Temperature drop prevention device and semiconductor processing system
By setting up a temperature sensor and an uninterruptible power supply in the etching equipment, the problem of product drop caused by temperature control system failure is solved, the stable maintenance of the process cavity temperature is achieved, and the production cost is reduced.
Patent Information
- Application Number
- CN202422617945.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-10-28
AI Technical Summary
In the prior art, the temperature control system of the main etching equipment fails or the machine is abnormally powered off, resulting in a drop in the process cavity temperature, a drop in the product, and an increase in production costs.
The temperature sensor and the uninterruptible power supply are set in the etching device. The switch module is controlled to be turned on through the controller. The uninterruptible power supply supplies power to the heating module to maintain the temperature of the process chamber.
Prevent the temperature of the process chamber from dropping to normal temperature, prevent the product from falling, and reduce production costs.
Smart Images
Figure CN223245571U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a temperature drop prevention device and a semiconductor processing system. Background Art
[0002] The process chamber temperature system of the main etching equipment is generally composed of the upper electrode, chamber wall, and lower electrode temperatures. During the production process, there may be a failure in the equipment temperature control system or an abnormal power outage in the machine, resulting in the power supply of the heating wire in the machine end being disconnected.
[0003] When an abnormal power outage occurs, the temperature inside the process chamber will drop to room temperature. The temperature drop will cause the products adhering to the chamber wall or the upper end of the chamber to fall into the chamber, posing a risk of product process defects. At this time, the chamber must be opened for cleaning and related spare parts must be replaced, resulting in increased manpower and spare parts costs.
[0004] In summary, the prior art has the problem of increased production costs due to equipment temperature control system failure or machine abnormal failure. Utility Model Content
[0005] The purpose of the present application is to provide a device for preventing temperature drop and a semiconductor processing system to solve the problem in the prior art of increased production costs caused by equipment temperature control system failure or machine abnormal failure.
[0006] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:
[0007] In a first aspect, an embodiment of the present application provides a temperature drop prevention device, which is applied to an etching device, wherein the etching device includes a process chamber and a heating module, wherein the heating module is located in the process chamber, and the temperature drop prevention device includes a controller, an uninterruptible power supply, a switch module, and a temperature sensor, wherein the controller is electrically connected to the switch module and the temperature sensor, respectively, and the uninterruptible power supply, the switch module, and the heating module are electrically connected in sequence, and the temperature sensor is installed on the surface of the process chamber; wherein,
[0008] The temperature sensor is used to collect temperature data;
[0009] The controller is used to control the switch module to be turned on when the temperature data is lower than a threshold value; and when the switch module is turned on, the uninterruptible power supply is used to supply power to the heating module.
[0010] Optionally, the temperature drop prevention device further includes a display, and the display is electrically connected to the controller.
[0011] Optionally, the temperature drop prevention device includes a storage rack, the storage rack is provided with multiple layers, and the uninterruptible power supply, the controller and the display are respectively arranged on different layers.
[0012] Optionally, rollers are provided at the bottom of the rack.
[0013] Optionally, the storage rack is provided with three layers, the uninterruptible power supply is provided on the bottom layer, the controller is provided on the middle layer, and the display is provided on the top layer.
[0014] Optionally, there are a plurality of temperature sensors, and the plurality of temperature sensors are respectively located around the surface of the process chamber.
[0015] Optionally, the surface of the process chamber is configured to be arc-shaped, and the plurality of temperature sensors are arranged at equal intervals on the surface of the process chamber.
[0016] Optionally, the uninterruptible power supply includes a first power supply and a second power supply, and the first power supply and the second power supply are electrically connected to the heating module through a switch module respectively.
[0017] Optionally, the controller is also electrically connected to the heating module, and the controller is also used to control the heating temperature of the heating module.
[0018] On the other hand, an embodiment of the present application further provides a semiconductor processing system, which includes the above-mentioned temperature drop prevention device.
[0019] Compared with the prior art, this application has the following beneficial effects:
[0020] The present application provides a temperature drop prevention device and a semiconductor processing system. The temperature drop prevention device is applied to an etching device. The etching device includes a process chamber and a heating module, wherein the heating module is located within the process chamber. The temperature drop prevention device includes a controller, an uninterruptible power supply (UPS), a switch module, and a temperature sensor. The controller is electrically connected to the switch module and the temperature sensor, respectively. The UPS, the switch module, and the heating module are electrically connected in sequence. The temperature sensor is mounted on the surface of the process chamber. The temperature sensor is configured to collect temperature data. The controller is configured to control the switch module to conduct when the temperature data falls below a threshold. When the switch module is on, the UPS is configured to supply power to the heating module. In the temperature drop prevention device provided by the present application, a temperature sensor is provided to collect the surface temperature of the process chamber and determine whether to utilize the UPS. When the power supply of the heating module itself unexpectedly loses power, the surface temperature of the process chamber will drop. When the surface temperature of the process chamber drops to a threshold, the controller can control the UPS to supply power to the heating module, thereby raising the temperature above the threshold. This prevents the product from falling off the chamber wall, thereby reducing production costs.
[0021] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0023] Figure 1 A schematic diagram of a module of the temperature drop prevention device provided in an embodiment of the present application.
[0024] Figure 2 This is a schematic diagram of the structure of the anti-temperature drop device provided in an embodiment of the present application.
[0025] In the picture:
[0026] 110-controller; 120-uninterruptible power supply; 130-switch module; 140-temperature sensor; 150-storage rack. DETAILED DESCRIPTION
[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.
[0030] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0031] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.
[0032] In the semiconductor device manufacturing process, etching is a very important step. When the etching equipment is working, it is necessary to maintain the temperature inside the process chamber of the etching equipment. Therefore, a heating module needs to be installed in the process chamber for heating.
[0033] The heating temperature of the heating module is generally controlled by the equipment temperature control system, that is, the heating module is provided with a fixed power supply. By adjusting the power of the power supply, the heating temperature of the heating module can be adjusted so that the temperature in the process chamber is maintained at the set temperature.
[0034] However, during the operation of the etching equipment, the equipment temperature control system may fail or an abnormal power outage may occur. For example, the equipment fails and cannot continue to supply power to the heating module.
[0035] If the heating module loses power, the temperature inside the process chamber drops. When the chamber temperature is high, the etching products produced during the etching process adhere to the chamber's sidewalls or ceiling. When the chamber temperature drops, for example to room temperature, these products fall from the chamber's sidewalls or ceiling. If they land on the wafer, they contaminate it and affect its quality. Therefore, if the heating module loses power, the chamber must be opened for cleaning or replacement, which increases production costs.
[0036] In view of this, the present application provides an anti-temperature drop device. By adding an additional temperature sensor and an uninterruptible power supply, even if the heating module loses power abnormally, the uninterruptible power supply can continue to power the heating module, thereby preventing the process chamber from cooling down within a certain period of time, and preventing the product from falling from the side walls or top walls of the chamber, thereby reducing production costs.
[0037] The following is an exemplary description of the anti-temperature drop device provided in this application:
[0038] As an optional implementation, the anti-temperature drop device is applied to an etching device, which includes a process chamber and a heating module. The heating module is located in the process chamber. Figure 1The temperature drop prevention device includes a controller 110, an uninterruptible power supply 120, a switch module 130 and a temperature sensor 140. The controller 110 is electrically connected to the switch module 130 and the temperature sensor 140 respectively. The uninterruptible power supply 120, the switch module 130 and the heating module are electrically connected in sequence. The temperature sensor 140 is installed on the surface of the process chamber; wherein, the temperature sensor 140 is used to collect temperature data; the controller 110 is used to control the switch module 130 to be turned on when the temperature data is lower than the threshold; and when the switch module 130 is turned on, the uninterruptible power supply 120 is used to power the heating module.
[0039] As an implementation, the heating module provided herein can be a heating wire. When the heating module's power supply fails, the heating module ceases heating, and the temperature within the process chamber gradually decreases. Since the temperature sensor 140 is disposed on the surface of the process chamber, it can monitor the temperature of the process chamber in real time.
[0040] When the heating module stops heating, the temperature inside the process chamber drops. The temperature sensor 140 then collects the corresponding temperature data and transmits it to the controller 110. The controller 110 compares the temperature data with a preset threshold to determine whether the temperature inside the process chamber is too low. If the temperature data falls below the threshold, indicating that the temperature inside the process chamber is relatively low, the controller 110 directly controls the uninterruptible power supply 120 to power the heating module, allowing it to continue heating and raise the temperature inside the process chamber.
[0041] It should be noted that the threshold value provided in this application needs to be greater than the room temperature and less than the working temperature of the process chamber. For example, the room temperature is generally 20°C, and the working temperature of the process chamber is 80°C. At this time, the threshold value can be set to a value between 20°C and 80°C. For example, the average value of the two can be selected, that is, (20°C + 80°C) / 2 = 50°C. When the threshold value is set to 50°C, on the one hand, this value is lower than the working temperature of the process chamber. Once it is detected that the temperature in the process chamber is lower than this value, it can be characterized that the heating module may have stopped heating. And since this value is also much greater than the room temperature, the residual temperature in the process chamber can also ensure that the product in the cavity will not fall from the cavity wall or the upper end of the cavity.
[0042] On this basis, when it is detected that the temperature in the process chamber drops below the threshold, it means that the temperature in the process chamber is less than 50°C at this time. The controller 110 will control the switch module 130 to turn on, and then power the heating module through the uninterruptible power supply 120, so that the heating module continues to work and the temperature in the process chamber is raised to 80°C again, ensuring that the product in the chamber will not fall from the chamber wall or the upper end of the chamber, thereby reducing the cost increase caused by the product processing.
[0043] The switch module 130 described in the present application may be a relay, a transistor, a MOS tube or other devices, which are not limited here.
[0044] As an optional implementation method, the temperature drop prevention device also includes a display, which is electrically connected to the controller 110. On the one hand, the display can display data related to the controller 110, such as temperature data, whether the uninterruptible power supply 120 is started, etc. On the other hand, the display can be a touch screen, on this basis, the relevant instructions to the controller 110 can be issued through the display. For example, through the touch screen, the staff can adjust the heating temperature of the heating module as needed. In addition, the display screen can also realize the display of the alarm function. For example, when the temperature data is detected to be lower than the threshold, it means that the power supply of the heating module may be abnormally powered off at this time. At this time, the controller 110 can control the screen to flash to prompt the staff to inspect the power supply of the heating module.
[0045] To facilitate management of the UPS 120, please refer to Figure 2 The temperature-drop prevention device includes a rack 150 , which is provided with multiple layers. The uninterruptible power supply 120 , the controller 110 and the display are respectively provided on different layers.
[0046] The provision of the rack 150 facilitates the installation of the uninterruptible power supply 120, controller 110, and display. Furthermore, the bottom of the rack 150 may be provided with rollers to facilitate the movement of the thermal protection device. Specifically, in actual application, when thermal protection is required, the thermal protection device can be moved close to the process chamber and the various components connected. If the power supply to the heating module unexpectedly fails, the uninterruptible power supply 120 continues to power the heating module.
[0047] To facilitate operator operation, the rack 150 is configured with three layers, with the uninterruptible power supply 120 located at the bottom layer, the controller 110 located in the middle layer, and the display located at the top layer. Furthermore, to ensure that the heating module's power supply can be maintained for an extended period in the event of an abnormal power outage, the uninterruptible power supply 120 provided herein includes a first power supply and a second power supply, each of which is electrically connected to the heating module via a switch module 130.
[0048] By providing the first power supply and the second power supply, on the one hand, the power supply of the heating module can be maintained for a longer period of time. On the other hand, even if one of the power supplies fails, the other power supply can keep the heating module working, thereby improving the stability of the entire system.
[0049] Understandably, since the staff do not need to operate the first and second power supplies, they can be placed at the bottom of the rack 150. The display allows the staff to intuitively view the relevant parameters, so it is placed at the top layer, and the controller 110 is placed in the middle layer. This hierarchical arrangement not only reduces the footprint of the entire temperature drop prevention device, but also facilitates staff operation.
[0050] Furthermore, in one implementation, the controller 110 is also electrically connected to the heating module and is used to control the heating temperature of the heating module. Based on this, the operator can control the heating temperature of the heating module via the touch screen. For example, by setting the heating temperature on the touch screen, a control instruction can be sent to the controller 110, which in turn can adjust the heating power of the heating module to achieve the effect of controlling the heating temperature.
[0051] In one optional implementation, to achieve more accurate temperature detection, multiple temperature sensors 140 are provided, each positioned around the surface of the process chamber. For example, the surface of the process chamber may be arc-shaped, with multiple temperature sensors 140 spaced evenly across the surface. This arrangement allows temperature changes within the process chamber to be accurately detected by the temperature sensors 140, thereby achieving precise temperature drop prevention.
[0052] Based on the above implementation, an embodiment of the present application further provides a semiconductor processing system, which includes the above-mentioned temperature drop prevention device.
[0053] In summary, the present application provides a temperature drop prevention device and a semiconductor processing system. The temperature drop prevention device is applied to etching equipment, which includes a process chamber and a heating module. The heating module is located within the process chamber. The temperature drop prevention device includes a controller, an uninterruptible power supply (UPS), a switch module, and a temperature sensor. The controller is electrically connected to the switch module and the temperature sensor, respectively. The UPS, the switch module, and the heating module are electrically connected in sequence. The temperature sensor is mounted on the surface of the process chamber. The temperature sensor is configured to collect temperature data. The controller is configured to control the switch module to conduct when the temperature data falls below a threshold. When the switch module is on, the UPS is configured to power the heating module. In the temperature drop prevention device provided by the present application, a temperature sensor is provided to collect the surface temperature of the process chamber to determine whether to use the UPS. When the power supply to the heating module itself abnormally loses power, the surface temperature of the process chamber will drop. When the surface temperature of the process chamber drops to a threshold, the controller can control the UPS to power the heating module, thereby raising the temperature above the threshold. This prevents the product from falling off the chamber wall, thereby reducing production costs.
[0054] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
[0055] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A device for preventing temperature drop, characterized in that: Applied to etching equipment, the etching equipment includes a process chamber and a heating module, the heating module is located in the process chamber, the temperature drop prevention device includes a controller, an uninterruptible power supply, a switch module and a temperature sensor, the controller is electrically connected to the switch module and the temperature sensor respectively, the uninterruptible power supply, the switch module and the heating module are electrically connected in sequence, and the temperature sensor is installed on the surface of the process chamber; wherein, The temperature sensor is used to collect temperature data; The controller is used to control the switch module to be turned on when the temperature data is lower than a threshold value; and when the switch module is turned on, the uninterruptible power supply is used to supply power to the heating module.
2. The device for preventing temperature drop according to claim 1, wherein: The temperature drop prevention device further includes a display, which is electrically connected to the controller.
3. The device for preventing temperature drop according to claim 2, wherein: The temperature drop prevention device includes a storage rack, which is provided with multiple layers. The uninterruptible power supply, the controller and the display are respectively provided on different layers.
4. The device for preventing temperature drop according to claim 3, wherein: Rollers are provided at the bottom of the rack.
5. The device for preventing temperature drop according to claim 3, wherein: The storage rack is provided with three layers, the uninterruptible power supply is provided on the bottom layer, the controller is provided on the middle layer, and the display is provided on the top layer.
6. The device for preventing temperature drop according to claim 1, wherein: The number of the temperature sensors includes multiple ones, and the multiple temperature sensors are respectively located around the surface of the process chamber.
7. The device for preventing temperature drop according to claim 6, wherein: The surface of the process chamber is arranged in an arc shape, and a plurality of temperature sensors are arranged at equal intervals on the surface of the process chamber.
8. The device for preventing temperature drop according to claim 1, wherein: The uninterruptible power supply includes a first power supply and a second power supply, and the first power supply and the second power supply are electrically connected to the heating module through a switch module respectively.
9. The device for preventing temperature drop according to claim 1, wherein: The controller is also electrically connected to the heating module, and is further used to control the heating temperature of the heating module.
10. A semiconductor processing system, characterized in that: The semiconductor processing system includes the temperature drop prevention device according to any one of claims 1 to 9.