Lead frame

Abstract

The utility model discloses a lead frame which comprises a plurality of basic units, each basic unit comprises a base island, a radiating fin is arranged above the base island, a welding platform is arranged below the base island, and the welding platform comprises a first welding piece, a second welding piece, a third welding piece and a fourth welding piece. The second welding piece is arranged between the first welding piece and the third welding piece, the area of the first welding piece is larger than the areas of the second welding piece, the third welding piece and the fourth welding piece, the first welding piece is connected with a first inner pin, the second welding piece is connected with a second inner pin, and the third welding piece is connected with a third inner pin. The fourth welding piece is connected with a fourth inner pin, the base island is connected with a fifth inner pin, and the fifth inner pin is arranged between the third welding piece and the fourth welding piece. Through the welding platforms with different sizes, the lead frame can meet the requirements of different chips, so that the utilization rate of a mold is improved, constant-value differentiated production can be realized, and the market competitiveness is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and more specifically, to a lead frame. Background Art

[0002] Different chips require customized specific lead frames for packaging. Although lead frames can be roughly divided into several categories based on the packaging structure, the same type of lead frames will vary depending on the chip. Newly customized lead frames need to be re-molded for production, which results in low utilization of a single mold and makes it difficult to reduce the production cost of the lead frame. Utility Model Content

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art and to provide a lead frame that can adapt to different chips.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a lead frame, comprising multiple basic units, the basic unit including a base island, a heat sink is arranged above the base island, a welding platform is arranged below the base island, the welding platform includes a first welding plate, a second welding plate, a third welding plate and a fourth welding plate, the second welding plate is placed between the first welding plate and the third welding plate, the area of the first welding plate is larger than the area of the second welding plate, the third welding plate and the fourth welding plate, the first welding plate is connected to a first inner pin, the second welding plate is connected to a second inner pin, the third welding plate is connected to a third inner pin, the fourth welding plate is connected to a fourth inner pin, the base island is connected to a fifth inner pin, and the fifth inner pin is placed between the third welding plate and the fourth welding plate.

[0005] Furthermore, the first inner pin, the second inner pin, the third inner pin, the fourth inner pin and the fifth inner pin are commonly connected with a first horizontal rib, and the first horizontal rib is connected with a first outer pin corresponding to the position of the first inner pin, a second outer pin corresponding to the position of the second inner pin, a third outer pin corresponding to the position of the third inner pin, a fourth outer pin corresponding to the position of the fourth inner pin and a fifth outer pin corresponding to the position of the fifth inner pin.

[0006] Furthermore, the first external pin, the second pin, the third external pin, the fourth external pin and the fifth external pin are commonly connected to a second transverse rib, a first connecting member is connected between the first transverse rib and the second transverse rib, and the first connecting member is placed between two adjacent basic units.

[0007] Furthermore, the base island and the fifth inner pin are connected via a second connecting member, the angle between the base island and the second connecting member is 120°, and the angle between the fifth inner pin and the second connecting member is also 120°.

[0008] Furthermore, the heat sinks of two adjacent basic units are connected via a second connecting member.

[0009] The beneficial effects of the utility model are:

[0010] The lead frame 100 can meet the requirements of different chips through welding platforms of different sizes, and realize the installation of multiple chips, thereby improving the utilization rate of the mold and realizing fixed-value differentiated production, thereby improving market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 Schematic diagram of the structure of the lead frame;

[0012] Figure 2 It is a structural diagram of the basic unit;

[0013] Figure 3 is a structural diagram of the fifth inner pin;

[0014] Figure markings: lead frame 100, basic unit 200, first horizontal rib 201, second horizontal rib 202, first connecting piece 203, second connecting piece 204, base island 210, heat sink 220, first welding piece 230, first inner pin 231, first outer pin 232, second welding piece 240, second inner pin 241, second outer pin 242, third welding piece 250, third inner pin 251, third outer pin 252, fourth welding piece 260, fourth inner pin 261, fourth outer pin 262, fifth inner pin 270, fifth outer pin 271, third connecting piece 272. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] See Figures 1 to 3A lead frame 100 is formed by connecting a plurality of basic units 200, wherein a first basic unit 200 corresponds to a chip. The substrate unit includes a base island 210 for placing the chip. A heat sink 220 is provided above the base island 210 for dissipating heat generated by the chip during operation. A welding platform is provided below the base island 210. The welding platform includes a first welding piece 230, a second welding piece 240, a third welding piece 250, and a fourth welding piece 260. The second welding piece 240 is positioned between the first welding piece 230 and the third welding piece 250. The area of the first welding piece 230 is larger than the areas of the second welding piece 240, the third welding piece 250, and the fourth welding piece 260. By using welding platforms of different sizes, the lead frame 100 can meet the requirements of different chips and realize the installation of multiple chips, thereby improving the utilization rate of the mold and realizing fixed-value differentiated production, thereby improving market competitiveness.

[0017] The first welding tab 230 is connected to the first inner pin 231, the second welding tab 240 is connected to the second inner pin 241, the third welding tab 250 is connected to the third inner pin 251, the fourth welding tab 260 is connected to the fourth inner pin 261, and the base island 210 is connected to the fifth inner pin 270, which is positioned between the third welding tab 250 and the fourth welding tab 260. The first inner pin 231, the second inner pin 241, the third inner pin 251, the fourth inner pin 261, and the fifth inner pin 270 are connected to the first horizontal rib 201. The first horizontal rib 201 is connected to the first outer pin 232 corresponding to the first inner pin 231, the second outer pin 242 corresponding to the second inner pin 241, the third outer pin 252 corresponding to the third inner pin 251, the fourth outer pin 262 corresponding to the fourth inner pin 261, and the fifth outer pin 271 corresponding to the fifth inner pin 270. After the chip is packaged, the first inner pin 231 is connected to the first outer pin 232, the second inner pin 241 is connected to the second outer pin 242, the third inner pin 251 is connected to the third outer pin 252, the fourth inner pin 261 is connected to the fourth outer pin 262, and the fifth inner pin 270 is connected to the fifth outer pin 271. The first outer pin 232, the second outer pin 242, the third outer pin 252, the fourth outer pin 262 and the fifth outer pin 271 are connected to the circuit. Through these pins, the heat generated by the chip can be conducted and dissipated while performing electrical transmission.

[0018] The first outer pin 232, the second pin, the third outer pin 252, the fourth outer pin 262, and the fifth outer pin 271 are connected to the second transverse rib 202. A first connector 203 is connected between the first transverse rib 201 and the second transverse rib 202. The first connector 203 is placed between two adjacent basic units 200. The heat sink 220 of two adjacent basic units 200 is connected by the second connector 204. The base island 210 and the fifth inner pin 270 are connected by the third connector 272. The angle between the base island 210 and the third connector 272 is 120°, and the angle between the fifth inner pin 270 and the third connector 272 is 120°. The first connector 203 and the second connector 204 can ensure the stability of the connection between adjacent basic units 200. At the same time, the first connector 203 and the second connector 204 are both between two adjacent basic units 200, which can ensure the cutting of the edge lead frame 100.

[0019] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, certain improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A lead frame, characterized in that: The invention comprises a plurality of basic units (200), wherein the basic unit (200) comprises a base island (210), a heat sink (220) is arranged above the base island (210), a welding platform is arranged below the base island (210), and the welding platform comprises a first welding plate (230), a second welding plate (240), a third welding plate (250) and a fourth welding plate (260), wherein the second welding plate (240) is arranged between the first welding plate (230) and the third welding plate (250), and the area of the first welding plate (230) is larger than that of the second welding plate ( 240), the third welding piece (250) and the fourth welding piece (260), the first welding piece (230) is connected to the first inner pin (231), the second welding piece (240) is connected to the second inner pin (241), the third welding piece (250) is connected to the third inner pin (251), the fourth welding piece (260) is connected to the fourth inner pin (261), the base island (210) is connected to the fifth inner pin (270), and the fifth inner pin (270) is placed between the third welding piece (250) and the fourth welding piece (260).

2. The lead frame according to claim 1, wherein: The first inner pin (231), the second inner pin (241), the third inner pin (251), the fourth inner pin (261) and the fifth inner pin (270) are commonly connected to a first transverse rib (201); the first transverse rib (201) is connected to a first outer pin (232) corresponding to the position of the first inner pin (231), a second outer pin (242) corresponding to the position of the second inner pin (241), a third outer pin (252) corresponding to the position of the third inner pin (251), a fourth outer pin (262) corresponding to the position of the fourth inner pin (261) and a fifth outer pin (271) corresponding to the position of the fifth inner pin (270).

3. The lead frame according to claim 2, wherein: The first external pin (232), the second pin, the third external pin (252), the fourth external pin (262) and the fifth external pin (271) are commonly connected to a second transverse rib (202); a first connecting member (203) is connected between the first transverse rib (201) and the second transverse rib (202); and the first connecting member (203) is placed between two adjacent basic units (200).

4. The lead frame according to claim 1, wherein: The base island (210) and the fifth inner pin (270) are connected via a third connecting member (272), the angle between the base island (210) and the third connecting member (272) is 120°, and the angle between the fifth inner pin (270) and the third connecting member (272) is also 120°.

5. The lead frame according to claim 1, wherein: The heat sinks (220) of two adjacent basic units (200) are connected via a second connecting member (204).

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