Heat dissipation optimization structure of electric appliance box of heat pump

Abstract

The utility model relates to the technical field of heat pump equipment, in particular to an electric appliance box heat dissipation optimization structure of a heat pump, which comprises an electric appliance box arranged in the heat pump, an inductor and a plurality of electronic modules are arranged in the electric appliance box, and an air duct assembly is arranged at the bottom of the electric appliance box; an air outlet communicated with a fan in the heat pump is formed in the top of the electric appliance box; external air enters the electric appliance box through the air duct assembly, passes through the inductor and the electronic modules from bottom to top and then is exhausted through the air outlet. Wherein the inductor is arranged at the top of the electric appliance box and is closer to the air outlet of the electric appliance box than the electronic modules. The heat dissipation optimization structure of the electric appliance box of the heat pump can further optimize the heat dissipation performance of the electric appliance box in heat pump equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of heat pump equipment, in particular to a heat pump electrical box heat dissipation optimization structure. Background Art

[0002] The versatility of heat pump equipment determines that the external environments it operates in are diverse, and the performance of heat pumps under different operating conditions varies. To ensure the stable operation of the heat pump unit, in addition to ensuring the stable performance of the various components within the heat pump, it is also necessary to ensure that the internal electronic control system of the heat pump will not malfunction under extreme conditions. Currently, in simulated operating condition tests on heat pump equipment, it has been found that when the ambient temperature is above 35°C, the temperatures of the various heating components inside the electrical box of the heat pump are significantly higher. When the temperature of the internal electronic module exceeds 75°C, the compressor often reduces the frequency to actively dissipate heat, which seriously affects the normal use of the heat pump equipment. Therefore, it is necessary to optimize the design of the heat dissipation structure of the electrical box.

[0003] Furthermore, using the existing electrical box design within a top-exhaust heat pump as a prototype, the optimized structure ensured that the device, under simulated conditions (designed at 35°C), met the design standards for the internal temperature of the box (PFC compressor inductor temperature <100°C, module temperature <75°C, filter board PFC inductor temperature <100°C). For top-exhaust systems, heat dissipation from the box was a key issue. Regarding the electronic module, because variable-frequency heat pumps require a variable-frequency module board, the high power demands require heat dissipation, often with a large aluminum heat sink. If heat dissipation is poor, the inverter temperature can overheat, potentially damaging the internal electrical components. On the other hand, inside the electrical box of the heat pump, the inductor (PFC inductor) is an important component of the circuit system. Its function is to improve the power factor of the AC power supply, reduce harmonic pollution, and improve the utilization rate of electric energy. However, the DC resistance and coil of the inductor will generate a large amount of heat when working at the maximum current, causing the temperature inside the electrical box to rise significantly. The high-temperature heat generated will also affect the heat dissipation effect of the electronic module inside the electrical box, causing the most obvious adverse effect on the heat dissipation performance of the electrical box inside the heat pump. In addition, if the heat dissipation of the inductor is not timely during operation, it will also cause the inductor coil to age faster and greatly shorten its service life, thereby causing machine failure of the heat pump equipment. Utility Model Content

[0004] In order to solve the technical problems existing in the prior art to a certain extent as much as possible, the utility model provides a heat pump electrical box heat dissipation optimization structure, which can further optimize the heat dissipation of the electrical box inside the heat pump equipment.

[0005] The utility model discloses a heat pump electrical box heat dissipation optimization structure, comprising an electrical box for being arranged inside the heat pump, wherein an inductor and a plurality of electronic modules are arranged inside the electrical box;

[0006] An air duct assembly is provided at the bottom of the electrical box;

[0007] The top of the electrical box is provided with an air outlet for connecting to the fan inside the heat pump;

[0008] External air enters the interior of the electrical box through the air duct assembly and passes through the inductor and various electronic modules from bottom to top before being discharged through the air outlet;

[0009] The inductor is arranged on the top of the electrical box and is closer to the air outlet of the electrical box than each of the electronic modules.

[0010] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, a first air duct and a second air duct separated from each other are formed inside the electrical box;

[0011] The air duct assembly is connected to the first air duct and the second air duct from the bottom of the electrical box; the air outlet is connected to the first air duct and the second air duct at the top of the electrical box;

[0012] Wherein, the inductor is arranged in the first air duct; and a plurality of the electronic modules are distributedly installed in the first air duct and the second air duct.

[0013] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, the electrical box includes an outer cover, an inner cover and a cover plate; the cover plate covers the inner cavity of the inner cover, and the inner cover covers and is sleeved on the inner cavity of the outer cover;

[0014] The first air duct is formed in the inner cavity of the outer cover;

[0015] The second air duct is formed in the inner cavity of the inner cover.

[0016] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, the inner cavity of the outer cover is formed with a step, and the outer side surface of the inner cover is superimposed on the high-level plane of the step and is separated from the low-level plane of the step by a certain gap;

[0017] The first air duct is formed in a gap between a lower-step plane of the step and the inner cover.

[0018] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, the air duct assembly includes an air inlet and an access port;

[0019] A plurality of air inlet holes are provided on the bottom side of the inner cover;

[0020] The bottom inlet of the first air duct and the air inlet holes at the bottom of the inner cover are connected to the access port of the air duct assembly.

[0021] According to the heat dissipation optimization structure of the electrical box of a heat pump of the utility model, an inductor cover located at the top of the first air duct and connected to the first air duct is provided in the electrical box, one side of the inductor cover is connected to the air outlet, and the inductor is accommodated in the inductor cover.

[0022] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, the outer wall of the reactor cover is embedded from the inner cavity of the outer cover into the inner cavity of the inner cover;

[0023] A conducting hole located in the inner cavity of the inner cover is formed on the side wall of the reactor cover, and the second air duct is connected to the interior of the reactor cover through the conducting hole.

[0024] According to the heat dissipation optimization structure of the electrical box of a heat pump of the present invention, the top surface of the inner cavity of the reactor cover is paved with thermal insulation cotton, and the thermal insulation cotton is located above the inductor.

[0025] According to the utility model, a heat pump electrical box heat dissipation optimization structure also includes at least one heat dissipation plate, and a part of the electronic module located in the first air duct is in heat transfer contact with the heat dissipation plate, and the heat dissipation plate is embedded in the inner cavity of the inner cover so that the second air duct passes through the heat dissipation plate.

[0026] According to the heat pump electrical box heat dissipation optimization structure of the utility model, a top cover is provided on the top of the electrical box;

[0027] The top cover covers the top outlet of the first air duct;

[0028] The air outlet is opened on the side wall of the outer cover and is connected to the top outlet of the first air duct from the side.

[0029] The utility model provides an optimized heat dissipation structure of the electrical box of a heat pump. First, air outlets and access duct components are respectively provided at the top and bottom of the electrical box. When the fan in the heat pump is running, the outside air is guided from the duct component into the interior of the electrical box and passes through the inductor and various electronic modules as heat sources from bottom to top, and then is discharged through the air outlets. The airflow entering the electrical box contacts the inductor and various electronic modules from bottom to top and dissipates the heat for them, and then converges to the top of the electrical box along the natural rising trend of the hot air, and finally is discharged to the outside through the air outlet at the top of the electrical box, taking away the heat inside the electrical box and dissipating the heat for the inductor and various electronic modules. In addition, The inductor is installed at the top of the electrical box and is closer to the air outlet of the electrical box than the other electronic modules. The external air contacts the electronic modules inside the electrical box before contacting the inductor, so as to avoid the air flow absorbing the heat of the inductor which generates more heat and then transferring the heat to other electronic modules. Therefore, not only the inductor inside the electrical box can be timely cooled, but also the high-temperature air generated when the inductor transfers heat to the outside can be prevented from causing secondary heating to other electronic modules in the electrical box. In this way, the heat dissipation effect inside the electrical box is improved, so that the heat dissipation of the electrical box inside the heat pump equipment can be further optimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is an assembly diagram of the electrical box of the utility model being assembled in the heat pump equipment;

[0032] Figure 2 This is a partial exploded view of the heat pump equipment of the present utility model;

[0033] Figure 3 This is an exploded view of the electrical box of the utility model (the air duct components are hidden);

[0034] Figure 4 This is the overall structure diagram of the electrical box of the utility model (the cover is hidden);

[0035] Figure 5 This is an exploded view of an electrical box according to the present invention.

[0036] Reference numerals:

[0037] 1. Electrical box, 2. Inductor, 3. Air duct assembly, 4. Air outlet, 5. First air duct, 6. Second air duct, 7. Outer cover, 8. Inner cover, 9. Cover, 10. Step, 11. Air inlet, 12. Access port, 13. Air inlet, 14. Reactance cover, 15. Conductive hole, 16. Heat sink, 17. Top cover, 18. Motor drive module, 19. Integrated module;

[0038] 100 heat pump equipment. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention. In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or positional relationships, are based on the positions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and are therefore not to be construed as limiting the present invention.

[0040] like Figures 1 to 5 As shown, the heat dissipation optimization structure of the electrical box of a heat pump in this embodiment includes an electrical box 1 installed inside the heat pump device 100, and an inductor 2 and several electronic modules are installed inside the electrical box 1. In this embodiment, the above-mentioned several electronic modules include a motor drive module 18, an integrated module 19, a module capacitor (not shown in the figure) and a mainboard filter board (not shown in the figure). The bottom of the electrical box 1 is installed and docked with an air duct component 3, and the top of the electrical box 1 is provided with an air outlet 4. The air outlet 4 is connected to the fan (not shown in the figure) inside the heat pump device 100. When the fan inside the heat pump device 100 starts and draws the air inside the heat pump to the outside, the air inside the electrical box 1 is continuously discharged through the air outlet 4, so that the interior of the electrical box 1 enters a negative pressure state, and the external air can automatically enter the interior of the electrical box 1 through the air duct component 3 at the bottom of the electrical box 1 and pass through the inductor 2 and various electronic modules from bottom to top and then continue to be discharged through the air outlet 4, thereby realizing air circulation through the interior of the electrical box 1. In addition, the inductor 2 is installed on the top of the electrical box 1 and is closer to the air outlet 4 of the electrical box 1 than the electronic modules.

[0041] It can be understood that in this embodiment, first, air outlets 4 and access duct components 3 are respectively opened at the top and bottom of the electrical box 1. When the fan in the heat pump is running, the external air is guided from the duct component 3 into the interior of the electrical box 1 and passes through the inductor 2 and various electronic modules as the heat source from bottom to top and is discharged through the air outlet 4. The airflow entering the electrical box 1 contacts the inductor 2 and various electronic modules from bottom to top and dissipates the heat, and then follows the natural upward trend of the hot air to converge to the top of the electrical box 1, and finally is discharged to the outside through the air outlet 4 at the top of the electrical box 1, taking away the heat inside the electrical box 1 and dissipating the heat for the inductor 2 and various electronic modules. In addition, The inductor 2 is also installed at the top of the electrical box 1 and is closer to the air outlet 4 of the electrical box 1 than other electronic modules, so that the external air contacts the various electronic modules in the electrical box 1 before contacting the inductor 2, avoiding the air flow absorbing the heat of the inductor 2, which generates more obvious heat, and then transferring the heat to other electronic modules. Therefore, not only can the inductor 2 inside the electrical box be dissipated in time, but also the high-temperature air generated when the inductor 2 transfers heat to the outside can be prevented from causing secondary heating to other electronic modules in the electrical box. In this way, the heat dissipation effect inside the electrical box is improved, so that the heat dissipation of the electrical box inside the heat pump equipment can be further optimized.

[0042] In one embodiment, specifically, a first air duct 5 and a second air duct 6 separated from each other are formed inside the electrical box 1. The air duct assembly 3 is connected to the first air duct 5 and the second air duct 6 from the bottom of the electrical box 1. The air outlet 4 is connected to the first air duct 5 and the second air duct 6 at the top of the electrical box 1. The inductor 2 is installed in the first air duct 5. Among the above-mentioned several electronic modules, the motor drive module 18 and the integrated module 19 are installed in the first air duct 5, while the module capacitor and the mainboard filter board are installed in the second air duct 6. In this way, two air flows can be formed inside the electrical box 1, and the inductor 2 and the electronic modules distributed and installed in the first air duct 5 and the second air duct 6 are cooled separately. This structure can better prevent the heat of the inductor 2 from affecting the heat dissipation effect of other electronic modules, and more effectively avoid the high-temperature air generated by the inductor 2 when transferring heat to the outside to cause secondary heating of other electronic modules in the electrical box, thereby further optimizing the heat dissipation effect inside the electrical box 1.

[0043] In order to simply separate the first air duct 5 and the second air duct 6 inside the electrical box 1 and avoid complicating the internal structure of the electrical box, the electrical box 1 structure of this embodiment includes an outer cover 7, an inner cover 8 and a cover plate 9. The cover plate 9 covers the inner cavity of the inner cover 8. The inner cover 8 covers the inner cavity of the outer cover 7 and is also sleeved in the inner cavity of the outer cover 7. The first air duct 5 is formed in the inner cavity of the outer cover 7, and the second air duct 6 is formed in the inner cavity of the inner cover 8. Specifically, the inner cavity of the outer cover 7 is formed with a step 10, and the outer side surface of the inner cover 8 is superimposed on the high-order plane of the step 10. At the same time, the outer side surface of the inner cover 8 is separated from the low-order plane of the step 10 by a certain gap. The first air duct 5 is formed in the gap between the low-order plane of the above-mentioned step 10 and the inner cover 8, so that the first air duct 5 can be simply formed inside the electrical box 1, and the structure is simple and compact.

[0044] In one embodiment, the air duct assembly 3 includes an air inlet 11 and an access port 12, and a plurality of air inlet holes 13 are formed on the bottom side of the inner cover 8. The bottom inlet of the first air duct 5 and the air inlet holes 13 at the bottom of the inner cover 8 are connected to the access port 12 of the air duct assembly 3. Through the above structure, a portion of the air entering the air duct assembly 3 can smoothly pass through the bottom inlet of the first air duct 5 from the access port 12 and upward into the first air duct 5, while another portion of the air can also smoothly pass through the air inlet holes 13 at the bottom of the inner cover 8 and upward into the second air duct 6 within the inner cover 8.

[0045] This embodiment also implements a preferred solution, which includes adding a reactor cover 14 within the electrical box 1. The reactor cover 14 is primarily composed of three sheet metal parts. The reactor cover 14 is located at the top of the first air duct 5, and the bottom opening of the first air duct 5 is connected to the first air duct 5. Furthermore, one side of the first air duct 5 is connected to the air outlet 4. Finally, the inductor 2 is housed and installed within the reactor cover 14. This structure has the beneficial effect of using the reactor cover 14 to block the heat generated by the inductor 2, preventing the heat generated by the reactor cover 14 from being directly radiated to the surrounding area and affecting the heat dissipation of other electronic modules.

[0046] In order to expand the accommodation space of the inductor cover 14 so that a larger inductor 2 can be accommodated in the inductor cover 14, in this embodiment, the outer wall of the inductor cover 14 is embedded from the inner cavity of the outer cover 7 into the inner cavity of the inner cover 8, so that the internal space of the inductor cover 14 is increased, while at the same time, the heat of the inductor cover 14 can be blocked from being significantly radiated to the second air duct 6 in the inner cavity of the inner cover 8. In addition, a conducting hole 15 is provided on the side wall of the reactor cover 14, and the conducting hole 15 is located in the inner cavity of the inner cover 8, so that the second air duct 6 is connected to the inside of the reactor cover 14 through the conducting hole 15, so that the heat dissipation airflow flowing from bottom to top along the second air duct 6 can enter the reactor cover 14 through the conducting hole 15, and converge with another heat dissipation airflow flowing from bottom to top along the first air duct 5 inside the reactor cover 14 at the top. The two airflows can converge inside the reactor cover 14 and jointly dissipate heat for the inductor 2, which can significantly improve the heat dissipation effect of the inductor 2. The two heat dissipation airflows coming from the first air duct 5 and the second air duct 6 respectively converged in the reactor cover 14 can finally be discharged smoothly outward through the air outlet 4 at the top of the electrical box 1, and can also avoid the high-temperature air around the inductor 2 from causing secondary heating to other electronic modules in the electrical box 1, thereby improving the heat dissipation effect inside the electrical box.

[0047] Optionally, the top surface of the inner cavity of the reactance cover 14 is covered with thermal insulation cotton (not shown in the figure), and the thermal insulation cotton is located above the inductor 2. It can be understood that since the two heat dissipation airflows coming from the first air duct 5 and the second air duct 6 respectively converge inside the reactance cover 14, it is easy to form condensation water inside the reactance cover 14, especially on the top. Therefore, the thermal insulation cotton laid on the top surface of the inner cavity of the reactance cover 14 can absorb the condensation water formed in the electrical box to prevent the condensation water from dripping into the inductor or the inside of the electrical box.

[0048] In this embodiment, a heat sink 16 is also provided, and a portion of the electronic modules located in the first air duct 5 are in heat transfer contact with the heat sink 16. Specifically, in this embodiment, the integrated module 19 is installed on the heat sink 16, so that the integrated module 19 located in the first air duct 5 is in heat transfer contact with the heat sink 16. At the same time, the other side of the heat sink 16 is embedded in the inner cavity of the inner cover 8 so that the second air duct 6 passes through the heat sink 16. Therefore, during the heat dissipation process, the heat dissipation airflow in the first air duct 5 can dissipate heat for the integrated module 19, and at the same time, the heat dissipation airflow in the second air duct 6 also dissipates heat for the heat sink 16, allowing the heat sink 16 to better absorb the heat of the integrated module 19, thereby further enhancing the heat dissipation effect of the integrated module 19.

[0049] Specifically, a top cover 17 is also provided on the top of the electrical box 1, and the top cover 17 covers the top outlet of the first air duct 5, so the top cover 17 can be used to close the top outlet of the first air duct 5. At the same time, the air outlet 4 is opened on the side wall of the outer cover 7 and is connected to the top outlet of the first air duct 5 from the side, so the heat dissipation airflow inside the first air duct 5 can be smoothly discharged to the outside through the air outlet 4 on the side wall of the outer cover 7.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A heat pump electrical box heat dissipation optimization structure, comprising an electrical box (1) for being arranged inside the heat pump, wherein an inductor (2) and a plurality of electronic modules are arranged inside the electrical box (1), characterized in that: An air duct assembly (3) is provided at the bottom of the electrical appliance box (1); The top of the electrical box (1) is provided with an air outlet (4) for communicating with the internal fan of the heat pump; External air enters the interior of the electrical box (1) through the air duct assembly (3) and passes through the inductor (2) and various electronic modules from bottom to top before being discharged through the air outlet (4); The inductor (2) is arranged on the top of the electrical box (1) and is closer to the air outlet (4) of the electrical box (1) than each of the electronic modules.

2. The heat pump electrical box heat dissipation optimization structure according to claim 1, characterized in that: A first air duct (5) and a second air duct (6) separated from each other are formed inside the electrical box (1); The air duct assembly (3) is connected to the first air duct (5) and the second air duct (6) from the bottom of the electrical box (1); the air outlet (4) is connected to the first air duct (5) and the second air duct (6) at the top of the electrical box (1); The inductor (2) is arranged in the first air duct (5); and a plurality of electronic modules are distributed and installed in the first air duct (5) and the second air duct (6).

3. The heat pump electrical box heat dissipation optimization structure according to claim 2, characterized in that: The electrical box (1) comprises an outer cover (7), an inner cover (8) and a cover plate (9); the cover plate (9) covers the inner cavity of the inner cover (8), and the inner cover (8) covers and is sleeved on the inner cavity of the outer cover (7); The first air duct (5) is formed in the inner cavity of the outer cover (7); The second air duct (6) is formed in the inner cavity of the inner cover (8).

4. The heat pump electrical box heat dissipation optimization structure according to claim 3, characterized in that: The inner cavity of the outer cover (7) is formed with a step (10), and the outer side surface of the inner cover (8) is superimposed on the high-order plane of the step (10) and is spaced a certain distance from the low-order plane of the step (10); The first air duct (5) is formed in a gap between the lower level plane of the step (10) and the inner cover (8).

5. The heat pump electrical box heat dissipation optimization structure according to claim 3, characterized in that: The air duct assembly (3) comprises an air inlet (11) and an access port (12); The bottom side of the inner cover (8) is provided with a plurality of air inlet holes (13); The bottom inlet of the first air duct (5) and the air inlet holes (13) at the bottom of the inner cover (8) are connected to the inlet (12) of the air duct assembly (3).

6. The heat pump electrical box heat dissipation optimization structure according to claim 3, characterized in that: The electrical box (1) is provided with a reactance cover (14) located at the top of the first air duct (5) and connected to the first air duct (5); one side of the reactance cover (14) is connected to the air outlet (4); and the inductor (2) is accommodated in the reactance cover (14).

7. The heat pump electrical box heat dissipation optimization structure according to claim 6, characterized in that: The outer wall of the reactance cover (14) is embedded from the inner cavity of the outer cover (7) into the inner cavity of the inner cover (8); A conducting hole (15) located in the inner cavity of the inner cover (8) is provided on the side wall of the reactance cover (14), and the second air duct (6) is connected to the interior of the reactance cover (14) through the conducting hole (15).

8. The heat pump electrical box heat dissipation optimization structure according to claim 6, characterized in that: The inner cavity top surface of the reactance cover (14) is paved with thermal insulation cotton, and the thermal insulation cotton is located above the inductor (2).

9. The heat pump electrical box heat dissipation optimization structure according to claim 3, characterized in that: It also includes at least one heat dissipation plate (16), and a portion of the electronic modules located in the first air duct (5) are in heat transfer contact with the heat dissipation plate (16), and the heat dissipation plate (16) is embedded in the inner cavity of the inner cover (8) so that the second air duct (6) passes through the heat dissipation plate (16).

10. The heat pump electrical box heat dissipation optimization structure according to claim 3, characterized in that: The top of the electrical box (1) is provided with a top cover (17); The top cover (17) covers the top outlet of the first air duct (5); The air outlet (4) is opened on the side wall of the outer cover (7) and is connected to the top outlet of the first air duct (5) from the side.

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