Heat conduction module applied to high-power lamp product

Abstract

The utility model discloses a heat conduction module applied to a high-power lamp product. Comprising a light source plate, a heat pipe, a base and heat dissipation fins, the heat pipe is a copper heat pipe, one end of the heat pipe is fixed to the base in a limited mode and is directly attached to the light source plate, and the other end of the heat pipe penetrates through the middles of the heat dissipation fins. The light source plate is directly attached to the heat pipe, the heat pipe with the high heat conduction function conducts heat, on one hand, the heat conduction effect can be enhanced, the heat conduction blocking rate can be reduced, on the other hand, use of a middle heat conduction component is omitted, cost can be effectively saved, and under the condition of the same power of a lamp, the whole lamp is better in heat conduction compared with an existing product.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp heat conduction modules, in particular to a heat conduction module used in high-power lamp products. Background Art

[0002] As we all know, lamps are electrical products used to generate lighting sources. They are mainly illuminated by the light source (lamp beads) inside the lamp when powered on. The most common light source at present is the LED lamp, also known as a light-emitting diode. It is a commonly used light-emitting device. The principle is to release energy through the recombination of electrons and holes to emit light. Therefore, when emitting light, it will generate an equivalent amount of heat. In order to avoid damage to the lamp caused by heat, a corresponding thermal conductive module is generally set up to dissipate the generated heat.

[0003] At present, the thermal conductivity modules of existing lamps are basically just a heat sink attached to the back of the LED light board. This attachment method is greatly affected by the thermal conductivity coefficient between the intermediate heat-conducting parts. For example, it relies on an aluminum substrate and needs to be coated with thermal conductive gel when necessary, resulting in poor thermal conductivity and increasing production costs. This is especially true for high-power lamp products, such as high-power stage lights, projectors and other products. Lighting will generate a lot of heat. If the thermal conductivity is not good, it will reduce the service life of the product. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a heat conduction module for high-power lamp products.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A heat conduction module used in high-power lamp products includes a light source board, a heat pipe, a base and heat dissipation fins. The heat pipe is a copper heat pipe. One end of the heat pipe is fixed on the base and directly attached to the light source board, and the other end of the heat pipe passes through the middle of the heat dissipation fins.

[0007] Preferably, when the number of the heat pipes is two or more, the ends of the heat pipes used to fit the light source board are placed side by side and pressed together, and the ends of the heat pipes used to pass through the heat dissipation fins are dispersed and pass through different parts of the heat dissipation fins.

[0008] Preferably, the end of the heat pipe in contact with the light source board is square, and the end of the heat pipe in contact with the heat dissipation fin is cylindrical.

[0009] Preferably, the heat dissipation fins are composed of a plurality of sheet-shaped heat dissipation fins, gaps are left between each of the heat dissipation fins, and each of the heat dissipation fins is in contact with the heat pipe.

[0010] Due to the adoption of the above-mentioned solution, the utility model chooses to directly attach the light source board to the heat pipe, allowing the heat pipe with high thermal conductivity to conduct heat. On the one hand, it can enhance the thermal conductivity effect and reduce the thermal conductivity resistance rate. On the other hand, it eliminates the use of intermediate thermal conductive components, which can effectively save costs and make the overall thermal conductivity better than existing products under the same power of the lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of an embodiment of the present utility model.

[0012] Figure 2 It is a structural explosion diagram of an embodiment of the present utility model.

[0013] Figure 3 It is a cross-sectional view of the structure of an embodiment of the utility model. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0015] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0016] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, removable connections, or integral connections. They may refer to mechanical connections or electrical connections. They may refer to direct connections or indirect connections through an intermediary, and they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0017] like Figures 1 to 3 As shown, this embodiment provides a thermal conductive module for use in high-power lamp products, including a light source board 1, a heat pipe 2, a base 3 and heat dissipation fins 4. The heat pipe 2 is a copper heat pipe. One end of the heat pipe 2 is fixed on the base 3 and directly adheres to the light source board 1, and the other end of the heat pipe 2 passes through the middle of the heat dissipation fin 4.

[0018] This embodiment eliminates the design of an intermediate heat-conducting component (aluminum substrate) and directly chooses to attach the light source board 1 directly to the heat pipe 2. After the LED lamp group on the light source board 1 is welded to the corresponding position, its back is directly attached to the heat pipe 2. In this way, the heat generated by the light emission can be directly transferred to the heat pipe 2 without being transferred through other components, allowing the heat pipe 2 with high thermal conductivity to conduct heat. On the one hand, this can enhance the thermal conductivity effect and reduce the thermal conductivity resistance rate. On the other hand, it eliminates the use of intermediate heat-conducting components, which can effectively save costs and make the overall thermal conductivity better than existing products under the same power of the lamp.

[0019] Furthermore, with respect to the number and arrangement of the heat pipes 2, when the number of the heat pipes 2 is two or greater than two, the ends of the heat pipes 2 that are attached to the light source board 1 are placed side by side and converged in one place to simultaneously conduct the heat generated by the light source of the light source board 1, and the ends of the heat pipes 2 that are used to pass through the heat dissipation fins 4 are dispersed and passed through different parts of the heat dissipation fins 4. In this way, multiple heat pipes 2 are dispersed to increase the heat dissipation effect.

[0020] Furthermore, in this embodiment, the end of the heat pipe 2 that contacts the light source board 1 is square, and the end of the heat pipe 2 that contacts the heat dissipation fin 4 is cylindrical. The square shape can increase the contact between the light source board 1, making the heat conduction more uniform, while the cylindrical shape at the other end increases the diffusion area, which can improve the heat dissipation speed.

[0021] In addition, the heat dissipation fins 4 of this embodiment are composed of a plurality of sheet-shaped heat dissipation fins 41 , gaps are left between each of the heat dissipation fins 41 , and each of the heat dissipation fins 41 is in contact with the heat pipe 2 .

[0022] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A thermal conductive module for high-power lamps, characterized by: It includes a light source board, a heat pipe, a base and heat dissipation fins. The heat pipe is a copper heat pipe. One end of the heat pipe is fixed on the base and directly fits the light source board, and the other end of the heat pipe passes through the middle of the heat dissipation fins.

2. The heat conduction module for high-power lamps according to claim 1, characterized in that: When the number of the heat pipes is two or more, the ends of the heat pipes for contacting the light source board are arranged side by side and the ends of the heat pipes for passing through the heat dissipation fins are dispersed and pass through different parts of the heat dissipation fins.

3. The heat conduction module for high-power lamps according to claim 2, characterized in that: The end of the heat pipe in contact with the light source board is square, and the end of the heat pipe in contact with the heat dissipation fin is cylindrical.

4. The heat conduction module for high-power lamps according to claim 3, wherein: The heat dissipation fins are composed of a plurality of sheet-shaped heat dissipation fins, gaps are left between each of the heat dissipation fins, and each of the heat dissipation fins is in contact with the heat pipe.

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