Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device. According to the utility model, each cleaning bin is provided with the first exhaust assembly and the second exhaust assembly which are respectively used for exhausting gases generated after cleaning, so that different gases generated after cleaning wafers in the cleaning bins can be exhausted from different exhaust assemblies, for example, when acidic gases are generated, the acidic gases are exhausted from the first exhaust assembly, and the acidic gases are exhausted from the second exhaust assembly. And the generated alkaline gas is discharged from the second exhaust assembly, so that the gas generated by cleaning the wafer is prevented from being discharged from one exhaust port assembly to generate a chemical reaction to generate toxic gas or generate a chemical reaction to cause danger or cleaning failure.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a wafer cleaning device. Background Art

[0002] In the semiconductor manufacturing process, wafer cleaning is a crucial link, which is directly related to the quality and performance of the final chip. The main purpose of wafer cleaning is to remove various impurities generated on the wafer surface during the previous process steps, such as particles, metal ions, organic matter, etc., to ensure the smooth progress of subsequent processing and improve the yield rate of the chip. Existing wafer cleaning equipment usually relies on chemical cleaning agents. Existing chemical cleaning agents include acidic cleaning agents and alkaline cleaning agents. Chemical cleaning agents with different pH levels will produce gases with different pH levels after cleaning the wafer. When the gas is discharged through the exhaust port, it will cause wall adhesion. For example, when acidic substances are attached to the air outlet, alkaline cleaning agents are used to clean the wafer, which will produce alkaline gas. When the alkaline gas is discharged from the exhaust port, it will react with the acidic gas attached to the exhaust port to generate toxic and harmful gases or cause accidents. Utility Model Content

[0003] The utility model provides a wafer cleaning device to solve the technical problem in the prior art that different cleaning solutions used in wafer cleaning devices may react with gases or attached matter.

[0004] The technical solution adopted in this utility model is:

[0005] The utility model provides a wafer cleaning device, comprising:

[0006] A housing, wherein the interior of the housing is divided into a plurality of cleaning chambers by partitions, each of the cleaning chambers being provided with a first exhaust assembly and a second exhaust assembly, respectively for discharging gases generated after cleaning;

[0007] A cleaning tank, wherein each cleaning chamber is provided with a cleaning tank, the top of the cleaning tank is not closed, the cleaning tank is used to hold the cleaning liquid, and the side wall of the cleaning tank is provided with a notch;

[0008] A guide plate, the guide plate being arranged at the notch of the cleaning tank and extending outwardly along the shell;

[0009] An overflow trough group, wherein the overflow trough group is arranged corresponding to the position of the guide plate, and the cleaning liquid in the cleaning tank exceeds the portion at the notch, and the cleaning liquid is guided to the overflow trough group through the guide plate;

[0010] A recovery pipe group is connected to the overflow trough group and is used to recover the cleaning liquid in the overflow trough group.

[0011] Furthermore, the first exhaust component includes a first exhaust channel and a first switch, and the second exhaust component includes a second exhaust channel and a second switch.

[0012] Furthermore, the first exhaust channel and the second exhaust channel are both cylindrical and overlap each other. They are both arranged at the partitions of two adjacent cleaning chambers, and the end faces of the air inlets of the first exhaust channel and the second exhaust channel are perpendicular to the partitions, so that the air inlets of the first exhaust channel and the second exhaust channel can be connected to the two adjacent cleaning chambers at the same time.

[0013] Furthermore, the first switch and the second switch are respectively arranged in two adjacent cleaning chambers.

[0014] Furthermore, the wafer cleaning device also includes a fan, and the cleaning chamber is provided with a fan, and the air outlet of the fan faces the first exhaust channel and the second exhaust channel.

[0015] Furthermore, the overflow trough group includes:

[0016] a first overflow trough, wherein a first liquid inlet is provided at the top of the first overflow trough, and the height of the first overflow trough is lower than the height of the guide plate, so that the cleaning liquid guided by the guide plate flows into the first overflow trough from the first liquid inlet, and a first liquid outlet pipe is provided at the bottom of the first overflow trough;

[0017] The second overflow trough is arranged below the first overflow trough, the top of the second overflow trough is provided with a second liquid inlet, the first liquid outlet pipe is connected to the second overflow trough, so that the cleaning liquid in the first overflow trough can flow into the second overflow trough, and the bottom of the second overflow trough is provided with a second liquid outlet connected to the recovery pipe group.

[0018] Furthermore, the recovery pipe group includes: a main recovery pipeline and multiple auxiliary recovery pipelines, the liquid inlet end of the main recovery pipeline is connected to the second liquid outlet of the second overflow tank, one end of the multiple auxiliary recovery pipelines is connected to the liquid outlet end of the main recovery pipeline, and each auxiliary recovery pipeline is provided with a valve.

[0019] Furthermore, the recovery pipe group also includes a third liquid outlet pipe with a valve near the bottom of the cleaning tank, and the liquid outlet end of the third liquid outlet pipe is between the first overflow tank and the second overflow tank, so that the cleaning liquid in the cleaning tank can be discharged into the second overflow tank.

[0020] Furthermore, the wafer cleaning device also includes a mixing tank and multiple liquid inlet pipes equipped with valves. Each cleaning chamber is provided with a mixing tank and a liquid inlet pipe. The mixing tank is provided with multiple liquid inlets, and the multiple liquid inlet pipes are respectively connected to the liquid inlets of the mixing tank. The mixing tank is also provided with a liquid outlet pipe connected to the liquid inlet of the cleaning tank.

[0021] Furthermore, the wafer cleaning device further includes a superhydrogen water pipeline and an ultrapure water pipeline provided with valves, and the superhydrogen water pipeline and the ultrapure water pipeline are both connected to the cleaning tank and the mixing tank.

[0022] Furthermore, the wafer cleaning device also includes a preliminary liquid mixing structure, which includes: a liquid mixing chamber and multiple liquid flow channels with valves. The liquid mixing chamber is provided with multiple liquid inlets, the liquid inlets of the liquid mixing chamber are connected to the liquid flow channels, and the liquid outlets of the liquid mixing chamber are connected to the liquid inlet pipes.

[0023] Furthermore, the liquid outlet of the mixing chamber is also connected to a temporary storage chamber.

[0024] Furthermore, the preliminary liquid mixing structure may be provided with a plurality of groups, and the liquid outlet of the liquid mixing chamber of each group is connected to the liquid inlet end of a different liquid inlet pipe.

[0025] Compared with the prior art, the present invention sets a first exhaust assembly and a second exhaust assembly in each cleaning chamber, so that different gases generated after cleaning the wafers in the cleaning chamber can be discharged from different exhaust assemblies. For example, when acidic gas is generated, it is discharged from the first exhaust assembly, and when alkaline gas is generated, it is discharged from the second exhaust assembly. This prevents the gases generated by cleaning the wafers from being discharged from one exhaust port assembly, causing chemical reactions to generate toxic gases or chemical reactions to cause danger or cleaning failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0027] Figure 1 This is a schematic diagram of the pipeline connection of an embodiment of the utility model;

[0028] Figure 2 This is a preliminary liquid mixing structure connection diagram of an embodiment of the utility model;

[0029] 1. First cleaning chamber; 2. Second cleaning chamber;

[0030] 3. Shell;

[0031] 4. Cleaning tank;

[0032] 5. First overflow trough;

[0033] 6. Second overflow trough;

[0034] 7. Guide plate;

[0035] 81. Main recovery pipeline; 82. Auxiliary recovery pipeline;

[0036] 91. Super hydrogen water pipeline; 92. Ultrapure water pipeline;

[0037] 01. First exhaust channel; 02. Second exhaust channel;

[0038] 101, first switch; 102, second switch; 103, fan;

[0039] 11. Mixing tank; 12. Liquid inlet pipe;

[0040] 13. Mixing chamber; 14. Liquid flow channel; 15. Temporary storage chamber. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0042] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments.

[0043] In the semiconductor manufacturing process, wafer cleaning is a crucial link, which is directly related to the quality and performance of the final chip. The main purpose of wafer cleaning is to remove various impurities generated on the wafer surface during the previous process steps, such as particles, metal ions, organic matter, etc., to ensure the smooth progress of subsequent processing and improve the yield rate of the chip. Existing wafer cleaning equipment usually relies on chemical cleaning agents. Existing chemical cleaning agents include acidic cleaning agents and alkaline cleaning agents. Chemical cleaning agents with different pH levels will produce gases with different pH levels after cleaning the wafer. When the gas is discharged through the exhaust port, it will cause wall adhesion. For example, when acidic substances are attached to the air outlet, alkaline cleaning agents are used to clean the wafer, which will produce alkaline gas. When the alkaline gas is discharged from the exhaust port, it will react with the acidic gas attached to the exhaust port to generate toxic and harmful gases or cause accidents.

[0044] like Figure 1-2As shown, the utility model proposes a wafer cleaning device, including: a shell 3, a cleaning tank 4, a guide plate 7, an overflow tank group and a recovery pipe group.

[0045] The outer shell 3 is divided into multiple cleaning chambers by partitions, and each cleaning chamber is provided with a first exhaust assembly and a second exhaust assembly for discharging the gas generated by cleaning the wafers in the cleaning chamber. Two exhaust assemblies are provided to discharge different gases generated by different cleaning liquids to prevent reactions between different gases. Each cleaning chamber is provided with a cleaning tank 4, which is a shell with an unsealed top. The cleaning liquid is contained in the cleaning tank 4, and the wafers are placed into the cleaning tank 4 from the top of the cleaning tank 4 for cleaning. A long strip notch is provided on the side wall of the upper part of the cleaning tank 4, and a rectangular guide plate 7 extending outward is provided at the notch. One side of the guide plate 7 is connected to the lower edge of the notch so that the cleaning liquid in the cleaning tank 4 that is higher than the notch can be discharged through the guide plate 7. When the wafer is placed in the cleaning tank 4 for cleaning, the liquid level of the cleaning liquid may rise or overflow from the cleaning tank 4, so a notch and a guide plate 7 are provided on the upper part of the cleaning tank 4 to prevent the liquid from overflowing from all sides of the cleaning tank.

[0046] An overflow trough assembly is provided below the guide plate 7. The cleaning liquid in the cleaning tank 4 that is above the notch is guided through the guide plate 7 and flows into the overflow trough assembly for collection. The overflow trough assembly is connected to a recovery pipe assembly. The liquid entering the overflow trough assembly will eventually flow into the recovery pipe assembly and be discharged and recovered through the recovery pipe assembly.

[0047] By setting up a first exhaust component and a second exhaust component in each cleaning chamber, the gas generated after cleaning the wafers in the cleaning chamber can be discharged from different exhaust components, preventing the gas generated after cleaning the wafers from being discharged from one exhaust port component to produce chemical reactions to generate toxic gases or chemical reactions that cause danger or cleaning failure.

[0048] The first exhaust assembly includes a first exhaust channel 01 and a first switch 101, and the second exhaust assembly includes a second exhaust channel 02 and a second switch 102. The first switch 101 controls the opening and closing of the first exhaust channel 01, and the second switch 102 controls the opening and closing of the second exhaust channel 02. The first exhaust channel 01 and the second exhaust channel 02 are used to discharge gases generated after different cleaning solutions are used to clean wafers. This prevents different solutions from reacting when exhausted through a single exhaust port. For example, if acidic gas is continuously discharged from the air outlet, acidic substances will adhere to the air outlet. If alkaline cleaning agents are used to clean wafers in this cleaning chamber, alkaline gas will be generated. When the alkaline gas is discharged from the exhaust port, it will react with the acidic gas attached to the exhaust port, generating toxic and harmful gases or causing accidents.

[0049] The first exhaust channel 01 and the second exhaust channel 02 are both cylindrical and overlap each other. The first exhaust channel 01 is placed on the outside of the second exhaust channel 02. The first exhaust channel 01 and the second exhaust channel 02 are both arranged at the partitions of two adjacent cleaning chambers, and the end faces of the air inlets of the first exhaust channel 01 and the second exhaust channel 02 are perpendicular to the partitions, so that the air inlets of the first exhaust channel 01 and the second exhaust channel 02 can be connected to the two adjacent cleaning chambers at the same time.

[0050] In this embodiment, a partition is vertically disposed within the housing 3, dividing the interior of the housing 3 into two cleaning chambers, the first cleaning chamber 1 and the second cleaning chamber 2. A first exhaust channel 01 and a second exhaust channel 02 are disposed on the partition, allowing the air inlets of the first exhaust channel 01 and the second exhaust channel 02 to communicate with both the first cleaning chamber 1 and the second cleaning chamber 2. Both the first cleaning chamber 1 and the second cleaning chamber 2 can exhaust gas through the first exhaust channel 01 disposed on the partition, or through the second exhaust channel 02 disposed on the partition.

[0051] The first switch 101 and the second switch 102 are respectively disposed in two adjacent cleaning chambers. The first switch 101 is used to control the opening and closing of the first exhaust channel 01, and the second switch 102 is used to control the opening and closing of the second exhaust channel 02. Specifically, the first switch 101 is disposed in the first cleaning chamber 1 and controls the opening and closing of the first exhaust channel 01, whose air inlet is connected to both the first cleaning chamber 1 and the second cleaning chamber 2. The second switch 102 is disposed in the second cleaning chamber 2 and controls the opening and closing of the second exhaust channel 02, whose air inlet is connected to both the first cleaning chamber 1 and the second cleaning chamber 2.

[0052] When the first switch 101 and the second switch 102 are both closed, the gas in the first cleaning chamber 1 is discharged from the second exhaust channel 02 , and the gas in the second cleaning chamber 2 is discharged from the first exhaust channel 01 .

[0053] When the first switch 101 is turned on, the gas in the first cleaning chamber 1 is discharged from the first exhaust channel 01 and the second exhaust channel 02 at the same time.

[0054] When the second switch 102 is turned on, the gas in the second cleaning chamber 2 is discharged from the first exhaust channel 01 and the second exhaust channel 02 at the same time.

[0055] There may be a variety of different cleaning solutions for cleaning wafers depending on actual usage requirements, so the first cleaning chamber 1 and the second cleaning chamber 2 can use different solutions to clean the wafers, such as an acidic solution and an alkaline solution. If the gases generated by the acidic solution and the alkaline solution will react chemically, the first switch 101 and the second switch 102 are both closed, so that the gas in the first cleaning chamber 1 flows out from the second exhaust channel 02, and the gas in the second cleaning chamber 2 flows out from the first exhaust channel 01, separating the two gases to prevent them from colliding and reacting.

[0056] The cleaning chamber is equipped with a fan 103, and the air outlet of the fan 103 is directed toward the first exhaust channel 01 and the second exhaust channel 02 for exhaust. The operation of the fan 103 accelerates the flow of gas in the cleaning chamber, and the gas is quickly blown toward the first exhaust channel 01 and the second exhaust channel 02, thereby accelerating the discharge of the gas and preventing the gas from accumulating in the cleaning chamber.

[0057] The overflow trough assembly is used to recover cleaning liquid overflowing from the cleaning trough 4. The overflow trough assembly includes a first overflow trough 5 and a second overflow trough 6. The first overflow trough 5 is a rectangular shell with an open top that serves as a first liquid inlet. The first liquid inlet of the first overflow trough 5 corresponds to the position of the guide plate 7, corresponding to the end position of the guide plate 7. The first liquid inlet of the first overflow trough 5 is lower than the height of the guide plate 7, allowing the cleaning liquid discharged from the guide plate 7 to enter the first overflow trough 5 through the first liquid inlet. A first liquid outlet pipe is provided at the bottom of the first overflow trough 5.

[0058] The second overflow trough 6 is located below the first overflow trough 5. The second overflow trough 6 is a rectangular shell with an unsealed top that serves as a second liquid inlet. This second liquid inlet corresponds to the position of the first liquid outlet pipe. The second overflow trough 6 is wider and longer than the first overflow trough 5. The first liquid outlet pipe connects to the second overflow trough 6, allowing the cleaning liquid in the first overflow trough 5 to flow into the second overflow trough 6. A second liquid outlet is also provided at the bottom of the second overflow trough 6, which is connected to the recovery pipe assembly.

[0059] The recovery pipe group includes: a main recovery pipe 81 and multiple auxiliary recovery pipes 82.

[0060] The inlet of the main recovery line 81 is connected to the second outlet of the second overflow trough 6. One end of multiple auxiliary recovery lines 82 is connected to the outlet of the main recovery line 81, and each auxiliary recovery line 82 is equipped with a valve. The liquid overflowing from the cleaning tank 4 is directed by a guide plate 7 into the first overflow trough 5, from which it flows into the second overflow trough 6, and then into the main recovery line 81. It then flows into the auxiliary recovery line 82 with its valve open, and exits the wafer cleaning apparatus through the other end of the auxiliary recovery line 82.

[0061] A third liquid outlet pipe is provided near the bottom of the cleaning tank 4, and a valve is provided on the third liquid outlet pipe. The liquid outlet end of the third pipe is between the first overflow tank 5 and the second overflow tank 6, so that the unnecessary cleaning liquid in the cleaning tank 4 can be directly discharged into the second overflow tank 6 by opening the valve on the third liquid outlet pipe.

[0062] The cleaning device of the present invention also includes a mixing tank 11 and a liquid inlet pipe 12 equipped with a valve. Each cleaning chamber is provided with a mixing tank 11 and a liquid inlet pipe 12. The mixing tank 11 is provided with multiple liquid inlets, and the multiple liquid inlet pipes are respectively connected to the liquid inlets of the mixing tank 11. Different types of liquid medicine are injected into the mixing tank 11 through the multiple liquid inlet pipes, so that the different types of liquid medicine are mixed in the mixing tank 11. The mixing tank 11 is also provided with a liquid outlet pipe connected to the liquid inlet of the cleaning tank 4, so that the mixed liquid medicine in the mixing tank 11 enters the cleaning tank 4 for cleaning the wafers. By controlling the opening and closing of the valve, the cleaning liquid in the liquid inlet pipe 12 is controlled to enter the mixing tank 11.

[0063] The wafer cleaning apparatus also includes a superhydrogen water pipeline 91 and an ultrapure water pipeline 92, each equipped with valves. Both the superhydrogen water pipeline and the ultrapure water pipeline 92 are connected to the cleaning tank 4 and the mixing tank 11, allowing superhydrogen water or ultrapure water to flow into the cleaning tank 4 and the mixing tank 11. Both the superhydrogen water pipeline 91 and the ultrapure water pipeline 92 are equipped with valves to control whether liquid is passed into the superhydrogen water pipeline 91 and the ultrapure water pipeline 92.

[0064] The wafer cleaning device also includes a preliminary liquid mixing structure, including a liquid mixing chamber 13 and multiple liquid medicine flow channels 14 equipped with valves. Before the liquid medicine enters the mixing tank 11 through the liquid inlet pipe 12, the liquid medicine needs to be preliminarily mixed. The liquid mixing chamber 13 is provided with multiple liquid inlets, each of which is connected to a liquid medicine flow channel 14. Liquid medicine is injected into the liquid mixing chamber 13 through the liquid medicine flow channel 14, and different liquid medicines are preliminarily mixed in the liquid mixing chamber 13. The liquid mixing chamber 13 is also provided with a liquid outlet, and the liquid outlet of the liquid mixing chamber 13 is connected to the liquid inlet end of the liquid inlet pipe of the mixing tank 11, so that the liquid medicine in the liquid mixing chamber 13 flows into the mixing tank 11 for mixing again. The liquid mixing components can be provided in multiple groups, and the liquid outlet of the liquid mixing chamber 13 of each group is connected to the liquid inlet end of different liquid inlet pipes. Whether the cleaning liquid enters the liquid medicine flow channel 14 can be controlled by switching the valve.

[0065] The liquid outlet of the mixing chamber 13 is also connected to a temporary storage chamber 15, and a valve is provided at the connection, and the switch of the valve controls whether the liquid in the mixing chamber 13 flows into the temporary storage chamber 15. The temporary storage chamber 15 can temporarily store the cleaning liquid.

[0066] Compared with the prior art, the present invention sets a first exhaust assembly and a second exhaust assembly in each cleaning chamber, so that different gases generated after cleaning the wafers in the cleaning chamber can be discharged from different exhaust assemblies. For example, when acidic gas is generated, it is discharged from the first exhaust assembly, and when alkaline gas is generated, it is discharged from the second exhaust assembly. This prevents the gases generated by cleaning the wafers from being discharged from one exhaust port assembly, causing chemical reactions to generate toxic gases or chemical reactions to cause danger or cleaning failure.

[0067] It should be noted that the terms used above are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0068] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0069] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0070] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0071] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer cleaning device, characterized in that: include: A housing, wherein the interior of the housing is divided into a plurality of cleaning chambers by partitions, each of the cleaning chambers being provided with a first exhaust assembly and a second exhaust assembly, respectively for discharging gases generated after cleaning; A cleaning tank, wherein each cleaning chamber is provided with a cleaning tank, the top of the cleaning tank is not closed, the cleaning tank is used to hold the cleaning liquid, and the side wall of the cleaning tank is provided with a notch; A guide plate, the guide plate being arranged at the notch of the cleaning tank and extending outwardly along the shell; An overflow trough group, wherein the overflow trough group is arranged corresponding to the position of the guide plate, and the cleaning liquid in the cleaning tank exceeds the portion at the notch, and the cleaning liquid is guided to the overflow trough group through the guide plate; A recovery pipe group is connected to the overflow trough group and is used to recover the cleaning liquid in the overflow trough group.

2. The wafer cleaning device according to claim 1, wherein: The first exhaust component includes a first exhaust channel and a first switch, and the second exhaust component includes a second exhaust channel and a second switch.

3. The wafer cleaning device according to claim 2, wherein: The first exhaust channel and the second exhaust channel are both cylindrical and overlap each other. They are both arranged at the partitions of two adjacent cleaning chambers, and the end faces of the air inlets of the first exhaust channel and the second exhaust channel are perpendicular to the partitions, so that the air inlets of the first exhaust channel and the second exhaust channel can be connected to the two adjacent cleaning chambers at the same time.

4. The wafer cleaning device according to claim 3, wherein: The first switch and the second switch are respectively arranged in two adjacent cleaning chambers.

5. The wafer cleaning device according to claim 3, wherein: The wafer cleaning device further includes a fan. The fan is provided in the cleaning chamber, and an air outlet of the fan faces the first exhaust channel and the second exhaust channel.

6. The wafer cleaning device according to claim 1, wherein: The overflow trough group includes: a first overflow trough, wherein a first liquid inlet is provided at the top of the first overflow trough, and the height of the first overflow trough is lower than the height of the guide plate, so that the cleaning liquid guided by the guide plate flows into the first overflow trough from the first liquid inlet, and a first liquid outlet pipe is provided at the bottom of the first overflow trough; The second overflow trough is arranged below the first overflow trough, the top of the second overflow trough is provided with a second liquid inlet, the first liquid outlet pipe is connected to the second overflow trough, so that the cleaning liquid in the first overflow trough can flow into the second overflow trough, and the bottom of the second overflow trough is provided with a second liquid outlet connected to the recovery pipe group.

7. The wafer cleaning device according to claim 6, wherein: The recovery pipe group includes: a main recovery pipeline and multiple auxiliary recovery pipelines, the liquid inlet end of the main recovery pipeline is connected to the second liquid outlet of the second overflow tank, one end of the multiple auxiliary recovery pipelines is connected to the liquid outlet end of the main recovery pipeline, and each of the auxiliary recovery pipelines is provided with a valve.

8. The wafer cleaning device according to claim 7, wherein: The recovery pipe group also includes a third liquid outlet pipe with a valve near the bottom of the cleaning tank. The liquid outlet end of the third liquid outlet pipe is between the first overflow tank and the second overflow tank, so that the cleaning liquid in the cleaning tank can be discharged into the second overflow tank.

9. The wafer cleaning device according to claim 1, wherein: The wafer cleaning device also includes a mixing tank and multiple liquid inlet pipes equipped with valves. Each cleaning chamber is provided with a mixing tank and a liquid inlet pipe. The mixing tank is provided with multiple liquid inlets, and the multiple liquid inlet pipes are respectively connected to the liquid inlets of the mixing tank. The mixing tank is also provided with a liquid outlet pipe connected to the liquid inlet of the cleaning tank.

10. The wafer cleaning device according to claim 9, wherein: The wafer cleaning device further comprises an ultra-hydrogen water pipeline and an ultra-pure water pipeline provided with valves, and the ultra-hydrogen water pipeline and the ultra-pure water pipeline are both communicated with the cleaning tank and the mixing tank.

11. The wafer cleaning device according to claim 10, wherein: The wafer cleaning device also includes a preliminary liquid mixing structure, which includes: a liquid mixing chamber and multiple liquid flow channels with valves. The liquid mixing chamber is provided with multiple liquid inlets, the liquid inlets of the liquid mixing chamber are connected to the liquid flow channels, and the liquid outlets of the liquid mixing chamber are connected to the liquid inlet pipes.

12. The wafer cleaning device according to claim 11, wherein: The liquid outlet of the liquid mixing chamber is also connected to a temporary storage chamber.

13. The wafer cleaning device according to claim 12, wherein: The preliminary liquid mixing structure may be provided with a plurality of groups, and the liquid outlet of the liquid mixing chamber of each group is connected to the liquid inlet end of a different liquid inlet pipe.

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