Computer cooling fin structure with high heat dissipation performance

Abstract

The utility model relates to a radiating fin structure, in particular to a computer radiating fin structure with high radiating performance, which comprises a heat conducting plate. A fan bracket for mounting a cooling fan is mounted on the heat conducting plate; a heat absorption block used for abutting against a computer central processing unit is installed on the heat conduction plate. A plurality of fin plates are arranged on the heat conducting plate; a limiting assembly is arranged on the heat conduction plate, a clamping assembly is arranged on the fin plate, the limiting assembly and the clamping assembly are matched with each other so that the fin plate can be stably connected to the heat conduction plate, and stable connection of the heat conduction plate and the fin plate can be ensured through interaction of the limiting assembly and the clamping assembly. The clamping assembly enables the fin plate to have the elastic characteristic, vibration generated in the working process is counteracted through the elasticity of the fin plate (when the cooling fan works, airflow around the fin plate can be driven to rapidly flow, the fin plate can be driven to generate resonance, and wind noise is generated on the cooling fins), and therefore the wind noise generated by the cooling fins in the cooling process is reduced.

Description

Technical Field

[0001] The utility model relates to a heat sink structure, in particular to a computer heat sink structure with high heat dissipation performance. Background Art

[0002] A computer heat sink is a device used to dissipate heat from heat-sensitive electronic components in electrical appliances. Its primary function is to effectively conduct heat generated by these components to the surrounding environment, keeping them operating within a suitable temperature range. Heat sinks are typically made of materials such as aluminum alloy, brass, or bronze. These materials have excellent thermal conductivity, allowing them to quickly transfer heat from the heat source to the heat sink, where it is then dissipated into the air.

[0003] Heat sinks typically come into direct contact with heat-generating components, such as the central processing unit (CPU) and graphics processing unit (GPU). These hardware components generate significant heat during operation, and this heat is transferred through the heat sink to ensure proper operation of the computer. Common heat sink designs feature a series of fins or plates, which increase surface area and provide more surface area for dissipating heat. These fins are also paired with cooling fans, which generate air flow over the heat sink or fins, increasing heat exchange efficiency.

[0004] When the cooling fan is working, it will drive the airflow around the fins to flow rapidly, causing the fins to resonate and generate wind noise on the heat sink, which may interfere with the user's work or entertainment experience. The fin resonance will be transmitted to the central processing unit (CPU) and graphics processing unit (GPU), which may affect the stability of the central processing unit (CPU) and graphics processing unit (GPU). Summary of the Invention

[0005] The purpose of the present invention is to provide a computer heat sink structure with high heat dissipation performance to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A computer heat sink structure with high heat dissipation performance comprises a heat conducting plate; a fan frame for mounting a heat dissipation fan is mounted on the heat conducting plate;

[0008] A heat absorbing block for contacting the computer central processing unit is installed on the heat conducting plate; a plurality of fins are provided on the heat conducting plate;

[0009] A limiting component is provided on the heat conducting plate, and a clamping component is provided on the fin plate. The limiting component and the clamping component cooperate with each other to stably connect the fin plate to the heat conducting plate.

[0010] The computer heat sink structure with high heat dissipation as described above: the limiting assembly includes a plurality of slots provided on the heat conducting plate, and two limiting blocks are symmetrically mounted on the inner walls of the slots.

[0011] The computer heat sink structure with high heat dissipation as described above: the clamping assembly includes a contraction seam provided on the fin plate, wedge blocks connected to the fin plate are provided on both sides of the contraction seam; and a limiting groove is provided on the fin plate to cooperate with the limiting block.

[0012] The computer heat sink structure with high heat dissipation as described above: the wedge block can cooperate with the limit block, and the surface where the limit block cooperates with the wedge block is set as a slope surface.

[0013] The computer heat sink structure with high heat dissipation as described above: the surface of the limiting block close to the heat conducting plate is parallel to the flat surface of the heat conducting plate, and the surface of the limiting groove close to the heat conducting plate is parallel to the plane of the heat conducting plate.

[0014] The computer heat sink structure with high heat dissipation as described above: multiple rows of dust storage components are arranged on the fin plate, and the dust storage components include multiple groups of dust storage grooves that are opened through the fin plate; the dust storage grooves are arranged at an angle, and multiple groups of the dust storage grooves are distributed; the dust storage components in two adjacent rows are staggered.

[0015] The computer heat sink structure with high heat dissipation performance as described above: the width of the fin plate has a shrinking feature, and the shrinking direction gradually decreases away from the heat conducting plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are: the interaction between the over-limit component and the clamping component can ensure that the heat conducting plate and the fin are stably connected, and the clamping component can make the fin have elastic characteristics, and can offset the vibration generated during the working process through the elasticity of the fin itself during the heat dissipation process (when the cooling fan is working, it will drive the air flow around the fin to flow rapidly, and the high-speed airflow will drive the fin to resonate, causing wind noise on the heat sink), thereby reducing the wind noise generated by the heat sink during the heat dissipation process, and can reduce the vibration transmitted to the heat conducting plate, thereby improving the protection of the CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of a computer heat sink with high heat dissipation performance.

[0018] Figure 2 This is a structural schematic diagram of a computer heat sink structure with high heat dissipation from another perspective.

[0019] Figure 3 for Figure 1 Schematic diagram of the structure from a cross-sectional perspective.

[0020] Figure 4for Figure 3 Schematic diagram of the structure at point A in the middle.

[0021] Figure 5 for Figure 3 Schematic diagram of the structure at point B.

[0022] Figure 6 This is a schematic diagram of the structure of the heat conducting plate in a computer heat sink structure with high heat dissipation.

[0023] Figure 7 Schematic diagram of the structure of the fins in a computer heat sink with high heat dissipation performance.

[0024] In the figure: 1, heat conducting plate; 101, heat absorbing block; 102, slot; 103, limit block;

[0025] 2. Fin plate; 201. Wedge; 202. Contraction joint; 203. Limiting groove; 204. Dust storage groove;

[0026] 3. Fan rack. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] See also Figures 1 to 7 As an embodiment of the present invention, the computer heat sink structure with high heat dissipation performance includes a heat conducting plate 1; a fan bracket 3 for mounting a heat dissipation fan is installed on the heat conducting plate 1;

[0029] The heat conducting plate 1 is provided with a heat absorbing block 101 for contacting the computer central processing unit; the heat conducting plate 1 is provided with a plurality of fins 2;

[0030] The heat conducting plate 1 is provided with a limiting assembly, and the fin plate 2 is provided with a clamping assembly. The limiting assembly and the clamping assembly cooperate with each other to stably connect the fin plate 2 to the heat conducting plate 1.

[0031] In this embodiment, a computer heat sink is a device used to dissipate heat from heat-prone electronic components in electrical appliances. Its primary function is to effectively conduct heat generated by these components to the surrounding environment, maintaining their operation within a suitable temperature range. Heat sinks are typically made of materials such as aluminum alloy, brass, or bronze. These materials have excellent thermal conductivity, enabling them to quickly transfer heat from the heat source to the heat sink, where it is then dissipated into the air.

[0032] The heat conducting plate 1 is installed on the computer motherboard, and the heat absorbing block 101 is in contact with the central processing unit (CPU). When the CPU is working, it will continuously produce a large amount of heat energy. The heat absorbing block 101 is made of metal material with good thermal conductivity, which can effectively absorb the heat energy of the CPU and conduct it to the heat conducting plate 1. The heat conducting plate 1 also has good thermal conductivity.

[0033] The fin 2 is connected to the heat conducting plate 1 through the interaction of the limit assembly and the clamping assembly, and the fin 2 and the heat conducting plate 1 are in conflict with each other; the fin 2 also has good thermal conductivity, and the heat energy transferred to the heat conducting plate 1 can be quickly and effectively conducted to the fin 2; the fan rack 3 is used to install a cooling fan that is in conflict with the fin 2, and the heat energy on the fin 2 is discharged by blowing air from the cooling fan.

[0034] The interaction between the limiting component and the snap-on component can ensure that the heat conducting plate 1 and the fin 2 are stably connected, and the snap-on component can make the fin 2 have elastic characteristics. During the heat dissipation process, the elasticity of the fin 2 itself can offset the vibration generated during the working process (when the cooling fan is working, it will drive the air flow around the fin 2 to flow rapidly, and the high-speed airflow will drive the fin 2 to resonate, causing wind noise on the heat sink), thereby reducing the wind noise generated by the heat sink during the heat dissipation process.

[0035] As a further solution of the present invention, the limiting assembly includes a plurality of slots 102 provided on the heat conducting plate 1 , and two limiting blocks 103 are symmetrically mounted on the inner walls of the slots 102 .

[0036] As a further solution of the present invention, the clamping assembly includes a contraction seam 202 provided on the fin plate 2 , and wedge blocks 201 connected to the fin plate 2 are provided on both sides of the contraction seam 202 ; a limiting groove 203 is provided on the fin plate 2 to cooperate with the limiting block 103 .

[0037] In this embodiment, the fin 2 is installed vertically on the heat conducting plate 1 during installation. During the installation process, the wedge block 201 will interact with the limit block 103 (the force applied to the fin 2 for inserting the fin 2 into the card slot 102 will be partially converted into a force that makes the wedge blocks 201 approach each other through the interaction between the limit block 103 and the wedge block 201). The spacing of the contraction gap 202 will gradually become smaller, so that the wedge block 201 can smoothly enter the card slot 102; when the wedge block 201 conflicts with the card slot 102, the limit block 103 will be separated from the mutual cooperation state with the wedge block 201. At this time, the limit block 103 will enter the limit groove 203. Through the interaction between the limit block 103 and the limit groove 203, the wedge block 201 will be fixed in the card slot 102 and cannot be easily separated from the card slot 102, thereby ensuring a stable connection between the fin 2 and the heat conducting plate 1.

[0038] The opening of the contraction seam 202 reduces the width of the portion of the fin 2 close to the heat conducting plate 1. Since the fin 2 is made of metal, its elasticity will gradually increase as the width decreases. During the heat dissipation process, the elasticity of the fin 2 itself can offset the vibration generated during operation (when the cooling fan is working, it will drive the air flow around the fin 2 to flow rapidly, and the high-speed airflow will drive the fin 2 to resonate, causing wind noise on the heat sink), thereby reducing the wind noise generated by the heat sink during the heat dissipation process and reducing the vibration transmitted to the heat conducting plate 1, thereby improving the protection of the CPU.

[0039] As a further solution of the present invention, the wedge block 201 can cooperate with the limit block 103, and the surface where the limit block 103 cooperates with the wedge block 201 is set as a slope.

[0040] In this embodiment, the force applied to the fin 2 for inserting the fin 2 into the slot 102 interacts with the limit block 103 and the wedge 201. That is, when the wedge 201 contacts the slope of the limit block 103, the slope converts part of the force into a force that moves the wedges 201 closer to each other, so that the spacing between the contraction joints 202 is reduced, thereby reducing the difficulty of the wedge 201 entering the slot 102, thereby reducing the difficulty of installing the fin 2.

[0041] As a further solution of the present invention, the surface of the limiting block 103 close to the heat conducting plate 1 is a flat surface parallel to the heat conducting plate 1 , and the surface of the limiting groove 203 close to the heat conducting plate 1 is a plane parallel to the heat conducting plate 1 .

[0042] In this embodiment, after the limit block 103 enters the limit groove 203, the straight surface and the flat surface conflict with each other, which increases the resistance of the limit block 103 to disengage from the limit groove 203, thereby increasing the difficulty of the wedge block 201 to disengage from the slot 102, ensuring the stability of the connection between the fin 2 and the heat conducting plate 1.

[0043] As a further solution of the present invention, multiple rows of dust storage components are provided on the fin 2, and the dust storage components include multiple groups of dust storage grooves 204 that are opened through the fin 2; the dust storage grooves 204 are arranged at an angle, and multiple groups of the dust storage grooves 204 are distributed; the dust storage components in two adjacent rows are staggered.

[0044] In this embodiment, when the cooling fan is working, it will enhance the air circulation inside and outside the computer case. The air with higher temperature inside the case will be discharged outside the case, and the air with lower temperature outside the case will be discharged into the case. The air discharged into the case will carry dust and other debris into the case.

[0045] When the cooling fan is working, the air around the fins 2 will flow from the heat conducting plate 1 to the cooling fan and parallel to the fins 2. During the air flow, the heat on the heat conducting plate 1 and the fins 2 will be carried to the cooling fan and discharged outside the chassis through the cooling fan. At the same time, some of the air will flow along with the air to the cooling fan and adhere to the surface of the fins 2. As time goes by, the amount of dust on the surface of the fins 2 will increase, making the distance between the two fins 2 smaller, thereby reducing the heat transfer coefficient of the heat sink (the air flow channel becomes smaller).

[0046] The dust storage component is designed to absorb part of the dust into the dust storage groove 204 when the dust passes through (the dust storage groove 204 is tilted so that part of the air passes through the dust storage groove 204 during air circulation, and the dust entrained in the passing air will be adsorbed in the dust storage groove 204 due to static electricity), so that the distance between the two fins 2 becomes smaller and the time for affecting the heat transfer coefficient of the heat sink is increased, thereby improving the working efficiency of the heat sink.

[0047] The dust storage slots 204 are relatively small and numerous, increasing the dust storage capacity of the fins 2 without significantly affecting (or only marginally affecting) the overall thermal conductivity of the fins 2, thereby improving the heat dissipation efficiency of the heat sink. Furthermore, the overall mass of the fins 2 is reduced, thereby reducing the heat sink's contribution to the overall weight of the chassis and enhancing user comfort.

[0048] As a further solution of the present invention, the width of the fin plate 2 has a shrinking feature, and the shrinking direction is gradually reduced away from the heat conducting plate 1.

[0049] In this embodiment, when the shape of the fin 2 is fixed, the balance between thickness and height becomes very important. In particular, when the fin 2 is thin and tall, it will cause difficulty in heat transfer at the front end, making it impossible to increase the efficiency of the heat sink even if the volume is increased.

[0050] The width of the fin 2 is in a contracted shape, which can effectively increase the contact area between the fin 2 and the air, thereby improving the heat dissipation performance of the heat sink.

[0051] The above embodiments are exemplary rather than restrictive, so any technical solution of the present invention that can be implemented in other specific forms without departing from the spirit or basic features of the present invention is included in the present invention.

Claims

1. A computer heat sink structure with high heat dissipation performance, comprising a heat conducting plate (1); a fan frame (3) for mounting a heat dissipation fan is mounted on the heat conducting plate (1); It is characterized by: A heat absorbing block (101) for contacting a computer central processing unit is mounted on the heat conducting plate (1); a plurality of fins (2) are provided on the heat conducting plate (1); A limiting assembly is provided on the heat conducting plate (1), and a clamping assembly is provided on the fin plate (2). The limiting assembly and the clamping assembly cooperate with each other to stably connect the fin plate (2) to the heat conducting plate (1).

2. A computer heat sink structure with high heat dissipation according to claim 1, characterized in that: The limiting assembly comprises a plurality of groups of slots (102) provided on the heat conducting plate (1), and two limiting blocks (103) are symmetrically mounted on the inner walls of the slots (102).

3. A computer heat sink structure with high heat dissipation according to claim 2, characterized in that: The clamping assembly comprises a contraction seam (202) provided on the fin plate (2), wedge blocks (201) connected to the fin plate (2) are provided on both sides of the contraction seam (202); and a limiting groove (203) is provided on the fin plate (2) to cooperate with the limiting block (103).

4. A computer heat sink structure with high heat dissipation according to claim 3, characterized in that: The wedge block (201) can cooperate with the limit block (103), and the surface where the limit block (103) and the wedge block (201) cooperate is set as a slope surface.

5. A computer heat sink structure with high heat dissipation according to claim 4, characterized in that: The surface of the limiting block (103) close to the heat conducting plate (1) is a flat surface parallel to the heat conducting plate (1), and the surface of the limiting groove (203) close to the heat conducting plate (1) is a plane parallel to the heat conducting plate (1).

6. A computer heat sink structure with high heat dissipation according to claim 1, characterized in that: The fin plate (2) is provided with multiple rows of dust storage components, and the dust storage components include multiple groups of dust storage grooves (204) that are opened through the fin plate (2); the dust storage grooves (204) are arranged obliquely, and the multiple groups of dust storage grooves (204) are distributed; the dust storage components in two adjacent rows are arranged in a staggered manner.

7. A computer heat sink structure with high heat dissipation according to claim 6, characterized in that: The width of the fin plate (2) has a shrinking feature, and the shrinking direction is gradually reduced away from the heat conducting plate (1).

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