Electronic package
By setting a thermally conductive layer on the non-acting surface of the electronic component and thermally coupling the second line structure, the problem of poor heat dissipation in the semiconductor package is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422342333.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-13
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the existing semiconductor packaging structure, the semiconductor chips have poor heat dissipation, which makes it difficult to solve the overheating problem.
A thermally conductive layer is provided on the non-acting surface of the electronic component, and a second line structure is thermally coupled through the thermally conductive layer to improve heat dissipation efficiency, and electrically connects the electronic component and the photonic component in conjunction with the first and second line structures.
The heat dissipation efficiency of electronic components is improved, the heat dissipation capacity of 5% to 10%, and the overheating of electronic components is avoided.
Smart Images
Figure CN223245604U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a packaging structure and an electronic package. Background Art
[0002] Figure 1 Schematic cross-sectional view of a conventional semiconductor package 1. The semiconductor package 1 includes a first redistribution layer 11, a semiconductor chip 13, a plurality of conductive pillars 12, an encapsulant 14, a second redistribution layer 15, a plurality of conductive elements 16, and a photonic chip 17.
[0003] The first redistribution layer 11 includes an insulating layer 111 and a circuit layer 112 bonded to the insulating layer 111. The semiconductor chip 13 is bonded to the underside of the first redistribution layer 21 and the circuit layer 112 via its upper functional surface and first conductive bumps 131. The photonic chip 17 is bonded to the upper side of the first redistribution layer 11 and the circuit layer 112 via its lower functional surface and second conductive bumps 171. A first underfill 132 covers the first conductive bumps 131, and a second underfill 172 covers the second conductive bumps 171.
[0004] The semiconductor chip 13 is bonded to the upper side of the second redistribution layer 15 via an adhesive layer 133. The second redistribution layer 15 includes an insulating layer 151 and a circuit layer 152 bonded to the insulating layer 151. Conductive pillars 12 are disposed between the first redistribution layer 11 and the second redistribution layer 15 to electrically connect the circuit layer 112 of the first redistribution layer 11 with the circuit layer 152 of the second redistribution layer 15. The encapsulation resin 14 is disposed between the first redistribution layer 11 and the second redistribution layer 15 and covers the semiconductor chip 13, the adhesive layer 133, and the conductive pillars 12. The conductive element 16 is disposed on the lower side of the second redistribution layer 15 and electrically connects the circuit layer 152 of the second redistribution layer 15.
[0005] Advanced semiconductor processes of 7nm, 5nm or smaller sizes require more efficient chip cooling technology. However, Figure 1 The semiconductor chip 13 shown is surrounded by the first underfill 131, the encapsulant 14 and the adhesive layer 133, resulting in poor heat dissipation. Therefore, how to provide a packaging structure that is conducive to heat dissipation to prevent the semiconductor chip 13 from overheating has become a technical problem that needs to be solved urgently. Utility Model Content
[0006] To solve the above problems, the present application provides an electronic package, comprising an electronic component, a photonic component, a first circuit structure, a second circuit structure, and a heat-conducting layer. The electronic component has an active surface and an inactive surface relative to each other. The first circuit structure is disposed between the electronic component and the photonic component and electrically connects the electronic component and the photonic component. The heat-conducting layer is disposed between the inactive surface of the electronic component and the second circuit structure to improve the heat dissipation efficiency of the electronic component during operation. The second circuit structure is electrically connected to the first circuit structure and thermally coupled to the electronic component through the heat-conducting layer.
[0007] The present application also provides a method for manufacturing an electronic package, comprising: placing an electronic component on a first circuit structure, wherein the electronic component has an active surface and an inactive surface relative to each other; forming a heat-conducting layer on the inactive surface of the electronic component to improve the heat dissipation efficiency of the electronic component during operation; forming a second circuit structure on the heat-conducting layer, wherein the second circuit structure is electrically connected to the first circuit structure and thermally coupled to the electronic component through the heat-conducting layer; and placing a photonic component on the first circuit structure so that the photonic component is electrically connected to the electronic component through the first circuit structure.
[0008] The electronic package and its manufacturing method of the present application mainly adhere the heat-conducting layer to the inactive surface of the electronic component, and make the second circuit structure thermally coupled to the electronic component through the heat-conducting layer to improve the heat dissipation efficiency of the electronic component during operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.
[0010] Figures 2 to 5 FIG1 is a schematic cross-sectional view of a method for manufacturing an electronic package according to an embodiment of the present application.
[0011] Figure 6 FIG1 is a schematic cross-sectional view of an electronic package according to another embodiment of the present application.
[0012] Description of Reference Numerals
[0013] 1 Semiconductor Package
[0014] 11. First redistribution layer
[0015] 111 insulation layer
[0016] 112 circuit layer
[0017] 12 conductive pillars
[0018] 13 semiconductor chips
[0019] 131 first conductive bump
[0020] 132 First Primer
[0021] 133 Adhesive layer
[0022] 14 Encapsulation colloid
[0023] 15 Second redistribution layer
[0024] 151 insulation layer
[0025] 152 circuit layer
[0026] 16 Conductive elements
[0027] 17 Photonic Chip
[0028] 171 second conductive bump
[0029] 172 Second primer
[0030] 2 Electronic packaging
[0031] 20 first bearing member
[0032] 21 First Line Structure
[0033] 211 insulation layer
[0034] 212 circuit layer
[0035] 22 conductive pillars
[0036] 23 Electronic components
[0037] 23a Active surface
[0038] 23b Non-active surface
[0039] 231 first conductive block
[0040] 232 First Primer
[0041] 233 thermal conductive layer
[0042] 24 cladding
[0043] 25 Second Line Structure
[0044] 251 insulation layer
[0045] 252 circuit layer
[0046] 253 heat dissipation area
[0047] 26 Conducting elements
[0048] 261 conductive elements
[0049] 262 thermal conductive elements
[0050] 263 Viscose
[0051] 27 Photonic Components
[0052] 27a Functional surface
[0053] 27b Non-functional surface
[0054] 271 Second conductive block
[0055] 272 Second Primer
[0056] 28 second bearing member
[0057] D1, D2 size. DETAILED DESCRIPTION
[0058] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0059] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "upper", "lower", "one", "first" and "second" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0060] Figures 2 to 5 FIG1 is a schematic cross-sectional view of a method for manufacturing an electronic package according to an embodiment of the present application. Figures 2 to 5 Each element shown has a first side and a second side opposite each other, the first side being Figure 2 and Figure 3 The lower side shown with Figure 4 and Figure 5 The upper side shown, and the second side is Figure 2 and Figure 3 The upper side shown with Figure 4 and Figure 5 Underside shown.
[0061] First, if Figure 2 As shown, a first circuit structure 21 is formed on a first carrier 20 , and then a conductive pillar 22 and an electronic component 23 are disposed on a second side of the first circuit structure 21 .
[0062] The first circuit structure 21 includes at least one insulating layer 211 and at least one circuit layer 212 connected to the insulating layer 211. For example, the circuit layer 212 may be made of copper or other conductive materials, and the insulating layer 211 may be made of polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials.
[0063] The conductive pillars 22 may be made of copper or other metals, or other conductive materials.
[0064] The electronic component 23 can be an active component, a passive component, or a combination thereof, with the active component being, for example, a semiconductor chip, and the passive component being, for example, a resistor, capacitor, or inductor. The first side of the electronic component 23 is an active surface 23a, and the second side is an inactive surface 23b. The electronic component 23 is flip-chip bonded to the second side of the first circuit structure 21 via its active surface 23a and a plurality of first conductive blocks 231. The first conductive blocks 231 can be formed of solder or a conductive metal. A first primer 232 is then applied to the first conductive blocks 231.
[0065] Furthermore, a coating layer 24 is disposed on the second side of the first circuit structure 21 to cover the electronic components 23 and the conductive pillars 22. The coating layer 24 is made of an insulating material, such as polyimide (PI) or epoxy encapsulant or packaging material. The coating layer 24 can be formed by molding, lamination, or coating.
[0066] like Figure 3 As shown, a portion of the coating layer 24 is removed to expose one end of the conductive column 22 (ie Figure 3 The upper end of the conductive post 22 is shown in the figure) and the inactive surface 23b of the electronic component 23. Next, a heat conductive layer 233 is formed on the inactive surface 23b of the electronic component 23, and a second circuit structure 25 is formed on the heat conductive layer 233 and the cladding layer 24, so that the second circuit structure 25 is electrically connected to the first circuit structure 21 through the conductive post 22 and is thermally coupled to the electronic component 23 through the heat conductive layer 233. When it is necessary to remove a portion of the cladding layer 24 to expose one end of the conductive post 22 and the inactive surface 23b of the electronic component 23, the portion of the cladding layer 24 can be removed by grinding.
[0067] The heat conducting layer 233 may be made of a metal material with high thermal conductivity, such as copper, to conduct heat generated during operation of the electronic component 23 to the second circuit structure 25 , thereby improving heat dissipation efficiency during operation of the electronic component 23 .
[0068] The second circuit structure 25 includes at least one insulating layer 251 and at least one circuit layer 252 connected to the insulating layer 251. For example, the circuit layer 252 may be made of copper or other conductive materials, and the insulating layer 251 may be made of the aforementioned poly(p-oxadiazole) (PBO), polyimide (PI), prepreg (PP), or other dielectric materials.
[0069] In addition, a plurality of conductive elements 26 are disposed on the second side of the second circuit structure 25. The conductive elements 26 are, for example, conductive pillars or conductive bumps.
[0070] like Figure 4 As shown, remove the first carrier 20 and flip Figure 3 The semi-finished electronic package is then mounted on the second carrier 28 via the conductive element 26 and the adhesive 263. Then, the photonic element 27 is mounted on the first circuit structure 21 so as to be electrically connected to the electronic element 23 via the first circuit structure 21.
[0071] The photonic element 27 may be a semiconductor element capable of transmitting and / or receiving optical signals.
[0072] The first side of the photonic element 27 is a non-functional surface 27b, and the second side is a functional surface 27a. The photonic element 27 is flip-chip bonded to the first side of the first circuit structure 21 via its functional surface 27a and a plurality of second conductive blocks 271. The second conductive blocks 271 can be formed of solder or a conductive metal. A second primer 272 is applied to cover the second conductive blocks 271.
[0073] The first circuit structure 21 has a first side and a second side opposite to each other. The photonic element 27 is disposed on the first side of the first circuit structure 21 , and the electronic element 23 is disposed on the second side of the first circuit structure 21 .
[0074] like Figure 5 As shown, the second carrier 28 and the adhesive 263 are removed to complete the electronic package 2 .
[0075] Figure 5 The electronic package 2 shown includes a first circuit structure 21 , an electronic component 23 , a heat-conducting layer 233 , a plurality of conductive pillars 22 , a cladding layer 24 , a second circuit structure 25 , a plurality of conductive components 26 , and a photonic component 27 .
[0076] The electronic component 23 is coupled to the second side of the first circuit structure 21 via the first conductive block 231, while the photonic component 27 is coupled to the first side of the first circuit structure 21 via the second conductive block 271. Therefore, the first circuit structure 21 is disposed between the electronic component 23 and the photonic component 27. The circuit layer 212 of the first circuit structure 21 is electrically connected to the electronic component 23 via the first conductive block 231 and to the photonic component 27 via the second conductive block 271.
[0077] Thermally conductive layer 233 is disposed between inactive surface 23b of electronic component 23 and the first side of second circuit structure 25. Conductive pillar 22 is disposed between first circuit structure 21 and second circuit structure 25 to electrically connect circuit layer 212 of first circuit structure 21 with circuit layer 252 of second circuit structure 25. Encapsulating layer 24 is disposed between first circuit structure 21 and second circuit structure 25, encapsulating electronic component 23, thermally conductive layer 233, and conductive pillar 22. Conductive element 26 is disposed on the second side of second circuit structure 25.
[0078] like Figure 5 As shown, the conductive element 26 may include at least one conductive element 261 and at least one thermal conductive element 262. The conductive element 261 electrically connects the electronic component 23 and / or the photonic component 27 through the circuit layer 252 of the second circuit structure 25, the conductive pillars 22, and the circuit layer 212 of the first circuit structure 21 to transmit electrical signals from the electronic component 23 and / or the photonic component 27. The thermal conductive element 262 thermally couples the electronic component 23 through the circuit layer 252 of the second circuit structure 25 and the thermal conductive layer 233 to conduct heat generated during operation of the electronic component 23 and prevent overheating of the electronic component 23.
[0079] In one embodiment of the present application, a size (eg, width or diameter) D1 of the thermally conductive element 262 is greater than a size (eg, width or diameter) D2 of the conductive element 261 .
[0080] In one embodiment of the present application, at least one of the thermally conductive elements 262 is electrically connected to the electronic element 23 and / or the photonic element 27 through the second circuit structure 25 , the conductive pillar 22 , and the first circuit structure 21 to serve as a power supply terminal or a ground terminal of the electronic element 23 and / or the photonic element 27 .
[0081] In one embodiment of the present application, a heat dissipation area 253 is provided on the second side of the second circuit structure 25 , and the heat conducting element 262 occupies at least 60% of the area of the heat dissipation area 253 , so that heat can be removed quickly without affecting the operation of the electronic component 23 .
[0082] Figure 6 FIG2 is a cross-sectional view of an electronic package 2 according to another embodiment of the present invention. The heat conducting layer 233 of this embodiment is embedded in the second circuit structure 25, and the first side (ie Figure 6 The upper surface shown) and the first side of the second circuit structure 25 (ie Figure 6 flush with the upper surface shown).
[0083] In summary, the electronic package 2 and its manufacturing method of the present application attach the thermal conductive layer 233 to the non-active surface 23b of the electronic component 23, and allow the second circuit structure 25 to be thermally coupled to the electronic component 23 through the thermal conductive layer 233 to improve the heat dissipation efficiency of the electronic component 23 during operation, thereby increasing the heat dissipation capacity of the electronic package 2 by 5% to 10%.
[0084] The above embodiments are intended only to illustrate the principles and effects of this application and are not intended to limit this application. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.
Claims
1. An electronic package, characterized in that: include: A first circuit structure having a first side and a second side opposite to each other; a photonic element, disposed on a first side of the first circuit structure and electrically connected to the first circuit structure; An electronic component having an active surface and an inactive surface opposite to each other, wherein the active surface is disposed on the second side of the first circuit structure and is electrically connected to the first circuit structure; a heat-conducting layer provided on the inactive surface of the electronic component; as well as The second circuit structure is disposed on the second side of the first circuit structure, is electrically connected to the first circuit structure, and is thermally coupled to the electronic component through the heat-conducting layer.
2. The electronic package according to claim 1, wherein The heat conducting layer is embedded in the second circuit structure.
3. The electronic package according to claim 1, wherein: The electronic package further comprises: The conductive column is disposed between the first circuit structure and the second circuit structure, wherein the second circuit structure is electrically connected to the first circuit structure through the conductive column.
4. The electronic package according to claim 3, wherein: The electronic package further comprises: The covering layer is disposed between the first circuit structure and the second circuit structure and covers the electronic component and the conductive column.
5. The electronic package according to claim 1, wherein: The second circuit structure has a first side and a second side opposite to each other. The heat conductive layer is disposed on the first side of the second circuit structure. The electronic package further includes: a conductive element disposed on a second side of the second circuit structure and electrically connected to the electronic element and / or the photonic element through the second circuit structure and the first circuit structure; and The heat-conducting element is disposed on the second side of the second circuit structure and is thermally coupled to the electronic element through the second circuit structure and the heat-conducting layer.
6. The electronic package according to claim 5, wherein: The size of the thermally conductive element is larger than that of the electrically conductive element.
7. The electronic package according to claim 5, wherein: The heat-conducting element is electrically connected to the electronic element and / or the photonic element through the second circuit structure and the first circuit structure to serve as a power supply terminal or a ground terminal of the electronic element and / or the photonic element.
8. The electronic package according to claim 5, wherein: A heat dissipation area is provided on the second side of the second circuit structure. The electronic package includes a plurality of the heat-conducting elements, and the plurality of heat-conducting elements occupy at least 60% of the area of the heat dissipation area.