Circuit board with dustproof structure

Abstract

The utility model discloses a circuit board with a dustproof structure, and relates to the field of circuit boards. According to the utility model, the circuit board and the glue sealing shell are included, the circuit board is placed in the glue sealing shell, and the glue tearing mechanism is arranged, so that a plurality of membrane strips of the glue tearing mechanism are attached to the outer surface of the circuit board in advance before glue filling is carried out on the circuit board; the film strips comprise first films, second films, third films and welt pieces with tearable edges, when electronic elements on the circuit board need to be replaced, the welt pieces are torn firstly, the first films are driven by the welt pieces, and then the second films and the third films are driven, so that a plurality of easy-to-shovel grooves are formed in the glue sealing layer, and the electronic elements on the circuit board can be replaced. According to the method, the glue removing efficiency is improved, and the risk of damage to the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with a dustproof structure. Background Art

[0002] A circuit board with a dustproof structure is a specially designed circuit board. Its production process includes placing the circuit board in a specially designed potting shell, and then accurately pouring a layer of sealant on the surface of the circuit board. After the sealant cures, it can form a strong and dust-proof protective layer, effectively preventing dust, moisture and other contaminants from contacting the circuit board, thereby ensuring that the circuit board can work stably and reliably even in harsh environments.

[0003] If electronic components on current circuit boards with dust-proof structures are damaged, they need to be replaced. However, the original intention of setting up this sealant is to protect the circuit board, but it can become a major obstacle when replacing components. The traditional removal method is mainly to remove the colloid by scraping it from the edge of the circuit board. However, this method has obvious defects. It is not only cumbersome and inefficient, but also easy to cause additional damage to the circuit board during the scraping process, such as scratching the surface of the circuit board or damaging surrounding electronic components. In addition, the scraped-off colloid fragments may also contaminate the circuit board, making subsequent maintenance work more difficult. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a circuit board with a dustproof structure to solve the technical problems that when replacing damaged electronic components on traditional dustproof circuit boards, the sealant is difficult to remove, the operation is cumbersome, the efficiency is low, and it is easy to cause additional damage and pollution to the circuit board, which brings difficulties to subsequent maintenance work.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a circuit board with a dustproof structure, comprising a circuit board and a plastic sealing shell, wherein the circuit board is placed inside the plastic sealing shell, the circuit board comprising a board body, a first port and a second port and a plurality of electronic components being mounted at both ends of the top of the board body, and a glue removal mechanism being adhered to the top surface of the board body;

[0006] The adhesive peeling mechanism includes a first film, a second film, a third film and an edge film, wherein the first film is adhered to the top outer edge of the board, and the second film and the third film are each provided with multiple strips, and the multiple second film and third film strips are adhered between the board and the multiple electronic components;

[0007] A plurality of welt pieces are provided on the outer side of the first membrane, and the plurality of welt pieces are in contact with the outer side of the plate body, and the ends of the welt pieces are folded onto the bottom of the plate body.

[0008] By adopting the above technical solution, comprehensive protection of the circuit board is achieved through the combination of the sealing shell and the glue tearing mechanism. The setting of the glue tearing mechanism makes it easy to remove the sealing layer when maintenance or replacement of electronic components is required, thereby improving maintenance efficiency.

[0009] Furthermore, a sealing glue layer is cast on the top of the glue-tearing mechanism, and the sealing glue layer is transparent. The material of the sealing glue layer is silicone gel.

[0010] By adopting the above technical solution, the sealing layer is made of silicone gel material, which has transparent properties. It can not only effectively prevent dust and moisture, but also help the circuit board dissipate heat. At the same time, the transparent nature makes it possible to intuitively observe the status of the circuit board.

[0011] Furthermore, the sealing layer is used for dustproof, moistureproof and heat dissipation, and the peeling mechanism is used for efficiently removing the sealing layer.

[0012] By adopting the above technical solution, the sealing layer is used to prevent dust, moisture and heat, while the glue tearing mechanism is used to efficiently remove the sealing layer. The combination of the two provides comprehensive protection and convenient maintenance for the circuit board.

[0013] Furthermore, the sealing shell includes a shell, and a shell groove is formed on the top of the shell, and the shell groove is adapted to the circuit board.

[0014] By adopting the above technical solution, the setting of the sealing shell enables the circuit board to be firmly placed therein, and the shell groove is adapted to the circuit board, providing good protection and support.

[0015] Furthermore, a first side opening and a second side opening are provided on both sides of the shell slot, and the first side opening and the second side opening are used to ensure that the first port and the second port do not interfere with the placement of the circuit board when the circuit board is placed in the shell.

[0016] By adopting the above technical solution, a first side opening and a second side opening are opened on both sides of the shell groove, ensuring that the first port and the second port of the circuit board will not be interfered when the circuit board is placed, thereby facilitating the installation and connection of the circuit board.

[0017] Furthermore, a top plate is slidably connected to the lower interior of the shell groove, and a top block is provided at the bottom of the top plate, and the top block passes through the shell and extends to the bottom of the shell. The top plate and the top block are used to push out the circuit board to facilitate the subsequent demolding of the sealing layer, and the shell is used to protect the edge piece.

[0018] By adopting the above technical solution, the top plate and top block are set at the bottom of the shell groove, so that when the circuit board needs to be maintained or replaced, the circuit board can be easily ejected, which facilitates the subsequent demolding of the sealing layer. At the same time, the shell also protects the edge piece to prevent it from being damaged during transportation or use.

[0019] Furthermore, the material of the glue-tearing mechanism is polyester film.

[0020] By adopting the above technical solution, the glue tearing mechanism is made of polyester film material, which has good tear resistance, temperature resistance and chemical corrosion resistance, so that it is not easy to break or deform during the tearing process, and can maintain an intact structure, thereby better promoting the removal of the sealing layer.

[0021] In summary, the present invention has the following beneficial effects:

[0022] 1. The present invention provides a glue-tearing mechanism. Before the circuit board is glued, multiple film strips of the glue-tearing mechanism are pre-attached to the outer surface of the circuit board. These film strips include a first film, a second film, a third film, and a welt sheet as a tearable edge. When it is necessary to replace electronic components on the circuit board, the welt sheet is first torn off, which then drives the first film, and then drives the multiple second and third films. In this way, multiple easy-to-shovel grooves are formed on the sealing layer, making the sealing layer easier to remove. This method not only improves the efficiency of glue removal, but also reduces the risk of damage to the circuit board.

[0023] 2. The utility model provides a top plate and a top block. When it is necessary to replace electronic components on the circuit board or perform maintenance, the top plate can be raised by operating the top block to push the circuit board out. This facilitates the subsequent demoulding and processing of the sealing layer, thereby improving maintenance efficiency. At the same time, the shell also plays a role in protecting the edge piece to prevent it from being damaged during transportation or use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the partial three-dimensional structure of the glue peeling mechanism of the present invention;

[0026] Figure 3 This is a schematic diagram of a side-view cross-sectional three-dimensional structure of the present utility model;

[0027] Figure 4 For this utility model Figure 1 Schematic diagram of the structure enlarged at point A.

[0028] In the figure: 1. Sealing shell; 101. Shell; 102. Shell groove; 103. First side opening; 104. Second side opening; 105. Top block; 106. Top plate; 2. Circuit board; 201. Board body; 202. First port; 203. Second port; 204. Sealing layer; 3. Glue peeling mechanism; 301. First diaphragm; 302. Second diaphragm; 303. Third diaphragm; 304. Welt sheet. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the internal parts of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The following describes an embodiment of the present invention based on its overall structure.

[0033] Example 1:

[0034] A circuit board with a dustproof structure, such as Figures 1-4As shown, it includes a circuit board 2 and a sealing shell 1, the circuit board 2 is placed inside the sealing shell 1, the circuit board 2 includes a board body 201, a first port 202 and a second port 203 and a plurality of electronic components are installed at both ends of the top of the board body 201, and a peeling mechanism 3 is adhered to the top surface of the board body 201; the peeling mechanism 3 includes a first diaphragm 301, a second diaphragm 302, a third diaphragm 303 and a welt sheet 304, the first diaphragm 301 is adhered to the top outer edge of the board body 201, the second diaphragm 302 and the third diaphragm 303 are each provided with multiple strips, and the multiple second diaphragms 302 and the third diaphragms 303 are adhered to the multiple strips. The outer side of the first diaphragm 301 is provided with multiple welt pieces 304, and the multiple welt pieces 304 are in contact with the outer side of the board body 201. The ends of the welt pieces 304 are folded over and aligned with the bottom of the board body 201. Through the combination of the circuit board 2 and the sealing shell 1, a circuit board with a dustproof structure is provided. The setting of the glue tearing mechanism 3, including the first diaphragm 301, the second diaphragm 302, the third diaphragm 303 and the welt piece 304, makes it easy to remove the sealing layer 204 when the electronic components need to be maintained or replaced, while protecting the circuit board 2 from the influence of dust and moisture.

[0035] See Figure 1 、 Figure 2 A sealing layer 204 is cast on the top of the glue tearing mechanism 3, and the sealing layer 204 is transparent. The material of the sealing layer 204 is silicone gel. The sealing layer 204 is made of silicone gel and is transparent. It can not only effectively prevent dust and moisture, but also help the circuit board 2 dissipate heat. The transparent nature makes it possible to intuitively observe the status of the circuit board 2, which is convenient for monitoring and maintenance.

[0036] See Figure 1 、 Figure 2 The sealing layer 204 is used to prevent dust, moisture and heat, and the glue tearing mechanism 3 is used to efficiently remove the sealing layer 204. The sealing layer 204 is used to prevent dust, moisture and heat, and the glue tearing mechanism 3 is used to efficiently remove the sealing layer 204. The combination of the two provides comprehensive protection and convenient maintenance for the circuit board 2.

[0037] See Figure 1 、 Figure 4 The sealing shell 1 includes a shell 101, and a shell groove 102 is opened on the top of the shell 101. The shell groove 102 is adapted to the circuit board 2. The setting of the sealing shell 1, especially the shell groove 102 opened on the top of the shell 101, enables the circuit board 2 to be firmly placed therein. The shell groove 102 is adapted to the circuit board 2, providing good protection and support.

[0038] See Figure 1 、 Figure 2A first side opening 103 and a second side opening 104 are provided on both sides of the shell slot 102. The first side opening 103 and the second side opening 104 are used to ensure that the first port 202 and the second port 203 of the circuit board 2 will not interfere with the insertion when the circuit board 2 is placed in the shell 101. The first side opening 103 and the second side opening 104 are provided on both sides of the shell slot 102, ensuring that the first port 202 and the second port 203 of the circuit board 2 will not be interfered with when the circuit board 2 is placed, thereby facilitating the installation and connection of the circuit board 2.

[0039] Example 2:

[0040] See Figure 1 、 Figure 2 A top plate 106 is slidably connected to the lower part of the shell groove 102, and a top block 105 is provided at the bottom of the top plate 106, and the top block 105 passes through the shell 101 and extends to the bottom of the shell 101. The top plate 106 and the top block 105 are used to push out the circuit board 2, which is convenient for the subsequent demolding of the sealing layer 204. At the same time, the shell 101 is used to protect the welt piece 304. The top plate 106 and the top block 105 at the lower part of the shell groove 102 are arranged so that when the circuit board 2 needs to be maintained or replaced, the circuit board 2 can be easily pushed out, which is convenient for the subsequent demolding of the sealing layer 204. At the same time, the shell 101 also protects the welt piece 304 to prevent it from being damaged during transportation or use.

[0041] See Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The material of the glue-tearing mechanism 3 is polyester film. The glue-tearing mechanism 3 is made of polyester film, which has good tear resistance, temperature resistance and chemical corrosion resistance, so that it is not easy to break or deform during the tearing process, and can maintain an intact structure, thereby better driving the removal of the sealing layer 204.

[0042] The implementation principle of the present invention is as follows: First, ensure that all electronic components on the circuit board 2 have been correctly installed and tested. Then, adhere the first film 301, the second film 302, the third film 303, and the welt 304 of the adhesive peeling mechanism 3 to the board body 201 of the circuit board 2 according to the predetermined positions. Ensure that the end of the welt 304 is folded and attached to the bottom of the board body 201 to provide a stable starting point for adhesive peeling.

[0043] A sealing layer 204 is poured on top of the adhesive peeling mechanism 3. The sealing layer 204 is made of transparent silicone gel and is used to prevent dust and moisture and dissipate heat. The sealing layer 204 is ensured to evenly cover the entire adhesive peeling mechanism 3 and the top of the circuit board 2, forming a protective barrier.

[0044] Place the sealed circuit board 2 into the housing groove 102 of the sealing housing 1, ensuring that the circuit board 2 fits in the housing groove 102. Ensure that the first port 202 and the second port 203 of the circuit board 2 do not interfere with the placement process through the first side openings 103 and the second side openings 104 on both sides of the housing groove 102.

[0045] When it is necessary to replace electronic components on the circuit board 2 or perform maintenance, the top plate 106 is raised by operating the top block 105, and the circuit board 2 is pushed out of the shell groove 102. The welt piece 304 is torn off, and the first membrane 301 is driven by the welt piece 304, and then the multiple second membranes 302 and the third membrane 303 are driven, forming multiple easy-to-shovel grooves on the sealing layer 204, which is convenient for scraping off the sealing layer 204 and performing subsequent maintenance or replacement work.

[0046] Parts not involved in the present invention are the same as those in the prior art or can be implemented by using the prior art, and will not be described in detail here.

[0047] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not limitations on the present invention. The specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and purpose of the present invention, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A circuit board with a dustproof structure, characterized in that: The invention comprises a circuit board (2) and a sealing shell (1), wherein the circuit board (2) is placed inside the sealing shell (1), the circuit board (2) comprises a plate body (201), a first port (202) and a second port (203) and a plurality of electronic components are installed at two ends of the top of the plate body (201), and a peeling mechanism (3) is adhered to the top surface of the plate body (201); The peeling mechanism (3) comprises a first film (301), a second film (302), a third film (303) and an edge sheet (304), wherein the first film (301) is adhered to the top outer edge of the board (201), and the second film (302) and the third film (303) are each provided with a plurality of strips, and the plurality of second films (302) and third films (303) are adhered between the board (201) of the plurality of electronic components; A plurality of welt sheets (304) are provided on the outer side of the first membrane (301), and the plurality of welt sheets (304) are in contact with the outer side of the plate body (201), with the ends of the welt sheets (304) folded over and aligned with the bottom of the plate body (201).

2. The circuit board with a dustproof structure according to claim 1, wherein: A sealing glue layer (204) is cast on the top of the glue tearing mechanism (3), and the sealing glue layer (204) is transparent. The material of the sealing glue layer (204) is silicone gel.

3. The circuit board with a dustproof structure according to claim 2, wherein: The sealing glue layer (204) is used for dustproofing, moistureproofing and heat dissipation, and the glue tearing mechanism (3) is used for efficiently removing the sealing glue layer (204).

4. The circuit board with a dustproof structure according to claim 1, wherein: The sealing shell (1) comprises a shell (101), a shell groove (102) is provided on the top of the shell (101), and the shell groove (102) is adapted to the circuit board (2).

5. The circuit board with a dustproof structure according to claim 4, characterized in that: A first side opening (103) and a second side opening (104) are provided on both sides of the housing slot (102). The first side opening (103) and the second side opening (104) are used to ensure that the first port (202) and the second port (203) do not interfere with the placement of the circuit board (2) when the circuit board (2) is placed in the housing (101).

6. The circuit board with a dustproof structure according to claim 4, wherein: A top plate (106) is slidably connected to the lower interior of the shell groove (102), a top block (105) is provided at the bottom of the top plate (106), and the top block (105) passes through the shell (101) and extends to the bottom of the shell (101), the top plate (106) and the top block (105) are used to push out the circuit board (2), so as to facilitate the subsequent demoulding of the sealing layer (204), and the shell (101) is used to protect the welt piece (304).

7. The circuit board with a dustproof structure according to claim 1, wherein: The material of the glue-tearing mechanism (3) is polyester film.

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