Telemetering terminal
By combining the zone heat dissipation component and the phase change thermal conduction layer in the telemetry terminal, the problem of poor heat dissipation effect of the telemetry terminal is solved, and the heat conduction and two heat dissipation in the high-temperature zone and the low-temperature zone are achieved, which improves the heat dissipation effect.
Patent Information
- Application Number
- CN202422196721.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-09
AI Technical Summary
The existing telemetry terminals have poor heat dissipation effects, resulting in local high temperatures of single-chip machines. Traditional heat dissipation methods cannot effectively distinguish between high-temperature zones and low-temperature zones, affecting the heat dissipation effect.
A separate area heat dissipation assembly is adopted, including a first thermal conductivity chamber and a second thermal conductivity chamber, which conducts heat conduction on the high and low temperature zones of the microcontroller respectively, and heat dissipation is performed twice through the first and second heat dissipation fans. The phase-change thermal conduction layer is used to achieve close contact and heat conduction at different temperatures, and heat dissipation is performed multiple times by combining the heat dissipation fins and the heat dissipation column.
The heat dissipation effect of the microcontroller in the high-temperature zone is improved, the heat in the high-temperature zone is avoided and the heat dissipation effect is achieved.
Smart Images
Figure CN223245079U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of hydrological monitoring, in particular to a telemetry terminal. Background Art
[0002] With the advancement of technology, the integration of single-chip microcomputers in telemetry terminals used for hydrological monitoring is becoming increasingly higher, which is also accompanied by high power consumption. As a result, the telemetry terminal generates a large amount of heat during operation. In order to ensure the normal operation of the telemetry terminal, the single-chip microcomputer needs to be cooled. The common heat dissipation method is to closely contact the radiator with the single-chip microcomputer, transfer the heat to the radiator by heat conduction, and then dissipate the heat to the environment through a fan. However, there will inevitably be a gap between the single-chip microcomputer and the heat sink, resulting in poor thermal conductivity and thus poor heat dissipation. At the same time, poor heat dissipation, excessive overclocking, excessive software load, etc. will cause local high temperature of the single-chip microcomputer, dividing the single-chip microcomputer into high-temperature and low-temperature zones. The temperature of the low-temperature zone is higher than the normal temperature of the single-chip microcomputer. The traditional heat dissipation method is to dissipate heat from both the high-temperature and low-temperature zones at the same time, which causes the heat from the high-temperature zone to be transferred to the low-temperature zone, which in turn increases the temperature of the low-temperature zone and fails to achieve a good heat dissipation effect.
[0003] Therefore, a telemetry terminal is needed to solve the above problems. Utility Model Content
[0004] The utility model provides a telemetry terminal, which conducts heat and dissipates heat in the high-temperature zone and the low-temperature zone of the single-chip computer respectively, thereby avoiding the influence of the heat in the high-temperature zone on the temperature of the low-temperature zone. At the same time, the high-temperature zone of the single-chip computer is dissipated twice, thereby improving the heat dissipation effect of the high-temperature zone.
[0005] The technical solution of the present utility model is achieved as follows:
[0006] The telemetry terminal comprises a housing, a circuit board body is mounted in the housing, a single-chip microcomputer is mounted on the circuit board body, and a heat dissipation component for dissipating heat of the single-chip microcomputer in different areas is provided in the housing;
[0007] The heat dissipation assembly includes a heat dissipation cover arranged on the outside of the single-chip microcomputer, the heat dissipation cover is provided with a first heat conduction cavity for conducting heat to the high-temperature area of the single-chip microcomputer, and the heat dissipation cover is also provided with a second heat conduction cavity for conducting heat to the low-temperature area of the single-chip microcomputer, the first heat conduction cavity and the first heat conduction cavity are respectively provided with a phase change heat conduction layer, a first heat conduction plate and a second heat conduction plate are installed on the top outer wall of the heat dissipation cover, the bottom surfaces of the first heat conduction plate and the second heat conduction plate are respectively adapted to the corresponding phase change heat conduction layers, a plurality of heat dissipation columns are provided on the top surface of the first heat conduction plate, and a plurality of heat dissipation fins are provided on the top surface of the second heat conduction plate, a first heat dissipation fan for performing primary heat dissipation on the heat dissipation fins and the heat dissipation columns is fixedly installed in the shell, a heat dissipation channel is formed between two adjacent heat dissipation fins, and two ends of each heat dissipation channel are respectively connected to the first heat dissipation fan outlet and the heat dissipation column, and a second heat dissipation fan for performing secondary heat dissipation on the heat dissipation column is fixedly installed in the shell.
[0008] As a preferred technical solution, a plurality of first mounting holes and a second mounting holes are provided on the top surface of the heat dissipation cover, and a plurality of first heat-conducting columns are vertically arranged on the bottom surface of the first heat-conducting plate, and each of the first heat-conducting columns passes through the corresponding first mounting hole. At room temperature, a plurality of cavities are provided on the phase-change heat-conducting layer, and each of the first heat-conducting columns is suspended in the cavity corresponding to the phase-change heat-conducting layer. A plurality of second heat-conducting columns are vertically arranged on the bottom surface of the second heat-conducting plate, and each of the second heat-conducting columns passes through the corresponding second mounting hole, and each of the second heat-conducting columns is suspended in the cavity corresponding to the phase-change heat-conducting layer.
[0009] As a preferred technical solution, a baffle for separating the first heat conduction cavity and the second heat conduction cavity is provided in the heat dissipation cover.
[0010] As a preferred technical solution, the air outlet of the second heat dissipation fan is located on the side of the heat dissipation channel.
[0011] As a preferred technical solution, a plurality of heat dissipation grooves are provided on both side walls of each of the heat dissipation fins.
[0012] As a preferred technical solution, a plurality of heat dissipation holes are provided on the shell.
[0013] By adopting the above technical solution, the beneficial effects of the utility model are:
[0014] Since the telemetry terminal includes a heat dissipation component, during the use of the telemetry terminal, the phase-change heat-conducting layer is composed of a gallium-based liquid alloy. Since the melting point of the gallium-based liquid alloy is higher than the normal temperature range, the phase-change heat-conducting layer is solid at room temperature. As the temperature of the single-chip computer increases, the temperature reaches the melting point of the gallium-based liquid alloy, and the phase-change heat-conducting layer becomes liquid, so that the first heat-conducting column and the second guide column are in close contact with the single-chip computer, thereby improving the heat conduction effect. At the same time, under the action of the baffle, the high-temperature area and the low-temperature area of the single-chip computer are separated, and the two phase-change heat-conducting layers are used to conduct heat to the high-temperature area and the low-temperature area respectively, so that the high The heat in the high temperature area is conducted to the heat dissipation column, and the heat in the low temperature area is conducted to the heat dissipation fins. Under the action of the first heat dissipation fan, the air is discharged from the air outlet of the first heat dissipation fan, enters the heat dissipation channel, and absorbs the heat on the heat dissipation fins, cooling the heat dissipation fins for the first time, and then passes through the heat dissipation column and absorbs the heat on the heat dissipation column, and is finally discharged from the shell, thereby realizing the first cooling of the heat dissipation fins and the heat dissipation column. Under the action of the second heat dissipation fan, the air is discharged from the air outlet of the second heat dissipation fan, passes through the heat dissipation column and absorbs the heat on the heat dissipation column, and is finally discharged from the shell, thereby realizing the second cooling of the heat dissipation column.
[0015] In the utility model, the heat of the high temperature area and the low temperature area on the single chip computer are conducted separately, thereby avoiding the influence of the heat of the high temperature area on the temperature of the low temperature area during the heat conduction process. The heat dissipation column is cooled twice through the cooperation of the first heat dissipation fan, the heat dissipation channel and the second heat dissipation fan, thereby improving the heat dissipation effect of the high temperature area of the single chip computer.
[0016] In the present invention, the second heat dissipation fan outlet is arranged on the side of the heat dissipation fin, so that the air discharged from the second heat dissipation fan outlet flows perpendicular to the heat dissipation fin, thereby reducing the hot air entering the channel after passing through the heat dissipation column, and further avoiding the influence of heat in the high temperature area on the temperature of the low temperature area.
[0017] In the present invention, the arrangement of the heat dissipation column can allow the air exhausted by the first heat dissipation fan and the air exhausted by the second heat dissipation fan to pass smoothly while conducting the heat of the first heat conduction plate, thereby achieving double heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0019] Figure 1 It is a structural diagram of the utility model;
[0020] Figure 2 for Figure 1 Schematic diagram of the enlarged structure at A in the middle;
[0021] Figure 3 for Figure 1 Schematic cross-sectional view along the BB direction;
[0022] Figure 4 for Figure 3 Schematic diagram of the enlarged structure at C in the middle;
[0023] Figure 5 This is a reference diagram of the state during the heat dissipation process.
[0024] Among them: 1. Shell; 2. Circuit board body; 3. Single chip microcomputer; 4. Heat dissipation cover; 5. High temperature zone; 6. First heat conduction cavity; 7. Low temperature zone; 8. Second heat conduction cavity; 9. Phase change heat conduction layer; 10. First heat conduction plate; 11. Second heat conduction plate; 12. Heat dissipation column; 13. Heat dissipation fin; 14. First heat dissipation fan; 15. Heat dissipation channel; 16. Second heat dissipation fan; 17. First mounting hole; 18. Second mounting hole; 19. First heat conduction column; 20. Second heat conduction column; 21. Baffle; 22. Heat dissipation groove; 23. Heat dissipation hole; 24. Cavity. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] like Figure 1-Figure 5 As shown together, the telemetry terminal includes a housing 1 , a circuit board body 2 is installed in the housing 1 , a single chip computer 3 is installed on the circuit board body 2 , and a heat dissipation component for dissipating heat for the single chip computer 3 in different areas is provided in the housing 1 .
[0027] The heat dissipation assembly includes a heat dissipation cover 4 that is arranged on the outside of the single-chip computer 3. The heat dissipation cover 4 is provided with a first heat conduction cavity 6 for conducting heat to the high temperature zone 5 of the single-chip computer 3. The heat dissipation cover 4 is also provided with a second heat conduction cavity 8 for conducting heat to the low temperature zone 7 of the single-chip computer 3. A phase change heat conduction layer 9 is respectively provided in the first heat conduction cavity 6 and the first heat conduction cavity 6. A first heat conduction plate 10 and a second heat conduction plate 11 are installed on the top outer wall of the heat dissipation cover 4. The bottom surfaces of the first heat conduction plate 10 and the second heat conduction plate 11 are respectively adapted to the corresponding phase change heat conduction layer 9. A plurality of heat dissipation columns 12 are provided on the top surface of a heat conducting plate 10, and a plurality of heat dissipation fins 13 are provided on the top surface of a second heat conducting plate 11. A first heat dissipation fan 14 for performing the first heat dissipation of the heat dissipation fins 13 and the heat dissipation columns 12 is fixedly installed in the shell 1. A heat dissipation channel 15 is formed between two adjacent heat dissipation fins 13. The two ends of each heat dissipation channel 15 are respectively connected to the outlet of the first heat dissipation fan 14 and the heat dissipation column 12. A second heat dissipation fan 16 for performing the second heat dissipation of the heat dissipation column 12 is fixedly installed in the shell 1.
[0028] Among them, a plurality of first mounting holes 17 and second mounting holes 18 are provided on the top surface of the heat dissipation cover 4, and a plurality of first heat-conducting columns 19 are vertically arranged on the bottom surface of the first heat-conducting plate 10, and each first heat-conducting column 19 passes through the corresponding first mounting hole 17 respectively. At room temperature, a plurality of cavities 24 are provided on the phase change heat-conducting layer 9, and each first heat-conducting column 19 is suspended in the cavity 24 of the corresponding phase change heat-conducting layer 9. A plurality of second heat-conducting columns 20 are vertically arranged on the bottom surface of the second heat-conducting plate 11, and each second heat-conducting column 20 passes through the corresponding second mounting hole 18 respectively, and each second heat-conducting column 20 is suspended in the cavity 24 of the corresponding phase change heat-conducting layer 9.
[0029] In the present invention, the two phase change heat conducting layers 9 are both composed of gallium-based liquid alloy. When the single chip computer 3 is at room temperature, Figure 4 As shown, the two phase-change heat-conducting layers 9 are solid, and the first heat-conducting column 19 and the second heat-conducting column 20 are respectively located in the cavity 24 of the corresponding phase-change heat-conducting layer 9 and are not in contact with the phase-change heat-conducting layer 9. As the temperature of the single-chip computer 3 increases, the temperature reaches the melting point of the gallium-based liquid alloy, as shown in FIG. Figure 5 As shown, the two phase-change heat-conducting layers 9 are in liquid state, the cavity 24 on the phase-change heat-conducting layer 9 disappears, and the first heat-conducting column 19 and the second heat-conducting column 20 are in close contact with the single-chip computer 3, achieving good heat conduction.
[0030] Furthermore, a baffle 21 is provided in the heat dissipation cover 4 for separating the first heat conduction cavity 6 from the second heat conduction cavity 8 .
[0031] In addition, the air outlet of the second heat dissipation fan 16 is located on the side of the heat dissipation channel 15 .
[0032] Secondly, a plurality of heat dissipation grooves 22 are provided on both side walls of each heat dissipation fin 13 .
[0033] The housing 1 is provided with a plurality of heat dissipation holes 23 .
[0034] The first heat dissipation fan 14 and the second heat dissipation fan 16 are both electrically connected to the circuit board body 2 .
[0035] In summary, the utility model provides for conducting heat and dissipating heat in the high temperature zone and the low temperature zone of the single chip microcomputer respectively, thereby avoiding the influence of the heat in the high temperature zone on the temperature of the low temperature zone. At the same time, the high temperature zone of the single chip microcomputer is dissipated twice, thereby improving the heat dissipation effect of the high temperature zone.
[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A telemetry terminal, comprising a housing, characterized in that: A circuit board body is installed in the housing, a single-chip microcomputer is installed on the circuit board body, and a heat dissipation component for dissipating heat of the single-chip microcomputer in different areas is provided in the housing; The heat dissipation assembly includes a heat dissipation cover arranged on the outside of the single-chip microcomputer, the heat dissipation cover is provided with a first heat conduction cavity for conducting heat to the high-temperature area of the single-chip microcomputer, and the heat dissipation cover is also provided with a second heat conduction cavity for conducting heat to the low-temperature area of the single-chip microcomputer, the first heat conduction cavity and the first heat conduction cavity are respectively provided with a phase change heat conduction layer, a first heat conduction plate and a second heat conduction plate are installed on the top outer wall of the heat dissipation cover, the bottom surfaces of the first heat conduction plate and the second heat conduction plate are respectively adapted to the corresponding phase change heat conduction layers, a plurality of heat dissipation columns are provided on the top surface of the first heat conduction plate, and a plurality of heat dissipation fins are provided on the top surface of the second heat conduction plate, a first heat dissipation fan for performing primary heat dissipation on the heat dissipation fins and the heat dissipation columns is fixedly installed in the shell, a heat dissipation channel is formed between two adjacent heat dissipation fins, and two ends of each heat dissipation channel are respectively connected to the first heat dissipation fan outlet and the heat dissipation column, and a second heat dissipation fan for performing secondary heat dissipation on the heat dissipation column is fixedly installed in the shell.
2. The telemetry terminal according to claim 1, characterized in that: A plurality of first mounting holes and a second mounting holes are provided on the top surface of the heat dissipation cover, a plurality of first heat-conducting columns are vertically provided on the bottom surface of the first heat-conducting plate, and each of the first heat-conducting columns passes through the corresponding first mounting hole. At room temperature, a plurality of cavities are provided on the phase-change heat-conducting layer, and each of the first heat-conducting columns is suspended in the cavity corresponding to the phase-change heat-conducting layer. A plurality of second heat-conducting columns are vertically provided on the bottom surface of the second heat-conducting plate, and each of the second heat-conducting columns passes through the corresponding second mounting hole, and each of the second heat-conducting columns is suspended in the cavity corresponding to the phase-change heat-conducting layer.
3. The telemetry terminal according to claim 1, wherein: A baffle for separating the first heat conduction cavity and the second heat conduction cavity is provided in the heat dissipation cover.
4. The telemetry terminal according to claim 1, wherein: The air outlet of the second heat dissipation fan is located on the side of the heat dissipation channel.
5. The telemetry terminal according to claim 1, wherein: A plurality of heat dissipation grooves are provided on the two side walls of each heat dissipation fin.
6. The telemetry terminal according to claim 1, characterized in that: The shell is provided with a plurality of heat dissipation holes.