Circuit board assembly and lamp

Abstract

The embodiment of the utility model provides a circuit board assembly and a lamp, the circuit board assembly comprises an inner shell, a circuit board, an electronic element and a waterproof outer shell, the inner shell comprises a first shell body and a second shell body, and the first shell body and the second shell body are mutually covered and jointly define a sealing cavity; the circuit board is positioned in the sealing cavity; the electronic element is located in the sealing cavity and is electrically connected to the circuit board; the waterproof outer shell is fixed to the outer surface of the inner shell in an injection molding mode and wraps the inner shell, and in the injection molding process of the waterproof outer shell, due to the fact that the inner shell can provide protection for the circuit board and the electronic elements, the inner shell is beneficial to reducing the situation that the circuit board and the electronic elements are damaged by factors such as overlarge injection molding pressure and unstable injection molding pressure; the inner shell and the waterproof outer shell are matched with each other, so that the influence of external environmental factors such as dust, moisture and liquid on the circuit board and the electronic components can be effectively isolated.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting devices, and in particular to a circuit board assembly and a lamp. Background Art

[0002] In related art lamps, electronic components are distributed on the circuit board. To achieve waterproofing, the circuit board and the electronic components are usually wrapped by injection molding. However, during the injection molding process, the electronic components may be damaged due to excessive injection pressure. Utility Model Content

[0003] The embodiments of the present invention provide a circuit board assembly and a lamp to improve at least one of the above-mentioned technical problems.

[0004] The embodiments of the present invention achieve the above-mentioned objectives through the following technical solutions.

[0005] An embodiment of the present utility model provides a circuit board assembly, which includes an inner shell, a circuit board, electronic components and a waterproof outer shell. The inner shell includes a first shell and a second shell, which cover each other and together form a sealed cavity; the circuit board is located in the sealed cavity; the electronic components are located in the sealed cavity, and the electronic components are electrically connected to the circuit board; the waterproof outer shell is injection molded and fixed to the outer surface of the inner shell and wraps the inner shell.

[0006] In some embodiments, the circuit board assembly further includes a wire, which passes through the inner shell and the waterproof outer shell. The wire is partially located in the sealed cavity and electrically connected to the circuit board, and is partially located outside the waterproof outer shell.

[0007] In some embodiments, at least one reinforcing rib is protruded from the outer surface of the inner shell, and the waterproof outer shell wraps the reinforcing rib; and / or, at least one positioning hole is provided on the outer surface of the inner shell, the positioning hole is a blind hole, and the waterproof outer shell is partially located in the positioning hole.

[0008] In some embodiments, one side of the first shell is connected to one side of the second shell to form a bent edge, and the first shell and the second shell are folded through the bent edge to cover each other and jointly form a sealed cavity.

[0009] In some embodiments, the inner shell also includes at least one snap-on structure, the snap-on structure includes a first snap-on portion and a second snap-on portion, the first snap-on portion is connected to the first shell, the second snap-on portion is connected to the second shell, and the second snap-on portion is snap-fitted with the first snap-on portion; the inner shell is provided with a snap-on structure near the bending edge, and / or the inner shell is provided with a snap-on structure away from the bending edge.

[0010] In some embodiments, the inner shell also includes a support platform, which is connected to the first shell. The support platform and the snap-fit structure are both located in the sealed cavity. The circuit board abuts the support platform. The snap-fit structure is located on the side of the circuit board away from the support platform. The snap-fit structure abuts against the circuit board or has a gap, and at least a part of the electronic components avoids at least one of the support platform and the snap-fit structure.

[0011] In some embodiments, the support platform and the snap-fit structure are respectively located on adjacent sides of the circuit board.

[0012] In some embodiments, the support platform has a support surface, which extends from the side wall of the first shell along the direction inside the first shell, faces the sealed cavity, and the circuit board abuts against the support surface, which is an inclined surface or a curved surface.

[0013] An embodiment of the present invention provides a lamp, which includes a circuit board assembly according to any of the above embodiments and a light source. The light source is located outside the waterproof housing and is electrically connected to the circuit board.

[0014] In some embodiments, the lamp also includes a hook, the hook includes a clamping body, a first hook arm and a second hook arm, the clamping body includes a first elastic arm and a second elastic arm, one end of the first elastic arm is connected to one end of the second elastic arm, and the other end of the first elastic arm extends toward the other end of the second elastic arm, so that the first elastic arm and the second elastic arm jointly form a clamping space; the first hook arm is connected to the other end of the first elastic arm and is located outside the clamping space; the second hook arm is connected to the connection between the first elastic arm and the second elastic arm, and is located outside the clamping space.

[0015] In any of the above-mentioned embodiments of the present invention, the first shell and the second shell of the inner shell cover each other and together form a sealed cavity, the circuit board and the electronic components are located in the sealed cavity, the electronic components are electrically connected to the circuit board, and the waterproof outer shell is injection-molded and fixed to the outer surface of the inner shell and wraps the inner shell. In this way, during the injection molding process of the waterproof outer shell, since the inner shell can provide protection for the circuit board and the electronic components, the inner shell helps to reduce the damage to the circuit board and the electronic components caused by factors such as excessive injection pressure and unstable injection pressure. In addition, the waterproof outer shell can fill the gap between the first shell and the second shell during the injection molding process, which helps to improve the sealing of the sealed cavity, so that the inner shell and the waterproof outer shell can cooperate with each other to effectively isolate the circuit board and the electronic components from external environmental factors such as dust, moisture, and liquids, and also help to improve the ability of the circuit board assembly to resist external impact and shock, enhance the mechanical strength of the circuit board assembly, and thus help to improve the stability and service life of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A perspective structural diagram of a circuit board assembly provided by an embodiment of the present utility model is shown.

[0018] Figure 2 Shown Figure 1 A schematic diagram of a portion of the structure of a circuit board assembly is provided in an embodiment.

[0019] Figure 3 Shown Figure 2 An embodiment provides a schematic diagram of a circuit board assembly from another perspective.

[0020] Figure 4 Shown Figure 3 The embodiment provides a schematic cross-sectional view of a circuit board assembly along line IV-IV.

[0021] Figure 5 Shown Figure 3 The embodiment provides a schematic cross-sectional view of a circuit board assembly along line V-V.

[0022] Figure 6 Shown Figure 1 A schematic structural diagram of an inner shell of a circuit board assembly provided in an embodiment.

[0023] Figure 7 The figure shows a schematic structural diagram of a lamp provided by an embodiment of the present utility model.

[0024] Figure 8 A schematic structural diagram of a hook for a lamp provided in an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0025] In order to help those skilled in the art better understand the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] See also Figures 1 to 4 An embodiment of the present invention provides a circuit board assembly 100, which includes an inner shell 10, a circuit board 20, electronic components 30 and a waterproof outer shell 40. The circuit board 20 and the electronic components 30 are both located in the inner shell 10, and the inner shell 10 is located in the waterproof outer shell 40.

[0028] The inner shell 10 includes a first shell 110 and a second shell 120, and the first shell 110 and the second shell 120 cover each other and together form a sealed cavity 130. The circuit board 20 is located in the sealed cavity 130. The electronic component 30 is located in the sealed cavity 130, and the electronic component 30 is electrically connected to the circuit board 20. The waterproof outer shell 40 is injection molded and fixed to the outer surface 101 of the inner shell 10 and wraps the inner shell 10. In this way, during the process of manufacturing the circuit board assembly 100, the electronic component 30 and the circuit board 20 can be placed in the inner shell 10 in advance and the first shell 110 and the second shell 120 cover each other, and then the waterproof outer shell 40 is injection molded and fixed to the outer surface 101 of the inner shell 10. Since the inner shell 10 can provide protection for the circuit board 20 and the electronic component 30, the inner shell 10 helps to reduce the damage to the circuit board 20 and the electronic component 30 caused by factors such as excessive injection pressure and unstable injection pressure.

[0029] In addition, the waterproof shell 40 can fill the gap between the first shell 110 and the second shell 120 during the injection molding process, which helps to improve the sealing of the sealed cavity 130, so that the inner shell 10 and the waterproof shell 40 can cooperate with each other to effectively isolate the influence of external environmental factors such as dust, moisture, and liquid on the circuit board 20 and electronic components 30, and also help to improve the ability of the circuit board assembly 100 to resist external impacts and shocks, enhance the mechanical strength of the circuit board assembly 100, thereby helping to improve the working stability and service life of the circuit board assembly 100.

[0030] In some embodiments, the circuit board 20 may be a rigid circuit board or other types.

[0031] In some embodiments, the electronic component 30 may be a resistor, a capacitor, or other devices. The electronic component 30 may be soldered to the circuit board 20. The number of the electronic component 30 may be one or more.

[0032] In some embodiments, one side of the first shell 110 is connected to one side of the second shell 120 to form a bent edge 160. The first shell 110 and the second shell 120 can be folded over via the bent edge 160 to cover each other and together form the aforementioned sealed cavity 130. In this way, the bent edge 160 helps to enhance the connection strength between the first shell 110 and the second shell 120, helping to improve the stability of the entire inner shell 10. The bent edge 160 also helps to enable the first shell 110 and the second shell 120 to quickly dock and cover each other to form the sealed cavity 130, helping to improve the covering efficiency of the first shell 110 and the second shell 120. In addition, the first shell 110 and the second shell 120 can be used as an integrated folding structure, which facilitates the manufacturing and molding of the first shell 110 and the second shell 120 and also helps to reduce the number of molds used.

[0033] In some embodiments, at least one of the first shell 110 and the second shell 120 may be provided with an outer bevel 1011 to reduce the thickness of the shell (the first shell 110, the second shell 120), thereby helping to reduce shrinkage of the shell after injection molding.

[0034] In some embodiments, the outer surface 101 of the inner shell 10 may be provided with at least one reinforcing rib 140, and the waterproof outer shell 40 may wrap around the reinforcing rib 140. This helps enhance the overall strength and rigidity of the inner shell 10, improving its ability to withstand external pressure, such as injection molding pressure. Furthermore, the reinforcing rib 140 increases the contact area between the inner shell 10 and the waterproof outer shell 40, ensuring a more secure connection between the two, improving the seal between the waterproof outer shell 40 and the inner shell 10, and preventing moisture from penetrating the interior of the inner shell 10.

[0035] In some embodiments, the reinforcing rib 140 may be provided protrudingly on at least one of the outer surface of the first housing 110 and the outer surface of the second housing 120. For example, the reinforcing rib 140 may be provided protrudingly on the outer surface of the first housing 110; another example, the reinforcing rib 140 may be provided protrudingly on the outer surface of the second housing 120; another example, the reinforcing rib 140 may be provided protrudingly on the outer surface of the first housing 110 and the outer surface of the second housing 120.

[0036] In some embodiments, the reinforcing rib 140 may be substantially in the shape of a semicircular bar or other shapes.

[0037] In some embodiments, the number of the reinforcing ribs 140 may be one or more, and the plurality of reinforcing ribs 140 may be spaced apart, or the plurality of reinforcing ribs 140 may intersect or be cross-distributed.

[0038] In some embodiments, the outer surface 101 of the inner shell 10 is provided with at least one positioning hole 150, and the waterproof outer shell 40 is partially located within the positioning hole 150. Thus, the positioning hole 150 can serve as a positioning reference, helping to accurately position the inner shell 10 within the mold of the waterproof outer shell 40, so that the waterproof outer shell 40 can subsequently better wrap the inner shell 10.

[0039] In some embodiments, the positioning hole 150 can be a blind hole, which helps prevent the glue of the waterproof outer shell 40 from penetrating into the inner shell 10 through the positioning hole 150 during the injection molding process, helping to avoid the glue from affecting the circuit board 20 and electronic components 30 inside the inner shell 10.

[0040] In some embodiments, the positioning hole 150 may be provided on at least one of the outer surface of the first housing 110 and the outer surface of the second housing 120. For example, the positioning hole 150 may be provided on the outer surface of the first housing 110; for another example, the positioning hole 150 may be provided on the outer surface of the second housing 120; for another example, the positioning hole 150 may be provided on the outer surface of the first housing 110 and the outer surface of the second housing 120.

[0041] In some embodiments, the positioning hole 150 may be substantially a circular hole, an elliptical hole, a square hole, or other shapes.

[0042] In some embodiments, the number of the positioning holes 150 may be one or more, and the positioning holes 150 may be distributed at intervals.

[0043] See Figures 5 and 6 In some embodiments, the inner housing 10 may further include at least one snap-fit structure 170. The snap-fit structure 170 may include a first snap-fit portion 171 and a second snap-fit portion 172. The first snap-fit portion 171 is connected to the first housing 110, and the second snap-fit portion 172 is connected to the second housing 120. The second snap-fit portion 172 snaps into engagement with the first snap-fit portion 171. This facilitates quick engagement of the first housing 110 and the second housing 120 via the snap-fit structure 170, thereby simplifying the assembly process of the circuit board assembly 100 and improving assembly efficiency.

[0044] In addition, the tight engagement of the first snap portion 171 and the second snap portion 172 helps to physically block the liquid penetration path, and the snap structure 170 helps to enhance the connection strength between the first shell 110 and the second shell 120, and helps to improve the structural stability of the entire inner shell 10, so that the first shell 110 and the second shell 120 are not easy to open the sealed cavity 130 when subjected to injection molding pressure.

[0045] In some embodiments, the inner shell 10 may be provided with a snap-fit structure 170 near the bending edge 160 , so that the structure of the inner shell 10 at the bending edge 160 is not likely to warp up.

[0046] In some embodiments, a snap-fit structure 170 may be provided at a location of the inner shell 10 away from the bending edge 160 , so that the structure of the inner shell 10 away from the bending edge 160 is less likely to warp.

[0047] In some embodiments, when there are multiple snap structures 170 , snap structures 170 may be provided at both the inner shell 10 near the bending edge 160 and the inner shell 10 away from the bending edge 160 .

[0048] In some embodiments, the first locking portion 171 and the second locking portion 172 can be engaged with each other in a block-to-block manner.

[0049] For example, the first locking portion 171 may include a rib that may be protruding from the surface of the first housing 110. The second locking portion 172 may include a hook that may be protruding from the surface of the second housing 120. The hook is opposite to the rib and can hook onto the rib, so that the first housing 110 and the second housing 120 can be engaged with each other.

[0050] For another example, the first latch portion 171 may include a hook that may be protruding from the surface of the first housing 110. The second latch portion 172 may include a rib that may be protruding from the surface of the second housing 120. The hook is opposite to the rib and may be hooked onto the rib, similarly enabling the first housing 110 and the second housing 120 to engage with each other.

[0051] For another example, the first locking portion 171 and the second locking portion 172 may both include hooks, and the hooks of the two can be hooked with each other to achieve mutual engagement between the first shell 110 and the second shell 120 .

[0052] In some embodiments, the first locking portion 171 and the second locking portion 172 may also be engaged with each other in a block and groove manner.

[0053] For example, the first latch portion 171 may include a hook that is protruding from the surface of the first housing 110. The second latch portion 172 may include a slot that is opposite to and can be embedded in, so that the first housing 110 and the second housing 120 can be engaged.

[0054] For another example, the first locking portion 171 may be provided with a locking groove, and the second locking portion 172 may be provided with a hook, the hook being opposite to the locking groove and being embedded in the locking groove, so that the first shell 110 and the second shell 120 can be locked together.

[0055] In other embodiments, the first locking portion 171 and the second locking portion 172 may also be engaged with each other in other ways.

[0056] In some embodiments, the inner shell 10 may further include a support platform 180, which is connected to the first shell 110. The support platform 180 and the snap-fit structure 170 are both located in the sealed cavity 130. The circuit board 20 abuts against the support platform 180. The snap-fit structure 170 is located on the side of the circuit board 20 away from the support platform 180. The snap-fit structure 170 abuts against the circuit board 20 or has a gap.

[0057] In this way, the support platform 180 helps to provide support for the circuit board 20, and the support platform 180 and the snap-fit structure 170 cooperate with each other to help limit the circuit board 20, so that the circuit board 20 is not easily displaced to a large extent due to external force collision in the sealed cavity 130, which helps to improve the stability of the circuit board 20 in the sealed cavity 130.

[0058] In some embodiments, at least a portion of the electronic components 30 avoids at least one of the support platform 180 and the snap structure 170. For example, at least a portion of the electronic components 30 avoids the support platform 180; another example, at least a portion of the electronic components 30 avoids the snap structure 170; another example, at least a portion of the electronic components 30 avoids both the support platform 180 and the snap structure 170. This helps reduce the impact of the support platform 180, the snap structure 170, and the like on the electronic components 30.

[0059] In some embodiments, the support platform 180 and the snap structure 170 can be located on adjacent sides of the circuit board 20. This helps the support platform 180 and the snap structure 170 to be limited from different sides of the circuit board 20, thereby improving the stability of the circuit board 20 in the sealed cavity 130.

[0060] In some embodiments, the support platform 180 may have a support surface 181. The support surface 181 may extend from the sidewall 1101 of the first housing 110 in a direction within the first housing 110. The support surface 181 faces the sealed cavity 130, and the circuit board 20 abuts against the support surface 181. The support surface 181 may be an inclined or curved surface. Thus, the support surface 181 helps improve the tightness between the circuit board 20 and the support platform 180. For example, when placing the circuit board 20 on the support platform 180 within the first housing 110, the inclined or curved support surface 181 allows the support surface 181 to better adapt to the size or shape of the circuit board 20 to maintain abutment with the circuit board 20, thereby improving the stability of the abutment between the circuit board 20 and the support surface 181.

[0061] See Figure 1 and Figure 4In some embodiments, the circuit board assembly 100 may further include a wire 50. The wire 50 is disposed through the inner housing 10 and the waterproof outer housing 40. The wire 50 is partially located within the sealed cavity 130 and electrically connected to the circuit board 20, and partially located outside the waterproof outer housing 40. In this way, the wire 50 facilitates electrical connection between the circuit board 20 and devices and equipment outside the waterproof outer housing 40.

[0062] The inner housing 10 may be provided with a through-hole 190 that matches the wire 50. For example, the through-hole 190 may be provided in the first housing 110, or in the second housing 120. In another example, a portion of the through-hole 190 may be provided in the first housing 110, and another portion may be provided in the second housing 120. In this way, when the first housing 110 and the second housing 120 are covered with each other, the wire 50 may be passed through the through-hole 190, thereby helping to reduce the squeezing effect of the first housing 110 and the second housing 120 on the wire 50.

[0063] During the manufacturing process of the circuit board assembly 100, the wire 50 can be electrically connected to the circuit board 20 in advance and then placed in the inner shell 10 together. Then, the inner shell 10 is placed in the mold of the waterproof outer shell 40 and a portion of the wire 50 is located outside the mold of the waterproof outer shell 40. Then, the mold material is injected into the mold to form the waterproof outer shell 40 and fix it to the outer surface 10 of the inner shell 10.

[0064] See Figure 7 An embodiment of the present invention provides a lamp 1000 , which includes a circuit board assembly 100 of any of the above embodiments and a light source 200 . The light source 200 is located outside the waterproof housing 40 and is electrically connected to the circuit board 20 .

[0065] In some embodiments, the light source 200 can be electrically connected to the circuit board 20 via the aforementioned wires 50 .

[0066] In some embodiments, the light source 200 may be an LED lamp bead, an LED chip, or other types.

[0067] In some embodiments, the number of the light emitting sources 200 can be one or more.

[0068] See Figure 8 In some embodiments, the lamp 1000 may further include a hook 300. The hook 300 may include a clamping body 301, a first hook arm 302, and a second hook arm 303. The first hook arm 302 and the second hook arm 303 are both connected to the clamping body 301. The hook 300 may be clamped in an installation position by the clamping body 301. The hook 300 may hook the wire 50 or other objects through the first hook arm 302 and the second hook arm 303.

[0069] In some embodiments, the clamping body 301 may include a first elastic arm 3011 and a second elastic arm 3012. One end of the first elastic arm 3011 is connected to one end of the second elastic arm 3012, and the other end of the first elastic arm 3011 extends toward the other end of the second elastic arm 3012, so that the first elastic arm 3011 and the second elastic arm 3012 jointly form a clamping space 3013. In this way, the first elastic arm 3011 and the second elastic arm 3012 can undergo elastic deformation, facilitating the hook 300 to be clamped to an installation location such as an eave or window through the clamping space 3013. For example, the hook 300 can be clamped to the eave vertically or horizontally, which helps to simplify the complexity of hanging the hook 300 at the installation location.

[0070] In some embodiments, the first hook arm 302 can be connected to the other end of the first elastic arm 3011 and located outside the clamping space 3013. The second hook arm 303 can be connected to the connection between the first elastic arm 3011 and the second elastic arm 3012 and located outside the clamping space 3013. In this way, the first hook arm 302 and the second hook arm 303 help enable the hook 300 to hook the wire 50 or other objects in different directions.

[0071] In this utility model, unless otherwise specified or limited, terms such as "assembly" should be interpreted broadly. For example, it can mean fixed connection, detachable connection, or integral connection; it can mean mechanical connection; it can mean direct connection, indirect connection through an intermediate medium, internal communication between two components, surface contact only, or surface contact connection through an intermediate medium. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0072] In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as a specific reference or special structure. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In the present invention, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in an appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present invention and the features of different embodiments or examples, unless they are contradictory.

[0073] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A circuit board assembly, characterized in that: include: An inner shell, the inner shell comprising a first shell and a second shell, the first shell and the second shell covering each other and forming a sealed cavity; a circuit board, wherein the circuit board is located in the sealed cavity; an electronic component, the electronic component being located in the sealed cavity and electrically connected to the circuit board; as well as A waterproof outer shell is injection-molded and fixed to the outer surface of the inner shell to wrap the inner shell.

2. The circuit board assembly according to claim 1, wherein: The circuit board assembly further includes a wire, which passes through the inner shell and the waterproof outer shell. The wire is partially located in the sealed cavity and electrically connected to the circuit board, and is partially located outside the waterproof outer shell.

3. The circuit board assembly according to claim 1, wherein: At least one reinforcing rib is convexly provided on the outer surface of the inner shell, and the waterproof outer shell wraps the reinforcing rib; And / or, the outer surface of the inner shell is provided with at least one positioning hole, the positioning hole is a blind hole, and the waterproof outer shell is partially located in the positioning hole.

4. The circuit board assembly according to claim 1, wherein: One side edge of the first shell is connected to one side edge of the second shell to form a bent edge. The first shell and the second shell are folded through the bent edge to cover each other and jointly form the sealed cavity.

5. The circuit board assembly according to claim 4, wherein: The inner shell further comprises at least one snap-fit structure, the snap-fit structure comprising a first snap-fit portion and a second snap-fit portion, the first snap-fit portion being connected to the first shell, the second snap-fit portion being connected to the second shell, and the second snap-fit portion being snap-fitted with the first snap-fit portion; The inner shell is provided with the snap-fit structure near the bending edge, and / or the inner shell is provided with the snap-fit structure away from the bending edge.

6. The circuit board assembly according to claim 5, wherein: The inner shell also includes a support platform, which is connected to the first shell. The support platform and the snap-fit structure are both located in the sealed cavity. The circuit board abuts the support platform. The snap-fit structure is located on the side of the circuit board away from the support platform. The snap-fit structure abuts against the circuit board or has a gap, and at least a portion of the electronic components avoid at least one of the support platform and the snap-fit structure.

7. The circuit board assembly according to claim 6, wherein: The support platform and the snap structure are respectively located on adjacent sides of the circuit board.

8. The circuit board assembly according to claim 6, wherein: The support platform has a support surface, which extends from the side wall of the first shell along the direction inside the first shell and faces the sealed cavity. The circuit board abuts against the support surface, and the support surface is an inclined surface or a curved surface.

9. A lamp, characterized in that: include: The circuit board assembly according to any one of claims 1 to 8; as well as A luminous light source is located outside the waterproof housing and is electrically connected to the circuit board.

10. The lamp according to claim 9, characterized in that The lamp further comprises a hook, and the hook comprises: a clamping body, the clamping body comprising a first elastic arm and a second elastic arm, one end of the first elastic arm being connected to one end of the second elastic arm, the other end of the first elastic arm extending toward the other end of the second elastic arm, so that the first elastic arm and the second elastic arm together form a clamping space; a first hook arm connected to the other end of the first elastic arm and located outside the clamping space; and The second hook arm is connected to the connecting portion of the first elastic arm and the second elastic arm and is located outside the clamping space.

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