Radio frequency power supply power amplifier board with high heat dissipation efficiency

Abstract

The utility model discloses a radio frequency power supply power amplifier board with high heat dissipation efficiency. The radio frequency power supply power amplifier board comprises a first power amplifier board, a second power amplifier board and a magnetic ring base plate, copper pipe printed boards are arranged on the two sides, close to the first power amplifier board and the second power amplifier board, of the magnetic ring base plate, through holes are formed in the copper pipe printed boards and used for allowing wires to penetrate through, and the two ends of the wires are converged on the second power amplifier board after penetrating through the through holes of the copper pipe printed boards and then are welded and fixed; wherein a copper pipe sleeves the part, located on the magnetic ring base plate, of the wire, and a magnetic ring sleeves the outer side of the copper pipe; the magnetic ring fixing structure further comprises a magnetic ring upper cover, and the magnetic ring upper cover is used for covering the magnetic ring and forming covering fixation on the magnetic ring base plate. Heat is transferred to the copper pipe through the wire, the copper pipe transfers the heat to the magnetic ring, the magnetic ring transfers the heat to the water cooling plate through the magnetic ring base plate and the magnetic ring upper cover, the problem that the wire and the magnetic ring generate a large amount of heat is solved, and rapid heat dissipation of the whole power amplifier board is achieved. And meanwhile, the power and the power density of the radio frequency power supply power amplifier board are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic radio frequency, in particular to a radio frequency power amplifier board with high heat dissipation efficiency. Background Art

[0002] Current RF power amplifier board designs utilize magnetic rings and twisted-pair cables. While these are not a major issue for low-power RF power amplifier boards, the increasing demand for RF power across various industries has necessitated the need for high-power RF power supplies. High-power RF power supplies require high-power amplifier boards, and the twisted-pair cables and magnetic rings on these boards generate significantly more heat as power increases, creating a bottleneck that limits the ability to achieve high-power RF power.

[0003] To address the high heat generation from twisted-pair cables and magnetic rings, current RF power amplifier board designs typically incorporate fans that blow air across the magnetic rings and twisted-pair cables to accelerate heat dissipation. However, air cooling has its limits, and the twisted-pair cables, threaded through the magnetic rings, are shielded from airflow. Consequently, high-power RF power amplifier boards continue to face heat dissipation challenges. Furthermore, high-power RF power amplifier boards require thicker and longer twisted-pair cables, which necessitate larger magnetic rings to pass through. This significantly increases the size of the magnetic rings, and thus the size of the amplifier board. With the increasing demand for miniaturization and high power density, addressing heat dissipation requires addressing size issues as well. Utility Model Content

[0004] In view of this, the present invention provides a radio frequency power amplifier board with high heat dissipation efficiency to solve the above problems.

[0005] In order to solve the above technical problems, the utility model provides a radio frequency power amplifier board with high heat dissipation efficiency, comprising:

[0006] A first power amplifier board, a second power amplifier board, and a magnetic ring backing plate arranged between the first power amplifier board and the second power amplifier board;

[0007] The magnetic ring backing plate is provided with copper tube printed boards on both sides close to the first power amplifier board and the second power amplifier board. The copper tube printed boards are provided with through holes for accommodating the passage of wires. The two ends of the wires are joined and welded to the second power amplifier board after passing through the through holes of the copper tube printed boards.

[0008] The part of the wire located on the magnetic ring pad is sleeved with a copper tube, and the outer side of the copper tube is sleeved with a magnetic ring; and it also includes a magnetic ring upper cover that cooperates with the magnetic ring pad, the magnetic ring upper cover is used to cover the magnetic ring, and is covered and fixed on the magnetic ring pad.

[0009] As an optional manner, a power amplifier tube is provided on the first power amplifier board.

[0010] As an optional manner, a power supply board is provided on the second power amplifier board, and two power supply boards are symmetrically provided.

[0011] As an option, the space between the wire and the copper tube is filled with thermally conductive silicone with high thermal conductivity.

[0012] As an optional method, the magnetic ring backing plate and the magnetic ring upper cover are respectively provided with arc grooves matching the outer diameter of the magnetic ring; and silicone grease is filled between the arc grooves and the inner wall of the magnetic ring.

[0013] As an optional method, the magnetic ring is tightly sleeved on the outer wall of the copper tube.

[0014] As an optional method, the first power amplifier board, the magnetic ring backing plate, and the second power amplifier board are fixed with screws.

[0015] The beneficial effects of the utility model are:

[0016] The present invention uses a conductive wire that transfers heat to a copper tube, which in turn transfers heat to a magnetic ring. The magnetic ring then conducts heat to a water-cooled plate via a magnetic ring backing plate and a magnetic ring cover. This solves the problem of excessive heat generation by the conductive wire and the magnetic ring, separates the power supply circuit from the amplifier circuit board, and reduces the size of the amplifier board. The copper tube acts as half of the conductive wire, reducing the size of the inner hole of the magnetic ring occupied by the conductive wire, reducing the size of the magnetic ring, and further reducing the size of the amplifier board, achieving rapid heat dissipation for the entire board. This also improves the power and power density of the RF power amplifier board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the layout of a power amplifier board in the prior art provided by an embodiment of the present utility model;

[0018] Figure 2 A schematic diagram of the layout of the power amplifier board provided in an embodiment of the present utility model;

[0019] Figure 3 A schematic diagram of the layout of the power amplifier board provided by an embodiment of the utility model after the magnetic ring cover is removed;

[0020] Figure 4 A schematic diagram of the layout of the power amplifier board after the magnetic ring is removed provided by an embodiment of the utility model;

[0021] Figure 5 A schematic diagram of the layout of the power amplifier board after the copper tube is removed provided in an embodiment of the present utility model;

[0022] Figure 6 This is a schematic structural diagram of the first power amplifier board and the second power amplifier board provided in an embodiment of the present utility model.

[0023] Reference numerals and their corresponding relationships:

[0024] 11-first power amplifier board, 111-power amplifier tube, 12-second power amplifier board, 121-power supply board, 2-magnetic ring pad, 21-magnetic ring cover, 22-magnetic ring, 23-copper tube, 24-copper tube printed circuit board, 3-wire. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods.

[0026] Example

[0027] First, the glossary of this embodiment is explained:

[0028] Magnetic ring: a ring-shaped object with magnetism;

[0029] Twisted pair: two wires twisted together;

[0030] Power amplifier board: a unit containing the power amplifier circuit board, power supply circuit and other components;

[0031] Power supply circuit: the circuit part that provides DC power supply to the power amplifier circuit;

[0032] Power amplifier pad: transfers the heat generated by the power amplifier tube and other heating components to the water cooling plate;

[0033] Magnetic ring pad: a curved pad that is in close contact with the magnetic ring and can conduct the heat of the magnetic ring to the water cooling plate;

[0034] Magnetic ring upper cover: The arc-shaped cover presses the magnetic ring tightly and transfers the heat from the upper part of the magnetic ring to the magnetic ring pad through the side wall and then to the water cooling plate;

[0035] Copper tube printed circuit board: connect the copper tube and the circuit board

[0036] Wire: conductive function.

[0037] See also Figure 1 , Figure 1 This is a schematic diagram of the structural layout of a radio frequency power amplifier board in a common prior art. Currently, there are problems such as the twisted pair cable taking up a large space in the magnetic ring 22, poor heat dissipation of the magnetic ring 22 and the twisted pair cable, and the integration of the power supply circuit and the amplifier board circuit. The amplifier board is large in size, and the spacing between the power divider and the synthesizer ports will increase, making the entire amplifier unit very large.

[0038] To do this, see Figure 2-Figure 6This embodiment provides a radio frequency power amplifier board with high heat dissipation efficiency, comprising: a first power amplifier board 11, a second power amplifier board 12, and a magnetic ring backing plate 2 disposed between the first power amplifier board 11 and the second power amplifier board 12; the magnetic ring backing plate 2 is provided with a copper tube printed circuit board 24 on both sides near the first power amplifier board 11 and the second power amplifier board 12, and the copper tube printed circuit board 24 has a through hole for accommodating a wire 3 to pass through. After passing through the through hole of the copper tube printed circuit board 24, the two ends of the wire 3 are joined and welded to the second power amplifier board 12; wherein, the portion of the wire 3 located on the magnetic ring backing plate 2 is sheathed with a copper tube 23, and the outer side of the copper tube 23 is sheathed with a magnetic ring 22; and further comprising a magnetic ring cover 21 that cooperates with the magnetic ring backing plate 2, the magnetic ring cover 21 being used to cover the magnetic ring 22 and forming a covering and fixing to the magnetic ring backing plate 2. As an optional embodiment, a power amplifier tube 111 is provided on the first power amplifier board 11.

[0039] In the above-described scheme, the high-heat dissipation-efficiency RF power amplifier board provided in this embodiment is divided into several sections, namely, a first power amplifier board 11 and a second power amplifier board 12, for easy removal and replacement. Conventional RF power amplifier boards require multiple turns of twisted-pair wiring. The conductive copper tube 23 serves as half of the conductor 3 of the twisted-pair wiring. This allows only one wire to pass through the magnetic ring 22, thus halving the inner hole size of the magnetic ring 22 in this embodiment.

[0040] In this embodiment, a power supply board 121 is provided on the second power amplifier board 12, and two power supply boards 121 are symmetrically provided. The two power supply circuit boards installed vertically on both sides make full use of the upper space of the power amplifier circuit board and reduce the size of the power amplifier board. It should also be noted that when implementing this embodiment, the copper tube 23 is tightly fitted with the inner hole of the magnetic ring 22, and a high thermal conductivity thermal conductive silicone is filled between the wire 3 and the copper tube 23; and the magnetic ring pad 2 and the magnetic ring cover 21 are respectively provided with an arc groove that matches the outer diameter of the magnetic ring 22, and the space between the arc groove and the inner wall of the magnetic ring 22 is filled with silicone grease to increase the thermal conductivity efficiency.

[0041] Please refer again Figure 5 Conventional RF power amplifier boards require multiple twisted-pair connections. The copper tube 23 is conductive and serves as half the conductor 3 of the twisted-pair cable. This embodiment requires only a single wire to pass through the magnetic ring 22, allowing the inner hole size of the magnetic ring 22 to be halved. Furthermore, the two power supply circuit boards mounted vertically on either side fully utilize the space above the power amplifier circuit board, reducing the size of the power amplifier board.

[0042] Through the above scheme, the wire 3 of this embodiment transfers heat to the copper tube 23, the copper tube 23 transfers heat to the magnetic ring 22, and the magnetic ring 22 transfers heat to the water cooling plate through the magnetic ring pad 2 and the magnetic ring cover 21, thereby solving the problem of large amounts of heat generated by the wire 3 and the magnetic ring 22, and achieving rapid heat dissipation of the entire power amplifier board. At the same time, the power and power density of the RF power amplifier board are improved. By reducing the space occupied by the magnetic ring 22 by the wire 3, the size of the magnetic ring 22 can be reduced, thereby solving the heat dissipation problem of the twisted pair and the magnetic ring 22, and solving the problem of the large size of the power amplifier board. In addition, the space above the power amplifier circuit board components is fully utilized to independently power the circuit, reducing the size of the power amplifier, and ultimately increasing the power of the RF power amplifier board and improving the power density of the RF power amplifier board.

[0043] The above are merely preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be construed as limiting the present invention. The scope of protection of the present invention shall be determined by the scope defined in the claims. Persons skilled in the art will appreciate that improvements and modifications may be made without departing from the spirit and scope of the present invention, and such improvements and modifications shall also be considered within the scope of protection of the present invention.

Claims

1. A radio frequency power amplifier board with high heat dissipation efficiency, characterized in that: include: A first power amplifier board (11), a second power amplifier board (12), and a magnetic ring pad (2) arranged between the first power amplifier board (11) and the second power amplifier board (12); The magnetic ring pad (2) is provided with a copper tube printed board (24) on both sides close to the first power amplifier board (11) and the second power amplifier board (12); a through hole is provided on the copper tube printed board (24); the through hole is used to accommodate the wire (3) passing through, and the two ends of the wire (3) are joined and welded on the second power amplifier board (12) after passing through the through hole of the copper tube printed board (24); wherein, The portion of the wire (3) located on the magnetic ring pad (2) is sleeved with a copper tube (23), and the outer side of the copper tube (23) is sleeved with a magnetic ring (22); and further comprising a magnetic ring upper cover (21) formed to cooperate with the magnetic ring pad (2), the magnetic ring upper cover (21) being used to cover the magnetic ring (22) and being covered and fixed on the magnetic ring pad (2).

2. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: A power amplifier tube (111) is provided on the first power amplifier board (11).

3. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: A power supply board (121) is provided on the second power amplifier board (12), and two power supply boards (121) are symmetrically provided.

4. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: The space between the wire (3) and the copper tube (23) is filled with thermally conductive silica gel with high thermal conductivity.

5. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: The magnetic ring pad (2) and the magnetic ring upper cover (21) are respectively provided with arc-shaped grooves matching the outer diameter of the magnetic ring (22); silicone grease is filled between the arc-shaped grooves and the inner wall of the magnetic ring (22).

6. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: The magnetic ring (22) is tightly sleeved on the outer wall of the copper tube (23).

7. The radio frequency power amplifier board with high heat dissipation efficiency according to claim 1, characterized in that: The first power amplifier board (11), the magnetic ring backing plate (2), and the second power amplifier board (12) are fixed with screws.

Images