure the accurate positioning of each layer of circuit boards, and the lifting and collecting mechanism are controlled through the lifting device.
It realizes efficient and stable material collection of multi-layer circuit boards, reduces manual operations, improves the neatness and stability of material collection, and facilitates subsequent work.
Smart Images
Figure CN223239174U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit board material receiving devices, in particular to a multi-layer lifting and receiving mechanism for circuit boards. Background Art
[0002] With the development of the electronics industry, the demand for high-end products such as precision circuit boards, thick board backplanes, and HDI boards is increasing. The processed circuit boards need to be uniformly sorted and collected. At present, the existing circuit board collection method is generally that the circuit boards are stacked together after being unloaded by the circuit board grinding machine, or moved along the unloading roller, and then manually sorted and collected and packaged one by one. The labor intensity is high and the human resource consumption is large. Some suction cup-type mechanical arms are used for material collection, which has a narrow working range, poor stability, and cannot be accurately positioned. The circuit boards after collection are not stacked neatly, which is not conducive to subsequent packaging or boxing. Utility Model Content
[0003] The purpose of the utility model is to provide a multi-layer lifting and receiving mechanism for circuit boards to solve the problems of time-consuming and labor-intensive receiving of circuit boards, inaccurate positioning, and lack of neatness.
[0004] Technical Solution: This utility model provides a multi-layer lifting and receiving mechanism for circuit boards, comprising: a set of vertical mounting plates, a lifting device, and a receiving mechanism. The vertical mounting plates are vertically symmetrically arranged, with connecting plates disposed below the plates. A sliding mechanism is provided on each of the vertical mounting plates. The lifting device is disposed below the plates and connected to the connecting plates, controlling the up and down movement of the connecting plates. The receiving mechanism comprises: a support plate, a receiving rack, a divider bar, a sensor, and a limiter. The support plate is disposed on the connecting plate, and a receiving rack is disposed above the support plate. The receiving rack is divided into multiple layers of receiving spaces by a plurality of evenly spaced divider bars. The sensor is disposed within each receiving space on the receiving rack, and the limiter is disposed on one side of the receiving rack, extending through the receiving rack and provided on each receiving space. The mechanism allows for multi-layer receiving, with a limiter on each layer ensuring that each layer of circuit boards is properly received. The sensor senses whether a circuit board is loaded within each receiving space and sends a signal to the lifting device to control the raising and lowering of the receiving mechanism.
[0005] Furthermore, in the above-mentioned multi-layer lifting and receiving mechanism for circuit boards, the sliding mechanism includes: a slide rail and a sliding block, the slide rail is arranged on the vertical mounting plate, the sliding block is arranged on the vertical mounting plate and is slidably connected and connected to the connecting plate.
[0006] Furthermore, the above-mentioned multi-layer lifting and collecting mechanism for circuit boards, the lifting device includes: a base plate, a first support frame, a driving motor, a second support frame, a screw, a rotating shaft, a pulley, a belt, and a lifting connecting piece, the base plate is arranged at a lower position between a group of vertical mounting plates, the first support frame is arranged on one side of the base plate, the driving motor is arranged on the first support frame, the second support frame is arranged on the other side of the base plate, the screw is vertically arranged on the second support frame, connected by setting a rotating shaft, the pulley is arranged below the screw, the belt connects the pulley and the output end of the driving motor, the lifting connecting piece is arranged on the screw, and the lifting connecting piece is moved up and down by controlling the rotation of the screw, and the lifting connecting piece is fixedly connected to the connecting plate.
[0007] Furthermore, in the above-mentioned circuit board multi-layer lifting and receiving mechanism, the support plate is a right-angled triangle structure with a hollow design in the middle, thereby improving the support and thus the carrying capacity of the receiving mechanism.
[0008] Furthermore, in the above-mentioned circuit board multi-layer lifting and receiving mechanism, the receiving frame is provided with a plurality of vertical long strip through holes, which facilitates the operator to observe the interior of the receiving mechanism from the holes and can be used as a lightweight design to reduce weight.
[0009] Furthermore, in the above-mentioned multi-layer lifting and receiving mechanism for circuit boards, the receiving rack is provided with an indicator light on the side where the sensor is set, and the indicator light is provided on the receiving rack outside each layer of the receiving space.
[0010] Furthermore, in the above-mentioned multi-layer lifting material receiving mechanism for circuit boards, a fixed plate is provided above the material receiving racks to fix the material receiving racks and improve the stability of the material receiving mechanism.
[0011] Furthermore, in the above-mentioned multi-layer lifting and receiving mechanism for circuit boards, slopes are provided at both ends of the dividing strips to facilitate receiving and discharging of materials.
[0012] It can be seen from the above technical solution that the utility model has the following beneficial effects: the utility model describes a multi-layer lifting and receiving mechanism for circuit boards, in which dividing bars are arranged to divide the receiving rack into layers, thereby being able to carry multiple layers of circuit boards, and the consistency of the stacking position of each layer of circuit boards is ensured by arranging a limit part, and each layer is provided with a sensor, which can sense whether the layer has completed the receiving, and thereby send a signal to the lifting mechanism to control the lifting and lowering of the receiving mechanism, thereby reducing manual operation, saving time and effort, having high stability, and facilitating subsequent work. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the structure of a multi-layer lifting and receiving mechanism for circuit boards in the utility model;
[0014] Figure 2 This is a schematic diagram of the material receiving mechanism of the utility model;
[0015] Figure 3 This is a schematic diagram of the sliding mechanism of the utility model;
[0016] Figure 4 This is a schematic diagram of the lifting device of the utility model.
[0017] In the figure: vertical mounting plate 1, lifting device 2, material receiving mechanism 3, connecting plate 11, sliding mechanism 12, bottom plate 21, first support frame 22, drive motor 23, second support frame 24, screw 25, rotating shaft 26, pulley 27, belt 28, lifting connection 29, support plate 31, material receiving frame 32, dividing bar 33, sensor 34, limit part 35, slide rail 121, sliding block 122, indicator light 321, fixed plate 322. DETAILED DESCRIPTION
[0018] Example 1
[0019] like Figure 1-2 The shown circuit board multi-layer lifting and collecting mechanism includes: a group of vertical mounting plates 1, a lifting device 2, and a collecting mechanism 3, the vertical mounting plates 1 are vertically symmetrically arranged, a connecting plate 11 is provided at the lower part between the vertical mounting plates 1, and a sliding mechanism 12 is provided on the vertical mounting plates 1; the lifting device 2 is arranged at a lower position between a group of vertical mounting plates 1 and is connected to the connecting plate 11 to control the up and down movement of the connecting plate 11; the collecting mechanism 3 includes: a support plate 31, a collecting rack 32, a dividing bar 33, a sensor 34, and a limit part 35, the support plate 31 is arranged on the connecting plate 11, and a collecting rack 32 is arranged above the support plate 31. The collecting rack 32 is divided into multiple layers of collecting space by evenly arranging several layers of dividing bars 33 on the collecting rack 32, and the sensor 34 is arranged in each layer of the collecting space of the collecting rack 32. The limit part 35 is arranged on the outside of one side of the collecting rack 32, passes through the collecting rack 32, and is arranged in each layer of the collecting space. Multi-layer material collection can be performed, and each layer is provided with a limit part 35 to ensure that each layer of circuit boards is collected in the right position. The sensor 34 senses whether there are circuit boards loaded in the material collection space of each layer, and then sends a signal to the lifting device 2 to control the lifting of the material collection mechanism 3.
[0020] like Figure 3 The shown circuit board multi-layer lifting and collecting mechanism, the sliding mechanism 12 includes: a slide rail 121, a sliding block 122, the slide rail 121 is set on the vertical mounting plate 1, the sliding block 122 is set on the vertical mounting plate 1 and is slidably connected and connected to the connecting plate 11.
[0021] In this embodiment, the support plate 31 is a right triangle structure with a hollow design in the middle to improve the support performance and thus improve the bearing capacity of the material receiving mechanism 3.
[0022] Example 2
[0023] On the basis of Example 1, in this embodiment, as Figure 4 The shown embodiment is a multi-layer lifting and receiving mechanism for a circuit board, wherein the lifting device 2 includes: a base plate 21, a first support frame 22, a drive motor 23, a second support frame 24, a screw 25, a rotating shaft 26, a pulley 27, a belt 28, and a lifting connection member 29. The base plate 21 is arranged at a lower position between a group of vertical mounting plates 1, the first support frame 22 is arranged on one side of the base plate 21, the drive motor 23 is arranged on the first support frame 22, and the second support frame 24 is arranged on the other side of the base plate 21. The screw 25 is vertically arranged on the second support frame 24 and is connected by setting a rotating shaft 26. The pulley 27 is arranged below the screw 25, and the belt 28 connects the pulley 27 and the output end of the drive motor 23. The lifting connection member 29 is arranged on the screw 25. By controlling the rotation of the screw 25, the lifting connection member 29 is moved up and down, and the lifting connection member 29 is fixedly connected to the connecting plate 11.
[0024] like Figure 2 The illustrated circuit board multi-layer lifting and receiving mechanism has a plurality of vertical long strip through holes on the receiving frame 32. This allows the operator to observe the interior of the receiving mechanism 3 from the holes, and can also be used as a lightweight design to reduce weight.
[0025] like Figure 1 The illustrated circuit board multi-layer lifting and receiving mechanism has an indicator light 321 located on the side of the sensor 34. Each indicator light 321 is located on the outside of each receiving space on the receiving rack 32. Whenever a circuit board is placed in the receiving space on that layer, the corresponding indicator light 321 on the outside of that layer lights up, alerting the operator.
[0026] In this embodiment, a fixing plate 322 is provided above the material receiving racks 32 to fix the material receiving racks 32 and improve the stability of the material receiving mechanism 3 .
[0027] In this embodiment, slopes are provided at both ends of the dividing strip 33 to facilitate material collection and discharge.
[0028] It should be noted that the above description is merely a technical solution of the utility model and is not intended to be limiting. Although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art will appreciate that modifications or equivalent substitutions may be made to the technical solution of the utility model without departing from the scope of the technical solution of the utility model, and such modifications or equivalent substitutions shall be encompassed by the claims of the utility model.
Claims
1. A multi-layer lifting and receiving mechanism for circuit boards, characterized by: include: A group of vertical mounting plates (1), wherein the vertical mounting plates (1) are vertically symmetrically arranged, a connecting plate (11) is arranged at the lower portion between the vertical mounting plates (1), and a sliding mechanism (12) is arranged on the vertical mounting plates (1); A lifting device (2), the lifting device (2) is arranged below a group of vertical mounting plates (1) and connected to the connecting plate (11) to control the up and down movement of the connecting plate (11); A material receiving mechanism (3), the material receiving mechanism (3) comprising: a support plate (31), a material receiving rack (32), a dividing bar (33), a sensor (34), and a position limiting portion (35); the support plate (31) is arranged on a connecting plate (11); a material receiving rack (32) is arranged above the support plate (31); the material receiving rack (32) is divided into multiple layers of material receiving spaces by evenly arranging a plurality of layers of dividing bars (33) on the material receiving rack (32); the sensor (34) is arranged in each layer of material receiving space of the material receiving rack (32); the position limiting portion (35) is arranged outside one side of the material receiving rack (32), passes through the material receiving rack (32), and is arranged in each layer of material receiving space.
2. A circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: The sliding mechanism (12) comprises a sliding rail (121) and a sliding block (122). The sliding rail (121) is arranged on the vertical mounting plate (1). The sliding block (122) is arranged on the vertical mounting plate (1) and is slidably connected thereto and is connected to the connecting plate (11).
3. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: The lifting device (2) comprises: a base plate (21), a first support frame (22), a drive motor (23), a second support frame (24), a lead screw (25), a rotating shaft (26), a pulley (27), a belt (28), and a lifting connecting member (29); the base plate (21) is arranged at a lower position between a group of vertical mounting plates (1); the first support frame (22) is arranged on one side of the base plate (21); the drive motor (23) is arranged on the first support frame (22); the second support frame (24) is arranged On the other side of the base plate (21), the lead screw (25) is vertically arranged on the second support frame (24) and connected by setting a rotating shaft (26). The pulley (27) is arranged below the lead screw (25). The belt (28) connects the pulley (27) and the output end of the drive motor (23). The lifting connection member (29) is arranged on the lead screw (25). By controlling the rotation of the lead screw (25), the lifting connection member (29) is moved up and down. The lifting connection member (29) is fixedly connected to the connecting plate (11).
4. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: The support plate (31) is a right-angled triangle structure with a hollow design in the middle.
5. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: The material receiving rack (32) is provided with a plurality of vertical long strip through holes.
6. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: The material receiving rack (32) is provided with an indicator light (321) on the side where the sensor (34) is provided, and the indicator light (321) is provided on the material receiving rack (32) outside each layer of the material receiving space.
7. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: A fixing plate (322) is provided above the material receiving racks (32).
8. The circuit board multi-layer lifting and receiving mechanism according to claim 1, characterized in that: Both ends of the dividing strip (33) are provided with slopes.