Photoresist spraying device and wafer processing system
By introducing a centrifugal gas-liquid separation device into the photoresist spraying device, the problem that bubbles cannot be completely discharged in high-viscosity photoresist is solved, and the stability and production efficiency of photoresist spraying are improved, thereby reducing production costs.
Patent Information
- Application Number
- CN202422103350.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-28
AI Technical Summary
The bubbles in the medium and high viscosity photoresist spraying pipeline cannot be completely discharged, resulting in abnormal photoresist spraying, affecting production efficiency and increasing production costs.
A centrifugal gas-liquid separation device is added to the photoresist spraying device, and the bubbles are separated from the liquid by centrifugal force, and a centrifugal gas-liquid separation device is set up in front of the bubble discharge module to further remove the bubbles.
Effectively remove bubbles in photoresist, avoid spewing abnormalities, improve production efficiency, and reduce production costs.
Smart Images
Figure CN223244970U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of coating and developing, and in particular to a photoresist spraying device and a wafer processing system. Background Art
[0002] In photoresist coating and developing equipment, bubbles can form in the photoresist ejection line, causing abnormal photoresist ejection. Therefore, a bubble removal device is required to remove these bubbles. When a bubble sensor detects bubbles, the bubble removal device automatically removes them.
[0003] However, when encountering high-viscosity photoresist, the increased viscosity leads to a high number of bubbles. Consequently, the equipment's existing bubble removal function is unable to completely expel these bubbles, resulting in bubbles remaining in the photoresist ejected through the nozzle. This in turn causes abnormal photoresist ejection alarms, impacting wafer coating operations.
[0004] Moreover, when this situation occurs, human intervention is required to shut down the equipment and manually remove bubbles, which affects the wafer processing efficiency and causes waste of photoresist.
[0005] In summary, the existing technology has the problem that bubbles in the spray pipeline cannot be completely discharged, resulting in reduced production efficiency and increased production costs. Utility Model Content
[0006] The purpose of the present application is to provide a photoresist spraying device and a wafer processing system to solve the problem in the prior art that bubbles in the spray pipe cannot be completely discharged, resulting in reduced production efficiency and increased production costs.
[0007] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:
[0008] On the one hand, an embodiment of the present application provides a photoresist spraying device, which includes a glue feed pipeline, a centrifugal gas-liquid separation device, a bubble removal module, a pump, and a glue discharge pipeline. The glue feed pipeline, the centrifugal gas-liquid separation device, the bubble removal module, the pump, and the glue discharge pipeline are connected in sequence. The glue feed pipeline is used to introduce liquid photoresist, and the glue discharge pipeline is used to connect to a nozzle and is used to spray photoresist from the nozzle when the pump is working; wherein,
[0009] The centrifugal gas-liquid separation device is used to separate bubbles from liquid in the photoresist under the action of centrifugal force, and input the processed photoresist into the bubble removal module;
[0010] The debubble module is used to debubble the processed photoresist again.
[0011] Optionally, the centrifugal gas-liquid separation device includes a shell, a working chamber, a guide impeller and an exhaust pipe, the working chamber and the guide impeller are both located in the shell, a liquid inlet and a liquid outlet are provided on the shell, the guide impeller is provided on one side of the working chamber, and the other side of the working chamber is connected to the liquid outlet; the glue feed pipeline passes through the liquid inlet and extends to above the guide impeller; the exhaust pipe passes through the shell and the working chamber, one end of the exhaust pipe extends to a side close to the liquid outlet, and the exhaust pipe and the liquid outlet are spaced apart, and the other end of the exhaust pipe is located outside the shell; wherein,
[0012] When the photoresist flows into the centrifugal gas-liquid separation device through the photoresist inlet pipeline, the photoresist impacts the guide impeller to rotate.
[0013] Optionally, the cross-sectional area of the working chamber gradually decreases along the direction from the liquid inlet to the liquid outlet.
[0014] Optionally, a line connecting the center of the guide impeller and the liquid inlet is arranged to form an angle greater than 0 degrees with the vertical direction.
[0015] Optionally, the guide impeller includes a runner and a plurality of blades, the runner is rotatably connected to the casing, and the plurality of blades are arranged at equal intervals on the periphery of the runner.
[0016] Optionally, the other end of the exhaust pipe faces the opposite direction of the liquid outlet.
[0017] Optionally, the photoresist spraying device further includes a bubble removal pipe, the bubble removal module is connected to the bubble removal pipe, and the gas outlet of the centrifugal gas-liquid separation device is also connected to the bubble removal pipe.
[0018] Optionally, the photoresist spraying device further includes a filter, the glue feed pipeline is connected to the filter, and the filter is also connected to the centrifugal gas-liquid separation device.
[0019] Optionally, the photoresist spraying device further includes a first liquid return pipeline and a second liquid return pipeline, the pump is connected to the bubble removal module through the first liquid return pipeline; the bubble removal module is connected to the glue feed pipeline through the second liquid return pipeline.
[0020] On the other hand, an embodiment of the present application further provides a wafer processing system, which includes the above-mentioned photoresist spraying device.
[0021] Compared with the prior art, this application has the following beneficial effects:
[0022] The present application provides a photoresist spraying device and a wafer processing system, wherein the photoresist spraying device includes a glue feed line, a centrifugal gas-liquid separator, a bubble removal module, a pump, and a glue discharge line, wherein the glue feed line, the centrifugal gas-liquid separator, the bubble removal module, the pump, and the glue discharge line are connected in sequence, the glue feed line is used to pass liquid photoresist, the glue discharge line is used to connect to a nozzle, and is used to spray the photoresist from the nozzle when the pump is working; wherein the centrifugal gas-liquid separator is used to separate bubbles from the liquid in the photoresist under the action of centrifugal force, and input the treated photoresist into the bubble removal module; the bubble removal module is used to perform bubble removal treatment on the treated photoresist again. Since the present application is provided with a centrifugal gas-liquid separator before the bubble removal module, a large amount of bubbles can be discharged by the centrifugal gas-liquid separator, so that the bubbles in the photoresist input to the bubble removal module are greatly reduced. Afterwards, the secondary bubble removal treatment of the bubble removal module is carried out so that the bubbles can be completely discharged, thereby avoiding the occurrence of abnormal photoresist ejection, thereby achieving the effect of improving production efficiency and reducing production costs.
[0023] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0025] Figure 1 A schematic diagram of an exemplary structure of a photoresist spraying device provided in an embodiment of the present application.
[0026] Figure 2 Another exemplary structural schematic diagram of the photoresist spraying device provided in an embodiment of the present application.
[0027] Figure 3 A schematic cross-sectional view of a centrifugal gas-liquid separation device provided in an embodiment of the present application.
[0028] Figure 4 Another cross-sectional schematic diagram of the centrifugal gas-liquid separation device provided in an embodiment of the present application.
[0029] Figure 5 A schematic structural diagram of the guide impeller provided in an embodiment of the present application.
[0030] In the picture:
[0031] 101-glue inlet pipeline; 102-centrifugal gas-liquid separation device; 1021-housing; 1022-working chamber; 1023-guide impeller; 10231-rotor; 10232-blades; 1024-exhaust pipe; 1025-liquid inlet; 1026-liquid outlet; 103-bubble removal module; 104-pump; 105-glue outlet pipeline; 106-bubble removal pipeline; 107-glue storage tank; 108-input tank; 109-filter; 110-first return liquid pipeline; 111-second return liquid pipeline. DETAILED DESCRIPTION
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0033] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0034] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.
[0035] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0036] In the description of this application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.
[0037] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.
[0038] As described in the background art, current coating and developing equipment generally uses a bubble removal device to remove bubbles. However, when a large amount of bubbles are generated in a high-viscosity photoresist, the bubble removal function may be unable to completely remove the bubbles. In this case, the coating and developing equipment may display an abnormal alarm for the photoresist to be ejected, requiring the equipment to be shut down for the bubble removal process. This not only affects production efficiency, but also results in waste of photoresist, leading to an increase in production costs.
[0039] In view of this, in order to solve the above problems, an embodiment of the present application provides a photoresist spraying device, which adds a centrifugal gas-liquid separation device in front of the bubble removal device, and discharges a large number of bubbles through the centrifugal gas-liquid separation device, thereby avoiding the situation where the bubble removal module cannot completely discharge the bubbles.
[0040] The following is an exemplary description of the photoresist spraying device provided in this application:
[0041] As an alternative implementation, see Figure 1 The photoresist spraying device includes a glue inlet pipeline 101, a centrifugal gas-liquid separation device 102, a bubble removal module 103, a pump 104 and a glue outlet pipeline 105. The glue inlet pipeline 101, the centrifugal gas-liquid separation device 102, the bubble removal module 103, the pump 104 and the glue outlet pipeline 105 are connected in sequence. The glue inlet pipeline 101 is used to introduce liquid photoresist, and the glue outlet pipeline 105 is used to connect to the nozzle and to spray the photoresist from the nozzle when the pump 104 is working; wherein, the centrifugal gas-liquid separation device 102 is used to separate bubbles from liquid in the photoresist under the action of centrifugal force, and input the processed photoresist into the bubble removal module 103; the bubble removal module 103 is used to remove bubbles from the processed photoresist again.
[0042] Depend on Figure 1 As can be known, photoresist, after passing through glue inlet pipeline 101, can enter centrifugal gas-liquid separator 102, and centrifugal gas-liquid separator 102 can separate bubble with the photoresist in liquid shape. Still may there be a small amount of bubble in the photoresist after the gas-liquid separation, so the photoresist of centrifugal gas-liquid separator 102 outputs is input into bubble removal module 103 again, and through the processing again of bubble removal module 103, it is guaranteed that there is no bubble completely in the photoresist. And, by the effect of pump 104, photoresist is exported to glue outlet pipeline 105, the end of glue outlet pipeline 105 is connected to nozzle, and then can spray by the bubble-free photoresist of nozzle.
[0043] The photoresist spraying device further includes a bubble removal pipe 106, and the bubble removal module 103 is connected to the bubble removal pipe 106, so that the bubble removal module 103 can discharge bubbles through the bubble removal pipe 106. At the same time, in one implementation, the gas outlet of the centrifugal gas-liquid separation device 102 is also connected to the bubble removal pipe 106, so that the gas separated by the centrifugal gas-liquid separation device 102 can be discharged through the bubble removal pipe 106. In another implementation, the gas outlet of the centrifugal gas-liquid separation device 102 can also be independently provided. For example, the gas outlet of the centrifugal gas-liquid separation device 102 is directly facing the workshop, so that the separated gas can be directly discharged to the workshop.
[0044] Since the photoresist spraying device provided by the present application is provided with a centrifugal gas-liquid separation device 102 before the bubble removal module 103, a large number of bubbles can be discharged by the centrifugal gas-liquid separation device 102. Therefore, when a high-viscosity photoresist is input, even if a large number of bubbles are generated, they can be removed by the treatment of the centrifugal gas-liquid separation device 102. Furthermore, when the photoresist is input into the bubble removal module 103, only the bubble removal module 103 needs to perform a secondary bubble discharge process, that is, the bubble removal module 103 needs to process fewer bubbles. Under the bubble removal action of the bubble removal module 103, it can be ensured that there are no bubbles in the photoresist ejected from the nozzle, and there will be no abnormal photoresist ejection, thereby achieving the effect of improving production efficiency and reducing production costs.
[0045] In one implementation, see Figure 2 The photoresist spraying device also includes a resin storage tank 107, an input tank 108, and a filter 109. Both the resin storage tank 107 and the input tank 108 are light-shielded tanks. The resin storage tank 107 stores photoresist. By discharging gas, such as N2, into the resin storage tank 107, the photoresist in the resin storage tank 107 can be pushed into the input tank 108. The input tank 108 is a tank for temporarily storing photoresist and is used to adjust the speed of the photoresist input into the resin feed line 101, among other functions.
[0046] The input tank 108 may be provided with multiple outlets, each of which may be connected to a different photoresist spraying device. Alternatively, one outlet of the input tank 108 may be used as a testing outlet, i.e., a portion of the photoresist may be obtained through the outlet and subjected to a quality test to determine whether the quality of the photoresist stored in the storage tank 107 meets the quality standards.
[0047] The photoresist entering the input tank 108 is pressurized and enters the glue inlet pipe 101. To ensure the quality of the sprayed photoresist, the photoresist spraying device further includes a filter 109. The glue inlet pipe 101 is connected to the filter 109, which is also connected to the centrifugal gas-liquid separator 102.
[0048] On the one hand, the filter 109 can filter out impurities in the photoresist and improve the quality of the photoresist. On the other hand, when the filter 109 is filtering, some bubbles can be removed synchronously. And the photoresist after passing through the filter 109 enters the centrifugal gas-liquid separation device 102 again. Therefore, in this application, the photoresist can be subjected to three bubble treatments. That is, the filter 109 can perform the first bubble treatment, the centrifugal gas-liquid separation device 102 performs the second bubble treatment, and the bubble removal module 103 performs the third bubble treatment to ensure that there are no bubbles in the photoresist ejected from the nozzle.
[0049] Furthermore, the output port of the filter 109 is connected to the bubble removal pipe 106, so that after filtration, poor-quality photoresist can be discharged through the bubble removal pipe 106. It is understood that the outlet of the bubble removal pipe 106 can be provided with a mounting groove, into which the photoresist containing impurities or bubbles is discharged. Of course, the photoresist in the mounting groove can be further processed to achieve reuse of the photoresist.
[0050] See also Figure 3 , Figure 3 This is a schematic cross-sectional view of a centrifugal gas-liquid separator 102 according to an embodiment of the present application. The centrifugal gas-liquid separator 102 comprises a housing 1021, a working chamber 1022, a guide impeller 1023, and an exhaust pipe 1024. The working chamber 1022 and the guide impeller 1023 are both located within the housing 1021. The housing 1021 is provided with a liquid inlet 1025 and a liquid outlet 1026. The guide impeller 1023 is provided on one side of the working chamber 1022, and the other side of the working chamber 1022 is connected to the liquid outlet 1026. The glue feed line 101 passes through the liquid inlet 1025. 25, and extends to the top of the guide impeller 1023; the exhaust pipe 1024 passes through the shell 1021 and the working chamber 1022, one end of the exhaust pipe 1024 extends to a side close to the liquid outlet 1026, and the exhaust pipe 1024 and the liquid outlet 1026 are spaced apart, and the other end of the exhaust pipe 1024 is located outside the shell 1021; wherein, when the photoresist flows into the centrifugal gas-liquid separation device 102 through the glue inlet pipeline 101, the photoresist impacts the guide impeller 1023 to rotate.
[0051] Regarding the configuration of the working chamber 1022, this application provides two methods. One method is to set a cavity in the housing as the working chamber 1022. The other method is to make the working chamber 1022 a physical device. For example, the working chamber 1022 is formed of a material such as glass, and a cavity for accommodating the photoresist is set inside the working chamber 1022, and the housing is set outside the working chamber 1022.
[0052] In an actual setting, the guide impeller 1023 includes a runner 10231 and a plurality of blades 10232 . The runner 10231 is rotatably connected to the housing 1021 , and the plurality of blades 10232 are equidistantly arranged on the periphery of the runner 10231 .
[0053] In one implementation, the entire centrifugal gas-liquid separation device 102 operates without external power. When liquid photoresist enters the working chamber 1022, it rushes toward the blades 10232 of the guide impeller 1023 with a certain amount of kinetic energy, thereby driving the rotor 10231 to rotate. The rotation of the rotor 10231 causes the liquid to spirally accelerate. Because the mass of the liquid is greater than the mass of the bubbles, the bubbles gather toward the central axis of the working chamber 1022 under the action of centrifugal force. The pressure along the central axis decreases as the spiral acceleration of the liquid increases. The pressure is lowest at the center of the working chamber 1022's minimum diameter. Due to the combined effects of the pressure differential along the central axis and the liquid near the center, the bubbles move toward the minimum diameter of the working chamber 1022 and gather there. Near the right side of the junction between the working chamber 1022 and the liquid outlet 1026, the pressure there is higher than the pressure at the liquid outlet 1026 because the liquid does not spiral. Under the action of pressure, the accumulated gas is discharged from the working chamber 1022 through the exhaust pipe 1024.
[0054] On this basis, the other end of the exhaust pipe 1024 can be oriented in the opposite direction of the liquid outlet 1026. Figure 3 As shown, the liquid outlet 1026 faces right, one end of the exhaust pipe 1024 is arranged near the liquid outlet 1026, and the other end of the exhaust pipe 1024 faces left.
[0055] Of course, the other end of the exhaust pipe 1024 can also pass through the side wall of the shell, such as Figure 4 shown.
[0056] Furthermore, in order to ensure that the guide impeller 1023 can rotate stably under the impact of the liquid kinetic energy, in this application, please refer to Figure 5 The line connecting the center of the guide impeller 1023 and the liquid inlet 1025 is arranged at an angle greater than 0 degrees with the vertical direction. That is, the angle a in the figure needs to be greater than 0 degrees. This arrangement ensures that the liquid inlet 1025 is not located directly above the guide impeller 1023, thus preventing the kinetic energy generated by the impact of the photoresist from driving the guide impeller 1023 to rotate when the guide impeller 1023 is symmetrical along the vertical direction.
[0057] As shown in the figure, positioning liquid inlet 1025 above and to the left of guide impeller 1023 ensures that the kinetic energy generated by the impact of photoresist input is concentrated on the left side of guide impeller 1023, thereby driving the entire guide impeller 1023 to rotate counterclockwise. Driven by guide impeller 1023, the photoresist rotates in a spiral, accelerating motion, achieving a centrifugal effect.
[0058] Furthermore, to achieve a better spiral acceleration effect, the cross-sectional area of the working chamber 1022 gradually decreases from the liquid inlet 1025 to the liquid outlet 1026. Specifically, the entire working chamber 1022 is shaped like a horizontally placed truncated cone, with the guide impeller 1023 disposed at the bottom of the cone. The liquid inlet 1025 also faces the bottom of the cone, and the liquid outlet 1026 exits from the top of the cone.
[0059] In another implementation, the entire centrifugal gas-liquid separation device 102 may also be powered by an external power source. For example, the photoresist spray coating device may further include a motor, the rotor of which is connected to the guide impeller 1023. When the motor is activated, it can drive the guide impeller 1023 to rotate, generating centrifugal force. Furthermore, the liquid inlet 1025 may be positioned directly above the guide impeller 1023, although this is not a limitation.
[0060] The centrifugal gas-liquid separation device 102 can remove most of the bubbles in the photoresist. Of course, after being processed by the centrifugal gas-liquid separation device 102, a small amount of bubbles may still remain in the photoresist input to the bubble removal module 103. These bubbles can be further completely removed by processing in the bubble removal module 103. Since the bubble removal module 103 is a common module, the specific structure of the bubble removal module 103 will not be described in this application.
[0061] When the pump 104 is working, the photoresist passing through the bubble removal module 103 flows to the nozzle through the pump 104. In order to adjust the pressure of the glue outlet pipe 105, please refer to Figure 2 The photoresist spraying device further includes a first liquid return line 110 and a second liquid return line 111 . The pump 104 is connected to the bubble removal module 103 through the first liquid return line 110 . The bubble removal module 103 is connected to the glue feed line 101 through the second liquid return line 111 .
[0062] By setting the first liquid return pipeline 110 and the second liquid return pipeline 111, when the pressure of the glue outlet pipeline 105 is relatively high, the pump 104 can discharge the excess photoresist back into the bubble removal module 103 through the first liquid return pipeline 110. At the same time, the bubble removal module 103 can discharge the excess photoresist back into the glue inlet pipeline 101 through the second liquid return pipeline 111, thereby forming a photoresist circulation, making the pressure in the glue outlet pipeline 105 relatively balanced, ensuring the relative balance of glue discharge at the nozzle, and better spraying effect.
[0063] Certainly, in order to control the nozzle spraying amount, in the photoresist spraying device, can also comprise modules such as flow meter, flow meter is communicated with glue discharge pipeline 105, can measure the flow of photoresist in real time by flow meter.And, in each pipeline, valve can be set, can realize being communicated with or shutting off in each passage by valve.For example, in glue feed pipeline 101, glue discharge pipeline 105, first liquid return pipeline 110 and second liquid return pipeline 111, valve can be set, in the pipeline being communicated with bubble row pipeline 106, valve also can be set, only when needs bubble row, valve just can be opened, and realization is better controlled to whole photoresist spraying device.
[0064] Based on the above implementation method, an embodiment of the present application further provides a wafer processing system, which includes the above-mentioned photoresist spraying device.
[0065] In summary, the present application provides a photoresist spraying device and a wafer processing system, the photoresist spraying device includes a glue feed line, a centrifugal gas-liquid separation device, a bubble removal module, a pump and a glue discharge line, the glue feed line, the centrifugal gas-liquid separation device, the bubble removal module, the pump and the glue discharge line are connected in sequence, the glue feed line is used to pass liquid photoresist, the glue discharge line is used to connect the nozzle, and is used to spray the photoresist from the nozzle when the pump is working; wherein, the centrifugal gas-liquid separation device is used to separate the bubbles in the photoresist from the liquid under the action of centrifugal force, and input the treated photoresist into the bubble removal module; the bubble removal module is used to perform bubble removal treatment on the treated photoresist again. Since the present application is provided with a centrifugal gas-liquid separation device before the bubble removal module, a large number of bubbles can be discharged by the centrifugal gas-liquid separation device, so that the bubbles in the photoresist input to the bubble removal module are greatly reduced. After that, the bubbles are completely discharged through the secondary bubble discharge treatment of the bubble discharge module, avoiding the abnormal photoresist spraying, thereby improving production efficiency and reducing production costs.
[0066] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
[0067] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A photoresist spraying device, characterized in that, The photoresist spraying device includes a glue inlet pipeline, a centrifugal gas-liquid separation device, a bubble removal module, a pump and a glue outlet pipeline. The glue inlet pipeline, the centrifugal gas-liquid separation device, the bubble removal module, the pump and the glue outlet pipeline are connected in sequence. The glue inlet pipeline is used to introduce liquid photoresist, and the glue outlet pipeline is used to connect to a nozzle and to spray photoresist from the nozzle when the pump is working; wherein, The centrifugal gas-liquid separation device is used to separate bubbles from liquid in the photoresist under the action of centrifugal force, and input the processed photoresist into the bubble removal module; The debubble module is used to debubble the processed photoresist again.
2. The photoresist spraying device according to claim 1, wherein: The centrifugal gas-liquid separation device includes a shell, a working chamber, a guide impeller and an exhaust pipe, the working chamber and the guide impeller are both located in the shell, a liquid inlet and a liquid outlet are provided on the shell, the guide impeller is provided on one side of the working chamber, and the other side of the working chamber is connected to the liquid outlet; the glue feed pipeline passes through the liquid inlet and extends to the top of the guide impeller; the exhaust pipe passes through the shell and the working chamber, one end of the exhaust pipe extends to a side close to the liquid outlet, and the exhaust pipe and the liquid outlet are spaced apart, and the other end of the exhaust pipe is located outside the shell; wherein, When the photoresist flows into the centrifugal gas-liquid separation device through the photoresist inlet pipeline, the photoresist impacts the guide impeller to rotate.
3. The photoresist spraying device according to claim 2, wherein: The cross-sectional area of the working chamber gradually decreases from the liquid inlet to the liquid outlet.
4. The photoresist spraying device according to claim 2, wherein: The line connecting the center of the guide impeller and the liquid inlet is arranged to form an angle greater than 0 degrees with the vertical direction.
5. The photoresist spraying device according to claim 2, wherein: The guide impeller includes a runner and a plurality of blades. The runner is rotatably connected to the housing. The plurality of blades are arranged at equal intervals on the periphery of the runner.
6. The photoresist spraying device according to claim 2, wherein: The other end of the exhaust pipe faces the opposite direction of the liquid outlet.
7. The photoresist spraying device according to claim 1, wherein: The photoresist spraying device further includes a bubble removal pipe, the bubble removal module is connected to the bubble removal pipe, and the gas outlet of the centrifugal gas-liquid separation device is also connected to the bubble removal pipe.
8. The photoresist spraying device according to claim 1, wherein: The photoresist spraying device further includes a filter. The glue feed pipeline is connected to the filter, and the filter is also connected to the centrifugal gas-liquid separation device.
9. The photoresist spraying device according to claim 1, wherein: The photoresist spraying device further includes a first liquid return pipeline and a second liquid return pipeline. The pump is connected to the bubble removal module through the first liquid return pipeline; the bubble removal module is connected to the glue feed pipeline through the second liquid return pipeline.
10. A wafer processing system, characterized in that: The wafer processing system includes the photoresist spraying device according to any one of claims 1 to 9.