Chip guide mechanism
The chip position is adjusted by adjusting the material position, material stop and vibration element of the chip guide mechanism, which solves the problem of irregular chip position and realizes automatic guide and efficient testing.
Patent Information
- Application Number
- CN202422385313.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The chip is irregular in position before putting it into the loading disk, causing the robot to deviate from its position when placed, affecting the testing efficiency and requires manual intervention and adjustment.
The chip guide mechanism is adopted, including a material carrier, a material retaining unit, an attitude adjustment unit and a vibration element. By adjusting the attitude of the carrier plate and using the vibration element, the chip is automatically guided to ensure that the chip is in the placement groove accurately.
The automatic guidance and correction of the chip in the placement slot is realized, which improves the guidance and correction efficiency, ensures that the test is carried out normally, reduces manual intervention, and improves the testing efficiency.
Smart Images
Figure CN223245584U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip alignment, in particular to a chip alignment mechanism. Background Art
[0002] With the rapid development of industrial electrification and intelligentization, the demand for semiconductor packaging chips has exploded, and the semiconductor packaging chip testing industry has also entered a period of rapid development. To increase production capacity and reduce production costs, automated test equipment that can simulate test environments and conduct large-scale performance testing of semiconductor chips has played an increasingly important role in the semiconductor testing industry.
[0003] Before testing, the chips need to be fed into the chip test sorting machine via the infeed tray for testing. After the test is completed, the chips are transported out via the outfeed tray. However, before the chips are placed in the parking slots of the tray, that is, before the robot picks up the chips, the chips are not in a regular position. Because the robot's movement method is fixed, the chips will remain in their original position after being transported. This causes the robot to still be out of position after picking up and placing the chips, resulting in irregular chip placement, which in turn causes the test sorting machine to sound an alarm, requiring manual intervention and adjustment, affecting test efficiency. Utility Model Content
[0004] The purpose of the present invention is to provide a chip guiding mechanism, aiming to solve the problems mentioned in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions: the chip guiding mechanism includes a base plate; a loading part, the loading part is located above the base plate, and the loading part is used to place the chip; a blocking part, the blocking part is arranged on the loading part, and the blocking part is used to limit the chip on the loading part within the loading part; a posture adjustment part, the posture adjustment part is arranged on the base plate, the loading part is arranged above the posture adjustment part, and the posture adjustment part is used to adjust the posture of the loading part; a vibration element, the vibration element is arranged on the posture adjustment part, and the vibration element is used to adjust the position of the chip placed on the loading part.
[0006] Preferably, the loading portion comprises a loading tray, and placement grooves for placing chips are evenly opened on the loading tray.
[0007] Preferably, the material blocking part includes several main shafts, which are arranged on the loading plate and located on one side of the placement slot. The main shaft is rotatably connected to the loading plate, and a baffle for covering the upper end opening of the placement slot is provided on the main shaft. A gear is provided at one end of the main shaft, and a shell is provided on one side of the loading plate. The interior of the shell is slidably connected with a rack meshing with the gear, and the outer surface of the shell is fixedly connected to a first cylinder, and a connecting rod is provided on the lower surface of the rack, and the output end of the first cylinder is fixedly connected to the connecting rod, and the lower end surface of the shell is provided with a through groove for moving the connecting rod.
[0008] Preferably, the posture adjustment part includes a shock-absorbing plate arranged at the lower end of the loading tray, and two fixed seats are provided on the lower surface of the shock-absorbing plate, and the two fixed seats are located on the same diagonal line of the shock-absorbing plate. It also includes a fixing rod, one end of the fixing rod is rotatably connected to one of the fixing seats, and the other end of the fixing rod is fixedly connected to the base plate, and a second cylinder is provided on the base plate, and the fixing rod and the second cylinder are located on the same diagonal line of the base plate. It also includes an adjusting rod, one end of the adjusting rod is rotatably connected to the output end of the second cylinder, and the other end of the adjusting rod is rotatably connected to the other fixing seat.
[0009] Preferably, the vibration element is a vibration motor, and the vibration motor is arranged on the lower surface of the shock-absorbing plate.
[0010] Preferably, two support seats are provided on the lower surface of the shock-absorbing plate, and the two support seats are located on another diagonal line of the shock-absorbing plate.
[0011] The beneficial effects of the utility model are:
[0012] The device can automatically align the chips in the placement slots by adjusting the loading tray to an inclined posture and then using micro-vibration. After the alignment is completed, it only needs to control the loading tray to return to a horizontal state to ensure the accurate position of the chips in the placement slots. All chips can be aligned at the same time, with high alignment efficiency to ensure the normal progress of the test. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a structural schematic diagram of a specific embodiment of the utility model.
[0014] Figure 2 It is a schematic diagram of the structure inside the shell.
[0015] Figure 3 This is a schematic diagram after the baffle is flipped.
[0016] Figure 4 This is a schematic diagram of the loading tray after posture adjustment.
[0017] Figure 5yes Figure 4 Front view of the state.
[0018] In the figure: 1. Base plate; 2. Loading tray; 3. Placement slot; 4. Main shaft; 5. Baffle; 6. Gear; 7. Housing; 8. Rack; 9. First cylinder; 10. Connecting rod; 11. Shock-absorbing plate; 12. Fixed seat; 13. Fixed rod; 14. Second cylinder; 15. Adjusting rod; 16. Vibration motor; 17. Support seat. DETAILED DESCRIPTION
[0019] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.
[0020] like Figure 1-5 As shown, a chip guiding mechanism includes a base plate 1; a loading part, which is located above the base plate 1 and is used to place chips; a blocking part, which is arranged on the loading part and is used to limit the chips on the loading part within the loading part; a posture adjustment part, which is arranged on the base plate 1 and the loading part is arranged above the posture adjustment part, and is used to adjust the posture of the loading part; a vibration element, which is arranged on the posture adjustment part and is used to adjust the position of the chip placed on the loading part.
[0021] Furthermore, the loading part includes a loading tray 2, on which placement slots 3 for placing chips are evenly opened. The size of the placement slots 3 is larger than the size of the chip. An external robot places the adsorbed chip into the placement slots 3. The position of some chips in the placement slots 3 is not correct, and the chips in the placement slots 3 need to be corrected subsequently.
[0022] Furthermore, the material blocking portion includes several spindles 4, which are arranged on the loading tray 2 and are located on one side of the placement groove 3. The spindle 4 is rotatably connected to the loading tray 2, and a baffle 5 for covering the upper end opening of the placement groove 3 is provided on the spindle 4. A gear 6 is provided at one end of the spindle 4, and a shell 7 is provided on one side of the loading tray 2. The interior of the shell 7 is slidably connected to a rack 8 meshing with the gear 6, and the outer surface of the shell 7 is fixedly connected to a first cylinder 9, and a connecting rod 10 is provided on the lower surface of the rack 8. The output end of the first cylinder 9 is fixedly connected to the connecting rod 10, and a through groove for moving the connecting rod 10 is provided on the lower end surface of the shell 7. Before the chip in the placement groove 3 is guided, in order to prevent the chip from The chip jumps out of the placement slot 3 and can be blocked by the placement slot 3 by the baffle 5 to ensure that the chip can be stably placed in the slot 3. Specifically, the first cylinder 9 is started, and the output end of the first cylinder 9 is extended. The output end of the first cylinder 9 drives the rack 8 to move, and the rack 8 drives the main shaft 4 to rotate by engaging with the gear 6. When the main shaft 4 rotates, the baffle 5 perpendicular to the loading tray 2 can be covered on the placement slot 3. The baffle 5 is used to prevent the chip from escaping from the placement slot 3. At the same time, when placing the chip in the placement slot 3 and testing the chip, the baffle 5 needs to be perpendicular to the loading tray 2 to avoid affecting the placement and testing of the chip. The baffle 5 is made of colorless and transparent plastic material or glass material.
[0023] Furthermore, the posture adjustment portion includes a shock-absorbing plate 11 arranged at the lower end of the loading tray 2, and two fixed seats 12 are provided on the lower surface of the shock-absorbing plate 11, and the two fixed seats 12 are both located on the same diagonal line on the shock-absorbing plate 11. It also includes a fixing rod 13, one end of the fixing rod 13 is rotatably connected to one of the fixing seats 12, and the other end of the fixing rod 13 is fixedly connected to the bottom plate 1, and a second cylinder 14 is provided on the bottom plate 1, and the fixing rod 13 and the second cylinder 14 are both located on the same diagonal line of the bottom plate 1, and it also includes an adjusting rod 15, one end of the adjusting rod 15 is rotatably connected to the output end of the second cylinder 14, and the other end of the adjusting rod 15 is rotatably connected to the other fixing seat 12, in the opposite placement groove 3. Before guiding the chip, it is necessary to adjust the state of the loading tray 2 first. Specifically, the second cylinder 14 is started, and the output end of the second cylinder 14 retracts. During the retraction of the output end of the second cylinder 14, the lower end of the adjusting rod 15 will be driven to move toward the direction of the second cylinder 14. During the movement, the adjusting rod 15 will push one corner of the loading tray 2 upward. At this time, the horizontal height relationship of the four corners of the placement slot 3 is that the horizontal height of one corner is the lowest and the horizontal height of one corner is the highest, and the two corners are on the same diagonal line of the loading tray 2, and the horizontal heights of the other two corners are the same, so that the corner of the chip in the placement slot 3 tends to move toward the corner with the lowest horizontal height in the placement slot 3.
[0024] Furthermore, the vibration element is a vibration motor 16, which is arranged on the lower surface of the shock-absorbing plate 11. When the chip in the placement groove 3 is guided, the vibration motor 16 is started, and the vibration motor 16 transmits the vibration to the loading tray 2 through the shock-absorbing plate 11, and vibrates the chip in the placement groove 3, so that the chip moves continuously in the placement groove 3, and cooperates with the effect of the chip's own gravity until one corner of the chip is aligned with the corner with the lowest horizontal height in the placement groove 3. At this time, the chip guidance work is completed, and then the vibration motor 16 is turned off, and the output end of the second cylinder 14 is controlled to extend to restore the loading tray 2 to a horizontal state. The shock-absorbing plate 11 is used to reduce the vibration effect of the vibration motor 16 to avoid excessive vibration intensity affecting the chip guidance work. The vibration intensity of the vibration motor 16 enables the chip in the placement groove 3 to produce a small amplitude of jumping and movement, while also avoiding damage to the chip.
[0025] Furthermore, two support seats 17 are provided on the lower surface of the shock-absorbing plate 11. The two support seats 17 are located on another diagonal line on the shock-absorbing plate 11. The support seats 17 are used to support the shock-absorbing plate 11 and the loading tray 2 on the shock-absorbing plate 11. When the lower end of the support seat 17 contacts the base plate 1, the loading tray 2 is in a horizontal state.
[0026] The device can automatically align the chips in the placement slot 3 by adjusting the loading tray 2 to an inclined posture and then using micro-vibration. After the alignment is completed, it is only necessary to control the loading tray 2 to return to a horizontal state to ensure that the chips are accurately positioned in the placement slot 3. All chips can be aligned at the same time, with high alignment efficiency to ensure the normal progress of the test.
[0027] In the description of this utility model, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.
Claims
1. A chip guiding mechanism, characterized in that: include: base plate; A loading portion, located above the bottom plate and used for placing chips; A material stopper, the material stopper being provided on the material loading portion and being used to limit the chips on the material loading portion within the material loading portion; A posture adjustment part, wherein the posture adjustment part is arranged on the bottom plate, the loading part is arranged above the posture adjustment part, and the posture adjustment part is used to adjust the posture of the loading part; A vibration element is provided on the posture adjustment portion and is used to adjust the position of the chip on the loading portion.
2. The chip guiding mechanism according to claim 1, wherein: The loading part includes a loading tray, and placement grooves for placing chips are evenly opened on the loading tray.
3. The chip guiding mechanism according to claim 2, wherein: The material blocking part includes several main shafts, which are arranged on the loading plate and located on one side of the placement slot. The main shaft is rotatably connected to the loading plate, and a baffle for covering the upper end opening of the placement slot is provided on the main shaft. A gear is provided at one end of the main shaft, and a shell is provided on one side of the loading plate. A rack meshing with the gear is slidably connected to the interior of the shell, and a first cylinder is fixedly connected to the outer surface of the shell, and a connecting rod is provided on the lower surface of the rack. The output end of the first cylinder is fixedly connected to the connecting rod, and a through groove for moving the connecting rod is provided on the lower end surface of the shell.
4. The chip guiding mechanism according to claim 3, wherein: The posture adjustment part includes a shock-absorbing plate arranged at the lower end of the loading tray, two fixed seats are provided on the lower surface of the shock-absorbing plate, and the two fixed seats are located on the same diagonal line of the shock-absorbing plate. It also includes a fixing rod, one end of the fixing rod is rotatably connected to one of the fixing seats, and the other end of the fixing rod is fixedly connected to the base plate, and a second cylinder is provided on the base plate, and the fixing rod and the second cylinder are located on the same diagonal line of the base plate. It also includes an adjusting rod, one end of the adjusting rod is rotatably connected to the output end of the second cylinder, and the other end of the adjusting rod is rotatably connected to the other fixed seat.
5. The chip guiding mechanism according to claim 4, characterized in that: The vibration element is a vibration motor, and the vibration motor is arranged on the lower surface of the shock-absorbing plate.
6. The chip guiding mechanism according to claim 5, characterized in that: Two support seats are provided on the lower surface of the shock-absorbing plate, and the two support seats are located on another diagonal line of the shock-absorbing plate.