Light emitting diode packaging structure

Abstract

The utility model relates to the technical field of light-emitting diodes, and discloses a light-emitting diode packaging structure which comprises a lower packaging seat, a light-emitting diode main body is arranged in the lower packaging seat in a penetrating mode, and an upper packaging seat is arranged outside the light-emitting diode main body in a sleeved mode. A splicing assembly convenient to disassemble and assemble is arranged between the upper packaging base and the lower packaging base, the splicing assembly comprises a mounting bolt, and the bottoms of the two sides of the upper packaging base are fixedly connected with connecting bases. According to the light-emitting diode packaging structure, the upper packaging base, the connecting base, the fixing plate, the built-in groove, the mounting bolt and the knob are arranged, the upper packaging base is rapidly installed, welding fixation is not needed, the splicing and fixing connection mode is optimized, the upper packaging base is effectively prevented from loosening or even falling off during use, firmness is improved, and the service life of the light-emitting diode packaging structure is prolonged. The problems that a light-emitting diode is small in structure, welding production is complex and tedious, the requirement for welding precision is high, production efficiency is greatly reduced, and disassembly and maintenance are not convenient are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting diodes, in particular to a light emitting diode packaging structure. Background Art

[0002] Light-emitting diodes, abbreviated as LEDs, are a commonly used light-emitting device that releases energy through the recombination of electrons and holes. They are widely used in the lighting field and can efficiently convert electrical energy into light energy. The main function of LED packaging is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure to air or mechanical damage, thereby improving the stability of the chip, enhancing the luminous efficiency of the LED, and thus extending its life.

[0003] Currently, welding packaging is mainly used. However, due to the small structure of the light-emitting diode, welding production is complicated and tedious, and high welding precision is required, which greatly reduces production efficiency and is inconvenient for disassembly and maintenance.

[0004] Therefore, a new light emitting diode packaging structure is proposed to solve the above problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a light-emitting diode packaging structure to solve the problems proposed in the above background technology that the light-emitting diode structure is small, the welding production is complicated and tedious, and the welding precision is required to be high, which greatly reduces the production efficiency and is inconvenient for disassembly and maintenance.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a light-emitting diode packaging structure, comprising a lower packaging seat, wherein a light-emitting diode body is provided through the interior of the lower packaging seat, an upper packaging seat is provided on the exterior of the light-emitting diode body, and a splicing component for easy disassembly and assembly is provided between the upper packaging seat and the lower packaging seat;

[0007] The splicing assembly includes mounting bolts, the bottoms of both sides of the upper packaging seat are fixedly connected to connecting seats, a built-in groove is provided on the outer side of the connecting seat, both sides of the lower packaging seat are fixedly connected to the limit protection frame, the top of the limit protection frame extends inward, the side walls inside the limit protection frame are fixedly connected to the fixing plates, the fixing plates are plugged into the inside of the built-in groove, two groups of mounting bolts are provided, and they are vertically penetrated at the top extension of the limit protection frame.

[0008] Preferably, the mounting bolts are symmetrically distributed about the vertical center line of the lower packaging seat, and the top ends of the mounting bolts are fixedly connected with knobs.

[0009] Preferably, mounting seats are symmetrically fixedly connected to both sides of the light-emitting diode body, the bottom end of the mounting seat is fixedly connected to the top end of the lower packaging seat, the inner wall of the upper packaging seat is fixedly connected to an adhesive inner layer, and the inner wall of the adhesive inner layer is fixedly connected to a sealing sleeve.

[0010] Preferably, a groove is provided at the top of the bottom of the mounting seat, a base is fixedly connected to one side of the interior of the mounting seat groove, and an inner seat is fixedly connected to the bottom ends of both sides of the sealing sleeve.

[0011] Preferably, a mounting block is fixedly connected to the top of the base, and the mounting block passes through the bottom of the internal seat and is plugged into the inside of the internal seat.

[0012] Preferably, a protective plate is provided through the front and rear ends of the lower packaging seat, a plurality of through holes are provided through the interior of the protective plate, and a moisture-proof layer is provided on the front and rear ends of the exterior of the light-emitting diode body.

[0013] Preferably, support frames are fixedly connected to both sides of the inner end of the protective plate, and the inner end of the support frame is fixedly connected to the outer end of the moisture-proof layer.

[0014] Preferably, the through holes are arranged at equal intervals inside the protective plate, and a circle of dust filter is fixedly connected to the inner wall of the through hole.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the light emitting diode packaging structure not only realizes the function of easy splicing and sealing and fixing, but also realizes the function of moisture-proof and heat dissipation;

[0016] (1) By providing an upper packaging seat, a connecting seat, a fixing plate, a built-in groove, a mounting bolt and a knob, the upper packaging seat is sleeved and installed on the outside of the main chip position of the light-emitting diode to provide it with all-round protection. The connecting seat is inserted into the groove of the limit protection frame, and the fixing plate is installed in the built-in groove by plug-in connection, thereby strengthening the connection force between the connecting seat and the limit protection frame, and playing a certain guiding role in the rotation and fixation of the mounting bolt. The mounting bolt quickly penetrates the interior of the limit protection frame and the connecting seat, and the upper packaging seat is quickly installed without welding fixation. The splicing and fixing connection method is optimized, and the upper packaging seat is effectively prevented from loosening or even falling off during use, thereby improving firmness.

[0017] (2) By providing a sealing sleeve, an adhesive inner layer, a base, a mounting block and an inner seat, the sealing sleeve is fixed to the inner wall of the upper packaging seat by the adhesive inner layer, which can provide strong sealing protection and strengthen the sealing between the upper packaging seat and the light-emitting diode body. The mounting block is inserted and fixed in the inner seat, which improves the stability of the sealing sleeve itself, avoids the viscosity of the sealing sleeve from decreasing and causing displacement after long-term use, and enhances the fixing force of the sealing sleeve itself;

[0018] (3) By providing a moisture-proof layer, a support frame, a protective plate, a through hole and a dust filter, two sets of protective plates are respectively set inside the two ends of the lower packaging seat. By opening a number of through holes, the air flow speed inside and outside the lower packaging seat can be accelerated, and the heat dissipation effect can be improved. The dust filter is used to quickly filter the particulate matter in the flowing air to avoid heat accumulation and foreign matter intrusion that damages the chip and affects its use. At the same time, a moisture-proof layer is added at both ends of the light-emitting diode body to provide strong moisture-proof protection for both ends of the light-emitting diode body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the front cross-sectional structure of the present utility model;

[0020] Figure 2 This is a schematic diagram of the top view of the position limiting protection frame of the present utility model;

[0021] Figure 3 For the utility model Figure 1 A schematic diagram of the enlarged structure of the local section at point A in the middle;

[0022] Figure 4 This is a schematic diagram of the cross-sectional structure of the lower packaging seat of the present invention from a top view.

[0023] In the figure: 1. Lower packaging seat; 2. Limit protection frame; 3. Fixing plate; 4. Connecting seat; 5. Knob; 6. Upper packaging seat; 7. Paste inner layer; 8. Sealing sleeve; 9. Mounting bolt; 10. Built-in groove; 11. Mounting seat; 12. LED body; 13. Protective plate; 14. Dust filter; 15. Through hole; 16. Base; 17. Mounting block; 18. Internal seat; 19. Support frame; 20. Moisture-proof layer. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figure 1-4 A light-emitting diode packaging structure includes a lower packaging seat 1, a light-emitting diode body 12 is provided inside the lower packaging seat 1, an upper packaging seat 6 is provided on the outside of the light-emitting diode body 12, and a splicing component for easy disassembly and assembly is provided between the upper packaging seat 6 and the lower packaging seat 1;

[0026] The splicing assembly includes mounting bolts 9. The bottom of both sides of the upper packaging seat 6 is fixedly connected to the connecting seat 4. The outer side of the connecting seat 4 is provided with a built-in groove 10. The two sides of the lower packaging seat 1 are fixedly connected to the limited protection frame 2. The top of the limited protection frame 2 extends inward. The side wall inside the limited protection frame 2 is fixedly connected with a fixing plate 3. The fixing plate 3 is plugged into the inside of the built-in groove 10. Two groups of mounting bolts 9 are provided, and they are vertically penetrated at the top extension of the limited protection frame 2.

[0027] The mounting bolts 9 are symmetrically distributed about the vertical center line of the lower packaging seat 1, and the top of the mounting bolts 9 is fixedly connected with a knob 5;

[0028] Specifically, if Figure 1 and Figure 2 As shown, when in use, the upper packaging seat 6 is sleeved on the outside of the top of the light-emitting diode body 12, and the connecting seat 4 is inserted into the inner wall of the limiting protective frame 2 until the fixing plate 3 is inserted and installed in the built-in groove 10. After turning the knob 5 in sequence, the mounting bolt 9 is driven to rotate and move downward, passing through the interior of the limiting protective frame 2 and the connecting seat 4, and the upper packaging seat 6 is quickly spliced and fixed.

[0029] The two sides of the light emitting diode body 12 are symmetrically fixedly connected with mounting bases 11. The bottom end of the mounting base 11 is fixedly connected to the top end of the lower packaging base 1. The inner wall of the upper packaging base 6 is fixedly connected with the adhesive inner layer 7. The inner wall of the adhesive inner layer 7 is fixedly connected with the sealing sleeve 8.

[0030] A groove is formed at the top of the bottom of the mounting base 11. A base 16 is fixedly connected to one side of the groove of the mounting base 11. The bottom ends of both sides of the sealing sleeve 8 are fixedly connected to the inner seat 18.

[0031] The top of the base 16 is fixedly connected to a mounting block 17, which passes through the bottom of the internal seat 18 and is plugged into the inside of the internal seat 18;

[0032] Specifically, if Figure 1 and Figure 3 As shown, when in use, the sealing sleeve 8 is fixed to the inner wall surface of the upper packaging seat 6 by pasting the inner layer 7. After the upper packaging seat 6 is fixed, the mounting block 17 fixed at the top of the base 16 is inserted and fixed in the corresponding inner seat 18, thereby improving the fixation of the sealing sleeve 8 itself.

[0033] The front and rear ends of the lower package base 1 are both penetrated by a protective plate 13, and a plurality of through holes 15 are formed inside the protective plate 13. The front and rear ends of the light emitting diode body 12 are both fitted with a moisture-proof layer 20.

[0034] Support frames 19 are fixedly connected to both sides of the inner end of the protective plate 13, and the inner end of the support frame 19 is fixedly connected to the outer end of the moisture-proof layer 20;

[0035] The through holes 15 are arranged at equal intervals inside the protective plate 13, and a dust filter 14 is fixedly connected to the inner wall of the through hole 15;

[0036] Specifically, if Figure 1 and Figure 4 As shown, when in use, two sets of protective plates 13 are respectively set through the inside of the two ends of the lower packaging seat 1. By opening a plurality of sets of through holes 15, the air flow speed inside and outside the lower packaging seat 1 can be accelerated to improve the heat dissipation effect. The dust filter 14 is used to quickly filter the particulate matter in the flowing air to avoid heat accumulation and foreign matter intrusion that causes damage to the chip. At the same time, a moisture-proof layer 20 is added at both ends of the light-emitting diode body 12 to provide strong moisture-proof protection for both ends of the light-emitting diode body 12.

[0037] Working principle: When the present invention is in use, the upper packaging seat 6 is sleeved on the outside of the top of the light-emitting diode body 12, and the connecting seat 4 is inserted into the inner wall of the limit protection frame 2 until the fixing plate 3 is inserted and installed in the built-in groove 10. After turning the knob 5 in sequence, the mounting bolt 9 is driven to rotate and move downward, passing through the interior of the limit protection frame 2 and the connecting seat 4. The upper packaging seat 6 is quickly spliced and fixed, and the sealing sleeve 8 is fixed to the inner wall surface of the upper packaging seat 6 by gluing the inner layer 7. After the upper packaging seat 6 is fixed, the mounting block 17 fixed on the top of the base 16 is inserted and fixed in the corresponding inner connecting seat 18.

[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A light emitting diode packaging structure, comprising a lower packaging seat (1), characterized in that: The interior of the lower packaging seat (1) is provided with a light-emitting diode body (12) penetrating therethrough, the exterior of the light-emitting diode body (12) is provided with an upper packaging seat (6) sleeved thereon, and a splicing assembly for easy assembly and disassembly is provided between the upper packaging seat (6) and the lower packaging seat (1); The splicing assembly includes mounting bolts (9), the bottoms of both sides of the upper packaging seat (6) are fixedly connected to connecting seats (4), the outer sides of the connecting seats (4) are provided with built-in grooves (10), the two sides of the lower packaging seat (1) are fixedly connected to the limiting protection frame (2), the top of the limiting protection frame (2) extends inward, the side walls inside the limiting protection frame (2) are fixedly connected to the fixing plates (3), the fixing plates (3) are plugged and connected inside the built-in grooves (10), and two groups of mounting bolts (9) are provided, and are vertically penetrated and arranged at the top extension of the limiting protection frame (2).

2. The light emitting diode package structure according to claim 1, wherein: The mounting bolts (9) are symmetrically distributed about the vertical center line of the lower packaging seat (1), and the top ends of the mounting bolts (9) are fixedly connected with a knob (5).

3. The light emitting diode package structure according to claim 1, wherein: The two sides of the light-emitting diode body (12) are symmetrically fixedly connected to mounting seats (11), the bottom end of the mounting seat (11) is fixedly connected to the top end of the lower packaging seat (1), the inner wall of the upper packaging seat (6) is fixedly connected to an adhesive inner layer (7), and the inner wall of the adhesive inner layer (7) is fixedly connected to a sealing sleeve (8).

4. The light emitting diode packaging structure according to claim 3, wherein: A groove is provided at the top of the bottom of the mounting seat (11), a base (16) is fixedly connected to one side of the groove of the mounting seat (11), and an inner seat (18) is fixedly connected to the bottom ends of both sides of the sealing sleeve (8).

5. The light emitting diode packaging structure according to claim 4, characterized in that: The top end of the base (16) is fixedly connected with a mounting block (17), and the mounting block (17) passes through the bottom of the internal seat (18) and is plugged into the interior of the internal seat (18).

6. The light emitting diode package structure according to claim 1, characterized in that: The front and rear ends of the lower packaging seat (1) are both penetrated by a protective plate (13), the interior of the protective plate (13) is penetrated by a plurality of through holes (15), and the front and rear ends of the exterior of the light-emitting diode body (12) are both fitted with a moisture-proof layer (20).

7. The light emitting diode package structure according to claim 6, characterized in that: Support frames (19) are fixedly connected to both sides of the inner end of the protective plate (13), and the inner end of the support frame (19) is fixedly connected to the outer end of the moisture-proof layer (20).

8. The light emitting diode package structure according to claim 6, characterized in that: The through holes (15) are arranged at equal intervals inside the protective plate (13), and a circle of dust filter (14) is fixedly connected to the inner wall of the through hole (15).

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