Circuit board thermal stress test device

By introducing a moving mechanism into the circuit board thermal stress test device and adjusting the circuit board position, the problem of uneven thermal stress distribution is solved, and the accuracy and reliability of the test are improved.

CN223244751UActive Publication Date: 2025-08-19LIANMENG ELECTRONICS(HUIZHOU) CO LTD
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Patent Information

Application Number
CN202421948157.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-13
Publication Date
2025-08-19
Estimated Expiration
2034-08-13

AI Technical Summary

Technical Problem

The existing circuit board thermal stress testing devices lack the adjustment structure to the circuit board position, resulting in uneven thermal stress distribution and affecting the accuracy of the test results.

Method used

The tray is moved by a moving mechanism, and the position of the circuit board is adjusted through the threaded rod and the drive motor to ensure a uniform thermal stress distribution.

Benefits of technology

The uniform thermal stress distribution of the circuit board during the test is achieved, which improves the accuracy and reliability of the test and reduces errors.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223244751U_ABST
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Abstract

The utility model discloses a thermal stress test device for a circuit board, which comprises a test box and is characterized in that a heating mechanism is matched with two groups of refrigerators to provide a high-temperature environment, a low-temperature environment and a rapid temperature change environment for the circuit board in the test box so as to simulate the thermal stress condition of the circuit board in actual use. The temperature sensor and the pressure sensor monitor the temperature and the pressure in the test box respectively, the pressure sensor measures thermal stress generated by the circuit board in the temperature change process in real time and transmits data to the control panel to be analyzed and processed, and a driving motor in the moving mechanism drives a threaded rod to rotate, so that the circuit board is driven to move. The sliding block in threaded connection with the outer wall of the threaded rod linearly moves under the limitation of the limiting rod, so that the position of the circuit board is adjusted when the circuit board in the tray is tested, uniform thermal stress can be ensured in the test process, the heat resistance and the reliability of the circuit board can be evaluated more accurately, errors are reduced, and the test efficiency is improved. And the test accuracy is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit board testing equipment, in particular to a circuit board thermal stress testing device. Background Art

[0002] The PCB thermal stress tester simulates the high and low temperatures and rapid temperature fluctuations that PCBs may encounter during actual use to verify their thermal shock resistance and long-term reliability. This type of testing is crucial for ensuring the quality and stability of electronic products.

[0003] For example, a circuit board thermal stress test device (Announcement No.: CN207703753U) includes a thermal stress test chamber, a pressure sensor disposed within the chamber, a processor device located outside the chamber, a buffer device disposed above the chamber, a movable device disposed on the buffer device, and a control device disposed to the right of the buffer device. This device automatically exhausts gas from the chamber, providing ease of use and high safety. It also effectively buffers the air pressure within the chamber before exhaust, maintaining pressure balance and preventing accidents.

[0004] Based on the search of the above patents and combined with the equipment in the prior art, it was found that the above equipment lacks a structure for moving the circuit board during application and cannot adjust the position of the circuit board during the test. Different positions of the circuit board may be affected by heat to varying degrees during the circuit board thermal stress test, resulting in uneven temperature gradient distribution. Uneven thermal stress distribution may cause deviations in the test results. Therefore, we need to propose a circuit board thermal stress test device. Utility Model Content

[0005] The purpose of the present utility model is to provide a circuit board thermal stress testing device, which can move the tray through a moving mechanism, and adjust the position of the circuit board in the tray during the test, thereby ensuring that it is subjected to uniform thermal stress during the test, thereby more accurately evaluating its heat resistance and reliability, and solving the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A circuit board thermal stress testing device includes a test box, a tray, a moving mechanism, a refrigerator, a heating mechanism, a vent and a blocking mechanism, wherein a door is provided on one side of the test box, a tray for supporting the circuit board is slidably installed inside the test box, a moving mechanism for moving the tray is provided on the inner bottom of the test box, two groups of refrigerators are symmetrically installed on the inner wall of one side of the test box, a heating mechanism for heating the interior of the test box is provided between the two groups of refrigerators, a vent is provided on the top of one side of the test box, and a blocking mechanism is provided inside the vent.

[0008] Preferably, the moving mechanism includes a threaded rod, which is rotatably installed inside the test box, and one end of the threaded rod passes through the test box and is fixedly connected to a drive motor; the outer wall of the threaded rod is threadedly connected to a sliding block, and the tray is fixedly installed on the top of the sliding block.

[0009] Preferably, the sliding block is located on both sides of the threaded rod and is slidably inserted with a limit rod, and both ends of the limit rod are fixedly connected to the inner walls of the test box on both sides.

[0010] Preferably, the heating mechanism includes an insulation board, which is fixedly mounted on one inner wall of the test box, and a plurality of groups of heating tubes are fixedly mounted on one side of the insulation board, and a heat dissipation shell is fixedly mounted on the outside of the plurality of groups of heating tubes.

[0011] Preferably, the thermal insulation board is made of thermal insulation material, and the heat dissipation shell is a heat dissipation shell with a plurality of through holes opened on the surface.

[0012] Preferably, the sealing mechanism includes an electric push rod, which is fixedly mounted on one side wall of the test box. The top of the electric push rod piston rod is fixedly connected to a mounting plate through a connecting plate. A sealing plate is fixedly mounted on the bottom of the mounting plate, and the sealing plate is slidably inserted into the inside of the vent.

[0013] Preferably, an exhaust pipe is fixedly connected to the center of the top of the test box, and an exhaust valve is provided on the outer wall of the exhaust pipe.

[0014] Preferably, a temperature sensor and a pressure sensor are fixedly mounted on the inner top of the test box, and a control panel is fixedly mounted on one side wall of the test box.

[0015] Preferably, the control panel is electrically connected to the drive motor, the refrigerator, the heating tube, the electric push rod, the exhaust valve, the temperature sensor and the pressure sensor through wires.

[0016] Preferably, an observation window is provided in the center of one side of the test box, and an anti-fogging film is provided in the observation window.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model places the circuit board in a tray, moves the tray by a moving mechanism, and then adjusts the position of the circuit board in the tray during the test, thereby ensuring that it is subjected to uniform thermal stress during the test, thereby more accurately evaluating its heat resistance and reliability, and has the advantages of reducing errors and improving test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model from a side view;

[0020] Figure 2 This is a schematic diagram of the cross-section structure of the utility model;

[0021] Figure 3 This is a structural diagram of the vent and blocking mechanism of the utility model;

[0022] Figure 4 It is a structural diagram of the heating mechanism of the present utility model.

[0023] In the figure: 1. Test chamber; 2. Tray; 3. Moving mechanism; 31. Threaded rod; 32. Drive motor; 33. Sliding block; 34. Limiting rod; 5. Refrigerator; 6. Heating mechanism; 61. Insulation board; 62. Heating tube; 63. Heat dissipation shell; 7. Ventilation port; 8. Sealing mechanism; 81. Electric push rod; 82. Mounting plate; 83. Sealing plate; 9. Exhaust pipe; 10. Exhaust valve; 11. Temperature sensor; 12. Pressure sensor; 13. Chamber door; 14. Control panel; 15. Observation window. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figure 1-4The utility model provides a technical solution: a circuit board thermal stress test device, comprising a test box 1, a box door 13 is provided on one side of the test box 1, a tray 2 for supporting the circuit board is slidably installed inside the test box 1, a moving mechanism 3 for moving the tray 2 is provided on the inner bottom of the test box 1, two groups of refrigerators 5 are symmetrically installed on the inner wall of one side of the test box 1, a heating mechanism 6 for heating the inside of the test box 1 is provided between the two groups of refrigerators 5, a vent 7 is opened on the top of one side of the test box 1, and a sealing mechanism 8 is provided inside the vent 7.

[0026] By placing the circuit board in the tray 2 and moving the tray 2 by the moving mechanism 3, the position of the circuit board in the tray 2 can be adjusted during the test, thereby ensuring that the circuit board is subjected to uniform thermal stress during the test.

[0027] In a further preferred embodiment, the moving mechanism 3 includes a threaded rod 31, which is rotatably installed inside the test box 1. One end of the threaded rod 31 passes through the test box 1 and is fixedly connected to a drive motor 32. The outer wall of the threaded rod 31 is threadedly connected to a sliding block 33. The tray 2 is fixedly installed on the top of the sliding block 33, so that the threaded rod 31 can be driven to rotate by the output shaft of the drive motor 32, so that the sliding block 33 threadedly connected to the outer wall of the threaded rod 31 drives the circuit board in the tray 2 to adjust the position of the circuit board during the test.

[0028] In a further preferred embodiment, the sliding block 33 is located on both sides of the threaded rod 31 and is slidably inserted with a limit rod 34, and the two ends of the limit rod 34 are respectively fixedly connected to the inner walls of the two sides of the test box 1, so that the sliding block 33 can be limited by the limit rod 34 when moving, so that the sliding block 33 can only move in a straight line.

[0029] In a further preferred embodiment, the heating mechanism 6 includes an insulation plate 61, which is fixedly mounted on one inner wall of the test box 1. Several groups of heating tubes 62 are fixedly mounted on one side of the insulation plate 61, and a heat dissipation shell 63 is fixedly mounted on the outside of the insulation plate 61 on the several groups of heating tubes 62, so as to facilitate heating the inside of the test box 1 through the heating tubes 62.

[0030] In a further preferred embodiment, the insulation board 61 is configured to be made of insulation material, and the heat dissipation shell 63 is configured to be a heat dissipation shell with several groups of through holes on the surface, so that the back of the test box 1 can be insulated and kept warm by the insulation board 61, and the heat generated by several groups of heating tubes 62 is evenly dissipated to the inside of the test box 1 through the heat dissipation shell 63.

[0031] In a further preferred embodiment, the sealing mechanism 8 includes an electric push rod 81, which is fixedly mounted on one side wall of the test box 1. The top of the piston rod of the electric push rod 81 is fixedly connected to the mounting plate 82 through a connecting plate, and the bottom of the mounting plate 82 is fixedly mounted with a sealing plate 83. The sealing plate 83 is slidably inserted into the inside of the vent 7. When the test box 1 is at high temperature, low temperature or the temperature changes rapidly, the electric push rod 81 can drive the sealing plate 83 at the bottom of the mounting plate 82 to rise, thereby accelerating the ventilation in the test box 1.

[0032] In a further preferred embodiment, an exhaust pipe 9 is fixedly connected to the center of the top of the test box 1, and an exhaust valve 10 is provided on the outer wall of the exhaust pipe 9 to facilitate exhaust when the temperature in the test box 1 is high and the air pressure in the test box 1 is too high, thereby achieving the purpose of reducing the pressure.

[0033] In a further preferred embodiment, a temperature sensor 11 and a pressure sensor 12 are fixedly installed on the inner top of the test box 1, and a control panel 14 is fixedly installed on one side wall of the test box 1, so that the temperature and pressure in the test box 1 can be monitored respectively by the temperature sensor 11 and the pressure sensor 12. The pressure sensor 12 measures the thermal stress generated by the circuit board during the temperature change process in real time, and transmits the data to the control panel 14 for analysis and processing. Finally, the performance and reliability of the circuit board can be judged whether they meet the requirements by evaluating the test data.

[0034] In a further preferred embodiment, the control panel 14 is electrically connected to the drive motor 32, the refrigerator 5, the heating tube 62, the electric push rod 81, the exhaust valve 10, the temperature sensor 11 and the pressure sensor 12 through wires, so as to facilitate the control of the electrically connected components through the control panel 14.

[0035] In a further preferred embodiment, an observation window 15 is provided in the center of one side of the test box 1 , and an anti-fogging film is provided inside the observation window 15 to prevent water droplets or fog from forming on the observation window 15 , making observation easier.

[0036] Working principle: When the utility model is used, the box door 13 is opened and the circuit board is placed in the tray 2. The heating mechanism 6 cooperates with the two sets of refrigerators 5 to provide the circuit board in the test box 1 with a high temperature, low temperature and rapidly changing temperature environment to simulate the thermal stress conditions of the circuit board in actual use. The temperature sensor 11 and the pressure sensor 12 monitor the temperature and pressure in the test box 1 respectively. The pressure sensor 12 measures the thermal stress generated by the circuit board during the temperature change in real time, and transmits the data to the control panel 14 for analysis and processing. The threaded rod 31 is driven to rotate by the driving motor 32 in the moving mechanism 3, so that the sliding block 33 threadedly connected to the outer wall of the threaded rod 31 moves linearly under the limit of the limit rod 34, and then the position of the circuit board in the tray 2 is adjusted during the test, which can ensure that it is subjected to uniform thermal stress during the test, thereby more accurately evaluating its heat resistance and reliability, and has the advantages of reducing errors and improving test accuracy.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board thermal stress test device, characterized in that: include: A test box (1), a tray (2), a moving mechanism (3), a refrigerator (5), a heating mechanism (6), a vent (7) and a blocking mechanism (8), wherein; A door (13) is provided on one side of the test box (1); a tray (2) for supporting a circuit board is slidably installed inside the test box (1); a moving mechanism (3) for moving the tray (2) is provided on the inner bottom of the test box (1); two groups of refrigerators (5) are symmetrically installed on the inner wall of one side of the test box (1); a heating mechanism (6) for heating the interior of the test box (1) is provided between the two groups of refrigerators (5); A vent (7) is provided on the top of one side of the test box (1), and a blocking mechanism (8) is provided inside the vent (7).

2. A circuit board thermal stress testing device according to claim 1, characterized in that: The moving mechanism (3) comprises a threaded rod (31); The threaded rod (31) is rotatably mounted inside the test box (1), and one end of the threaded rod (31) passes through the test box (1) and is fixedly connected to a drive motor (32); The outer wall of the threaded rod (31) is threadedly connected to a sliding block (33), and the tray (2) is fixedly mounted on the top of the sliding block (33).

3. A circuit board thermal stress testing device according to claim 2, characterized in that: The sliding block (33) is located on both sides of the threaded rod (31) and is slidably connected to a limiting rod (34). The two ends of the limiting rod (34) are respectively fixedly connected to the inner walls of the test box (1).

4. A circuit board thermal stress testing device according to claim 3, characterized in that: The heating mechanism (6) includes a temperature insulation plate (61); The insulation board (61) is fixedly mounted on one inner wall of the test box (1), a plurality of groups of heating tubes (62) are fixedly mounted on one side of the insulation board (61), and a heat dissipation shell (63) is fixedly mounted on the outer sides of the plurality of groups of heating tubes (62) on the insulation board (61).

5. A circuit board thermal stress testing device according to claim 4, characterized in that: The thermal insulation plate (61) is configured to be made of thermal insulation material, and the heat dissipation shell (63) is configured to be a heat dissipation shell with a plurality of groups of through holes opened on its surface.

6. A circuit board thermal stress testing device according to claim 4, characterized in that: The blocking mechanism (8) includes an electric push rod (81); The electric push rod (81) is fixedly mounted on a side wall of the test box (1); the top of the piston rod of the electric push rod (81) is fixedly connected to a mounting plate (82) via a connecting plate; a blocking plate (83) is fixedly mounted on the bottom of the mounting plate (82); and the blocking plate (83) is slidably inserted into the interior of the vent (7).

7. A circuit board thermal stress testing device according to claim 6, characterized in that: An exhaust pipe (9) is fixedly connected to the center of the top of the test box (1), and an exhaust valve (10) is provided on the outer wall of the exhaust pipe (9).

8. The circuit board thermal stress testing device according to claim 7, characterized in that: A temperature sensor (11) and a pressure sensor (12) are fixedly mounted on the inner top of the test box (1), and a control panel (14) is fixedly mounted on one side wall of the test box (1).

9. A circuit board thermal stress testing device according to claim 8, characterized in that: The control panel (14) is electrically connected to the drive motor (32), the refrigerator (5), the heating pipe (62), the electric push rod (81), the exhaust valve (10), the temperature sensor (11) and the pressure sensor (12) through wires.

10. The circuit board thermal stress testing device according to claim 1, characterized in that: An observation window (15) is provided in the center of one side of the test box (1), and an anti-fogging film is provided in the observation window (15).

Citation Information

Patent Citations

  • Hot stress test device of circuit board

    CN207703753U