Low-thermal-resistance side wall type heat dissipation cold plate structure
By setting a heat dissipation structure and heat conducting parts on the cooling cold plate, the contact thermal resistance problem in the sidewall heat dissipation structure of the airborne radar is solved, the heat dissipation efficiency is improved and the equipment's vibration resistance is enhanced, and it is suitable for heat dissipation applications of plug-in and unplugged chassis.
Patent Information
- Application Number
- CN202422396063.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-29
AI Technical Summary
In the sidewall heat dissipation structure of existing airborne radars, there is a large thermal resistance between the surface of the module locking strip guide and the chassis guide, resulting in a reduced heat dissipation efficiency and the equipment is easily affected by the external environment under harsh environments.
The low-thermal resistance sidewall heat dissipation cold plate structure is adopted. By setting a heat dissipation structure and heat conductor on the heat dissipation cold plate, the contact thermal resistance is reduced, the heat dissipation efficiency is enhanced, and the cold plate is fixed by locking strips to reduce shaking and vibration to ensure the stability of the equipment.
It improves the heat dissipation ability of the chassis, reduces contact thermal resistance, enhances the vibration resistance of the equipment, avoids the impact of the external environment on the inside, and ensures the stable operation of the equipment.
Smart Images
Figure CN223246931U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat exchange structures, and in particular relates to a low thermal resistance side wall type heat dissipation cold plate structure. Background Art
[0002] With the continuous advancement of electronic technology, the integration of electronic devices is becoming increasingly higher, and their heat consumption is also increasing, leading to a continuous increase in heat flux density. If the heat generated by electronic devices cannot be removed promptly, it will affect the performance and lifespan of the equipment. Due to different usage scenarios, the heat dissipation solutions of various electronic devices are also different. As the functions and performance requirements of airborne radars continue to rise, the usage scenarios are becoming increasingly complex. In some environments with harsh environmental conditions, airborne radars must be sealed to prevent external environmental influences.
[0003] Existing structure: The electronic equipment of airborne radar is made into a closed structure. Equipment that requires plugging and unplugging modules adopts a side-wall heat dissipation structure, such as side-wall air cooling or side-wall liquid cooling. Its heat dissipation module is connected to the chassis guide rail through the locking bar guide surface to conduct heat, and the cooling medium is transferred through the flow channel inside the chassis for heat exchange. Therefore, the side-wall heat dissipation solution can ensure that the interior of the equipment is isolated from the external environment, preventing the external environment from affecting the modules or printed circuit boards inside the equipment. However, there is a large contact thermal resistance between the module locking bar guide surface and the chassis guide rail. This thermal resistance causes a large temperature difference between the module cold plate and the chassis guide rail, reducing the heat dissipation efficiency. Utility Model Content
[0004] In view of this, the heat dissipation cold plate of the present invention reduces the contact thermal resistance between the heat dissipation cold plate and the chassis, improves the heat dissipation capacity, and does not affect the vibration resistance of the equipment.
[0005] A heat dissipation cold plate is suitable for heat dissipation of a plug-in chassis. The inner wall of the top surface and the inner wall of the inner bottom surface of the chassis are correspondingly provided with a plurality of slots, and the slots are used for installing boards. The boards include circuit hard boards and heat dissipation cold plates. The heat dissipation cold plate is made of metal material and the central area is used for installing circuit hard boards or electronic components. The size of the side surface in the thickness direction of the heat dissipation cold plate is adapted to the width of the slot. Heat dissipation structures are symmetrically spaced in the axial direction of the heat dissipation cold plate. All the heat dissipation structures are located on the same side of the heat dissipation cold plate, wherein:
[0006] The heat dissipation structure can increase the heat dissipation or heat exchange between the slot and the heat dissipation cold plate, and reduce the contact thermal resistance.
[0007] Preferably, the heat dissipation cold plate includes a front surface and a back surface, and a mounting portion is provided on a side surface in the thickness direction of the heat dissipation cold plate and parallel to its axial direction, and the mounting portion includes a first surface and a second surface, the first surface and the front surface are in the same plane, and the second surface and the back surface are in the same plane, wherein,
[0008] A locking strip is installed on the first surface along the center line of the front surface, and the locking strip is used to fasten the heat dissipation cold plate to prevent the heat dissipation cold plate from moving, shaking or vibrating in the corresponding groove due to environmental forces;
[0009] The heat dissipation structures are installed at intervals on the second surface along the center line direction of the reverse surface.
[0010] Preferably, the length of the mounting portion is smaller than the length of the heat dissipation cold plate.
[0011] Preferably, the heat dissipation structure includes a heat dissipation slot and a heat conducting member installed in the heat dissipation slot, wherein the height of the heat conducting member is greater than the depth of the heat dissipation slot, wherein:
[0012] The heat conducting member can reduce the contact thermal resistance between the chassis and the heat dissipation cold plate to improve the heat dissipation capacity of the chassis, and under the action of the locking strip, the heat conducting member can reduce or eliminate the contact gap or gap between the chassis and the heat dissipation cold plate.
[0013] Preferably, mounting holes are provided between the heat dissipation slots, and the mounting holes are used for installing locking strips.
[0014] Beneficial effects
[0015] By setting up the heat dissipation structure, the heat dissipation efficiency of the chassis is improved, and it can be applied to the side wall heat dissipation solution. The internal modules of the chassis are isolated from the cooling medium, avoiding the influence of the external environment on the internal of the chassis. In addition, the heat dissipation structure greatly reduces the contact thermal resistance between the heat dissipation cold plate and the chassis guide rail, and improves the heat dissipation capacity of the force resistance heat dissipation cold plate. The temperature of the heat dissipation components of the printed circuit board is significantly reduced and has a certain vibration resistance performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0017] Figure 1 This is a front view of the chassis of the present invention with slots arranged therein;
[0018] Figure 2This is a schematic diagram of the board installed in the slot;
[0019] Figure 3 This is a schematic diagram of the front of the heat dissipation cold plate;
[0020] Figure 4 This is a schematic diagram of the back side of the heat dissipation cold plate, where:
[0021] 1. Chassis; 2. Slots; 3. Heat sink; 31. Mounting portion; 32. Locking strip; 33. Heat sink; 34. Heat conductor; 35. Mounting hole. DETAILED DESCRIPTION
[0022] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
[0023] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.
[0024] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.
[0025] It should also be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present disclosure, showing only the components related to the present disclosure rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.
[0026] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, one skilled in the art will appreciate that aspects may be practiced without these specific details.
[0027] like Figures 1 to 4 The low thermal resistance side wall type heat dissipation cold plate 3 structure shown is suitable for heat dissipation of plug-in type chassis 1, such as Figure 1 As shown, the inner wall of the top surface and the inner wall of the bottom surface of the chassis 1 are correspondingly provided with a plurality of slots 2, and the slots 2 are used for installing boards. The boards include circuit hard boards (such as national standard 3U or 6U model circuit modules or circuit boards) and heat dissipation cold plates 3. The heat dissipation cold plates 3 are made of metal materials and the central area is used for installing circuit hard boards or electronic components. The size of the side surface of the heat dissipation cold plate 3 in the thickness direction is adapted to the width of the slots 2 to accommodate the installation of the boards. Heat dissipation structures are arranged symmetrically in the axial direction of the heat dissipation cold plate 3, and all heat dissipation structures are located on the same side of the heat dissipation cold plate 3, wherein,
[0028] The heat dissipation structure increases the amount of heat dissipated or exchanged between slot 2 and the heat dissipation cold plate 3, while also reducing contact thermal resistance. Conventional methods place the heat dissipation cold plate 3 in direct contact with slot 2, which reduces the overall heat dissipation efficiency of the chassis 1 due to contact thermal resistance. This structure, however, reduces the contact thermal resistance between the two by providing a heat dissipation structure, thereby improving the heat dissipation efficiency of the chassis 1.
[0029] As a specific embodiment provided in this case, the heat dissipation cold plate 3 includes a front side and a back side, and a mounting portion 31 is provided on the side of the heat dissipation cold plate 3 in the thickness direction and parallel to its axial direction. Figure 2 or Figure 3 The placement direction is used as a reference, and mounting parts 31 are respectively provided on the left and right sides of the heat dissipation cold plate 3. The mounting part 31 includes a first surface and a second surface, the first surface and the front surface are in the same plane, and the second surface and the back surface are in the same plane, wherein,
[0030] like Figure 3 As shown, a locking strip 32 is installed along the center line direction of the front side and on the first surface of the mounting portion 31. The locking strip 32 is used to fasten the heat dissipation cold plate 3 to prevent the heat dissipation cold plate 3 from moving, shaking or vibrating in the corresponding groove due to the influence of environmental forces. The locking strip 32 is, for example, a national standard 5J type locking strip or a broken type locking strip, and the heat dissipation structure is installed at intervals along the center line direction of the back side of the heat dissipation cold plate 3 and on the second surface. Preferably, the length of the mounting portion 31 is less than the length of the heat dissipation cold plate 3. Generally, the mounting portion 31 and the heat dissipation cold plate 3 are formed as an integral structure. In order to facilitate the processing of the mounting portion 31, generally, after the mounting portion 31 is formed as an integral part, a notch is opened at one end to facilitate the installation of the whole in the slot 2.
[0031] Further, such as Figure 4 As shown, the heat dissipation structure includes a heat dissipation groove 33 and a heat conducting member 34 installed in the heat dissipation groove 33. The height of the heat conducting member 34 is greater than the depth of the heat dissipation groove 33. Preferably, the heat conducting member 34 is made of a flexible heat conducting material, for example, a rubber material. The processing method is to fill the heat conducting member 34 in the heat dissipation groove 33 by bonding or using a mold. The slot 2 is a metal slot, wherein,
[0032] The heat conducting member 34 reduces the contact thermal resistance between the chassis 1 and the heat dissipation plate 3, thereby improving the heat dissipation capacity of the chassis 1. Furthermore, the locking strip 32 reduces or eliminates the contact gap or gap between the chassis 1 and the heat dissipation plate 3, thereby preventing the generation of metal debris due to environmental forces. If a large amount of metal debris falls on the circuit board, it will reduce the performance of the circuit board. It should be noted that the heat dissipation structure is arranged in a discontinuous manner to ensure sufficient friction between the heat dissipation plate 3 and / or the mounting portion 31 and the chassis 1. Since the chassis 1 is subject to external environmental forces, such as vibration, the combined effect of the above structure ensures that the heat dissipation plate 3 does not shake, thereby ensuring that the communication function between the circuit board and the module in the chassis 1 is not affected. Furthermore, if the heat dissipation plate 3 vibrates too frequently, the friction between the slot 2 and the module 2 will generate metal debris. Excessive metal debris falling on the card can prevent the communication terminals from transmitting data.
[0033] Furthermore, to facilitate the installation of the locking strip 32 , mounting holes 35 are provided between the heat dissipation slots 33 . The mounting holes 35 are used for installing the locking strip 32 , and the size of the side surface of the mounting portion 31 in the thickness direction is adapted to the width of the groove.
[0034] As a specific implementation provided in this case, a motherboard is provided in the chassis 1, and the board is electrically connected to the motherboard through a slot in a plug-in manner.
[0035] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.
Claims
1. A low thermal resistance sidewall heat dissipation cold plate structure suitable for heat dissipation of plug-in chassis, wherein the inner wall of the top surface and the inner wall of the bottom surface of the chassis are respectively provided with a plurality of slots, wherein the slots are used for installing boards, wherein the boards include a circuit hard board and a heat dissipation cold plate, and the heat dissipation cold plate is made of metal material and the central area is used for installing the circuit hard board or electronic components, characterized in that: The size of the side surface of the heat dissipation cold plate in the thickness direction is adapted to the width of the slot, and heat dissipation structures are arranged symmetrically in the axial direction of the heat dissipation cold plate, and all the heat dissipation structures are located on the same side surface of the heat dissipation cold plate, wherein: The heat dissipation structure can increase the heat dissipation or heat exchange between the slot and the heat dissipation cold plate, and reduce the contact thermal resistance.
2. The low thermal resistance side wall heat dissipation cold plate structure according to claim 1, characterized in that: The heat dissipation cold plate includes a front surface and a back surface, and a mounting portion is provided on a side surface in the thickness direction of the heat dissipation cold plate and parallel to its axial direction. The mounting portion includes a first surface and a second surface, the first surface and the front surface are in the same plane, and the second surface and the back surface are in the same plane, wherein: A locking strip is installed on the first surface along the center line of the front surface, and the locking strip is used to fasten the heat dissipation cold plate to prevent the heat dissipation cold plate from moving, shaking or vibrating in the corresponding groove due to environmental forces; The heat dissipation structures are installed at intervals on the second surface along the center line direction of the reverse surface.
3. The low thermal resistance side wall heat dissipation cold plate structure according to claim 2, characterized in that: The length of the mounting portion is smaller than the length of the heat dissipation cold plate.
4. The low thermal resistance side wall heat dissipation cold plate structure according to claim 3, characterized in that: The heat dissipation structure includes a heat dissipation slot and a heat conducting member installed in the heat dissipation slot, wherein the height of the heat conducting member is greater than the depth of the heat dissipation slot, wherein: The heat conducting member can reduce the contact thermal resistance between the chassis and the heat dissipation cold plate to improve the heat dissipation capacity of the chassis, and under the action of the locking strip, the heat conducting member can reduce or eliminate the contact gap or gap between the chassis and the heat dissipation cold plate.
5. The low thermal resistance side wall heat dissipation cold plate structure according to claim 4, characterized in that: Mounting holes are provided between the heat dissipation slots, and the mounting holes are used for mounting locking strips.
6. The low thermal resistance side wall heat dissipation cold plate structure according to claim 4, characterized in that: The heat conducting member is made of a flexible heat conducting material, and the slot is a metal slot.
7. The low thermal resistance side wall heat dissipation cold plate structure according to claim 6, characterized in that: The heat conducting element is made of rubber material.
8. The low thermal resistance side wall heat dissipation cold plate structure according to claim 4, characterized in that: The mounting portion and the heat dissipation cold plate are formed into an integral structure.
9. The low thermal resistance side wall heat dissipation cold plate structure according to claim 8, characterized in that: The size of the side surface of the mounting portion in the thickness direction is adapted to the width of the groove.
10. The low thermal resistance side wall heat dissipation cold plate structure according to claim 1, characterized in that: A motherboard is arranged in the chassis, and the board is electrically connected to the motherboard in a plug-and-pull manner.