Wafer straightening device and wafer electroplating machine table
The problem of bubbles generated in the wafer plating machine is solved through the unilateral alignment method, which reduces bubbles, improves the plating quality, and reduces process defects.
Patent Information
- Application Number
- CN202422544024.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-10-21
AI Technical Summary
Existing wafer plating machines generate more bubbles during wafer alignment, resulting in damage to the plating layer and forming process defects.
The single-sided alignment method is adopted, and the wafer clamp assembly is rotated with one end of the wafer diameter as the reference point and the tangent line of the wafer where the reference point is located as the axis to change the angle between the wafer and the horizontal plane and reduce bubble generation.
Effectively reduce the generation of bubbles during electroplating, improve the quality of the plating, and reduce the damage and defects of the plating.
Smart Images
Figure CN223240198U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer alignment device and a wafer electroplating machine. Background Art
[0002] During the process of copper (Cu) electroplating on wafers by the wafer electroplating machine, the wafer enters the electroplating solution at a certain angle. Since bubbles in the electroplating solution will affect the electroplating, and then the plating layer will be damaged, resulting in process defects, the wafer is usually immersed in the electroplating solution at a certain tilt angle to the surface of the electroplating solution. Before reaching the process setting position, the wafer alignment device of the wafer electroplating machine will align the wafer so that the wafer reaches a horizontal position to discharge the bubbles in the electroplating solution under the wafer. The wafer alignment device is used to align the wafer so that bubbles are discharged from the edge of the wafer. In the prior art, the alignment method of the wafer alignment device is center alignment, that is, the diameter of the wafer is used as the axis of symmetry, and the wafer is tilted or aligned based on the axis of symmetry.
[0003] Specifically, the drive motor on the wafer plating machine aligns the chuck at the center, using the central axis as a reference. The wafer held by the chuck tilts and aligns with the chuck at the lower end. As one end of the wafer rises while the other descends, both edges of the wafer squeeze the plating solution during the alignment process, generating bubbles. While this centering method can reduce bubbles that affect the plating process during wafer immersion, there is still room for improvement.
[0004] Therefore, it is necessary to improve the alignment mechanism to reduce the generation of bubbles during wafer alignment, thereby reducing process defects caused by damage to the coating caused by bubbles during the electroplating process. Utility Model Content
[0005] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a wafer alignment device and a wafer electroplating machine to solve the problem in the prior art that a large number of bubbles are generated during the wafer alignment process, thereby forming a large number of coating damage defects.
[0006] An embodiment of the present application provides a wafer straightening device for feeding the wafer into the plating solution during electroplating, and is characterized in that it includes a wafer clamp assembly, an angle drive unit and a support plate, wherein the wafer clamp assembly is fixedly mounted on the angle drive unit, and the angle drive unit is mounted on the support plate; wherein one end of the diameter of the wafer held by the wafer clamp assembly is a reference point, and the angle drive unit drives the wafer clamp assembly to rotate with the wafer tangent line where the reference point is located as the axis, thereby changing the angle between the wafer and the horizontal plane.
[0007] In some embodiments, the angle driving unit includes a slide rail assembly and an angle driving motor, the slide rail assembly includes a first angle guide rail and a first angle slider and a second angle guide rail and a second angle slider, the first angle guide rail and the second angle guide rail are arranged in parallel, the angle driving motor is respectively connected to the first angle slider and the second angle slider, the angle driving motor drives the first angle slider to move on the first angle guide rail and the second angle slider to move on the second angle guide rail, and the wafer clamp assembly is installed on the first angle slider and the second angle slider.
[0008] In some embodiments, the wafer clamp assembly includes a chuck and a connecting plate, the chuck is located at the bottom of the wafer clamp assembly, the chuck is used to hold the wafer, and the wafer clamp assembly is fixed to the first angle slider and the second angle slider through the connecting plate, so that the wafer clamp assembly can be rotatably fixed on the support plate.
[0009] In some embodiments, the first angle guide rail and the second angle guide rail are both arc-shaped.
[0010] In some embodiments, both ends of the first angle guide rail and the second angle guide rail are respectively configured with limit blocks.
[0011] In some embodiments, the angle range between the wafer held by the wafer clamp assembly and the horizontal plane when entering the plating solution is set to be 2.7° to 3°.
[0012] An embodiment of the present application also provides a wafer electroplating machine, comprising a plating chamber, a vertical drive unit, a bracket, and the wafer alignment device of the above embodiment, wherein the plating chamber is located below the wafer alignment device and is used to accommodate the plating liquid, the vertical drive unit is fixed on the bracket, and the wafer alignment device is fixedly mounted on the vertical drive unit, and the vertical drive unit drives the wafer alignment device to move vertically as a whole, driving the wafer to immerse in or leave the plating liquid.
[0013] In some embodiments, the wafer alignment device is fixed to the vertical driving unit via the support plate.
[0014] In some embodiments, the vertical driving unit includes a vertical slide rail and a vertical driving motor, the vertical slide rail includes a vertical guide rail and a vertical slider, and the support plate is fixed on the vertical slider.
[0015] In some embodiments, a control unit is included, which is electrically connected to the vertical driving unit and the wafer alignment device, respectively, for controlling the wafer to enter or leave the plating solution, as well as the angle between the wafer and the horizontal plane when immersed in the plating solution, and to align the wafer.
[0016] As described above, the wafer alignment device and wafer electroplating machine of the present application have the following beneficial effects: a unilateral alignment method is adopted during wafer alignment to reduce the generation of bubbles, thereby reducing coating damage defects caused by bubbles during the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The following figures describe in detail exemplary embodiments disclosed in this application. Like reference numerals denote similar structures throughout the several views of the drawings. Those skilled in the art will appreciate that these embodiments are non-limiting, exemplary embodiments, and that the drawings are provided for illustration and description purposes only and are not intended to limit the scope of this application. Other embodiments may also achieve the inventive intent of this application. It should be understood that the drawings are not drawn to scale.
[0018] in:
[0019] Figure 1 is a schematic diagram of a wafer alignment device according to some embodiments of the present application;
[0020] Figure 2 This is a schematic diagram of unilateral straightening according to some embodiments of the present application;
[0021] Figure 3 is a schematic diagram of center alignment according to some embodiments;
[0022] Figure 4 (a) is the effect of wafer electroplating using the center alignment method;
[0023] Figure 4 (b) is the effect of wafer electroplating using the unilateral alignment method;
[0024] Figure 5 This is a schematic diagram of the principle of achieving unilateral straightening according to some embodiments of the present application;
[0025] Figure 6 It is a three-dimensional schematic diagram of a wafer electroplating machine according to some embodiments of the present application. DETAILED DESCRIPTION
[0026] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content of this application. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but is intended to be of the widest scope consistent with the claims.
[0027] An embodiment of the present application provides a wafer straightening device for feeding wafers into electroplating liquid during electroplating, comprising a wafer clamp assembly, an angle drive unit and a support plate, wherein the wafer clamp assembly is fixedly mounted on the angle drive unit, and the angle drive unit is mounted on the support plate; wherein one end of the diameter of the wafer held by the wafer clamp assembly is a reference point, and the angle drive unit drives the wafer clamp assembly to rotate with the tangent line of the wafer where the reference point is located as the axis, thereby changing the angle between the wafer and the horizontal plane.
[0028] Specifically, when copper is electroplated on a wafer, the wafer first descends in a vertical direction and enters the electroplating solution at a certain angle. After entering the electroplating solution and before reaching the process position, the wafer needs to be aligned by a wafer alignment device to a horizontal position. When the wafer alignment method is a center alignment method, it is easy to cause both ends of the wafer to squeeze the electroplating solution at the same time, forming a large number of bubbles and unable to effectively discharge the bubbles. The bubbles in the electroplating solution form gaps in the plating layer during the copper electroplating process, and too many gaps will affect the yield of the product. The alignment method of the wafer alignment device of the present application is a unilateral alignment method, that is, one end of the wafer diameter is used as a reference point, and the wafer clamp assembly swings the wafer with the tangent line of the wafer where the reference point is located as the axis. During unilateral alignment, only one side of the wafer is aligned, and the electroplating solution is squeezed in one direction, resulting in fewer bubbles and easier to discharge bubbles, ensuring that there are not too many bubbles in the wafer alignment process that affect the electroplating, thereby reducing metal plating defects.
[0029] The technical solution of this application is described in detail below with reference to the embodiments and drawings.
[0030] refer to Figure 1 , Figure 1 It is a three-dimensional schematic diagram of a wafer alignment device according to some embodiments of the present application.
[0031] In some embodiments, embodiments of the present application provide a wafer alignment device 100 for feeding a wafer 1 into a plating solution during electroplating. The wafer alignment device 100 includes a wafer clamp assembly 2, an angle drive unit 3, and a support plate 4. The wafer clamp assembly 2 is fixedly mounted on the angle drive unit 3, which is mounted on the support plate 4. That is, the wafer clamp assembly 2 is rotatably fixed to the support plate 4 via the angle drive unit 3. The diametrical end 11 of the wafer 1 held by the wafer clamp assembly 2 serves as a reference point. The angle drive unit 3 drives the wafer clamp assembly 2 to rotate about the tangent line of the wafer at which the reference point is located, thereby changing the angle between the wafer 1 and the horizontal plane. The wafer clamp assembly 2 is used to clamp the wafer 1. The wafer clamp assembly 2 can drive the wafer 1 to move back and forth between the middle space and the top space of the electroplating space, or to rotate within the electroplating space. The wafer clamp assembly 2 can also drive the wafer 1 to flip and tilt so that the wafer 1 is set at a certain angle to the liquid level of the electroplating solution in the electroplating space.
[0032] Combine Figure 1 and Figure 2In some embodiments, wafer 1 is first tilted by wafer clamp assembly 2 to an angle α relative to the horizontal plane (i.e., the plating solution surface); wafer 1 is then lowered by wafer clamp assembly 2 until it is immersed in the plating solution; finally, wafer 1 is straightened to a horizontal position. Immersing wafer 1 in the plating solution at a certain angle can effectively reduce resistance and the generation of bubbles. After wafer 1 successfully enters the plating solution, wafer 1 is adjusted to a horizontal position to ensure more uniform plating.
[0033] Specifically, refer to Figure 2 The schematic diagram of unilateral alignment shown shows the process of aligning the wafer by rotating and swinging with one end of the diameter of the wafer 1 as the reference point. The wafer 1 is held by the wafer clamp assembly 2. In order to reduce the bubbles generated during the alignment of the wafer 1, the alignment mechanism 100 uses one end 11 of the edge of the wafer as the reference point and the tangent line of the wafer where the reference point is located as the axis to rotate and perform unilateral alignment. During the alignment process, the unilateral movement of the wafer 1 can minimize the bubbles generated by squeezing the electroplating solution. The wafer 1 is immersed in the electroplating solution at a certain angle α and combined with the unilateral alignment method, so that the entire wafer 1 is immersed in the electroplating solution to reach the process position, which minimizes the number of bubbles on the surface of the wafer 1 and can improve the quality of the electroplating coating.
[0034] refer to Figure 3 , Figure 3 This is a schematic diagram of centering, showing the wafer alignment process using the wafer's center diameter 11' as the reference point. Centering causes the plating solution to squeeze at both ends of wafer 1, creating numerous bubbles that cannot be effectively removed.
[0035] refer to Figure 4 (a) and Figure 4 (b) and combined Figures 1 to 3 ,in, Figure 4 (a) is the effect diagram of wafer electroplating using the center alignment method. Figure 4 (b) shows the effect of wafer electroplating using the single-side alignment method. Experiments have shown that the center alignment method produces more bubbles than the single-side alignment method, resulting in more process defects.
[0036] refer to Figure 5 and combined Figure 1As shown, in some embodiments, the angle drive unit 3 includes a slide rail assembly 31 and an angle drive motor 32. The slide rail assembly 31 includes a first angle guide rail 311 and a first angle slider 312, as well as a second angle guide rail 313 and a second angle slider 314. The first angle guide rail 311 and the second angle guide rail 313 are arranged in parallel. The angle drive motor 32 is connected to the first angle slider 312 and the second angle slider 314, respectively. The angle drive motor 32 drives the first angle slider 312 to move on the first angle guide rail 311 and the second angle slider 314 to move on the second angle guide rail 313, respectively. The wafer clamp assembly 2 is mounted on the first angle slider 312 and the second angle slider 314.
[0037] Specifically, refer to Figure 1 、 Figure 2 and Figure 5 As shown, in some embodiments, the wafer clamp assembly 2 includes a chuck 22 and a connecting plate 23. The chuck 22 is located at the bottom of the wafer clamp assembly 2 and holds the wafer 1 via conductive pins disposed thereon. The wafer clamp assembly 2 is fixed to the first angular slider 312 and the second angular slider 314 via the connecting plate 23, allowing the wafer clamp assembly 2 to be rotatably fixed to the support plate 4.
[0038] In some embodiments, the first angle guide rail 311 and the second angle guide rail 313 are both arc-shaped. The arrangement of the arc-shaped guide rails enables the wafer clamp assembly 2 to rotate at a certain angle.
[0039] In some embodiments, both ends of the first angle guide rail 311 and the second angle guide rail 313 are configured with limit blocks to limit the range of motion of the first angle slider 312 and the second angle slider 314, that is, to limit the rotation range of the wafer clamp assembly 2. The first angle guide rail 311 is configured with a limit block 3111, and the second angle guide rail 313 is configured with a limit block 3131.
[0040] In some embodiments, the angle α between the wafer 1 held by the wafer clamp assembly 2 and the horizontal plane (ie, the plating liquid surface) when entering the plating liquid is set to be in the range of 2.7° to 3°.
[0041] Specifically, before wafer 1 is immersed in the plating solution, the plane of wafer 1 is set to form a certain angle α with the plating solution surface (i.e., the horizontal plane). At this time, the first angle slider 312 is located at position 312A on the first angle guide 311, and the second angle slider 314 is located at position 314A on the first angle guide 313 (positions 312A, 314A, and reference point O are aligned). Wafer 1 is located at position 1A, forming an angle α with the horizontal plane. After being immersed in the plating solution, wafer 1 is aligned by wafer clamp assembly 2: the first angle slider 312 slides to position 312B, and the second angle slider 314 slides to position 314B (positions 312B, 314B, and reference point O are aligned). Because wafer clamp assembly 2 is fixed to the first angle slider 312 and the second angle slider 314 via connecting plate 23, wafer 1 held by wafer clamp assembly 2 is moved to horizontal position 1B and aligned.
[0042] like Figure 6 As shown, the present application also provides a wafer electroplating machine 200, comprising an electroplating chamber 7, a vertical drive unit 6, a bracket 5, and a wafer alignment device 100. The electroplating chamber 7 is located below the wafer alignment device and is used to contain the electroplating solution. The vertical drive unit 6 is fixed to the bracket 5, and the wafer alignment device 100 is fixedly mounted on the vertical drive unit 6. The vertical drive unit 6 drives the wafer alignment device 100 to move vertically as a whole, driving the wafer 1 to immerse in or out of the electroplating solution.
[0043] Specifically, in some embodiments, the wafer straightening device 100 is fixed on the vertical driving unit 6 via the support plate 4 .
[0044] In some embodiments, the vertical driving unit 6 includes a vertical slide rail 61 and a vertical driving motor 62. The vertical slide rail 61 includes a vertical guide rail 611 and a vertical slider 612, and the support plate 4 is fixed on the vertical slider 612.
[0045] In some embodiments, the wafer electroplating machine 200 also includes a control unit (not shown), which is electrically connected to the vertical drive unit 6 and the wafer alignment device 100, respectively, and is used to control the immersion or exit of the wafer 1 from the plating solution, as well as the angle between the wafer 1 and the plating solution surface (i.e., the horizontal plane) when immersed in the plating solution, and the subsequent alignment of the wafer 1.
[0046] The beneficial effects that may be brought about by the embodiments of the present application include but are not limited to: the wafer alignment device and wafer electroplating machine of the present application adopt a unilateral alignment method to reduce the generation of bubbles during the wafer alignment process, thereby reducing process defects caused by damage to the coating caused by bubbles during the electroplating process.
[0047] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.
[0048] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and revisions to this application. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this application.
[0049] It should be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; rotational connections, or sliding connections; direct connections, or indirect connections through an intermediate medium; and can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application in light of specific circumstances.
[0050] In addition, when terms such as "first", "second", and "third" are used in the specification of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relationship between the features, the relative importance, or implicitly indicating the number of features indicated.
[0051] In addition, this specification describes exemplary embodiments by reference to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be interpreted as limited to the shapes of the regions shown herein, but should include deviations in shapes due to, for example, manufacturing. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device nor to limit the scope of the exemplary embodiments.
[0052] At the same time, this application uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this application does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application may be appropriately combined.
[0053] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.
[0054] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application.
Claims
1. A wafer alignment device for feeding wafers into electroplating solution during electroplating, characterized in that: It includes a wafer clamp assembly, an angle driving unit and a support plate, wherein the wafer clamp assembly is fixedly mounted on the angle driving unit, and the angle driving unit is mounted on the support plate; Among them, one end of the diameter of the wafer held by the wafer clamp assembly is a reference point, and the angle driving unit drives the wafer clamp assembly to rotate with the wafer tangent line where the reference point is located as the axis to change the angle between the wafer and the horizontal plane.
2. The wafer straightening device according to claim 1, characterized in that: The angle driving unit includes a slide rail assembly and an angle driving motor. The slide rail assembly includes a first angle guide rail and a first angle slider and a second angle guide rail and a second angle slider. The first angle guide rail and the second angle guide rail are arranged in parallel. The angle driving motor is respectively connected to the first angle slider and the second angle slider. The angle driving motor drives the first angle slider to move on the first angle guide rail and the second angle slider to move on the second angle guide rail. The wafer clamp assembly is installed on the first angle slider and the second angle slider.
3. The wafer straightening device according to claim 2, characterized in that: The wafer clamp assembly includes a chuck and a connecting plate. The chuck is located at the bottom of the wafer clamp assembly and is used to hold the wafer. The wafer clamp assembly is fixed to the first angle slider and the second angle slider through the connecting plate, so that the wafer clamp assembly can be rotatably fixed on the support plate.
4. The wafer straightening device according to claim 2, characterized in that: The first angle guide rail and the second angle guide rail are both arc-shaped.
5. The wafer straightening device according to claim 2, characterized in that: Both ends of the first angle guide rail and the second angle guide rail are respectively configured with limit blocks.
6. The wafer alignment device according to claim 1, wherein: The angle range between the wafer held by the wafer clamp assembly and the horizontal plane when entering the electroplating solution is set to be 2.7° to 3°.
7. A wafer electroplating machine, characterized in that: It comprises a plating chamber, a vertical drive unit, a bracket and the wafer alignment device according to any one of claims 1 to 6, wherein the plating chamber is located below the wafer alignment device and is used to accommodate the plating liquid, the vertical drive unit is fixed on the bracket, the wafer alignment device is fixedly mounted on the vertical drive unit, and the vertical drive unit drives the wafer alignment device to move vertically as a whole, thereby driving the wafer to be immersed in or out of the plating liquid.
8. The wafer electroplating machine according to claim 7, wherein: The wafer alignment device is fixed on the vertical driving unit through the support plate.
9. The wafer electroplating machine according to claim 8, wherein: The vertical driving unit includes a vertical slide rail and a vertical driving motor. The vertical slide rail includes a vertical guide rail and a vertical sliding block. The supporting plate is fixed on the vertical sliding block.
10. The wafer electroplating machine according to claim 7, wherein: It includes a control unit, which is electrically connected to the vertical driving unit and the wafer alignment device, and is used to control the wafer to enter or leave the plating solution, as well as the angle between the wafer and the horizontal plane when immersed in the plating solution, and to align the wafer.