Radial adjusting device of wafer electroplating module
By designing the radial adjustment device of the wafer electroplating module, the thread coordination between the adjustment module and the connection module is used to solve the problem of installation error of the electroplating module, the alignment between the electroplating module center and the electrolytic cell center is achieved, and the plating quality is improved.
Patent Information
- Application Number
- CN202422122266.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-30
AI Technical Summary
In the semiconductor packaging electroplating process, when the electroplating module is fixedly installed on the main structural frame, artificial installation errors are prone to occur, resulting in position deviations in the wafer immersion into the electrolytic cell, affecting the plating quality.
A radial adjustment device for wafer electroplating module is designed, including a movable adjustment module and a connection module. The alignment adjustment between the center of the electroplating module and the center of the electrolytic cell is achieved through thread coordination, and locking components are used to ensure accurate and stable adjustment.
By cooperating with the threads of the adjustment module and the connection module, the center position of the electroplating module can be accurately adjusted, the installation errors are eliminated, the wafer center is aligned with the electrolytic cell center, and the plating quality is improved.
Smart Images
Figure CN223240195U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a radial adjustment device for a wafer electroplating module. Background Art
[0002] In the semiconductor packaging electroplating process, the electroplating module is fixedly installed on the main structural frame, and the wafer is loaded on the bottom surface of the electroplating module to form the cathode. As the main structural frame drives the movement of the electroplating module, the wafer is gradually immersed in the electrolyte of the electrolytic tank from top to bottom for electroplating.
[0003] However, during the actual installation process, when the electroplating module is fixedly installed on the main structure frame, human installation errors are prone to occur, and it is difficult to ensure that the center of the electroplating module is aligned with the center of the electrolytic tank, which causes the position of the wafer immersed in the electrolytic tank to deviate, affecting the electroplating quality. Therefore, it is urgent to design a radial adjustment device for the wafer electroplating module. Summary of the Invention
[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a new radial adjustment device for a wafer electroplating module.
[0005] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows:
[0006] A radial adjustment device for a wafer electroplating module, comprising an adjustment module movably arranged on a main structural frame, a connecting module fixedly connected to the electroplating module, and a locking component for locking or unlocking the adjustment module and / or the electroplating module relative to the main structural frame, wherein an adjustment channel extending along the radial direction of the wafer is formed on the adjustment module, the connecting module is inserted into the adjustment channel, and the connecting module forms a threaded fit with the inner wall of the adjustment channel, when unlocked, the adjustment module drives the connecting module and drives the electroplating module to reciprocate along the radial direction of the wafer; when locked, the adjustment module, the connecting module and the main structural frame are relatively fixed.
[0007] Preferably, when unlocked, the adjustment module can be freely rotated around the center line of the adjustment channel, thereby facilitating manual operation by staff.
[0008] Preferably, the inner wall of the adjustment channel is formed with a first mating surface and a second mating surface arranged sequentially along its length, and the surface of the connection module is sequentially formed with a third mating surface and a fourth mating surface. The first mating surface and the third mating surface are threadedly engaged, and the second mating surface and the fourth mating surface are in contact. During adjustment, the first mating surface drives the third mating surface to move, and the second mating surface and the fourth mating surface slide synchronously relative to each other. Here, when the first and third mating surfaces cooperate to implement adjustment, the second and fourth mating surfaces are simultaneously combined with the contact sliding to achieve guidance, thereby improving adjustment stability.
[0009] Preferably, the regulating channel comprises a first channel and a second channel with gradually increasing inner diameters, wherein the inner wall of the first channel forms a first mating surface, and the inner wall of the second channel forms a second mating surface.
[0010] According to another specific embodiment and preferred aspect of the present invention, the connection module includes a first block fixedly connected to the electroplating module, and a second block sleeved on the first block and formed with a third mating surface and a fourth mating surface. This provides a simple structure, convenient replacement and maintenance, and low cost.
[0011] Preferably, the first block is formed with an annular groove that matches the second block. The second block is positioned within the annular groove, and opposite ends of the second block correspondingly abut against opposite sidewalls of the annular groove. Here, the second block is positioned with high precision on the first block, ensuring that the first and second blocks move synchronously during adjustment, thereby improving adjustment accuracy.
[0012] Specifically, the second block is spaced apart from the bottom of the annular groove, and the connecting module further includes a plurality of elastic washers sleeved on the first block and spaced side by side between the second block and the bottom of the annular groove. The elastic washers enable vertical adaptability of the second block, eliminating thread fit errors between the adjustment module and the connecting module and preventing the threads from becoming stuck and causing damage.
[0013] Preferably, the first block includes a hollow cylindrical block body, an annular protrusion extending outward from a surface of the block body, and an end plate detachably mounted at one end of the block body, wherein an annular groove is formed between the block body, the annular protrusion, and the end plate. This provides a simple structure and facilitates installation and implementation.
[0014] Preferably, a disc-shaped connecting portion is formed at one end of the block body away from the end plate, and the connecting portion is fixedly connected to the electroplating module by a plurality of bolts distributed at annular intervals.
[0015] Furthermore, the main structural frame is formed with a mounting channel that matches the adjustment module, and the adjustment module is installed within the mounting channel. A plurality of first connection holes are formed in an annular arrangement on the sidewalls of the main structural frame, and a plurality of second connection holes are formed in an annular arrangement on the end face of the adjustment module. The locking component includes a plurality of bolts for correspondingly securing the plurality of first and second connection holes. In this locked state, the connection between the adjustment module, the connection module, and the main structural frame is effectively stabilized, and assembly and disassembly are simplified and convenient.
[0016] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:
[0017] When the electroplating module of the prior art is installed on the main structural frame, it is prone to human installation errors, and it is difficult to ensure that the center of the electroplating module is aligned with the center of the electrolytic tank, which causes the position of the wafer immersed in the electrolytic tank to deviate, affecting the electroplating quality; and the present application comprehensively designs the structure of the radial adjustment device of the wafer electroplating module, cleverly solving the shortcomings and defects of the prior art. After adopting the radial adjustment device, during assembly, the adjustment module is first installed on the main structural frame and is in an unlocked state, and the connecting module is inserted into the adjustment channel of the adjustment module to form a threaded fit; then the connecting module is fixedly connected to the electroplating module, and finally, the movement of the adjustment module drives the connecting module and drives the electroplating module to reciprocate along the radial direction of the wafer to perform alignment adjustment of the center of the electroplating module and the center of the electrolytic tank, and after the adjustment is completed, the adjustment module, the connecting module and the main structural frame are relatively fixed by the locking component. Therefore, compared with the existing technology, the utility model is based on the premise that the electroplating module is installed on the main structure frame, and through the threaded cooperation of the adjustment module and the connection module, the center position of the electroplating module can be precisely adjusted in the radial direction of the wafer, thereby eliminating the installation error of the electroplating module, ensuring that the center of the wafer is aligned with the center of the electrolytic tank, and effectively improving the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the radial adjustment device of the wafer electroplating module of the present invention (partially omitted);
[0019] Figure 2 A half-section schematic diagram (partially omitted) of the radial adjustment device of the wafer electroplating module of the present invention;
[0020] Wherein: J, main structure frame; J0, installation channel; k1, first connection hole; Z, electroplating module;
[0021] 1, adjustment module; k2, second connection hole; t, adjustment channel; t1, first channel; m1, first mating surface; t2, second channel; m2, second mating surface;
[0022] 2. Connection module; 21. First block; 210. Block body; b. Connection portion; 211. Annular protrusion; 212. End plate; c. Annular groove; 22. Second block; m3. Third mating surface; m4. Fourth mating surface; 23. Elastic washer. DETAILED DESCRIPTION
[0023] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0026] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0027] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.
[0029] like Figure 1 and Figure 2 As shown, the radial adjustment device of the wafer electroplating module of this embodiment includes an adjustment module 1 movably arranged on the main structure frame J, a connection module 2 fixedly connected to the electroplating module Z, and a locking component.
[0030] Specifically, a mounting channel J0 matching the adjustment module 1 is formed on the main structural frame J, and the adjustment module 1 is installed in the mounting channel J0; a plurality of first connection holes k1 distributed at an annular interval are formed on the side wall of the main structural frame J, and a plurality of second connection holes k2 distributed at an annular interval are formed on the end face of the adjustment module 1. The locking component includes a plurality of bolts for correspondingly fixing the plurality of first connection holes k1 and the second connection holes k2.
[0031] That is, one end of the adjustment module 1 extends out of the mounting channel J0 and forms a disk body that fits against the side wall of the main structural frame J. A plurality of second connection holes k2 are distributed on the disk body. When locked, a plurality of bolts correspondingly fix each first connection hole k1 and each second connection hole k2 to achieve locking between the adjustment module 1 and the main structural frame J. When unlocked, the bolts are removed to unlock the adjustment module 1 and the main structural frame J, and the adjustment module 1 can rotate freely.
[0032] In this example, the adjustment module 1 is formed with an adjustment channel t extending along the radial direction of the wafer, the connection module 2 is inserted into the adjustment channel t, and the connection module 2 forms a threaded fit with the inner wall of the adjustment channel t. When unlocked, the adjustment module 1 can be freely rotated around the center line of the adjustment channel t, and the adjustment module 1 drives the connection module 2 and drives the electroplating module Z to reciprocate along the radial direction of the wafer; when locked, the adjustment module 1, the connection module 2 and the main structure frame J are relatively fixed.
[0033] For the convenience of implementation, the inner wall of the adjustment channel t is formed with a first mating surface m1 and a second mating surface m2 arranged in sequence along its own length direction, and the surface of the connecting module 2 is formed with a third mating surface m3 and a fourth mating surface m4 in sequence, wherein the first mating surface m1 and the third mating surface m3 are threadedly matched, and the second mating surface m2 and the fourth mating surface m4 are in contact with each other. During adjustment, the first mating surface m1 drives the third mating surface m3 to move, and the second mating surface m2 and the fourth mating surface m4 slide synchronously relative to each other.
[0034] In some specific embodiments, the regulating channel t includes a first channel t1 and a second channel t2 with gradually increasing inner diameters, wherein the inner wall of the first channel t1 forms a first mating surface m1, and the inner wall of the second channel t2 forms a second mating surface m2.
[0035] In this example, the connection module 2 includes a first block 21 fixedly connected to the electroplating module Z, a second block 22 sleeved on the first block 21 and formed with a third mating surface m3 and a fourth mating surface m4, and an elastic washer 23.
[0036] In some specific embodiments, an annular groove c matching the second block 22 is formed on the first block 21, the second block 22 is located in the annular groove c, and the opposite ends of the second block 22 correspondingly abut against the opposite side walls of the annular groove c; the second block 22 and the bottom of the annular groove c are spaced apart; there are multiple elastic washers 23, and the multiple elastic washers 23 are sleeved on the first block 21 and distributed side by side and spaced apart between the second block 22 and the bottom of the annular groove c.
[0037] To further facilitate disassembly and assembly, the first block 21 includes a block body 210 in the shape of a hollow cylinder, an annular protrusion 211 extending outward from the surface of the block body 210, and an end plate 212 detachably arranged at one end of the block body 210, wherein an annular groove c is formed between the block body 210, the annular protrusion 211, and the end plate 212; a disc-shaped connecting portion b is formed at the end of the block body 210 away from the end plate 212, and the connecting portion b is fixedly connected to the electroplating module Z by a plurality of bolts distributed at an annular interval.
[0038] In summary, after adopting the radial adjustment device, during assembly, the adjustment module is first installed on the main structure frame and is in an unlocked state, and the connecting module is inserted into the adjustment channel of the adjustment module to form a threaded fit; then the connecting module is fixedly connected to the electroplating module, and finally the movement of the adjustment module drives the connecting module and drives the electroplating module to reciprocate along the radial direction of the wafer to perform alignment adjustment between the center of the electroplating module and the center of the electrolytic cell, and after the adjustment is completed, the adjustment module, the connecting module and the main structure frame are relatively fixed by the locking component. Therefore, compared with the prior art, the present invention, on the one hand, is based on the premise that the electroplating module is installed on the main structural frame, and through the threaded cooperation of the adjustment module and the connecting module, the center position of the electroplating module is precisely adjusted in the radial direction of the wafer, thereby eliminating the installation error of the electroplating module, ensuring that the center of the wafer is aligned with the center of the electrolytic tank, and effectively improving the quality of electroplating; on the second hand, when the first and third mating surfaces cooperate to implement adjustment, the second and fourth mating surfaces are synchronously combined to slide together to achieve guidance and improve the adjustment stability; on the third hand, the second block has high positioning accuracy on the first block, ensuring that the first and second blocks move synchronously during adjustment to improve the adjustment accuracy; on the fourth hand, by setting an elastic gasket, the second block can be adaptively adjusted in the up and down directions to eliminate the screw thread cooperation error between the adjustment module and the connecting module, and prevent the problem of jamming and damage at the thread cooperation; on the fifth hand, the stability of the connection between the adjustment module, the connecting module and the main structural frame can be effectively improved in the locked state, and the disassembly and assembly are simple and convenient, and it is convenient to replace and repair, and the cost is low.
[0039] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.
Claims
1. A radial adjustment device for a wafer electroplating module, characterized in that: It includes an adjustment module movably arranged on the main structure frame, a connection module fixedly connected to the electroplating module, and a locking component for locking or unlocking the adjustment module and / or the electroplating module relative to the main structure frame, wherein the adjustment module is formed with an adjustment channel extending along the radial direction of the wafer, the connection module is inserted into the adjustment channel, and the connection module forms a threaded fit with the inner wall of the adjustment channel. When unlocked, the adjustment module drives the connection module and drives the electroplating module to reciprocate along the radial direction of the wafer; when locked, the adjustment module, the connection module and the main structure frame are relatively fixed.
2. The radial adjustment device of the wafer electroplating module according to claim 1, characterized in that: When unlocked, the adjustment module can be freely rotated around the center line of the adjustment channel.
3. The radial adjustment device for a wafer electroplating module according to claim 1, wherein: The inner wall of the adjustment channel is formed with a first mating surface and a second mating surface arranged in sequence along its own length direction, and the surface of the connection module is formed with a third mating surface and a fourth mating surface in sequence, wherein the first mating surface and the third mating surface are threadedly matched, and the second mating surface and the fourth mating surface are in contact with each other. During adjustment, the first mating surface drives the third mating surface to move, and the second mating surface and the fourth mating surface slide synchronously relative to each other.
4. The radial adjustment device for a wafer electroplating module according to claim 3, wherein: The regulating channel includes a first channel and a second channel with gradually increasing inner diameters, wherein the inner wall of the first channel forms the first mating surface, and the inner wall of the second channel forms the second mating surface.
5. The radial adjustment device for a wafer electroplating module according to claim 3, wherein: The connection module includes a first block fixedly connected to the electroplating module, and a second block sleeved on the first block and formed with the third matching surface and the fourth matching surface.
6. The radial adjustment device for a wafer electroplating module according to claim 5, characterized in that: An annular groove matching the second block is formed on the first block. The second block is located in the annular groove, and opposite ends of the second block correspondingly abut against opposite side walls of the annular groove.
7. The radial adjustment device for a wafer electroplating module according to claim 6, wherein: The second block is spaced apart from the bottom of the annular groove, and the connection module further comprises a plurality of elastic washers sleeved on the first block and spaced apart side by side between the second block and the bottom of the annular groove.
8. The radial adjustment device of the wafer electroplating module according to claim 6 or 7, characterized in that: The first block includes a block body in the shape of a hollow cylinder, an annular protrusion extending outward from the surface of the block body, and an end plate detachably arranged at one end of the block body, wherein the annular groove is formed between the block body, the annular protrusion and the end plate.
9. The radial adjustment device of the wafer electroplating module according to claim 8, characterized in that: A disc-shaped connecting portion is formed at one end of the block body away from the end plate, and the connecting portion is fixedly connected to the electroplating module through a plurality of bolts distributed at annular intervals.
10. The radial adjustment device of the wafer electroplating module according to claim 1, characterized in that: The main structure frame is formed with a mounting channel matching the adjustment module, and the adjustment module is installed in the mounting channel; a plurality of first connecting holes distributed in an annular manner are formed on the side wall of the main structure frame, and a plurality of second connecting holes distributed in an annular manner are formed on the end face of the adjustment module, and the locking component includes a plurality of bolt members for fixing the plurality of first connecting holes and the second connecting holes to each other.