Wafer carrying device

Abstract

A wafer carrying device comprises a suction cup mechanism and a clamping jaw mechanism. The sucking disc mechanism comprises a Bernoulli sucking disc; the clamping jaw mechanism comprises a clamping jaw driving assembly and two adjustable clamping jaws, and the clamping jaw driving assembly drives the two adjustable clamping jaws to get close to each other or get away from each other; the two adjustable clamping jaws are transversely and symmetrically distributed with the Bernoulli suction cup as the center. The adjustable clamping jaw comprises a clamping plate and a rotary clamping jaw, the clamping plate is connected with the clamping jaw driving assembly, the rotary clamping jaw can horizontally rotate and is assembled on the clamping plate inwards or outwards, a clamping jaw part is arranged on the transverse side of the bottom of the rotary clamping jaw, and a horizontally-arranged annular clamping groove is formed in the clamping jaw part. Therefore, the Bernoulli suckers are arranged, so that the ABM film can be prevented from being attracted and deformed. The distance between the two clamping jaw parts on the two transverse sides can be adjusted by simply rotating the rotary clamping jaw, so that the production requirements of large-size wafers and small-size wafers are met, equipment does not need to be replaced, operation is convenient, the structure is simple, and the production efficiency can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer transport device. Background Art

[0002] A wafer is a silicon chip used to make silicon semiconductor integrated circuits. Because of its round shape, it's called a wafer. In the semiconductor industry's automated manufacturing process, it's often necessary to move these wafers from one fixed point to another.

[0003] Existing handling robots usually use vacuum suction cups to transport wafers. However, for wafers covered with ABM film, when using vacuum suction cups, the ABM film will be attracted and deformed, affecting the normal progress of subsequent production processes.

[0004] Moreover, existing handling robots can usually only handle wafers of one size. When the size of the wafer changes, it is necessary to replace the handling robot with another specification. The replacement steps are cumbersome and the operation is troublesome, which affects production efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer transport device, which has the advantages of avoiding damage to the wafer film layer and improving the transport efficiency.

[0006] In order to achieve the above objectives, the solution of the present invention is:

[0007] A wafer transport device includes a suction cup mechanism and a clamping claw mechanism;

[0008] The suction cup mechanism includes a Bernoulli suction cup;

[0009] The clamping mechanism includes a clamping jaw driving assembly and two symmetrically arranged adjustable clamping jaws, and the clamping jaw driving assembly drives the two adjustable clamping jaws to move closer or farther away from each other;

[0010] The two adjustable grippers are laterally symmetrically distributed around the center of the Bernoulli suction cup and are located on the periphery of the Bernoulli suction cup;

[0011] The adjustable clamping jaw includes a clamping plate and a rotating clamping jaw, the clamping plate is connected to the clamping jaw drive assembly, the rotating clamping jaw can be rotated horizontally and assembled on the clamping plate inward or outward, and a clamping jaw portion is provided on one horizontal side of the bottom of the rotating clamping jaw, and a horizontally arranged annular clamping groove is provided on the clamping jaw portion.

[0012] Furthermore, the rotating claw includes a rotating shaft portion, a connecting portion and the claw portion; the rotating shaft portion can be rotatably and movably placed up and down through the rotating shaft hole provided on the clamping plate, and a clamping portion extends radially outward from the top of the rotating shaft portion; the top surface of the clamping plate is provided with two clamping grooves which are symmetrical along the center of the rotating shaft hole and for the clamping portion to be movably engaged, and when the clamping portion is engaged in different clamping grooves, the rotating claw is controlled to be assembled inward or outward; the connecting portion extends in the transverse direction, and one end of the connecting portion is connected to the lower end of the rotating shaft portion, and the other end is connected to the claw portion.

[0013] Furthermore, two symmetrical clamping parts are provided on the top of the rotating shaft.

[0014] Furthermore, a magnet is provided in the clamping groove, and the clamping portion is made of magnetic material.

[0015] Furthermore, two clearance grooves are respectively provided between the two clamping parts on the top surface of the clamping plate, and the side wall of the rotating shaft part is provided with a notch at the position of the clearance groove.

[0016] Furthermore, the clamping plate is provided with a detection port that passes through from top to bottom on the inner side of the rotating shaft hole near the Bernoulli suction cup, and a clamping claw detection sensor is installed at the detection port.

[0017] Furthermore, the claw portion includes a longitudinally extending connecting rod, the middle part of the connecting rod is connected to the transverse connecting portion, and a vertically extending claw column is provided below each longitudinal end of the connecting rod, and the bottom of the claw column forms the annular groove; there are four claw columns in total with two adjustable clamping jaws, and the annular groove of each claw column is respectively for the outer edge of the wafer to extend into and cooperate with.

[0018] Furthermore, it also includes a device shell; the suction cup mechanism and the clamping jaw drive components of the clamping jaw mechanism are installed in the device shell with longitudinal intervals, the bottom Bernoulli suction cup of the suction cup mechanism is exposed at the bottom opening of the device shell, and the adjustable clamping jaw of the clamping jaw mechanism is movable laterally in the side opening set on the side of the device shell.

[0019] Furthermore, a drive shaft connection hole is provided on the top of the device housing; and a wafer detection sensor is provided on the device housing.

[0020] Furthermore, the suction cup mechanism also includes a suction cup bracket and a suction cup drive assembly; the suction cup drive assembly drives the suction cup bracket to rise and fall, and the Bernoulli suction cup is arranged at the bottom of the suction cup bracket.

[0021] With this technical solution, the Bernoulli chuck forms an air film between the wafer and avoids direct contact with the wafer, thus preventing the ABM film from being attracted and deformed. A clamping mechanism with adjustable jaws protects the wafer. After the chuck secures the wafer, the jaw drive assembly drives the two adjustable jaws toward each other to hold the wafer. If the Bernoulli chuck unexpectedly stops, the wafer is held by the adjustable jaws on both sides, preventing it from falling and being damaged.

[0022] Furthermore, because a claw portion is provided on one side of the bottom of the rotating claw, when the rotating claw rotates inward, the claw portion can be rotated to the inner side, so the distance between the two claw portions of the two adjustable jaws is smaller, which is suitable for small-sized wafers; when the rotating claw rotates outward, the claw portion can be rotated to the outer side, so the distance between the two claw portions of the two adjustable jaws becomes larger, which is suitable for large-sized wafers; and an annular groove is provided on the claw portion, and no matter whether the inner side of the claw portion faces inward or the outer side faces inward, the annular groove can be used for the edge of the wafer to extend and clamp, so as to clamp and support the wafer.

[0023] In this way, by simply rotating the claw, the distance between the two claw parts on both sides can be adjusted to meet the production needs of large-size wafers and small-size wafers. There is no need to replace equipment, it is easy to operate, has a simple structure, and can effectively improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a perspective view of an embodiment of the present invention, showing the rotating claw facing outward;

[0025] Figure 2 This is a perspective view of an embodiment of the present utility model, with part of the device housing hidden;

[0026] Figure 3 for Figure 2 A view from another perspective;

[0027] Figure 4 This is a three-dimensional diagram of the suction cup mechanism of an embodiment of the present utility model;

[0028] Figure 5 This is a three-dimensional diagram of the clamping mechanism of an embodiment of the present utility model;

[0029] Figure 6 This is a partial structural exploded view of the clamping mechanism of an embodiment of the present utility model;

[0030] Figure 7 This is a three-dimensional view of an embodiment of the present invention, showing the rotating claw facing inward.

[0031] Description of reference numerals: suction cup mechanism 100, Bernoulli suction cup 110, suction cup bracket 120, suction cup driving assembly 130;

[0032] The jaw mechanism 200, the jaw drive assembly 210, and the adjustable jaw 220;

[0033] Snap-on plate 221, shaft hole 222, snap-on slot 223, magnet 224, clearance slot 225, detection port 226, and clamping jaw detection sensor 227;

[0034] Rotating claw 230, claw portion 231, annular groove 232, rotating shaft portion 233, clamping portion 234, connecting portion 235, notch 236, connecting rod 237, claw column 238;

[0035] Device housing 300 , drive shaft connection hole 310 , wafer detection sensor 320 , wafer 400 . DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0037] like Figures 1 to 7 As shown, a wafer transport device of this embodiment includes a suction cup mechanism 100 and a clamping claw mechanism 200 .

[0038] like Figure 4 The chuck mechanism 100 includes a Bernoulli chuck 110. The Bernoulli chuck 110 can adopt a conventional structure and can stably hold the wafer 400 below the Bernoulli chuck 110 by generating the Bernoulli effect. This prevents the ABM film from being attracted and deformed because an air film is formed between the Bernoulli chuck 110 and the wafer 400 and the wafer 400 is not directly contacted and held.

[0039] In this embodiment, the suction cup mechanism 100 further includes a suction cup support 120 and a suction cup drive assembly 130. The suction cup drive assembly 130 drives the suction cup support 120 to rise and fall. The Bernoulli suction cup 110 is disposed at the bottom of the suction cup support 120. The suction cup drive assembly 130 may be a drive motor.

[0040] like Figure 2 、 Figure 3 and Figure 5The clamping mechanism 200 includes a clamping jaw driving component 210 and two symmetrically arranged adjustable clamping jaws 220. The clamping jaw driving component 210 drives the two adjustable clamping jaws 220 to move relatively closer or farther away. The two adjustable clamping jaws 220 are laterally symmetrically distributed around the center of the Bernoulli suction cup 110 and are located on the periphery of the Bernoulli suction cup 110. The clamping mechanism 200 with adjustable clamping jaws 220 can protect the wafer 400. After the suction cup mechanism 100 adsorbs and fixes the wafer 400, the clamping jaw driving component 210 can drive the two adjustable clamping jaws 220 to move closer to each other to clamp the wafer 400. When the Bernoulli suction cup 110 stops unexpectedly, the wafer 400 can be clamped by the adjustable clamping jaws 220 on both sides to avoid falling and damage.

[0041] At the same time, in order to adapt to wafers 400 of different sizes, the adjustable clamping jaw 220 of this embodiment includes a clamping plate 221 and a rotating clamping jaw 230. The clamping plate 221 is connected to the clamping jaw drive assembly 210. The rotating clamping jaw 230 can be rotated horizontally and assembled on the clamping plate 221 inward or outward. A clamping jaw portion 231 is provided on one horizontal side of the bottom of the rotating clamping jaw 230, and a horizontally arranged annular clamping groove 232 is provided on the clamping jaw portion 231.

[0042] Therefore, since the bottom side of the rotating claw 230 is provided with a claw portion 231, when the rotating claw 230 rotates inward, the rotating claw 230 Figure 7 , the claw portion 231 can be rotated to the inside, so the distance between the two claw portions 231 of the two adjustable clamping jaws 220 is small, which can be applied to small-sized wafers 400; when the rotating claw 230 rotates outward, refer to Figure 1 The claw portion 231 can be rotated to the outside, so the distance between the two claw portions 231 of the two adjustable clamping jaws 220 becomes larger, which can be suitable for large-sized wafers 400; and an annular groove 232 is provided on the claw portion 231. Regardless of whether the inner side of the claw portion 231 faces inward or the outer side faces inward, the annular groove 232 can be used for the edge of the wafer 400 to extend and clamp, so as to clamp and support the wafer 400.

[0043] Thus, by simply rotating the rotating claw 230, the distance between the two claw parts 231 on both sides can be adjusted to meet the production requirements of large-size wafers 400 and small-size wafers 400. It is easy to operate, has a simple structure, and can effectively improve production efficiency.

[0044] See Figure 6The cam 233 is pivoted with the top of the cam 234 so that the cam 234 can be moved in a direction opposite to the top of the cam 234.

[0045] In this embodiment, two symmetrical clamping portions 234 are provided on the top of the rotating shaft portion 233. Therefore, the two clamping portions 234 can be movably engaged in the two clamping grooves 223 at the same time, and the rotating claw 230 is limited to rotating in two directions: inward and outward.

[0046] A magnet 224 may be provided on the engaging groove 223, and the engaging portion 234 may be made of a magnetic material to attract and fix the engaging portion 234 in the engaging groove 223, thereby strengthening the connection and cooperation between the rotating claw 230 and the engaging plate 221 and preventing the rotating claw 230 from rotating accidentally.

[0047] In this embodiment, two clearance slots 225 are provided between the two engaging portions 234 on the top surface of the engaging plate 221, and notches 236 are provided on the sidewalls of the rotating shaft portion 233 at positions corresponding to the clearance slots 225. Thus, a worker can insert their fingers from the two clearance slots 225 into the two notches 236 to grasp the rotating shaft portion 233, thereby facilitating the lifting of the magnetically fixed rotating claw 230 and enabling rotational adjustment.

[0048] Another example Figure 2 and Figure 3 The clamping plate 221 may be provided with a vertically extending detection port 226 on the inner side of the rotating shaft hole 222 near the Bernoulli suction cup 110. A clamping jaw detection sensor 227 is mounted at the detection port 226. Thus, when the rotating clamping jaw 230 turns inward, the clamping jaw portion 231 can rotate inward, allowing the clamping jaw detection sensor 227 to detect and identify the rotation adjustment (illustrated by the detection light effect in the figure) to determine whether the rotation adjustment is complete.

[0049] For example Figure 6In this embodiment, the connecting portion 235 extends in the horizontal direction, with one end of the connecting portion 235 connected to the lower end of the rotating shaft portion 233 and the other end connected to the claw portion 231. By controlling the length of the connecting portion 235, the diameter of the wafer 400 that can be clamped by the claw portions 231 on both sides when rotating inward or outward can be set.

[0050] The claw portion 231 includes a longitudinally extending connecting rod 237, the middle part of the connecting rod 237 is connected to the horizontal connecting portion 235, and a vertically extending claw column 238 is provided below each longitudinal end of the connecting rod 237, and the bottom of the claw column 238 forms the annular groove 232; the two adjustable clamping jaws 220 have a total of four claw columns 238, and the annular groove 232 of each claw column 238 is respectively for the outer edge of the wafer 400 to extend into and cooperate with.

[0051] In this embodiment, four claw columns 238 are provided to achieve four-point stable clamping support. Of course, only two claw columns 238 or other numbers of claw columns 238 can be provided to ensure balanced support for the wafer 400.

[0052] like Figures 1 to 3 The wafer handling device of this embodiment also includes a device housing 300; the suction cup mechanism 100 and the clamping claw driving assembly 210 of the clamping claw mechanism 200 are installed in the device housing 300 with longitudinal spacing, the bottom Bernoulli suction cup 110 of the suction cup mechanism 100 is exposed at the bottom opening of the device housing 300, and the adjustable clamping claw 220 of the clamping claw mechanism 200 is movable laterally at the side opening set on the side of the device housing 300.

[0053] The top of the device housing 300 may be provided with a drive shaft connection hole 310 for connecting a drive shaft (not shown) to control the movement of the wafer handling device and thus move the wafer 400.

[0054] And as Figure 3 The device housing 300 may also be provided with a wafer detection sensor 320 for detecting whether a wafer 400 is adsorbed.

[0055] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, equivalent changes and modifications that do not depart from the principles of the present invention should still fall within the scope of protection of the present invention.

[0056] In the description of the embodiments of the present application, it should be understood that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the application is conventionally placed when in use, or is the orientation or position relationship conventionally understood by those skilled in the art. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

Claims

1. A wafer transport device, characterized in that: It includes a suction cup mechanism and a clamping claw mechanism; The suction cup mechanism includes a Bernoulli suction cup; The clamping mechanism includes a clamping jaw driving assembly and two symmetrically arranged adjustable clamping jaws, and the clamping jaw driving assembly drives the two adjustable clamping jaws to move closer or farther away from each other; The two adjustable grippers are laterally symmetrically distributed around the center of the Bernoulli suction cup and are located on the periphery of the Bernoulli suction cup; The adjustable clamping jaw includes a clamping plate and a rotating clamping jaw, the clamping plate is connected to the clamping jaw drive assembly, the rotating clamping jaw can be rotated horizontally and assembled on the clamping plate inward or outward, and a clamping jaw portion is provided on one horizontal side of the bottom of the rotating clamping jaw, and a horizontally arranged annular clamping groove is provided on the clamping jaw portion.

2. The wafer transport device according to claim 1, wherein: The rotating claw includes a rotating shaft portion, a connecting portion and the claw portion; the rotating shaft portion can be rotated and moved up and down to pass through the rotating shaft hole set on the clamping plate, and a clamping portion extends radially outward from the top of the rotating shaft portion; the top surface of the clamping plate is provided with two clamping grooves that are symmetrical along the center of the rotating shaft hole and for the clamping portion to be movably engaged, and when the clamping portion is engaged in different clamping grooves, the rotating claw is controlled to be assembled inward or outward; the connecting portion extends along the horizontal direction, and one end of the connecting portion is connected to the lower end of the rotating shaft portion, and the other end is connected to the claw portion.

3. The wafer transport device according to claim 2, wherein: Two symmetrical clamping parts are provided on the top of the rotating shaft.

4. A wafer transport device according to claim 2 or 3, characterized in that: A magnet is provided in the clamping groove, and the clamping portion is made of magnetic material.

5. The wafer transport device according to claim 2, wherein: Two clearance grooves are respectively provided between the two clamping parts on the top surface of the clamping plate, and the side wall of the rotating shaft part is provided with a notch at the position corresponding to the clearance groove.

6. The wafer transport device according to claim 2, wherein: The clamping plate is provided with a detection port which passes through from top to bottom on the inner side of the rotating shaft hole close to the Bernoulli suction cup, and a clamping claw detection sensor is installed at the detection port.

7. The wafer transport device according to claim 2, wherein: The claw part includes a longitudinally extending connecting rod, the middle part of the connecting rod is connected to the transverse connecting part, and a vertically extending claw column is provided below each longitudinal end of the connecting rod, and the bottom of the claw column forms the annular groove; there are four claw columns in total with two adjustable clamping jaws, and the annular groove of each claw column is respectively for the outer edge of the wafer to extend into and cooperate with.

8. The wafer transport device according to claim 1, wherein: It also includes a device shell; the suction cup mechanism and the clamping jaw drive assembly of the clamping jaw mechanism are installed in the device shell with longitudinal intervals, the bottom Bernoulli suction cup of the suction cup mechanism is exposed at the bottom opening of the device shell, and the adjustable clamping jaw of the clamping jaw mechanism moves laterally in the side opening set on the side of the device shell.

9. The wafer transport device according to claim 8, wherein: A driving shaft connection hole is provided on the top of the device shell; and a wafer detection sensor is provided on the device shell.

10. The wafer transport device according to claim 1, wherein: The suction cup mechanism also includes a suction cup bracket and a suction cup drive assembly; the suction cup drive assembly drives the suction cup bracket to rise and fall, and the Bernoulli suction cup is arranged at the bottom of the suction cup bracket.

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