Substrate for electroplating and electroplating jig

Abstract

The utility model provides a substrate for electroplating and an electroplating clamp, and the substrate for electroplating comprises a plurality of non-conductive clamping plates which are arranged in a stacked manner, and conductive plates which are arranged between every two adjacent non-conductive clamping plates, the non-conductive clamping plate and the conductive plate are provided with a plurality of to-be-electroplated substrate stations and a plurality of groups of first conductive through holes arranged around the to-be-electroplated substrate stations in a penetrating manner along the stacking direction, and each group of first conductive through holes is used for mounting a first conductive pressing piece which is pressed against the first side of one to-be-electroplated substrate; according to the utility model, the substrate for electroplating adopts a substrate structure in which the non-conductive clamping plates and the conductive plates are stacked and alternately arranged, so that the technical problems of high cost, high processing difficulty, large processing precision error, overlarge and uncontrollable overall deformation of the fixture after processing, heavy weight of the full-metal material and the like of the substrate of the electroplating fixture are solved; the technical effects that machining is easy, the precision error is small, the overall deformation of the machined clamp is small, the quality of the manufactured clamp is high, and the automatic transmission burden is small are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating, and more specifically relates to an electroplating substrate and an electroplating fixture. Background Art

[0002] Vertical electroplating of solar cells is a key process in solar cell manufacturing. It aims to form a uniform metal film on the cell surface through vertical electroplating technology, thereby improving the cell's photoelectric conversion efficiency and stability. Vertical electroplating involves connecting the anodes on both sides and the cathode through the plating fixture in the middle. The plating fixture is the part that connects to the cathode.

[0003] Among the existing electroplating fixtures, for example, the patent with publication number CN220867559U discloses a vertical electroplating silicon wafer fixture, which includes a metal carrier frame with a loading station on the carrier frame, and the loading station is suitable for loading silicon wafers; two clamping components are respectively provided on both sides of the carrier frame, and the clamping ends of the clamping components extend into the loading station. During installation, the two clamping components respectively abut against the two sides of the silicon wafer to clamp the silicon wafer. The existing electroplating fixture is firstly made of metal materials (stainless steel, titanium, etc.) as the basis, and secondly, the structure is realized by single-sided spring clamping, manual spring spring clamping, V-shaped spring clamping, etc. The existing technical solutions have the disadvantages of high cost of the all-metal material of the electroplating fixture substrate, greater difficulty in metal processing, and larger metal machining precision error. Utility Model Content

[0004] The purpose of the utility model is to provide a substrate for electroplating and an electroplating fixture, so as to solve the problems of the existing electroplating fixture substrate being made of all metal, being high in cost, and being difficult in metal processing.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] The utility model provides a substrate for electroplating, comprising: a plurality of non-conductive clamping plates arranged in a stacked manner, and a conductive plate arranged between each two adjacent non-conductive clamping plates, wherein the non-conductive clamping plates and the conductive plates are penetrated along the stacking direction to provide a plurality of substrate stations to be electroplated and a plurality of groups of first conductive through holes arranged around the substrate stations to be electroplated, and each group of the first conductive through holes is used to install a first conductive pressing member that abuts against the first side of a substrate to be electroplated.

[0007] Furthermore, a plurality of second conductive through holes are formed through the non-conductive clamping plate and the conductive plate along the stacking direction, and the second conductive through holes are used for installing bearings that are conductively connected to an external power source.

[0008] Furthermore, the thickness of the non-conductive clamping plate along the stacking direction is 2 mm to 15 mm, and the thickness of the conductive plate along the stacking direction is 20 μm to 100 μm.

[0009] Furthermore, a plurality of substrate countersunk holes are provided through the non-conductive clamping plate and the conductive plate along the stacking direction, and the substrate countersunk holes are used for installing magnets.

[0010] Furthermore, a plurality of reserved conductive through holes are provided through the non-conductive clamping plate and the conductive plate along the stacking direction, and the reserved conductive through holes are used for installing hanging poles.

[0011] The utility model also provides an electroplating fixture, comprising the electroplating substrate as described above.

[0012] Furthermore, it also includes a first cover plate stacked with the electroplating substrate, the first cover plate is provided with a plurality of cover plate countersunk holes, and the cover plate countersunk holes are arranged corresponding to the substrate countersunk holes provided on the electroplating substrate.

[0013] Furthermore, the first cover plate is provided with multiple groups of first pressing members and second pressing members corresponding to the substrate to be electroplated workstations, each group of the first pressing members is used to abut against the second side edge position of a substrate to be electroplated, and each group of the second pressing members is used to abut against the middle position of the second side of a substrate to be electroplated.

[0014] Furthermore, the first cover plate is provided with liquid holes of various shapes, including circular holes, oblong holes and square holes.

[0015] Furthermore, the first cover plate is provided with a plurality of limiting holes for installing limiting columns.

[0016] Furthermore, the thickness of the first cover plate along the stacking direction is 2 mm to 10 mm.

[0017] Furthermore, it also includes a second cover plate stacked with the electroplating substrate, the second cover plate is provided with a plurality of hanging holes, and the hanging holes are arranged corresponding to the reserved conductive through holes provided on the electroplating substrate.

[0018] Furthermore, the second cover plate includes an interlayer body and multiple groups of second conductive pressing members arranged on the interlayer body, the interlayer body includes a plurality of stacked non-conductive clamps, and a conductive plate arranged between each adjacent two non-conductive clamps, and the non-conductive clamps and the conductive plates are provided with multiple substrate stations to be electroplated along the stacking direction, and each group of the second conductive pressing members is arranged around the substrate station to be electroplated and abuts against the second side of a substrate to be electroplated.

[0019] Furthermore, the thickness of the second cover plate along the stacking direction is 2 mm to 15 mm.

[0020] Compared with the existing technology, the utility model solves the technical problems of high cost of electroplating fixture substrates made of all-metal materials, great difficulty in processing, large processing precision error, excessive and uncontrollable overall deformation of the fixture after processing, and heavy weight of all-metal materials by setting up a substrate structure in which non-conductive clamps and conductive plates are stacked and alternately arranged for electroplating. It achieves technical effects such as simple processing, small precision error, small overall deformation of the fixture after processing, high quality of the prepared fixture, and small burden on automated transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic structural diagram of the electroplating substrate provided by the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the non-conductive clamping plate or the conductive plate inside the electroplating substrate provided by the utility model;

[0024] Figure 3 A schematic cross-sectional view of a substrate for electroplating provided by the present invention;

[0025] Figure 4 An exploded schematic diagram of an electroplating fixture provided by the utility model;

[0026] Figure 5 This is a schematic diagram of the back side of an electroplating fixture provided by the present invention;

[0027] Figure 6 This is a front view of the first cover provided by the present invention;

[0028] Figure 7 A three-dimensional schematic diagram of another electroplating fixture provided by the present invention;

[0029] Figure 8 This is a front view of the second cover provided by the present invention;

[0030] Figure 9 This is a schematic diagram of the back side of the second cover provided by the present invention;

[0031] Among them, the main marks of the drawings in the figure are:

[0032] 10. Substrates for electroplating;

[0033] 101, non-conductive clamping plate; 102, conductive plate; 103, first conductive through-hole; 104, conductive layer; 111, substrate station to be electroplated; 112, first conductive pressing member; 121, second conductive through-hole; 122, bearing; 130, substrate countersunk hole; 141, reserved conductive through-hole; 142, hanging column;

[0034] 20. First cover plate;

[0035] 201, cover plate countersunk hole; 202, first pressing member; 203, second pressing member; 204, liquid hole; 2041, round hole; 2042, oblong hole; 2043, square hole; 205, limit hole;

[0036] 30. Second cover plate;

[0037] 301, sandwich body; 302, second conductive pressing member; 303, hanging hole; 304, cover plate groove. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0039] Example 1

[0040] In order to solve the technical problems of high cost of existing electroplating fixture substrates made of all-metal materials, great difficulty in metal processing, large metal machining precision error, excessive and uncontrollable overall deformation of the fixture after processing, heavy weight of all-metal materials, and heavy burden on automated transmission, the utility model adopts a substrate structure in which non-conductive clamps and conductive plates are stacked and arranged alternately for electroplating, so as to achieve technical effects such as simple processing, small precision error, small overall deformation of the fixture after processing, high quality of the prepared fixture, and small burden on automated transmission.

[0041] like Figures 1 to 3 As shown, the electroplating substrate 10 provided in this embodiment includes: a plurality of stacked non-conductive clamps 101, and a conductive plate 102 arranged between each two adjacent non-conductive clamps 101, and the non-conductive clamps 101 and the conductive plates 102 are provided with a plurality of substrate stations 111 to be electroplated and a plurality of groups of first conductive through holes 103 arranged around the substrate stations 111 to be electroplated along the stacking direction, and each group of first conductive through holes 103 is used to install a first conductive pressing member 112 that abuts against the first side of a substrate to be electroplated.

[0042] It should be understood that the non-conductive clamping plate 101 is made of non-conductive material, such as resin or other non-conductive materials. The conductive plate 102 is made of conductive material, such as copper or other conductive metals, alloys, composite metals, composite materials, etc.

[0043] It should be noted that the present invention can flexibly set the specific number of non-conductive clamps 101, conductive plates 102 and substrate stations 111 to be electroplated according to actual application requirements. This embodiment will be described later using the example of a substrate 10 for electroplating using two non-conductive clamps 101 to clamp a conductive plate 102 and four substrate stations 111 to be electroplated.

[0044] Preferably, if Figure 2 As shown, the non-conductive clamping plate 101 and the conductive plate 102 have the same structure. The electroplating substrate 10 is provided with four substrate stations 111 to be electroplated. That is, the non-conductive clamping plate 101 and the conductive plate 102 are provided with four substrate stations 111 to be electroplated. At the same time, the non-conductive clamping plate 101 and the conductive plate 102 are provided with four groups of first conductive through holes 103, each group of first conductive through holes 103 being arranged around one substrate station 111 to be electroplated.

[0045] Each group of first conductive through-holes 103 includes a plurality of first conductive through-holes 103, which are arranged in four rows. The first conductive through-holes 103 in two rows are arranged opposite the first conductive through-holes 103 in the other two rows. That is, the first conductive through-holes 103 in the first and second rows are located near the upper side of the substrate station 111 to be electroplated, and the first conductive through-holes 103 in the third and fourth rows are located near the lower side of the substrate station 111 to be electroplated. When the first conductive pressing member 112 is installed, the first conductive pressing member 112 is simultaneously connected to two first conductive through-holes 103 belonging to the first and second rows, respectively, and the first conductive pressing member 112 is simultaneously connected to two first conductive through-holes 103 belonging to the third and fourth rows, respectively, and the pressing end of the first conductive pressing member 112 extends into the substrate station 111 to be electroplated.

[0046] like Figure 1 、 Figure 3 As shown, a conductive layer 104 is provided on the inner wall of each first conductive through-hole 103, and the conductive layer 104 is electrically connected to the conductive plate 102. In practical applications, the conductive plates 102 can be arranged in multiple layers with the non-conductive clamping plate 101, and the conductive layers 104 are used to provide internal electrical connection between the multiple conductive plates 102. If any of the conductive plates 102 has a problem, it will not affect the operation of the entire electroplating fixture.

[0047] like Figure 2As shown, a plurality of second conductive through holes 121 are formed through the non-conductive clamping plate 101 and the conductive plate 102 along the stacking direction. The second conductive through holes 121 are used to install bearings 122 that are conductively connected to an external power source.

[0048] It can be understood that the external power supply is the power cathode, which is connected in sequence to the bearing 122, the conductive plate 102 and the conductive layer 104 inside the electroplating substrate 10, and the first conductive pressing member 112, thereby being electrically connected to the first side of the substrate to be electroplated.

[0049] Preferably, four second conductive through holes 121 are formed through the non-conductive clamping plate 101 and the conductive plate 102 , and each second conductive through hole 121 is used to connect a bearing.

[0050] The thickness of the non-conductive clamping plate 101 along the stacking direction is 2 mm to 15 mm, and the thickness of the conductive plate 102 along the stacking direction is 20 μm to 100 μm.

[0051] It is understood that the conductive plate 102 disposed within the electroplating substrate 10 of the present invention is relatively thin, which offers significant advantages in terms of thinness, cost, and ease of processing. Furthermore, due to its thinness, the present invention can utilize a non-conductive clamping plate 101 and the conductive plate 102 for fixing via lamination. This electroplating substrate 10 can be standardized and mass-produced, utilizing a mature lamination process, resulting in good consistency and low cost.

[0052] like Figure 2 As shown, a plurality of substrate countersunk holes 130 are provided through the non-conductive clamping plate 101 and the conductive plate 102 along the stacking direction, and the substrate countersunk holes 130 are used to install magnets.

[0053] Preferably, nine substrate countersunk holes 130 are provided through the non-conductive clamping plate 101 and the conductive plate 102. The nine substrate countersunk holes 130 are all non-conductive. After a magnet is installed in each substrate countersunk hole 130, the electroplating substrate 10 is connected to the cover plate.

[0054] like Figure 2 As shown, a plurality of reserved conductive through holes 141 are provided through the non-conductive clamping plate 101 and the conductive plate 102 along the stacking direction. The reserved conductive through holes 141 are used to install the hanging poles 142 .

[0055] Preferably, two reserved conductive through-holes 141 are provided through the non-conductive clamping plate 101 and the conductive plate 102. The inner wall of each reserved conductive through-hole 141 is provided with a conductive layer 104 so as to be electrically connected to the conductive plate 102. After a hanging post 142 is installed in each reserved conductive through-hole 141, the cover plate can be hung on the hanging post 142.

[0056] It should be noted that although the electroplating substrate 10 is provided with both the substrate countersunk hole 130 and the reserved conductive through-hole 141 for connection to the cover plate, typically only one cover plate is used, and the electroplating substrate 10 can be connected to the cover plate solely through the magnetic attraction of the magnet within the substrate countersunk hole 130. If the cover plate needs to be energized on one side of the substrate to be plated, the electroplating substrate 10 is connected to the cover plate simultaneously through the substrate countersunk hole 130 and the reserved conductive through-hole 141.

[0057] Example 2

[0058] like Figures 4 to 6 As shown, the electroplating fixture provided in this embodiment includes an electroplating substrate 10 and a first cover plate 20 that are stacked.

[0059] It should be noted that the specific structure of the electroplating substrate 10 in the electroplating fixture of this embodiment is similar to that of the first embodiment and will not be further described here. Furthermore, the electroplating fixture only needs to be connected to the cathode of the power supply on the first side of the substrate to be plated, thereby enabling single-sided electroplating of the substrate. Based on this, the specific structure of the first cover plate 20 will be described later.

[0060] The thickness of the first cover plate 20 along the stacking direction is 2 mm to 10 mm.

[0061] like Figure 6 As shown, the first cover plate 20 is provided with a plurality of cover plate countersunk holes 201 , and the cover plate countersunk holes 201 are arranged corresponding to the substrate countersunk holes 130 provided on the electroplating substrate 10 .

[0062] Preferably, the first cover plate 20 is provided with nine cover plate countersunk holes 201, and the cover plate countersunk holes 201 are all non-conductive. After an iron sheet is installed in each substrate countersunk hole 130, the magnet installed in the substrate countersunk hole 130 is adsorbed together with the iron sheet installed in the substrate countersunk hole 130 to achieve connection between the first cover plate 20 and the electroplating substrate 10.

[0063] like Figure 5 、 Figure 6 As shown, the first cover plate 20 is provided with a plurality of groups of first pressing members 202 and second pressing members 203 corresponding to the substrate stations 111 to be electroplated. Each group of first pressing members 202 is used to abut against the second side edge position of a substrate to be electroplated, and each group of second pressing members 203 is used to abut against the middle position of the second side of a substrate to be electroplated.

[0064] Preferably, the first cover plate 20 is provided with four groups of first pressing members 202 and four groups of second pressing members 203. Each group of first pressing members 202 includes a plurality of first pressing members 202, and each group of second pressing members 203 includes a plurality of second pressing members 203. Each first pressing member 202 and each second pressing member 203 are non-conductive and can be made of rubber.

[0065] Taking clamping each substrate to be electroplated as an example, a plurality of first conductive pressing members 112 installed in each group of first conductive through holes 103 are abutted against the first side edge position of the substrate to be electroplated, and a plurality of first pressing members 202 in each group of first pressing members 202 are abutted against the second side edge position of the substrate to be electroplated, and a plurality of second pressing members 203 in each group of second pressing members 203 are abutted against the middle position of the second side of the substrate to be electroplated, thereby realizing that the first conductive pressing members 112, the first pressing members 202 and the second pressing members 203 jointly clamp the substrate to be electroplated, thereby facilitating single-sided electroplating of the substrate to be electroplated.

[0066] like Figure 6 As shown, the first cover plate 20 is provided with liquid holes 204 of various shapes, including a circular hole 2041 , an oblong hole 2042 and a square hole 2043 .

[0067] The shape and number of the liquid holes 204 can be flexibly set according to actual application requirements. Preferably, the first cover plate 20 is provided with three shapes of liquid holes 204: a circular hole 2041, an oblong hole 2042, and a square hole 2043. The number of circular holes 2041 is greater than the number of square holes 2043, which is greater than the number of oblong holes 2042.

[0068] In order to facilitate electroplating, in this embodiment, a liquid hole 204 is opened through the first cover plate 20 to facilitate the outflow of the plating liquid and prevent the liquid from accumulating on the unplated area when plating on one side of the substrate.

[0069] like Figure 6 As shown, the first cover plate 20 is provided with a plurality of limiting holes 205 for installing limiting columns.

[0070] Preferably, the first cover plate 20 is provided with eight limiting holes 205 , each of which is used to install a limiting post. By installing the limiting post in the limiting hole 205 of the first cover plate 20 , the first cover plate 20 can be limited.

[0071] Example 3

[0072] like Figures 7 to 9 As shown, the electroplating fixture provided in this embodiment includes an electroplating substrate 10 and a second cover plate 30 that are stacked.

[0073] It should be noted that the specific structure of the electroplating substrate 10 in the electroplating fixture of this embodiment can be found in the first embodiment above and will not be repeated here. Furthermore, the electroplating fixture only requires connecting the cathode of the power supply to opposite sides (i.e., the first side and the second side) of the substrate to be plated, thereby achieving double-sided electroplating of the substrate to be plated. The specific structure of the second cover plate 30 will be described later.

[0074] The thickness of the second cover plate 30 along the stacking direction is 2 mm to 15 mm.

[0075] like Figure 8 As shown, the second cover plate 30 is provided with a plurality of hanging holes 303 , and the hanging holes 303 are arranged corresponding to the reserved conductive through holes 141 provided on the electroplating substrate 10 .

[0076] Preferably, the second cover plate 30 defines two anisotropically shaped mounting holes 303. The two mounting posts 142 mounted on the electroplating substrate 10 are correspondingly inserted into the two mounting holes 303 of the second cover plate 30, allowing the second cover plate 30 to be mounted on the electroplating substrate 10. Furthermore, the mounting posts 142 provide electrical connection between the interior of the electroplating substrate 10 and the interior of the second cover plate 30.

[0077] like Figure 9 As shown, to ensure a more secure connection between the second cover plate 30 and the electroplating substrate 10, six cover plate grooves 304 may be provided on the side of the second cover plate 30 facing the electroplating substrate 10. These six cover plate grooves 304 correspond to six of the substrate countersunk holes 130 provided on the electroplating substrate 10. After an iron sheet is placed in each cover plate groove 304, the magnets installed in the substrate countersunk holes 130 attract the iron sheet installed in the cover plate groove 304, thereby achieving connection between the second cover plate 30 and the electroplating substrate 10.

[0078] like Figure 8 As shown, the second cover plate 30 includes an interlayer body 301 and a plurality of second conductive pressing members 302 disposed on the interlayer body 301. Figure 3 The sandwich body 301 includes a plurality of stacked non-conductive clamping plates 101 and a conductive plate 102 disposed between each adjacent two non-conductive clamping plates 101. A plurality of substrate stations 111 to be plated are provided through the non-conductive clamping plates 101 and the conductive plates 102 along the stacking direction. Each set of second conductive pressing members 302 is disposed around the substrate station 111 to be plated and abuts against the second side of a substrate to be plated.

[0079] It is understandable that the interlayer body 301 of the second cover plate 30 adopts the same interlayer structure as the electroplating substrate 10. Preferably, the second cover plate 30 adopts two non-conductive splints 101 to clamp a conductive plate 102. The non-conductive splint 101 is made of a non-conductive material, which can be a resin material or other non-conductive materials. The conductive plate 102 is made of a conductive material, which can be a copper material or other conductive metal, alloy, composite metal, composite material, etc. A third guide through-hole is provided through the non-conductive splint 101 and the conductive plate 102, and a conductive layer 104 is provided on the inner wall of the third conductive through-hole. The conductive layer 104 is electrically connected to the conductive plate 102, and the third conductive through-hole is used to install the second conductive pressure member 302.

[0080] Preferably, the second cover plate 30 is provided with four substrate stations 111 to be plated, and the second cover plate 30 is also provided with four groups of second conductive pressing members 302. Each group of second conductive pressing members 302 includes a plurality of second conductive pressing members 302, and the plurality of second conductive pressing members 302 are arranged in two rows, upper and lower. Each group of second conductive pressing members 302 is electrically connected to the conductive plate 102 and the hanging column 142 through the conductive layer 104 within the interlayer body 301. Thus, each group of second conductive pressing members 302 on the second cover plate 30 and each group of first conductive pressing members 112 on the electroplating substrate 10 respectively energize the first side and the second side of the substrate to be plated, thereby achieving double-sided electroplating of the substrate to be plated.

[0081] The present invention solves technical problems such as the high cost of electroplating fixture substrates made of all-metal materials, the difficulty in processing, large processing precision errors, excessive and uncontrollable deformation of the fixture after processing, and the heavy weight of all-metal materials by providing an electroplating substrate structure that uses non-conductive clamps and conductive plates in alternating layers. The invention achieves technical benefits such as simple processing, small precision errors, small deformation of the fixture after processing, high-quality prepared fixtures, and a small burden on automated transmission. Furthermore, the present invention also provides two cover plate structures, namely a first cover plate and a second cover plate. The first cover plate cooperates with the electroplating substrate to form an electroplating fixture for single-sided electroplating, while the second cover plate cooperates with the electroplating substrate to form an electroplating fixture for double-sided electroplating.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A substrate for electroplating, characterized in that include: A plurality of stacked non-conductive clamps and a conductive plate arranged between each adjacent two non-conductive clamps, wherein the non-conductive clamps and the conductive plates are provided with a plurality of substrate stations to be electroplated and a plurality of groups of first conductive through holes arranged around the substrate stations to be electroplated along the stacking direction, and each group of the first conductive through holes is used to install a first conductive pressing member that abuts against the first side of a substrate to be electroplated.

2. The electroplating substrate according to claim 1, wherein The non-conductive clamping plate and the conductive plate are provided with a plurality of second conductive through holes along the stacking direction, and the second conductive through holes are used for installing bearings that are conductively connected to an external power source.

3. The electroplating substrate according to claim 1, wherein The thickness of the non-conductive clamping plate along the stacking direction is 2 mm to 15 mm, and the thickness of the conductive plate along the stacking direction is 20 μm to 100 μm.

4. The electroplating substrate according to claim 1, wherein The non-conductive clamping plate and the conductive plate are provided with a plurality of substrate countersunk holes along the stacking direction, and the substrate countersunk holes are used for installing magnets.

5. The electroplating substrate according to claim 1, wherein The non-conductive clamping plate and the conductive plate are provided with a plurality of reserved conductive through holes along the stacking direction, and the reserved conductive through holes are used for installing hanging columns.

6. Electroplating fixture, characterized in that, The electroplating substrate comprises the electroplating substrate according to any one of claims 1 to 5.

7. The electroplating fixture according to claim 6, wherein: It also includes a first cover plate stacked with the electroplating substrate, the first cover plate is provided with a plurality of cover plate countersunk holes, and the cover plate countersunk holes are arranged corresponding to the substrate countersunk holes provided on the electroplating substrate.

8. The electroplating fixture according to claim 7, wherein: The first cover plate is provided with multiple groups of first and second pressing members corresponding to the substrate to be electroplated workstations, each group of the first pressing members is used to abut against the second side edge position of a substrate to be electroplated, and each group of the second pressing members is used to abut against the middle position of the second side of a substrate to be electroplated.

9. The electroplating fixture according to claim 7, wherein: The first cover plate is provided with liquid holes of various shapes, including circular holes, oblong holes and square holes.

10. The electroplating fixture according to claim 7, wherein: The first cover plate is provided with a plurality of limiting holes for installing limiting columns.

11. The electroplating fixture according to claim 7, wherein: The thickness of the first cover plate along the stacking direction is 2 mm to 10 mm.

12. The electroplating fixture according to claim 6, wherein: It also includes a second cover plate stacked with the electroplating substrate, the second cover plate is provided with a plurality of hanging holes, and the hanging holes are arranged corresponding to the reserved conductive through holes provided on the electroplating substrate.

13. The electroplating fixture according to claim 12, wherein: The second cover plate includes a sandwich body and multiple groups of second conductive pressing members arranged on the sandwich body, the sandwich body includes a plurality of stacked non-conductive clamps, and a conductive plate arranged between each adjacent two non-conductive clamps, and multiple substrate stations to be electroplated are arranged through the non-conductive clamps and the conductive plates along the stacking direction, each group of the second conductive pressing members is arranged around the substrate station to be electroplated and abuts against the second side of a substrate to be electroplated.

14. The electroplating fixture according to claim 12, wherein: The thickness of the second cover plate along the stacking direction is 2 mm to 15 mm.

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