Small hook-shaped lead shell with ceramic heat sink

Abstract

The utility model discloses a small hook-shaped lead shell with a ceramic heat sink. The small hook-shaped lead shell comprises a shell, a hook-shaped bent lead, a ceramic heat sink assembly, a hook-shaped flattened lead and a bent flattened inner lead, the ceramic heat sink assembly is installed in an inner cavity of the shell, ceramic insulators are arranged on the hook-shaped bent lead and the hook-shaped flattened lead in a penetrating mode, and the hook-shaped bent lead and the hook-shaped flattened lead are welded and installed on the two sides of the shell through the ceramic insulators respectively. The bent and flattened inner lead passes through a flat position hole of the hook-shaped flattened lead, and one end of the bent and flattened inner lead is connected with the ceramic heat sink assembly; according to the utility model, good heat dissipation performance and relatively high insulation and voltage resistance performance are realized, longitudinal stacking of circuits in a relatively small cavity and direct winding of coils on the housing can be realized, and the space utilization rate is high.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging shells, in particular to a small shell with a hook-shaped lead and a ceramic heat sink. Background Art

[0002] With the rapid development of satellite-borne, ship-borne, aircraft-borne, missile-borne weapons and equipment and civilian communication systems, the demand for high-power and high-voltage integrated circuits is increasing. The casing that protects the circuits needs better heat dissipation performance and also has higher requirements on volume. Conventional metal packaging casings can no longer meet the requirements. Utility Model Content

[0003] In view of this, the utility model provides a small hook-lead housing with a ceramic heat sink, which has good heat dissipation performance and high insulation voltage resistance performance. It can realize vertical stacking of circuits in a smaller cavity and direct winding of coils on the housing, with high space utilization.

[0004] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0005] The utility model provides a small shell with a hook-shaped lead and a ceramic heat sink, comprising a shell, a hook-shaped bent lead, a ceramic heat sink assembly, a hook-shaped flattened lead, and a bent and flattened inner lead; the ceramic heat sink assembly is installed in the inner cavity of the shell, and ceramic insulators are passed through the hook-shaped bent lead and the hook-shaped flattened lead, and the hook-shaped bent lead and the hook-shaped flattened lead are respectively welded and installed on both sides of the shell through the ceramic insulators; the bent and flattened inner lead passes through the flat position hole of the hook-shaped flattened lead, and one end of the bent and flattened inner lead is connected to the ceramic heat sink assembly.

[0006] Furthermore, the ceramic heat sink assembly includes a ceramic substrate, a heat sink sheet, and a nail head lead. The heat sink sheet is welded to the ceramic substrate, the nail head lead is vertically welded to the ceramic substrate, the ceramic substrate is connected to the bottom of the shell, and one end of the bent and flattened inner lead is connected to the ceramic substrate.

[0007] Furthermore, the shell is made of 4J50 expansion alloy.

[0008] Furthermore, the heat sink is a CPC heat sink.

[0009] The beneficial effects of the utility model are as follows:

[0010] The utility model adopts a ceramic substrate to weld a heat sink, which provides good insulation pressure resistance and heat dissipation performance. The welding of ceramic insulators can achieve good air tightness and electrical performance. The product has a wide operating temperature range and can operate at temperatures of -55℃ to 125℃.

[0011] The utility model can realize vertical stacking of circuits in a smaller cavity by printing circuits on the ceramic heat sink assembly and welding vertical nail head leads, thereby achieving high space utilization and meeting the demand for miniaturization of relays.

[0012] The hook-shaped bent lead and the hook-shaped flattened lead adopted by the utility model can be directly wound around the coil, thereby simplifying the external installation method of the coil outside the shell.

[0013] The shell of the utility model is made of 4J50 expansion alloy material, which can avoid the problem of ceramic cracking after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a cross-sectional view of a small housing with hook leads and a ceramic heat sink according to an embodiment of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of a small housing with a hook-shaped lead and a ceramic heat sink according to an embodiment of the utility model;

[0016] Among them: 1 is the shell, 2 is the hook-shaped bent lead, 3 is the ceramic insulator, 4 is the ceramic heat sink assembly, 41 is the ceramic substrate, 42 is the heat sink sheet, 43 is the nail head lead, 5 is the bent and flattened inner lead, 6 is the hook-shaped flattened lead, and 61 is the flat hole. DETAILED DESCRIPTION

[0017] In order to enable a more detailed understanding of the features and technical contents of the present invention, the implementation of the present invention is described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference only and are not intended to limit the present invention.

[0018] like Figure 1-2 As shown, an embodiment of the utility model is a small shell with a hook-shaped lead and a ceramic heat sink, which includes a shell 1, a hook-shaped bent lead 2, a ceramic heat sink assembly 4, a hook-shaped flattened lead 6, and a bent and flattened inner lead 5; the ceramic heat sink assembly 4 includes a ceramic substrate 41, a heat sink sheet 42, and a nail head lead 43, the heat sink sheet 42 is welded to the ceramic substrate 41, and the nail head lead 43 is vertically welded to the ceramic substrate 42.

[0019] The ceramic heat sink assembly 4 is installed in the inner cavity of the shell 1, the ceramic substrate 41 is connected to the bottom of the shell 1, and the hook-shaped bent lead 2 and the hook-shaped flattened lead 6 are both provided with ceramic insulators 3. The hook-shaped bent lead 2 and the hook-shaped flattened lead 6 are respectively welded and installed on both sides of the shell 1 through the ceramic insulator 3. The ceramic insulator 3 passes through the side wall of the shell 1, and the bent and flattened inner lead 5 passes through the flat hole 61 of the hook-shaped flattened lead 6. One end of the bent and flattened inner lead 5 is connected to the ceramic substrate 41, and the hook-shaped flattened lead 6 is connected to the ceramic substrate 41 through the bent and flattened inner lead 5.

[0020] The housing 1 is a 4J50 housing, and the heat sink 42 is a CPC heat sink. The expansion coefficient of the 4J50 housing is similar to that of the ceramic insulator 3 and the ceramic substrate 41, thereby avoiding the problem of ceramic cracking after welding.

[0021] The specific assembly and use process of the embodiment of the utility model is as follows:

[0022] First, the prepared ceramic substrate 41 is welded together with the heat sink sheet 42 and the nail head lead 43 to form a ceramic heat sink assembly 4. Then, the preformed welding sheet is placed in the welding position. The shell 1, the hook-shaped bent lead 2, the hook-shaped flattened lead 6, the ceramic insulator 3, and the ceramic heat sink assembly 4 are assembled together through a mold and then silver-copper welded. Among them, the bent and flattened inner lead 5 is passed through the flat position hole 61 of the hook-shaped flattened lead 6 and welded to the ceramic substrate 41, thus connecting the hook-shaped flattened lead 6 to the ceramic substrate 41. After all the product parts are welded, the islands of the printed circuit on the ceramic substrate 41 are wired and partially gold-plated internally. The shell and leads are nickel-plated. From then on, the product processing is completed.

[0023] During use, the circuit is printed on the ceramic substrate 41, and the heat sink 42 is welded at the required position, and the nail head lead 43 is vertically welded at the required position to form a ceramic heat sink assembly 4. The ceramic heat sink assembly 4 is welded to the bottom of the shell 1 to achieve good heat dissipation performance of the shell 1, so that the product has a wide operating temperature range and can operate at a temperature of -55°C to 125°C; the circuit can be stacked vertically in the inner cavity of the shell 1, and the vertically installed nail head lead 43 can connect the circuit at the bottom of the ceramic substrate 41 and the upper circuit board to achieve vertical circuit stacking in a smaller space, with high space utilization, and meet the miniaturization requirements of the relay; the hook-shaped bent lead 2 and the hook-shaped flattened lead 6 can directly wrap the coil around the outside of the shell 1, which simplifies the external installation method of the coil, and the hook-shaped bent lead 2 and the hook-shaped flattened lead 6 are both provided with a ceramic insulator 3, which can directly wrap the coil around the outside of the shell 1 while ensuring high insulation withstand voltage performance, and the product has good sealing performance.

[0024] Here, the specific models of the above-mentioned devices are not limited or described in detail, and the in-depth connection methods of the above-mentioned devices are not described in detail. As common knowledge, those skilled in the art can understand it.

[0025] The embodiments of the present utility model are only to introduce its specific implementation methods and are not intended to limit its scope of protection. Those skilled in the art may make certain modifications inspired by the embodiments, so any equivalent changes or modifications made in accordance with the scope of the present utility model patent shall fall within the scope of the claims of the present utility model patent.

Claims

1. A small housing with hook leads and a ceramic heat sink, characterized in that: It includes a shell, a hook-shaped bent lead, a ceramic heat sink assembly, a hook-shaped flattened lead, and a bent and flattened inner lead; the ceramic heat sink assembly is installed in the inner cavity of the shell, and the hook-shaped bent lead and the hook-shaped flattened lead are both provided with ceramic insulators, and the hook-shaped bent lead and the hook-shaped flattened lead are respectively welded and installed on both sides of the shell through the ceramic insulators; the bent and flattened inner lead passes through the flat position hole of the hook-shaped flattened lead, and one end of the bent and flattened inner lead is connected to the ceramic heat sink assembly.

2. The small hook-lead housing with a ceramic heat sink according to claim 1, characterized in that: The ceramic heat sink assembly includes a ceramic substrate, a heat sink sheet, and a nail head lead. The heat sink sheet is welded to the ceramic substrate, the nail head lead is vertically welded to the ceramic substrate, the ceramic substrate is connected to the bottom of the shell, and one end of the bent and flattened inner lead is connected to the ceramic substrate.

3. The small hook-lead housing with a ceramic heat sink according to claim 2, characterized in that: The shell is made of 4J50 expansion alloy.

4. The small hook-lead housing with a ceramic heat sink according to claim 3, wherein: The heat sink is a CPC heat sink.

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